TWM553876U - Supporting module and wafer moving equipment - Google Patents

Abstract

A supporting module adapted to connect to a wafer platform to fix on a wafer ring to the wafer platform is provided. The supporting module includes a supporting ring and a plurality of fixing elements. The supporting ring is adapted to surround the wafer platform and has a supporting surface to support the wafer ring. The fixing elements connect to the supporting ring to limit the position of the wafer ring on the supporting surface in the direction perpendicular to the supporting surface. In addition, a wafer moving equipment is also provided.

Description

Support module and wafer mobile device

The present invention relates to a support structure and a mobile device, and more particularly to a support module and a wafer moving device.

In the fabrication process of a semiconductor device, especially in the fabrication process of a light-emitting diode, a wafer can be cut into a plurality of die. After the wafer is diced, the die of the wafer can be electrically tested via a probe. However, in order to ensure good electrical conduction between the probe and the die of the wafer, the die of the wafer must be stably fixed on the adsorption platform so that the tip of the probe is in good contact with it, thereby establishing an effective electrical property. Turn on.

In the prior art, the wafer mobile device can move a wafer or a plurality of dies mounted on the wafer platform by moving its wafer platform, so that the dies of the wafer can be used for spotting. The needle set is in contact. In order to efficiently carry and move the wafer, the wafer moving device provides an adsorption force on the wafer platform by an external vacuum device, thereby adsorbing the wafer die on the wafer platform.

However, in accordance with conventional wafer moving devices, the components used to carry the wafer are not completely fixed to the wafer platform. Therefore, in the process of spot measurement, the wafer moving device easily causes the components carrying the wafer to be shaken to cause a numerical abnormality of the spot measurement.

The novel creation provides a support module and a wafer moving device for securing the wafer ring to the wafer platform.

The novel support module is adapted to be coupled to a wafer platform to secure a wafer ring to the wafer platform. The support module includes a support ring and a plurality of fixing elements. The support ring is adapted to surround the wafer platform and has a support surface to support the wafer ring. A plurality of fixing elements are coupled to the support ring to limit the position of the wafer ring on the support surface in a direction perpendicular to the support surface.

The novel wafer mobile device is adapted to carry a wafer ring. The wafer mobile device includes a mobile module, a wafer platform, and a support module. The wafer platform is disposed on the mobile module, wherein the wafer platform can be translated, lifted or rotated by the mobile module. The support module is coupled to the wafer platform to secure the wafer ring to the wafer platform. The support module includes a support ring and a plurality of fixing elements. The support ring is adapted to surround the wafer platform and has a support surface to support the wafer ring. A plurality of fixing elements are coupled to the support ring to limit the position of the wafer ring on the support surface in a direction perpendicular to the support surface.

Based on the above, in the novel creation, the wafer ring is fixed on the wafer platform by a plurality of fixing elements on the support module. Therefore, when the mobile module moves the wafer ring through the wafer platform, the vibration of the wafer ring on the wafer platform can be reduced, thereby improving the spot quality of the die.

The above described features and advantages of the present invention will become more apparent and understood from the following description.

Referring to FIGS. 1 through 3, in the present embodiment, the wafer moving device 50A is adapted to carry a wafer ring 60. Generally, the die 80 of the wafer to be tested (for example, a die separated from the wafer) is placed and attached to the transparent film 70, and then the transparent film 70 is stretched and connected to the wafer. Ring 60. The die 80 to be measured in advance is divided from the wafer, and the die 80 to be tested can be separated from each other by the stretching of the transparent film 70. In the present embodiment, the light transmissive film 70 is, for example, a blue film, but the creation of the present invention is not limited thereto.

In this embodiment, the wafer moving device 50A includes a mobile module 52, a wafer platform 54, and a support module 100A. The wafer platform 54 is disposed on the mobile module 52, wherein the wafer platform 54 can be translated, lifted, or rotated by the moving module 52. The support module 100A is connected to the wafer platform 54 to fix the wafer ring 60 on the wafer platform 54, so that the wafer ring 60 can also be driven, moved, lifted or rotated by the moving module 52, thereby reducing the wafer ring 60. The vibration on the wafer platform 54 further enhances the spot quality of the die 80.

In this embodiment, the support module 100A includes a support ring 110 and a plurality of fixing elements 120A. The support ring 110 is adapted to surround the wafer platform 54 and has a support surface 112 to support the wafer ring 60. Specifically, the support ring 110 is fixed to the wafer platform 54 in a manner of, for example, locking the support ring 110 around the wafer platform 54 by screws. These fixing elements 120A are coupled to the support ring 110 to limit the position of the wafer ring 60 on the support surface 112. In detail, the inner edge of the support ring 110 will coincide or be slightly larger than the outer edge of the wafer platform 54. Thus, when the support ring 110 is disposed on the wafer platform 54, the wafer platform 54 can extend from the center of the support ring 110 and be substantially flush with the support surface 112 of the support ring 110. As such, when the wafer moving device 50A is adapted to carry a wafer ring 60, the wafer ring 60 is carried on the support surface 112. At the same time, the light transmissive film 70 carrying the die 80 is carried on the wafer platform 54. In the present embodiment, the fixing members 120A limit the position of the wafer ring 60 on the support surface 112 in a direction perpendicular to the support surface 112 (i.e., in the negative Z-axis direction). In other words, the wafer ring 60 is adhered to the support surface 112 by the fixing member 120A to prevent vibration caused by the separation of the wafer ring 60 from the support surface 112 when the support module 100A is moved.

In this embodiment, the support module 100A further includes at least one pair of bit elements 130. The number of the alignment elements 130 is not limited. In this embodiment, the four alignment elements 130 are represented as shown in the figure, and the alignment is performed. Element 130 is coupled to support ring 110 to limit the position of wafer ring 60 on support surface 112 on a plane parallel to support surface 112 (ie, the XY plane). Further, in the present embodiment, the alignment elements 130 protrude from the support surface 112, and the inner sides of the alignment elements 130 are conformal with a portion of the outer side of the wafer ring 60, that is, the shapes cooperate. For example, in the present embodiment, the inner side of the alignment element 130 is, for example, a pair of planes 130a, and the outer side of the wafer ring 60 also has a plurality of alignment sides 60a corresponding to the alignment surfaces 130a. As such, when the wafer ring 60 is placed on the support module 100A, the wafer ring 60 can be fixed to the support ring 110 by the alignment member 130 protruding from the support surface 112, and at the same time by the alignment member 130. The position of the wafer ring 60 at the support surface 112 is limited in the plane of the parallel support surface 112 (i.e., the XY plane), thereby increasing the robustness of the wafer ring 60 in the support module 100A. In other words, the plurality of alignment elements 130 on the support module 100A have a registration function with the wafer ring 60. In the present embodiment, the alignment element 130 is integrally formed with the support ring 110, that is, the support ring 110 and the alignment element 130 are formed by a single workpiece. In other embodiments, the shape and size of the alignment component 130 can be arbitrarily adjusted according to actual needs, and the manner in which the alignment component 130 is connected to the support ring 110 can be arbitrarily adjusted according to actual needs. Limited to this.

In this embodiment, each of the fixing elements 120A has a vacuum nozzle 122, and each vacuum nozzle 122 is disposed in the support ring 110 and connected to a vacuum source (not shown), and each vacuum nozzle 122 is in accordance with the vacuum. The drive of the source provides vacuum suction to attract the wafer ring 60 onto the support surface 112. Each of the fixing members 120A further has a port 128A, and each port 128A is connected to a corresponding vacuum nozzle 122, and each vacuum nozzle 122 is connected to an external vacuum source via a corresponding port 128A. For example, the vacuum nozzle 122 is embedded in the support ring 110 and exposed to the support surface 112, and the vacuum suction provided by the vacuum source is transmitted to the vacuum suction nozzle 122 through the connection port 128A to adsorb the wafer ring 60 toward the support. The surface on the side of the face 112 is on the support surface 112, thereby fixing the wafer ring 60 to the support ring 110.

Referring to FIGS. 4-6, the wafer moving device 50B of the present embodiment is similar to the wafer moving device 50A of FIG. The difference is that in the embodiment, the support module 100B includes a support ring 110 and a plurality of fixing elements 120B.

Each of the fixing elements 120B has a cylinder 124 and a pressing member 126, and each cylinder 124 is connected to the supporting ring 110 and connected to a corresponding pressing member 126. Each cylinder 124 is connected to an external vacuum source (not shown), and each cylinder The corresponding pressing member 126 is moved in accordance with the driving of the vacuum source to press the wafer ring 60 against the support surface 112. In this embodiment, each fixing element 120B further has a pair of connecting ports 128B, each pair of connecting ports 128B is connected to a corresponding cylinder 124, and each cylinder 124 is connected to an external vacuum source via a corresponding pair of connecting ports 128B (not drawn Show). In detail, the pressing member 126 is disposed on the outer side of the support ring 110 and extends toward the support surface 112, and the vacuum suction provided by the vacuum source is transmitted to the cylinder 124 through the pair of connecting ports 128B to drive the pressing member 126 on the supporting surface. Lift up and down 112. However, in other embodiments, the wafer ring 60 can also be pressed against the support surface 112 using other kinds of fixing methods. The novel creation is not limited thereto.

Referring to FIG. 7A and FIG. 7B, in the above state, in a state where the wafer ring 60 is not fixed, the controlled vacuum source transmits vacuum suction to the cylinder 124 through one of the pair of ports 128B, so that the cylinder 124 pushes the pressing member 126 toward Moving away from the support surface 112 (ie, in the positive Z-axis direction), the pusher 126 is moved away from the wafer ring 60, so the wafer ring 60 can be placed on or removed from the support surface 112, as shown in FIG. 7A. Show. In a state in which the wafer ring 60 is fixed, the controlled vacuum source provides vacuum suction through the other pair of cylinders 124 of the pair of ports 128B such that the cylinder 124 directs the pressing member 126 toward the adjacent support surface 112 (ie, negative Z). The movement in the axial direction causes the pressing member 126 to press the wafer ring 60, thereby fixing the wafer ring 60 to the support surface 112 as shown in Fig. 7B.

Referring to FIG. 8, the wafer moving device 50C of the present embodiment is similar to the wafer moving device 50A of FIG. The difference is that in the embodiment, the support module 100C includes a support ring 110 and a plurality of fixing elements 120A, 120B. In other words, the support module 100C simultaneously selects the vacuum adsorption type fixing member 120A and the mechanical pressing type fixing member 120B to fix the wafer ring 60 to the support module 100C.

In summary, in the novel creation, the wafer ring is fixed on the wafer platform by a plurality of fixing elements on the support module. Therefore, when the mobile module moves the wafer ring through the wafer platform, the vibration of the wafer ring on the wafer platform can be reduced, thereby improving the spot quality of the die.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.

50A, 50B, 50C‧‧‧ wafer mobile devices
52‧‧‧Mobile Module
54‧‧‧ Wafer Platform
60‧‧‧ wafer ring
60a‧‧‧ opposite side
70‧‧‧Transparent film
80‧‧‧ grain
100A, 100B, 100C‧‧‧ support modules
110‧‧‧Support ring
112‧‧‧Support surface
120A, 120B‧‧‧Fixed components
122‧‧‧Vacuum nozzle
124‧‧‧ cylinder
126‧‧‧Pressing parts
128A, 128B‧‧‧ Connection埠
130‧‧‧ Alignment components
130a‧‧‧ opposite plane

1 is an exploded perspective view of a wafer moving apparatus in accordance with an embodiment of the present invention. 2 is an exploded perspective view of the wafer moving device and wafer ring of FIG. 1. 3 is a perspective view of the wafer moving device of FIG. 1 with a wafer ring attached thereto. 4 is an exploded perspective view of a wafer moving apparatus in accordance with another embodiment of the present invention. 5 is an exploded perspective view of the wafer moving device and wafer ring of FIG. 4. 6 is a perspective view of the wafer moving device of FIG. 4 with a wafer ring attached thereto. 7A is a side view of the wafer moving device of FIG. 4 without a wafer ring attached thereto. 7B is a side elevational view of the wafer moving device of FIG. 4 with a wafer ring attached thereto. 8 is a perspective view of a wafer moving apparatus in accordance with still another embodiment of the present invention.

50C‧‧‧Wab Mobile Devices

52‧‧‧Mobile Module

54‧‧‧ Wafer Platform

60‧‧‧ wafer ring

70‧‧‧Transparent film

80‧‧‧ grain

100C‧‧‧Support Module

120A, 120B‧‧‧Fixed components

130‧‧‧ Alignment components

Claims (16)

A support module is adapted to be coupled to a wafer platform to fix a wafer ring on the wafer platform, the support module comprising: a support ring adapted to surround the wafer platform and having a support surface Supporting the wafer ring; and a plurality of fixing members coupled to the support ring to limit the position of the wafer ring on the support surface in a direction perpendicular to the support surface. The support module of claim 1, further comprising: at least one pair of positional members coupled to the support ring to limit the wafer ring on the support surface in a plane parallel to the support surface s position. The support module of claim 2, wherein the at least one pair of bit elements protrude from the support surface, and an inner side of the at least one pair of bit elements is conformal with a portion of an outer side of the wafer ring. The support module of claim 2, wherein the at least one pair of position elements are integrally formed with the support ring. The support module of claim 1, wherein each of the fixing elements has a vacuum nozzle, each vacuum nozzle is disposed in the support ring and connected to an external vacuum source, and each vacuum suction The nozzle provides vacuum suction in accordance with the driving of the vacuum source to adsorb the wafer ring on the support surface. The support module of claim 5, wherein each of the fixing elements further has a connecting port, each connecting port is connected to the corresponding vacuum nozzle, and each of the vacuum nozzles is connected via the corresponding connecting port. This vacuum source to the outside. The support module of claim 1, wherein each of the fixing elements has a cylinder and a pressing member, and each of the cylinders is connected to the support ring and connects the corresponding pressing member, and the cylinder is connected to the outside. a vacuum source, and each of the cylinders moves the corresponding pressing member according to the driving of the vacuum source to press the wafer ring on the supporting surface. The support module of claim 7, wherein each of the fixing elements further has a pair of connecting ports, each of the pair of connecting ports connecting the corresponding cylinders, and each of the cylinders is connected to the corresponding pair of ports External vacuum source. A wafer moving device adapted to carry a wafer ring, comprising: a mobile module; a wafer platform disposed on the mobile module, wherein the wafer platform can be driven by the mobile module to translate, lift Or rotating; and a support module coupled to the wafer platform to fix the wafer ring to the wafer platform, the support module comprising: a support ring adapted to surround the wafer platform and having a a support surface to support the wafer ring; and a plurality of fixing elements coupled to the support ring to limit the position of the wafer ring on the support surface. The wafer moving device of claim 9, wherein the support module further comprises at least one pair of bit elements connected to the support ring, the at least one pair of bit elements being in a plane parallel to the support surface The position of the wafer ring on the support surface is restricted, and the fixing elements limit the position of the wafer ring on the support surface in a direction perpendicular to the support surface. The wafer moving device of claim 10, wherein the at least one pair of bit elements protrude from the support surface, and an inner side of the at least one pair of bit elements is conformal with a portion of an outer side of the wafer ring. The wafer moving apparatus of claim 10, wherein the at least one pair of bit elements are integrally formed with the support ring. The wafer moving device of claim 9, wherein each of the fixing members has a vacuum nozzle, each of the vacuum nozzles being disposed in the support ring and connected to an external vacuum source, and each of the vacuums The nozzle provides vacuum suction in accordance with the driving of the vacuum source to adsorb the wafer ring on the support surface. The wafer moving device of claim 13, wherein each of the fixing elements further has a connecting port, each of the connecting ports is connected to the corresponding vacuum nozzle, and each of the vacuum nozzles corresponds to the connecting port. This vacuum source is connected to the outside. The wafer moving device of claim 9, wherein each of the fixing elements has a cylinder and a pressing member, and each of the cylinders is connected to the supporting ring and connects the corresponding pressing member, and the cylinder is connected to each An external vacuum source, and each of the cylinders moves the corresponding pressing member according to the driving of the vacuum source to press the wafer ring on the supporting surface. The wafer moving device of claim 15, wherein each of the fixing elements further has a pair of connecting ports, each of the pair of ports connecting the corresponding cylinders, and each of the cylinders is connected via the corresponding pair of ports This vacuum source to the outside.