TWM553488U - Inductor for resisting low-frequency EMI - Google Patents
Inductor for resisting low-frequency EMI Download PDFInfo
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- TWM553488U TWM553488U TW106211957U TW106211957U TWM553488U TW M553488 U TWM553488 U TW M553488U TW 106211957 U TW106211957 U TW 106211957U TW 106211957 U TW106211957 U TW 106211957U TW M553488 U TWM553488 U TW M553488U
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Description
本創作係一種電感器,尤指一種抗低頻EMI的電感。 This creation is an inductor, especially an inductor that is resistant to low frequency EMI.
常見之電感器(inductor),可作為扼流(choke)、繞組(winding)、高低頻訊號濾波(filter)或變壓器功率轉換等等。因此,具有一種環形電感(Ring inductance),請參閱第一圖所示,其中包含一環形磁芯10,該環形磁芯10上繞設至少一繞組11(winding),致以形成電感器。 Common inductors can be used as chokes, windings, high and low frequency signal filters or transformer power conversions. Therefore, there is a ring inductance, as shown in the first figure, which includes a toroidal core 10 on which at least one winding 11 is wound to form an inductor.
此一技術方案中,環形電感通常具有體積較大的缺點,且較難以藉由表面黏著技術(Surface-mount technology,SMT)進行於電路基板上的裝設。雖可如中華民國專利第482320號揭露的一種「濾波電感器」,其482320號該案中第2圖所示,該濾波電感器進一步設有一承載裝置,以利於表面黏著(SMD)裝設於電路基板上,但設置承載裝置,體積即為更大,係較難符合現代化電子產品之體積縮小化的需求。 In this technical solution, the toroidal inductor generally has the disadvantage of being bulky, and is difficult to mount on the circuit substrate by surface-mount technology (SMT). Although it can be a "filter inductor" disclosed in the Republic of China Patent No. 482320, as shown in FIG. 2 of the case No. 482320, the filter inductor is further provided with a carrying device for facilitating surface adhesion (SMD) mounting. On the circuit board, but the carrier device is provided, the volume is larger, which is more difficult to meet the needs of the volume reduction of modern electronic products.
是故,如何針對以上所論述之缺失加以改進,即為本案申請人所欲解決之技術困難點所在。 Therefore, how to improve the above-mentioned deficiencies, that is, the technical difficulties that the applicant of this case wants to solve.
有鑑於習用之缺失,因此本創作之目的在於發展一種抗低頻EMI的電感。 In view of the lack of practice, the purpose of this creation is to develop an inductor that is resistant to low frequency EMI.
為了達成以上之目的,本創作提供一種抗低頻EMI的電感,其包含:一磁芯本體,該磁芯本體為錳鋅鐵氧體材料,該磁芯本體設有一第一繞線柱和一第二繞線柱,該第一繞線柱和第二繞線柱之同一側延伸設有一第一法蘭,且該第一繞線柱和第二繞線柱之同另一側延伸設有一第二法蘭,該第一法蘭上設有一第一載板,該第一載板上設有一第一端電極和一第二端電極,該第二法蘭上設有一第二載板,該第二載板上設有一第三端電極和一第四端電極,且該第一法蘭和第二法蘭分別為矩形狀;一第一線圈,係繞設於該第一繞線柱上,且該第一線圈兩端分別電性接設於該第一端電極和第三端電極;一第二線圈,係繞設於該第二繞線柱上,且該第二線圈兩端分別電性接設於該第二端電極和第四端電極。 In order to achieve the above object, the present invention provides an inductance against low frequency EMI, comprising: a magnetic core body, the magnetic core body is a MnZn ferrite material, the magnetic core body is provided with a first winding post and a first a first bobbin, a first flange extending from the same side of the first bobbin and the second bobbin, and a first extension of the first bobbin and the second bobbin a first flange is disposed on the first flange, the first carrier is provided with a first end electrode and a second end electrode, and the second flange is provided with a second carrier The second carrier is provided with a third end electrode and a fourth end electrode, and the first flange and the second flange are respectively rectangular; a first coil is wound around the first bobbin. And the first coil is electrically connected to the first end electrode and the third end electrode respectively; a second coil is wound on the second bobbin, and the two ends of the second coil are respectively Electrically connected to the second terminal electrode and the fourth terminal electrode.
其中該第一法蘭上其中一側面之周緣設有複數第一卡抵部,該第一載板卡合設於該等第一卡抵部之間,該第二法蘭上其中一側面之周緣設有複數第二卡抵部,該第二載板卡合設於該等第二卡抵部之間,又該第一至第四端電極上依序分別設有一第一容置槽、一第二容置槽、一第三容置槽和一第四容置槽,該第一線圈兩端分別容設於該第一容置槽和第三容置槽內,且該第二線圈兩端分別容設於該第二容置槽和第四容置槽內。該第一載板上設有複數第一抵靠部,該等第一抵靠部係分布設置抵靠設於該第一端電極和第二端電極之周圍,該第二載板上設有複數第二抵靠部,該等第二抵靠部係分布設置抵靠設於該第三端電極和第四端電極之周圍。又該第一載板和第二載板為印刷電路板(Printed circuit board,PCB)所構成。 The first flange of the first flange is provided with a plurality of first latching portions, and the first carrier is engaged between the first latching portions, and one of the sides of the second flange a plurality of second card abutting portions are disposed on the periphery, the second carrier plate is disposed between the second card abutting portions, and the first to fourth end electrodes are respectively provided with a first receiving groove, a second accommodating groove, a third accommodating groove and a fourth accommodating groove, the two ends of the first coil are respectively accommodated in the first accommodating groove and the third accommodating groove, and the second coil The two ends are respectively disposed in the second accommodating groove and the fourth accommodating groove. The first carrier is provided with a plurality of first abutting portions, and the first abutting portions are disposed to be disposed around the first end electrode and the second end electrode, and the second carrier is provided on the second carrier The plurality of second abutting portions are disposed to be disposed adjacent to the third end electrode and the fourth end electrode. Further, the first carrier board and the second carrier board are formed of a printed circuit board (PCB).
俾可使本創作達到縮小電感器的體積,因此可符合現代化電 子產品之體積縮小化的需求,更可利於表面黏著(SMD)於電路基板上,予以達成功效。 俾This design can reduce the size of the inductor, so it can meet the modernization The need to reduce the volume of the sub-products is more conducive to surface adhesion (SMD) on the circuit board to achieve the effect.
〔習用〕 [Use]
10‧‧‧環形磁芯 10‧‧‧Round core
11‧‧‧繞組 11‧‧‧Winding
〔本創作〕 [this creation]
2‧‧‧磁芯本體 2‧‧‧magnetic core body
21‧‧‧第一繞線柱 21‧‧‧First bobbin
22‧‧‧第二繞線柱 22‧‧‧second bobbin
23‧‧‧第一法蘭 23‧‧‧First flange
231‧‧‧第一卡抵部 231‧‧‧ First card arrival
24‧‧‧第二法蘭 24‧‧‧second flange
241‧‧‧第二卡抵部 241‧‧‧Second card arrival
25‧‧‧第一載板 25‧‧‧ first carrier
26‧‧‧第二載板 26‧‧‧Second carrier
31‧‧‧第一端電極 31‧‧‧First-end electrode
32‧‧‧第二端電極 32‧‧‧second terminal electrode
33‧‧‧第三端電極 33‧‧‧Terminal electrode
34‧‧‧第四端電極 34‧‧‧ fourth end electrode
35‧‧‧第一容置槽 35‧‧‧First accommodating slot
36‧‧‧第二容置槽 36‧‧‧Second accommodating slot
37‧‧‧第三容置槽 37‧‧‧The third accommodating slot
38‧‧‧第四容置槽 38‧‧‧fourth receiving slot
6‧‧‧第一抵靠部 6‧‧‧First Abutment
7‧‧‧第二抵靠部 7‧‧‧Second Abutment
4‧‧‧第一線圈 4‧‧‧First coil
41‧‧‧端 41‧‧‧
42‧‧‧端 42‧‧‧
5‧‧‧第二線圈 5‧‧‧second coil
51‧‧‧端 51‧‧‧
52‧‧‧端 52‧‧‧
100‧‧‧SMD 100‧‧‧SMD
200‧‧‧電路基板 200‧‧‧ circuit substrate
第一圖係習用之環形電感的結構示意圖。 The first figure is a schematic diagram of the structure of a conventional ring inductor.
第二圖係本創作較佳實施例之抗低頻EMI的電感之立體分解結構示意圖。 The second figure is a schematic exploded perspective view of the low frequency EMI resistant inductor of the preferred embodiment of the present invention.
第三圖係本創作較佳實施例之第二圖的立體組合結構示意圖。 The third drawing is a schematic view of a three-dimensional combination structure of the second embodiment of the preferred embodiment of the present invention.
第四圖係本創作較佳實施例之利於表面黏著(SMD)的示意圖。 The fourth figure is a schematic diagram of the preferred embodiment of the present invention for surface adhesion (SMD).
為了使 貴審查委員能清楚了解本創作之內容,係以下列實施例搭配圖式及符號加以說明,敬請參閱之。 In order for your review board to have a clear understanding of the content of this work, please refer to the following examples with diagrams and symbols, please refer to it.
請參閱第二圖和第三圖所示,本創作提供一種抗低頻EMI的電感,其包含:一磁芯本體2、一第一線圈4和一第二線圈5。 Referring to the second and third figures, the present invention provides an inductance against low frequency EMI, comprising: a core body 2, a first coil 4 and a second coil 5.
該磁芯本體2可為錳鋅鐵氧體材料,其磁導率及飽和感應(saturation induction)都較鎳鋅鐵氧體要高。該磁芯本體2設有一第一繞線柱21和一第二繞線柱22,該第一繞線柱21和第二繞線柱22之同一側延伸設有一第一法蘭23,且該第一繞線柱21和第二繞線柱22之同另一側延伸設有一第二法蘭24,該第一法蘭23上設有一第一載板25,該第一載板25上設有一第一端電極31和一第二端電極32,該第二法蘭24上設有一第二載板26,該第二載板26上設有一第三端電極33和一第四端電極34,且該第一法蘭23和第二法蘭24分別為矩形狀。於本實施例中,該第一載板25和第二載板26為印刷電路板(Printed circuit board,PCB)所構成,且不以此為限制。因此本創作不僅體積 縮小(相較於先前技術),且可產生抗低頻電磁干擾(EMI)的效果。例如(電源端)通過低頻雜訊訊號或直流電時,則可產生濾波的功能,係為習知技術在此不予贅述。 The core body 2 can be a MnZn ferrite material having higher magnetic permeability and saturation induction than nickel zinc ferrite. The core body 2 is provided with a first bobbin 21 and a second bobbin 22, and a first flange 23 is extended on the same side of the first bobbin 21 and the second bobbin 22, and the first flange 23 is disposed. A second flange 24 is defined on the other side of the first bobbin 21 and the second bobbin 22, and the first flange 23 is provided with a first carrier 25, and the first carrier 25 is disposed on the first carrier 25 There is a first terminal electrode 31 and a second terminal electrode 32. The second carrier 24 is provided with a second carrier 26. The second carrier 26 is provided with a third terminal electrode 33 and a fourth terminal electrode 34. And the first flange 23 and the second flange 24 are each rectangular. In this embodiment, the first carrier 25 and the second carrier 26 are formed of a printed circuit board (PCB), and are not limited thereto. Therefore, this creation is not only volume Reduced (compared to prior art) and produces an effect that is resistant to low frequency electromagnetic interference (EMI). For example, when the (power terminal) passes the low-frequency noise signal or the direct current, the filtering function can be generated, which is not described here.
以及,該第一線圈4繞設於該第一繞線柱21上,且該第一線圈4兩端41、42分別電性接設於該第一端電極31和第三端電極33。又該第二線圈5繞設於該第二繞線柱22上,且該第二線圈5兩端51、52分別電性接設於該第二端電極32和第四端電極34。 The first coil 4 is wound around the first bobbin 21, and the two ends 41 and 42 of the first coil 4 are electrically connected to the first end electrode 31 and the third end electrode 33, respectively. The second coil 5 is wound around the second bobbin 22, and the two ends 51 and 52 of the second coil 5 are electrically connected to the second end electrode 32 and the fourth end electrode 34, respectively.
於本實施例中,該第一法蘭23上其中一側面之周緣設有複數第一卡抵部231,該第一載板25卡合設於該等第一卡抵部231之間,該第二法蘭24上其中一側面之周緣設有複數第二卡抵部241,該第二載板26卡合設於該等第二卡抵部241之間,又該第一至第四端電極31、32、33、34上依序分別設有一第一容置槽35、一第二容置槽36、一第三容置槽37和一第四容置槽38,該第一線圈4兩端41、42分別容設於該第一容置槽35和第三容置槽37內,且該第二線圈5兩端51、52分別容設於該第二容置槽36和第四容置槽38內。因此,該第一線圈4、第二線圈5與磁芯本體2之間產生較好拉線組裝的效果,該第一線圈4和第二線圈5其各別兩端41、42、51、52的拉(繞)線定位將更方便(可使用黏著劑黏結),更利於本創作表面黏著(SMD)於電路基板上時,可與電路基板上的電接腳連接更加無誤差(藉由第一至第四端電極31、32、33、34電連接至電路基板上)。 In this embodiment, a plurality of first card abutting portions 231 are disposed on a periphery of one of the first flanges 23, and the first carrier 25 is engaged between the first card abutting portions 231. A plurality of second card abutting portions 241 are disposed on a circumference of one of the side surfaces of the second flange 24, and the second carrier plate 26 is engaged between the second card abutting portions 241, and the first to fourth ends are further A first accommodating groove 35, a second accommodating groove 36, a third accommodating groove 37 and a fourth accommodating groove 38 are respectively disposed on the electrodes 31, 32, 33, and 34, and the first coil 4 is provided. The two ends 41 and 42 are respectively received in the first accommodating groove 35 and the third accommodating groove 37, and the two ends 51 and 52 of the second coil 5 are respectively accommodated in the second accommodating groove 36 and the fourth It is accommodated in the groove 38. Therefore, an effect of better cable assembly is produced between the first coil 4, the second coil 5 and the core body 2, and the first coil 4 and the second coil 5 have respective ends 41, 42, 51, 52 The positioning of the pull (wrap) line will be more convenient (adhesive bonding can be used), which is more conducive to the surface connection (SMD) on the circuit board, and can be connected with the electrical pin on the circuit board without error (by the first The first to fourth terminal electrodes 31, 32, 33, 34 are electrically connected to the circuit substrate).
請繼續參閱第四圖所示,其中,本創作將環形電感設計成方形,或稱矩型。其可藉由SMD100將磁芯本體2拾放於一電路基板200上,以第一至第四端電極31、32、33、34處電連接。於本實施例中,可符合現代化 電子產品之體積縮小化的需求(相較於先前技術),更可利於表面黏著之SMD100拾放於電路基板200上,實為本創作之特點。 Please continue to refer to the fourth figure, in which the creation of the ring inductor is square or rectangular. The magnetic core body 2 can be picked up and placed on a circuit substrate 200 by the SMD 100, and electrically connected at the first to fourth terminal electrodes 31, 32, 33, and 34. In this embodiment, it can be modernized The need to reduce the size of electronic products (compared to the prior art), the SMD100 which is more favorable for surface adhesion is placed on the circuit substrate 200, which is a feature of the creation.
請再參閱第二圖所示,其中該第一載板25上設有複數第一抵靠部6,該等第一抵靠部6係分布設置抵靠設於該第一端電極31和第二端電極32之周圍。又該第二載板26上設有複數第二抵靠部7,該等第二抵靠部7係分布設置抵靠設於該第三端電極33和第四端電極34之周圍。俾可使本創作達到結構補強。 Referring to the second figure, the first carrier 25 is provided with a plurality of first abutting portions 6 disposed on the first end electrodes 31 and The periphery of the two-terminal electrode 32. Further, the second carrier 26 is provided with a plurality of second abutting portions 7 disposed on the periphery of the third terminal electrode 33 and the fourth terminal electrode 34.俾 Make this creation structurally reinforced.
以上所論述者,僅為本創作較佳實施例而已,並非用以限定本創作實施之範圍;故在不脫離本創作之精神與範疇內所作之等效形狀、構造或組合之變換,皆應涵蓋於本創作之申請專利範圍內。 The above discussion is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; therefore, the equivalent shape, structure or combination of changes made in the spirit and scope of the present invention should be It is covered by the patent application scope of this creation.
2‧‧‧磁芯本體 2‧‧‧magnetic core body
21‧‧‧第一繞線柱 21‧‧‧First bobbin
22‧‧‧第二繞線柱 22‧‧‧second bobbin
23‧‧‧第一法蘭 23‧‧‧First flange
231‧‧‧第一卡抵部 231‧‧‧ First card arrival
24‧‧‧第二法蘭 24‧‧‧second flange
241‧‧‧第二卡抵部 241‧‧‧Second card arrival
25‧‧‧第一載板 25‧‧‧ first carrier
26‧‧‧第二載板 26‧‧‧Second carrier
31‧‧‧第一端電極 31‧‧‧First-end electrode
32‧‧‧第二端電極 32‧‧‧second terminal electrode
33‧‧‧第三端電極 33‧‧‧Terminal electrode
34‧‧‧第四端電極 34‧‧‧ fourth end electrode
35‧‧‧第一容置槽 35‧‧‧First accommodating slot
36‧‧‧第二容置槽 36‧‧‧Second accommodating slot
37‧‧‧第三容置槽 37‧‧‧The third accommodating slot
38‧‧‧第四容置槽 38‧‧‧fourth receiving slot
6‧‧‧第一抵靠部 6‧‧‧First Abutment
7‧‧‧第二抵靠部 7‧‧‧Second Abutment
Claims (4)
Priority Applications (1)
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TW106211957U TWM553488U (en) | 2017-08-14 | 2017-08-14 | Inductor for resisting low-frequency EMI |
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TW106211957U TWM553488U (en) | 2017-08-14 | 2017-08-14 | Inductor for resisting low-frequency EMI |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108269676A (en) * | 2018-03-28 | 2018-07-10 | 庆邦电子元器件(泗洪)有限公司 | The core structure of insertion loss can be reduced |
CN111788643A (en) * | 2018-03-05 | 2020-10-16 | 株式会社村田制作所 | Coil component and method for manufacturing same |
-
2017
- 2017-08-14 TW TW106211957U patent/TWM553488U/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111788643A (en) * | 2018-03-05 | 2020-10-16 | 株式会社村田制作所 | Coil component and method for manufacturing same |
CN111788643B (en) * | 2018-03-05 | 2022-09-02 | 株式会社村田制作所 | Coil component and method for manufacturing same |
CN108269676A (en) * | 2018-03-28 | 2018-07-10 | 庆邦电子元器件(泗洪)有限公司 | The core structure of insertion loss can be reduced |
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