TWM553259U - Improved structure of eco-friendly cushion pad for aligning and hot-pressing of circuit board - Google Patents

Description

Improvement of environmental protection cushion structure for circuit board alignment hot pressing

This creation is about the improvement of the environmental protection cushion structure of the circuit board alignment hot pressing, especially a high heat-resistant cushioning environmental protection gasket structure with positioning holes to assist the circuit board.

In the prior art, in the multi-layer circuit board pressing process, the main technique of hot pressing is to press the multi-layer structure into one body, wherein the pressing direction is from the upper and lower opposite ends, and Provide high temperature.

In order to avoid the process of processing, because the direct hard force causes the object to be processed of the circuit plywood and the like to be damaged by heavy pressure, a high temperature buffer layer for providing buffer is generally disposed between the contact surfaces of the two ends. . More common, such as through copper foil, steel plate or multi-layered kraft paper, etc., but because these materials do not have the characteristics of repeated use, it is a material that is thrown away, for environmental conservation, this The consumables are not ideal, so with the development of materials technology, it is better to reuse hundreds of times of cushioning environmentally friendly materials to become a high temperature buffer layer.

In order to avoid the pressing process, the pressing process in the multi-level structure slides due to external force, which causes the alignment between the layers to shift, resulting in structural errors, so that in operation, it will further penetrate through the various structures. It is equipped with a plurality of positioning holes, and then a plurality of positioning columns running through the layers to ensure accurate positioning, so as to ensure accurate alignment between the layers.

However, because of the perforation factor on the high temperature buffer layer, in the actual operation of the high temperature pressing process, the glue synthesis points between the layers will be liquefied due to high temperature, and will flow into the perforation after being pressed, and then penetrate into the high temperature buffer. On the layer, and solidified after cooling, the properties of the buffer layer which is originally buffered are changed, such as local hardening or embrittlement, which may greatly reduce the number of times the high temperature buffer layer can be reused. , causing rapid consumption of consumables and affecting environmental conservation, which is a technical bottleneck that has yet to be overcome in the technical field.

Therefore, before the comprehensive review, the creators of this creation thought about and designed a circuit board to improve the environmental protection cushion structure of the thermal compression, in order to improve the lack of the existing technology, thereby enhancing the implementation and utilization of the industry.

In view of the above-mentioned shortcomings of the prior art, the present invention designs an environmentally-friendly cushion structure improvement of a circuit board aligning thermal compression combined with a patent element such as novelty, advancement and industrial utilization, in order to overcome the difficulties of the prior art.

In order to achieve the above object, the technical means adopted in the present invention is to design a circuit board alignment thermal compression environmental protection cushion structure improvement, which comprises: an environmental protection cushion, which is a cushioning elastic flat material, and a plurality of reserved holes are disposed on the plurality of holes; and the plurality of rubber-resistant members are corresponding to the reserved holes, and are detachably fixed in the reserved holes of the environmental protection cushion, and the rubber-resistant member is A positioning perforation is provided at the center.

Among them, the environmental protection cushion is of a long rectangular type.

The number of the reserved holes is four, and corresponding to the four corners of the environmental protection cushion.

Wherein, the rubber resist is a gasket.

Wherein, the reserved hole is a circular hole.

The circuit board alignment hot-pressing environmental protection cushion structure of the present invention is improved in design, because the environmental protection cushion can be effectively isolated during heating and pressing so as not to be exposed to the heated melted glue, It can ensure the material characteristics are not changed, and can be used repeatedly to maximize the material usage rate, directly reduce the cost of waste disposal too fast, and reduce the environmental conservation caused by the rapid consumption of consumables. The problem is not seen in the prior art.

In order to make the above-mentioned objects, technical features, and gains after actual implementation more obvious, a more detailed description will be given below with reference to the corresponding drawings in the preferred embodiments.

(10)‧‧‧Environmental cushion

(11) ‧‧‧Reserved holes

(20) ‧‧‧Resistance parts

(21)‧‧‧ Positioning perforation

(30)‧‧‧Hot platen

(40) ‧ ‧ layers to be processed

(50)‧‧‧Positioning column

The first figure is an exploded view of the appearance of the environmentally-friendly cushion structure of the thermal compression of the circuit board.

Figure 2 is a partial cross-sectional view showing the application of the improved environmentally-friendly cushion structure of the circuit board.

Fig. 3 is a cross-sectional view showing an application embodiment of the improved environmentally-friendly cushion structure of the circuit board.

Fig. 4 is a partial cross-sectional view showing an application embodiment of the improved environmentally-friendly cushion structure of the circuit board.

Advantages and features of the present invention, as well as methods for achieving the same, will be more readily understood by reference to the exemplary embodiments and the accompanying drawings. However, the present invention may be implemented in different versions and should not be construed as being limited to the embodiments set forth herein. Rather, the embodiments are provided to provide a more thorough and complete and complete disclosure of the scope of the present invention, and the present invention will be only the scope of the appended claims. Defined. In the figures, the dimensions and relative sizes of the components or elements are shown in an exaggerated manner for clarity and clarity. Throughout the specification, the same component symbols refer to the same components. As used hereinafter, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Unless otherwise defined, all terms (including technical and scientific terms) used hereinafter have the same meaning as commonly understood by those skilled in the art to which the present invention belongs. It will be further understood that terms such as those defined by commonly used dictionaries should be understood to have the meaning consistent with the relevant art and will not be overly idealized or excessive unless explicitly defined below. Formal meaning understanding.

The exemplary embodiments will be described in detail below with reference to the drawings. However, these embodiments may be included in different versions and should not be construed as limiting the scope of the invention. The disclosure of the present invention is intended to be complete and obvious, and those skilled in the art will be able to understand the scope of the present invention.

Please refer to the figures 1 to 4, the present invention proposes an improved environmentally-friendly cushion structure for circuit board alignment, which in a preferred embodiment may include: an environmental protection cushion (10) and a plurality of plastic barriers. Piece (20).

The environmental protection cushion (10) is a cushioning elastic flat material, or may be of a long rectangular shape, and is provided with a plurality of reserved holes (11) thereon, and the reserved holes (11) may be round a hole, and the number of the reserved holes (11) may be four, and correspondingly disposed on the environmental protection cushion (10) The four corners.

The foregoing rubber resist member (20) may be a gasket, and the number and the outer shape correspond to the reserved hole (11), and the detachable correspondingly fixed to the reserved hole of the environmental protection cushion (10) (11) A positioning perforation (21) is provided in the center of the rubber resist (20).

The improved environmentally-friendly cushion structure of the circuit board of the present invention can be applied to the step of arranging the layer to be processed and the heat-resistant cushion between the pressure-heating trays, and the steps are based on two relatively hot-pressed disks ( Between 30), a plurality of layers to be processed (40) to be pressed are fixed, wherein the layer to be processed (40) contains a glue layer, and each of the hot platens (30) and the plurality of An environmentally-friendly cushion (10) is disposed between the processing layer (40), and the hot-pressing plate (30) and the layer to be processed (40) are provided with corresponding perforations corresponding to the environmental protection cushion. (10) positioning the perforation (21) of the resistive member (20), and then positioning a plurality of positioning posts (50) in the perforation and the positioning perforation (21), thereby ensuring the layers to be processed (40) There is no relative displacement between each other due to the relationship of stress pushing.

In addition, the environmental protection cushion (10) is firstly passed through the positioning hole (11) through the reserved hole (11), and then further penetrated by the positioning through hole (21) of the resistance member (20). On the positioning post (50), nextly, the environmental protection cushion (10) is laterally adjusted, and the rubber resist (20) is aligned with the reserved hole (11), and the reserve is moved to the environmental protection cushion (10). In the hole (11).

Through such an operation method, the environmental protection cushion (10) and the rubber resistant member (20) can be fastened to the positioning post (50), and the step of moving the heavy environmental protection cushion can be eliminated. (10) For positioning, the positioning hole (11) of the environmental protection cushion (10) having a larger hole diameter than the positioning post (50) can be quickly applied directly, and then only the weight is required to be held. A relatively light and flexible resisting member (20), and the positioning hole (21) corresponding to the positioning post (50) of the resisting member (20) is passed over the positioning post (50), and then only laterally Adjusting the position of the environmental protection cushion (10) so that the resistance member (20) can fall into the reserved hole (11), the positioning of the environmental protection cushion (10) can be completed.

When the hot platen (30) is heated and pressed at the same time, the layers to be processed (40) are fixed, and when the hot platen (30) is pressed, the resistive member is (20) blocking between the positioning post (50) and the environmental protection cushion (10), so as to completely block the heated melted glue flowing down from the positioning post (50) to protect the environmental protection cushion (10) ).

The environmentally-friendly cushion structure of the heat-compression bonding of the circuit board of the present invention is improved in design ingenuity, because the environmental protection cushion (10) can be effectively isolated during heating and pressing, so that it does not touch. To the melted melt, it can ensure that the material properties are not changed, so that it can be used repeatedly to maximize the material utilization rate, directly reducing the cost of the waste material being discarded too quickly, and reducing the conventional Consumables cause rapid environmental protection problems, so the gain is visible.

The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, the equivalent changes or modifications made by the people in accordance with the spirit revealed by this creation should still be covered by the scope of the patent of this creation.

Looking at the above, it can be seen that under the breakthrough of the previous technology, this creation has indeed achieved the desired effect, and it is also unfamiliar to those skilled in the art. The progress and practicality of the creation are in line with the patent. Apply for the requirements, and file a patent application in accordance with the law. You are requested to approve the creation of a patent application for this article to encourage creation.

(10)‧‧‧Environmental cushion

(11) ‧‧‧Reserved holes

(20) ‧‧‧Resistance parts

(21)‧‧‧ Positioning perforation

Claims (5)

The invention relates to an improved environmentally-friendly cushion structure for a circuit board, comprising: an environmentally-friendly cushion, which is a flat material having a cushioning elasticity, and having a plurality of reserved holes thereon; and a plurality of rubber-resistant members, The number and the shape correspond to the reserved hole, and are detachably fixed in the reserved hole of the environmental protection cushion, and a positioning hole is disposed at the center of the rubber resist. The environmental protection cushion structure of the circuit board alignment heat pressing according to the first aspect of the patent application is improved, wherein the environmental protection cushion is of a long rectangular type. For example, the environmental protection cushion structure of the circuit board alignment hot press is improved according to the second aspect of the patent application, wherein the number of the reserved holes is four, and correspondingly disposed at four corners of the environmental protection cushion. The environmental protection cushion structure of the circuit board alignment heat pressing according to the third aspect of the patent application is improved, wherein the rubber resistant member is a gasket. The environmental protection cushion structure of the circuit board alignment heat pressing according to the fourth aspect of the invention is improved, wherein the reserved hole is a circular hole.