TWM552191U - Antenna device capable of generating specific radiation field - Google Patents

Description

Antenna device capable of generating a specific radiation field type

The present invention relates to an antenna device, and more particularly to an antenna device capable of generating a specific radiation field type.

With the advancement of wireless communication technology, wireless communication products have been widely used in daily life, and antenna devices are one of the most important parts of wireless communication products. The microstrip antenna has the advantages of planar structure, mass production and easy integration on the circuit board, so it is widely used in various portable electronic products, such as mobile phones, smart phones, tablets, notebook computers, global positioning. System GPS (Global Positioning System) or Radio Frequency Identification (RFID).

In order to reduce the size and weight of the portable electronic device, a generally built-in antenna usually has a Planar Inverted F Antenna (PIFA) and a PIFA antenna can be placed on the circuit board of the portable electronic device. Thereby, thereby reducing the set volume of the antenna in the portable electronic device.

However, with the antenna designed by PIFA structure, the main direction of the radiation pattern will point to the direction of the grounded metal, and the engineer can not easily adjust the design shape of the antenna to change the direction of the radiation pattern, resulting in the signal intensity of the radiation field of the PIFA. The biggest direction is not necessarily the direction that the product needs.

The present invention proposes an antenna device capable of generating a specific radiation pattern, which mainly places the wafer antenna in the clearance area of the circuit board, and the distance from the edge of the clearance area to the edge of the nearest circuit board is greater than the narrowest width of the circuit board. /10, whereby the polarization direction generated by the antenna device is substantially perpendicular to the upper surface of the circuit board, and the direction of the signal intensity of the antenna device radiating field type is substantially parallel to the upper surface of the circuit board.

The present invention proposes an antenna device capable of generating a specific radiation field type and a polarization direction, and the chip antenna is mainly disposed in a clearance area of the circuit board, wherein a first conductive layer is disposed on the circuit board around the clearance area, the first An isolation region exists between a conductive layer and the second conductive layer of the circuit board, wherein the isolation region is a region having no metal layer. Through the above design, the wafer antenna, the clearance area, and the first conductive layer can be disposed at any position on the circuit board, and the polarization direction of the antenna device can still be substantially perpendicular to the upper surface of the circuit board, and the radiation field of the antenna device The shape can still be substantially parallel to the upper surface of the board.

The present invention proposes an antenna device capable of generating a specific radiation pattern, comprising: a circuit board comprising a clearance area and at least one signal feed line, wherein the signal feed line is located in the clearance area, wherein the edge of the clearance area is closest to The distance between the edges of the circuit board is greater than 1/10 of the narrowest width of the circuit board; and at least one of the wafer antennas includes a substrate and at least one resonant unit, and the resonant unit is a conductive line or a conductive layer formed by using a conductive material And a part or all of the resonant unit is disposed on a surface or an inner portion of the substrate, wherein the chip antenna is disposed in the clearance area of the circuit board, and the resonant unit is connected to the signal feeding line.

The present invention proposes another antenna device capable of generating a specific radiation pattern, comprising: a circuit board comprising a clearance area, at least one signal feed line, a first ground layer and a second ground layer, wherein the first ground layer An isolation region is disposed between the first ground layer and the second ground layer, the isolation region is a region having no metal layer; and at least one wafer antenna includes a substrate and at least one The resonant unit, part or all of the resonant unit is located on the surface or inside of the substrate, wherein the chip antenna is disposed in the clearing area of the circuit board, and the resonant unit is connected to the signal feeding line.

Please refer to FIG. 1 , which is a perspective view of a first embodiment of an antenna device capable of generating a specific radiation pattern. 2 and 3 are top views of a first embodiment of an antenna device capable of producing a specific radiation pattern. 4 and 5 are perspective perspective views of an embodiment of a wafer antenna of the antenna device of the present invention.

As shown in FIG. 1 and FIG. 2, the antenna device 10 of the present invention comprises a circuit board 11 and a chip antenna 13, wherein the circuit board 11 includes a clearance area 113 and at least one signal feed line 115. The chip antenna 13 includes a substrate 131 and at least one resonating unit 133, wherein the chip antenna 13 is disposed in the clearance area 113 of the circuit board 11.

The distance d1 from one edge of the clearance area 113 of the presently-created embodiment to the edge of the closest circuit board 11 is greater than 1/10 of the narrowest width (W1 or W2) of the board. The clearing area 113 is disposed on an upper surface 111 of the circuit board 11, wherein the clearing area 113 defines a range in which the chip antenna 13 and the signal feeding line 115 are disposed. When the chip antenna 13 and the signal feeding line 115 are disposed on the clearing of the circuit board 11, In the region 113, the polarization direction of the antenna device 10 is substantially perpendicular to the upper surface 111 of the circuit board 11, such that the direction of the signal intensity of the radiation field of the antenna device 10 is substantially parallel to the upper surface 111 of the circuit board 11.

The present invention can produce a specific radiation field type antenna device 10 whose width of the circuit board 11 and the distance from the edge of the clearance area 113 to the edge 112 of the circuit board 11 must maintain a specific relative ratio to the antenna device 10. The characteristics and functions have a significant impact. In general, if the wafer antenna 13 is placed directly adjacent to the edge 112 of the circuit board 11, the antenna device 10 will be caused to be unable to produce a radiation pattern in which the direction of maximum signal intensity is parallel to the upper surface 111 of the circuit board 11. For this reason, the inventors have, after many experiments, define the area of the circuit board 11 that is not immediately adjacent to the edge 112 as the area where the clearance area 113 can be set, specifically, the edge of the clearance area 113 to the edge of the closest circuit board 11. The distance d1 of 112 is greater than 1/10 of the narrowest width of the board 11.

In the setting, the chip antenna 13 and the signal feeding line 115 can be disposed in the clearance area 113, so that the direction in which the antenna device 10 generates the maximum signal intensity is substantially parallel to the radiation pattern of the upper surface 111 of the circuit board 11.

In an embodiment of the present invention, the circuit board 11 has a square shape as shown in FIGS. 1 and 2 and has four side lengths of the same length, such as a first width W1 and a second width W2, wherein the first width W1 and the second width W2 are the same and are the narrowest width of the circuit board 11, and the distance d1 from the edge of the clearance area 113 to the edge 112 of the closest circuit board 11 is greater than the first width W1 and the second width W2. 1/10.

In another embodiment of the present invention, the circuit board 11 has a rectangular shape, as shown in FIG. 3, and has a first width W1 and a second width W2, wherein the second width W2 is smaller than the first width W1. Therefore, the second width W2 is the narrowest width of the circuit board 11, and the distance d1 from the edge of the clearance area 113 to the edge 112 of the closest circuit board 11 needs to be larger than 1/10 of the second width W2.

Of course, the above-mentioned square or rectangular circuit board 11 is only an embodiment of the present invention, and is not limited by the scope of the present invention. In practical applications, the circuit board 11 may also have other different geometric shapes, such as a polygon. However, regardless of the shape of the circuit board 11, the distance d1 from the edge of the clearance area 113 to the edge 112 of the closest circuit board 11 is also greater than 1/10 of the narrowest width of the board, and is defined on the board 11. The area where the clearance area 113 can be set.

Further, the wafer antenna 13 is disposed in the central portion of the circuit board 11, which has a better effect, so that the antenna device 10 radiates the direction of the signal intensity of the field type to the maximum, and is closer to the upper surface 111 of the parallel circuit board 11.

The wafer antenna 13 of the present invention includes a substrate 131 and a resonance unit 133, wherein the resonance unit 133 is a conductive line or a conductive layer built using a conductive material, and the resonance unit 133 is connected to the signal feed line 115.

In an embodiment of the present invention, part or all of the resonance unit 133 is built on the surface of the substrate 131 as shown in FIG. Specifically, the substrate 131 of the wafer antenna 13 of the present invention has a three-dimensional structure such as a rectangular parallelepiped, a cube, a polygonal cylinder or a cylinder. The substrate 131 in Fig. 4 of the present invention is a rectangular parallelepiped in which the bottom surface 132 of the substrate 131 is disposed on the upper surface of the clearance area 113 of the circuit board 11, and the resonance unit 133 is disposed on the bottom surface 132 of the substrate 131. On other surfaces.

In another embodiment of the present creation, some or all of the resonance unit 133 may be built inside the substrate 131 as shown in FIG. Specifically, the main feature of the present embodiment is that the wafer antenna 13 is disposed in the clearance area 113 of the circuit board 11 such that the polarization direction of the antenna device 10 is substantially perpendicular to the upper surface 111 of the circuit board 11, and The direction of the signal intensity of the radiation pattern is greatest parallel to the upper surface 111 of the circuit board 11, where the upper surface 111 of the circuit board 11 is the surface on which the wafer antenna 13 is disposed. Therefore, in practical applications, the above object can be achieved regardless of whether the resonance unit 133 is partially or entirely disposed on the surface or inside of the substrate 131.

In an embodiment of the present invention, a conductive layer 135 may be disposed on the bottom surface 132 of the substrate 131. The wafer antenna 13 is disposed in the clearance area 113 via the conductive layer 135. The conductive layer 135 is connected to the resonance unit 131 and The signal is fed into line 115.

However, the conductive layer 135 is not an essential component of the present invention. In different embodiments, the wafer antenna 13 may not be provided with the conductive layer 135, and the bottom surface of the wafer antenna 13 may be directly disposed in the clearance area 113 of the circuit board 11, the chip antenna. The resonance unit 133 of 13 is directly connected to the signal feed line 115.

In the embodiment of the present invention, the resonance unit 133 includes a first resonance unit 1331 and a second resonance unit 1333. The first resonance unit 1331 is connected to the second resonance unit 1333 via a frequency modulation component 137, as shown in FIG. 6 and Figure 7 shows. The frequency modulation element 137 can be used to adjust the resonant frequency of the wafer antenna 13. Specifically, the frequency modulation component 137 can include at least one inductor or a capacitor or a resistor.

In another embodiment of the present invention, the first resonant unit 1331 of the chip antenna 13 can generate a first resonant frequency f1, and the frequency adjusting component 137 exhibits a high impedance characteristic for an electronic signal having a frequency of the first resonant frequency f1. The electronic signal having the first resonance frequency f1 is blocked by the frequency modulation element 137 without being transmitted to the second resonance unit 1333. The first resonant unit 1331, the frequency adjusting component 137 and the second resonant unit 1333 jointly generate a second resonant frequency f2, and the frequency adjusting component 137 exhibits a low impedance characteristic to the electronic signal having the second resonant frequency f2, so that the frequency The electronic signal, which is the second resonance frequency f2, passes through the frequency modulation element 137. Through the arrangement of the frequency modulation component 137, the antenna device 10 can be caused to generate two resonance frequencies. Specifically, the frequency modulation component 137 can include at least one inductor or a resonant circuit composed of a capacitor and an inductor.

Further, although the shapes of the two types of resonance units 133 are depicted in FIGS. 4 to 7 of the present creation, the two shapes are merely examples of the present creation, and are not intended to limit the scope of the present invention. In various embodiments, the shape of the resonant unit 133 has many different variations.

Please refer to FIG. 8 , which is a perspective view of a second embodiment of an antenna device capable of generating a specific radiation field type. As shown in the figure, the antenna device 20 of the present invention includes a circuit board 21 and a chip antenna 13. The circuit board 21 includes a clearance area 211, at least one signal feed line 213, a first ground layer 215, and an isolation area 219. And a second ground layer 217. The chip antenna 13 includes a substrate 131 and at least one resonating unit 133, wherein the chip antenna 13 is disposed in the clearance area 211 of the circuit board 21.

The first ground layer 215 of the circuit board 21 is disposed around the clearance area 211, and the isolation area 219 is disposed between the second ground layer 217 and the first ground layer 215. In an embodiment of the present creation, the shape of the first ground layer 215 may be close to a square.

Since the isolation region 219 and the first ground layer 215 are disposed between the wafer antenna 13 and the second ground layer 217 of the circuit board 21, the wafer antenna 13, the clearance area 211, the first ground layer 215, and the isolation region of the present embodiment are provided. 219 can be disposed in any area of the circuit board 21, including the edge area of the circuit board 21, such that the polarization direction of the antenna device 20 is substantially perpendicular to the upper surface of the circuit board 21, and the direction of the signal intensity of the radiation pattern is the largest. It is substantially parallel to the upper surface of the circuit board 21. As shown in FIG. 8, the wafer antenna 13, the clearance area 211 and the first ground layer 215, and the isolation region 219 are disposed near the corner or edge of the circuit board 21. In different embodiments, the chip antenna 13, the clearance area 211, the first ground layer 215, and the isolation region 219 may also be disposed in the inner region of the circuit board 21 without clinging to the corners or edges of the circuit board 21, such as Figure 9 shows.

Specifically, the antenna device 20 of the present embodiment does not need to define a setting area of the clearance area 113 on the circuit board 11 in advance, and the chip antenna 13 is disposed on the circuit board 11 as described in the first embodiment of the present invention. In the clearance area 113, the polarization direction of the antenna device 20 can still be perpendicular to the upper surface of the circuit board 21, and the direction of the signal intensity of the radiation pattern can be substantially parallel to the upper surface of the circuit board 21.

In the present embodiment, a first ground layer 215 is disposed around the wafer antenna 13 , and an isolation region 219 is disposed between the first ground layer 215 and the second ground layer 217 . Thus, regardless of the area where the chip antenna 13, the clearance area 211, the first ground layer 215, and the isolation region 219 are disposed on the circuit board 21, the polarization direction of the antenna device 20 is substantially the same as the upper surface of the circuit board 21. Vertically, and causing the antenna device 20 to produce a radiation pattern having a direction of maximum intensity parallel to the surface of the circuit board 21. In practical applications, the position of the wafer antenna 13 can be adjusted according to the position of other components on the circuit board 21.

The resonance unit 133 of the wafer antenna 13 of the present embodiment can be disposed on the surface or inside of the substrate 131 as shown in Figs. 4 and 5. In addition, the wafer antenna 13 can also be disposed on the bottom surface 132 of the substrate 131 and connected to the resonant unit 133 and the signal feed line 115 by the conductive layer 135, as shown in FIG. The resonant unit 133 of the chip antenna 13 can include a first resonant unit 1331 and a second resonant unit 1333. The first resonant unit 1331 is connected to the second resonant unit 1333 via a frequency adjusting component 137, so that the antenna device 20 can utilize the frequency adjusting component. To adjust the resonant frequency or to generate two resonant frequencies, as shown in Figures 6 and 7.

In another embodiment of the present invention, as shown in FIG. 10, the antenna device 20 may further include at least one filter element 218 connecting the first ground layer 215 and the second ground layer 217. In particular, filter element 218 can be a capacitive element, an inductive element, a band pass element, a low pass element, or a high pass element.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the shape, structure, characteristics and spirit described in the scope of the patent application are equally changed. Modifications shall be included in the scope of the patent application of this creation.

10‧‧‧Antenna device
11‧‧‧ boards
111‧‧‧Upper surface
112‧‧‧ edge
113‧‧‧ clearance area
115‧‧‧ signal feed line
13‧‧‧Watt antenna
131‧‧‧Substrate
132‧‧‧ bottom surface
133‧‧‧Resonance unit
1331‧‧‧First Resonance Unit
1333‧‧‧second resonance unit
135‧‧‧ Conductive layer
137‧‧‧FM components
20‧‧‧Antenna device
21‧‧‧ boards
211‧‧‧ clearance area
213‧‧‧ signal feed line
215‧‧‧First ground plane
217‧‧‧Second ground plane
218‧‧‧Filter components
219‧‧‧Isolated area

Fig. 1 is a perspective view showing a first embodiment of an antenna device capable of generating a specific radiation field type

Figure 2: A top view of a first embodiment of an antenna device capable of producing a particular radiation pattern.

Figure 3: A top view of a first embodiment of an antenna device capable of producing a particular radiation pattern.

Fig. 4 is a perspective perspective view showing an embodiment of a wafer antenna of the antenna device of the present invention.

Fig. 5 is a perspective perspective view showing still another embodiment of the wafer antenna of the antenna device of the present invention.

Fig. 6 is a perspective perspective view showing still another embodiment of the wafer antenna of the antenna device of the present invention.

Fig. 7 is a perspective perspective view showing still another embodiment of the wafer antenna of the antenna device of the present invention.

Figure 8 is a perspective view of a second embodiment of an antenna device capable of generating a specific radiation pattern.

Fig. 9 is a perspective view showing a third embodiment of an antenna device capable of generating a specific radiation field type.

Fig. 10 is a perspective view showing a fourth embodiment of an antenna device capable of generating a specific radiation field type.

10‧‧‧Antenna device

11‧‧‧ boards

111‧‧‧Upper surface

113‧‧‧ clearance area

115‧‧‧ signal feed line

13‧‧‧Watt antenna

131‧‧‧Substrate

133‧‧‧Resonance unit

Claims (10)

An antenna device capable of generating a specific radiation pattern includes: a circuit board including a clearance area and at least one signal feed line, the signal feed line being located in the clearance area, wherein the edge of the clearance area is closest to the circuit board The distance between the edges is greater than 1/10 of the narrowest width of the circuit board; and the at least one wafer antenna includes a substrate and at least one resonant unit, the resonant unit being a conductive line or a conductive layer formed by using a conductive material, and a portion Or all of the resonant unit is built on the surface or inside of the substrate, wherein the chip antenna is disposed in the clearing area of the circuit board, and the resonant unit is connected to the signal feeding line. The antenna device of claim 1, further comprising a conductive layer on a bottom surface of the substrate and connecting the resonant unit and the signal feed line. The antenna device of claim 1, wherein the resonant unit comprises a first resonant unit and a second resonant unit, and the first resonant unit is coupled to the second resonant unit via a frequency modulation component. The antenna device of claim 3, wherein the frequency modulation component is a capacitive component, an inductive component, a resistive component, or a resonant circuit composed of a capacitor and an inductor. An antenna device capable of generating a specific radiation pattern includes: a circuit board including a clearing area, at least one signal feeding line, a first ground layer, and a second ground layer, wherein the first ground layer is disposed in the clear space An isolation region is disposed between the first ground layer and the second ground layer; and at least one of the wafer antennas includes a substrate and at least one resonant unit, and some or all of the resonant units are located on the substrate a surface or an interior, wherein the chip antenna is disposed in the clearance area of the circuit board, and the resonance unit is connected to the signal feed line. The antenna device of claim 5, wherein the shape of the first ground layer is close to a square. The antenna device of claim 5, further comprising a conductive layer disposed on a bottom surface of the substrate and located in the clearance area, the conductive layer connecting the resonant unit and the signal feed line. The antenna device of claim 5, wherein the resonant unit comprises a first resonant unit and a second resonant unit, and the first resonant unit is coupled to the second resonant unit via a frequency modulation component. The antenna device of claim 5, comprising at least one filter element connecting the first ground layer and the second ground layer. The antenna device of claim 9, wherein the filter element is a capacitive element, an inductive element, a band pass element, a low pass element, or a high pass element.