TWM549879U - Device controlling critical testing condition of electronic component - Google Patents

Description

Critical test condition control device for electronic components

The present invention relates to a critical test condition control device, and more particularly to an electronic component that accommodates electronic components and adjusts the temperature and voltage of the electronic components by utilizing a temperature control space surrounded by the substrate and the component cover. Critical test condition control device.

Since the information revolution in the 1980s, the speed of information transfer has increased dramatically, and the cost of information transfer has become lower and lower. Thanks to the booming computer industry, people only need to communicate with users in any corner of the world via a personal computer via the Internet. Therefore, the invention of personal computers has dramatically changed the way people live.

Among them, in addition to transmitting information over the Internet, personal computers can also perform word processing, game entertainment and running programs. In order to achieve the above functions, the memory must be installed on the computer motherboard to temporarily store the data generated during the operation of the computer. Since memory is an indispensable electronic component for computers, the related industries of memory are also born accordingly.

In order to make the memory work in a variety of harsh environments, people will perform a Four Corner Test on the memory when producing or developing memory. In other words, people will test at each critical angle of the memory to know that the memory is in these four shapes. State of operation.

These four states are extremely high temperature and apply extremely high voltage, extremely high temperature and apply extremely low voltage, extremely low temperature and apply extremely high voltage and extremely low temperature and apply extremely low voltage. Thereby, the operating state of the memory is tested in the above four states, thereby knowing the performance of the memory and detecting whether the regulatory standards are met.

In order to perform the four-corner test, one must constantly change the memory to test the environment. For example, when performing the four-corner test, the memory is first changed to an extremely high temperature environment, and a very high voltage is applied to measure the test parameters of the memory at high temperature and high voltage. Then, the memory is switched to an extremely high temperature environment, and a very low voltage is applied to measure the test parameters of the memory at a high temperature and low voltage.

Then, the memory is switched to a very low temperature environment, and a very high voltage is applied to measure the test parameters of the memory at low temperature and high voltage. Finally, the memory is switched to a very low temperature environment, and a very low voltage is applied to measure the test parameters of the memory at low temperature and low voltage. Thereby, four test parameters are recorded one by one, so that the memory completes the four corner test.

However, since it is necessary to constantly change the environment in which the memory is placed when performing the four-corner test, it is extremely time-consuming to perform the four-corner test. In addition, testers need to record test parameters one by one, so it is cumbersome for testers to perform four-corner tests.

In view of the prior art, people need to constantly change the environment in which memory is placed, thus making the four-corner test more time consuming. question. In addition, testers need to record test parameters one by one, thus increasing the complexity of the test.

In order to solve the problems of the prior art, the present invention adopts the necessary technical means to provide a critical test condition control device for an electronic component. The critical test condition control device of the electronic component is configured to detect a plurality of test parameters generated when at least one electronic component operates under a critical test rule. The critical test rule includes at least one critical test condition, each critical test condition including a critical temperature and a threshold voltage. The critical test condition control device of the electronic component comprises an electronic component setting module, a temperature regulating module, a voltage regulating module and an electronic component testing module.

The electronic component setting module comprises a substrate, at least one electronic component setting unit and at least one component cover. The substrate defines at least one test area. The electronic component setting units are respectively disposed in the test area for electrically connecting the electronic components. The component covers respectively cover the test area, and at least one closed temperature control space is enclosed with the substrate, and each temperature control space has an instantaneous temperature.

The temperature control module includes at least one temperature sensing unit, a temperature processing unit, a cooling unit and a heating unit. The temperature sensing units are respectively disposed in the temperature control space for sensing the instantaneous temperature of each temperature control space and generating at least one temperature signal corresponding to the temperature control space. The temperature processing unit is electrically connected to the temperature sensing unit for generating a cooling signal or a heating signal corresponding to each temperature control space according to the critical test condition and each temperature signal corresponding to each temperature control space.

The cooling unit is electrically connected to the temperature processing unit and connected The temperature control space is configured to reduce the instantaneous temperature of each temperature control space to a critical temperature of each critical test condition when receiving the temperature drop signal corresponding to each temperature control space. The heating unit is electrically connected to the temperature processing unit and thermally coupled to the temperature control space for raising the instantaneous temperature of the temperature control space to the critical temperature of each critical test condition when receiving the heating signal corresponding to each temperature control space .

The voltage regulation module is electrically connected to the electronic component setting unit, and supplies power to each electronic component with a threshold voltage of each critical test condition. The electronic component test module is electrically connected to the temperature processing unit and the voltage regulation module for generating a temperature control signal and a voltage control signal according to the critical test condition, thereby controlling the temperature control module and the voltage regulation module, and receiving the test The parameter produces an electronic component critical condition test data.

Based on the above-mentioned necessary technical means, an auxiliary technical means derived from the critical test condition control device of the above electronic component is that the heating unit comprises at least one ceramic heater. The ceramic heater is used to individually heat the temperature control space to increase the instantaneous temperature of the temperature control space. Wherein, the heating unit is coupled to the component cover.

Based on the above-mentioned necessary technical means, an auxiliary technical means derived from the critical test condition control device of the electronic component is that the cooling unit comprises at least one cooling gas communication pipe, a cooling gas generator and at least one communication pipe control valve. The cooling gas communication pipe communicates with the temperature control space. The cooling gas generator is connected to the cooling gas communication tube for generating a cooling gas. The communication pipe control valve is electrically connected to the temperature processing unit, and is respectively disposed in the cooling gas communication pipe for receiving the cooling signal When the communication pipe control valve is selectively turned on, the cooling gas flows from the cooling gas generator to the temperature control space via the cooling gas communication pipe, so that the instantaneous temperature of the temperature control space is lowered to the critical temperature of each critical test condition. Wherein, the cooling gas generator is a refrigerant cooling gas generator.

On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the critical test condition control device of the above electronic component is that a fan is disposed in each of the component cover bodies, thereby generating a temperature control when the component cover covers the test area. Airflow in the hood of the space flow.

On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the critical test condition control device of the above electronic component is that the electronic component setting module further comprises a connecting unit. The connecting unit is electrically connected to the electronic component setting unit, and is disposed on the substrate for electrically connecting to the voltage regulating module. The connection unit is an integrated circuit (I ² C) connection unit or a serial voltage identification (SVID) connection unit.

On the basis of the above-mentioned necessary technical means, one of the auxiliary technical means derived from the critical test condition control device of the above electronic component is that the voltage regulation module is disposed on the substrate, and the voltage regulation module is a voltage control circuit.

As described above, the critical test condition control device for the electronic component provided by the present invention is provided by placing the electronic component in the electronic component setting unit of the electronic component setting module, and placing the electronic component in the temperature control space. Then, the temperature control module adjusts the temperature control space to the critical temperature of each critical test condition, and the voltage regulation module applies a threshold voltage of each critical test condition to the electronic component, thereby making the electronic component Under critical test conditions. Finally, the test parameters are received through the electronic component test module, and the critical component test data of the electronic component is formed.

Compared with the prior art, in the critical test condition control device for the electronic component provided by the present invention, since the electronic component is disposed in the electronic component setting unit of the electronic component setting module, the four corner test of different critical test conditions is performed one by one, so there is no need Constantly changing the environment in which the memory is placed, thus solving the problem in the prior art, the four-corner test is time consuming. In addition, since the tester can judge the operating state and performance of the electronic component under the critical test condition by using the electronic component critical condition test data, it is not necessary to record the test parameters one by one, thereby solving the problem of reducing the complexity of the test.

100, 100a‧‧‧ critical test condition control device for electronic components

1, 1a‧‧‧Electronic component setting module

11‧‧‧Substrate

111‧‧‧Test area

12‧‧‧Electronic component setting unit

13‧‧‧Component cover

131‧‧‧ Cover vent

132‧‧‧Fan

14‧‧‧ Connection unit

2‧‧‧temperature control module

21‧‧‧Temperature sensing unit

22‧‧‧Temperature processing unit

23‧‧‧Cooling unit

231‧‧‧Cooling gas communication tube

232‧‧‧Cooling gas generator

233‧‧‧Valve components

2331‧‧‧Connected pipe control valve

24‧‧‧heating unit

241‧‧‧Ceramic heater

3, 3a‧‧‧ voltage regulation module

4‧‧‧Electronic component test module

200‧‧‧Electronic components

C1‧‧‧ temperature control signal

C2‧‧‧ voltage control signal

C3‧‧‧ Temperature signal

C4‧‧‧ cooling signal

C5‧‧‧heating signal

F1‧‧‧Cooling gas

F2‧‧‧ in-hood airflow

S‧‧‧ temperature control space

T‧‧‧ test parameters

The first figure shows a schematic diagram of a critical test condition control device for the electronic component provided by the first preferred embodiment of the present invention; the second figure shows the AA cross-sectional view of the first figure; A block diagram of a critical test condition control device for an electronic component provided by a preferred embodiment; a fourth block showing a control flow chart of a critical test condition control device for an electronic component provided by the first preferred embodiment of the present invention; and a fifth The figure shows a schematic diagram of a critical test condition control device for an electronic component provided by the second preferred embodiment of the present invention.

Please refer to the first to third figures. The first figure shows a schematic diagram of the critical test condition control device of the electronic component provided by the first preferred embodiment of the present invention; the second figure shows the AA profile of the first figure. BRIEF DESCRIPTION OF THE DRAWINGS The third drawing shows a block diagram of a critical test condition device for an electronic component provided by the first preferred embodiment of the present invention. As shown, the first preferred embodiment of the present invention provides a critical test condition control device 100 for an electronic component.

The critical test condition control device 100 of the electronic component is configured to detect four electronic components 200 (only one of which is labeled in the second figure, and only one of which is shown in the third figure) is generated when operating under a critical test rule. A plurality of test parameters T. Incidentally, in other embodiments, only one electronic component 200 can be tested. The critical test rule contains a plurality of critical test conditions. Each critical test condition includes a critical temperature and a threshold voltage. The critical test condition control device 100 of the electronic component comprises an electronic component setting module 1, a temperature control module 2, a voltage regulating module 3 and an electronic component testing module 4.

In the embodiment, the electronic component 200 is a computer memory. Preferably, the electronic component 200 is a dynamic random access memory (DRAM), but is not limited thereto. The test parameter T can be a first command delay (CMD Rate), a column address strobe (CAS), a row address strobe (RAS), a RAS to CAS delay (tRCD). ) or refers to the pre-charge time (RAS Precharge Time; tRP), but not limited to this.

The electronic component setting module 1 comprises a substrate 11 and four The electronic component setting unit 12 (here only one of which is labeled) and the four component covers 13 (only one of which is indicated here). The substrate 11 is divided into four test areas 111. In the embodiment, the substrate 11 is a circuit board, but it is not limited thereto in other embodiments. Each of the electronic component setting units 12 is disposed in each of the test areas 111. In this embodiment, each of the electronic component setting units 12 is a memory slot, but is not limited thereto in other embodiments.

Each of the component covers 13 covers each test area 111 and encloses four closed temperature control spaces S (here only one of them is indicated) with the substrate 11, and each temperature control space S has an instantaneous temperature. In addition, the component cover 13 defines a cover vent 131, and a fan 132 is disposed in the temperature control space S.

The temperature control module 2 includes four temperature sensing units 21 (only one of which is shown in the second figure, only one of which is shown in the third figure), a temperature processing unit 22, a cooling unit 23 and a heating unit 24 . Each of the temperature sensing units 21 is disposed in each of the test areas 111 and located in each of the temperature control spaces S. In other embodiments, the temperature sensing unit 21 can be disposed on the component cover 13 , but is not limited thereto. The temperature processing unit 22 is electrically connected to the temperature sensing unit 21. The temperature processing unit 22 can be a temperature control device or a temperature control chip, but is not limited thereto.

The cooling unit 23 includes four cooling gas communication tubes 231 (only one of which is labeled here), a cooling gas generator 232, and a valve assembly 233. The cooling gas communication pipe 231 is connected to the cover vent 131 and communicates with the temperature control space S. The cooling gas generator 232 communicates with the cooling gas communication pipe 231. In the present embodiment, the cooling gas generator 232 is cold. The medium cools the gas generator, but is not limited thereto in other embodiments.

Valve assembly 233 includes four communication tube control valves 2331 (only one of which is labeled herein). The communication pipe control valve 2331 is electrically connected to the temperature processing unit 22 and disposed in each of the cooling gas communication pipes 231. In other words, in the embodiment, the cooling unit 23 is a refrigerant gas cooling device, but in other embodiments, the cooling unit 23 may be a cooling wafer assembly, but not limited thereto. In the present embodiment, the communication pipe control valve 2331 is an electrically controlled valve, but is not limited thereto.

The heating unit 24 is electrically connected to the temperature processing unit 22 and thermally coupled to the temperature control space S, and includes four ceramic heaters 241 (only one of which is labeled here). Among them, the ceramic heater 241 is coupled to the module cover 13. Incidentally, in other embodiments, the ceramic heater 241 can be replaced with a heat generating wafer, but not limited thereto.

The voltage regulation module 3 is disposed on the substrate 11 and electrically connected to the electronic component setting unit 12 . In this embodiment, the voltage regulation module 3 is a voltage control circuit. Preferably, the voltage regulation module 3 is a Pulse Width Modulation (PWM) voltage control circuit. The electronic component test module 4 is electrically connected to the temperature processing unit 22 and the voltage regulation module 3. In this embodiment, the electronic component test module 4 can be a computer or a test host, but is not limited thereto in other embodiments.

Please refer to the third and fourth figures together. The fourth figure shows a control flow chart of the critical test condition device of the electronic component provided by the first preferred embodiment of the present invention. As shown in the figure, set in the electronic component 200 In the electronic component setting unit 12, and the electronic component 200 is placed in the temperature control space S, whereby the electronic component 200 is electrically connected to the electronic component setting unit 12, first, the critical test condition is set by the electronic component test module 4. And generating a temperature control signal C1 and a voltage control signal C2 according to each critical test condition, and transmitting the temperature control signal C1 to the temperature processing unit 22, and transmitting the voltage control signal C2 to the voltage regulation module 3 (ie, step S1).

Thereafter, the temperature sensing unit 21 senses the instantaneous temperature of each temperature control space S and generates a plurality of temperature signals C3 (ie, step S21). Next, the temperature processing unit 22 receives the temperature signal C3 and the temperature control signal C1, and generates a temperature drop signal C4 or a heating signal C5 according to the temperature signal C3 and the temperature control signal C1 (ie, step S22).

Then, when the temperature processing unit 22 transmits the temperature drop signal C4 to the cooling unit 23, the cooling unit 23 reduces the instantaneous temperature of each temperature control space S to the critical temperature of each critical test condition. In detail, the cooling gas generator 232 generates a cooling gas F1. When receiving the temperature drop signal C4, the communication pipe control valve 2331 selectively turns on the communication pipe control valve 2331 to cause the cooling gas F1 to flow from the cooling gas generator 232 to the temperature control space S via the cooling gas communication pipe 231, thereby The instantaneous temperature of the temperature control space S is lowered to the critical temperature of each critical test condition. Incidentally, since the module cover 13 covers the test area 111, the temperature control space S is isolated from the outside. Thereby, moisture outside the component cover 13 is prevented from condensing on the low-temperature electronic component 200, and the electronic component 200 is prevented from being damaged by moisture.

When the temperature processing unit 22 transmits the heating signal C5 to the heating unit 24, the heating unit 24 adds the instantaneous temperature of each temperature control space S. Heat to the critical temperature of each critical test condition. When receiving the heating signal C5 corresponding to the temperature control space S, the heating unit 24 raises the instantaneous temperature of each temperature control space S to the critical temperature of each critical test condition (ie, step S23). Among them, the ceramic heater 241 uniformly heats the temperature control space S. In addition, the fan 132 generates a hood airflow F2 flowing in the temperature control space S when the component cover 13 covers the test area 111, so that the cooling unit 23 is in the temperature control space S or the heating unit 24 is in the temperature control space S. When heated, the temperature distribution in the temperature control space S is made uniform.

At the same time, when the voltage control module 3 receives the voltage control signal C2, the voltage regulation module 3 supplies power to the electronic component 200 according to the threshold voltage (ie, step S24), so that the electronic component 200 reaches the critical test condition and generates the test parameter T. (ie step S25). That is to say, the voltage regulation module 3 and the temperature control module 2 cause the electronic components 200 in the four temperature control spaces S to be in four different or the same states according to the critical test conditions. These four different states are high temperature and conduct high voltage, low temperature and conduct high voltage, high temperature and conduct low voltage and low temperature and turn on low voltage. Thereby, the electronic component 200 can simultaneously generate individual test parameters T in four different or identical states.

Finally, after repeating the test several times and causing the electronic component test module 4 to receive the plurality of test parameters T, the electronic component test module 4 establishes an electronic component critical condition test data according to the test parameter T (ie, step S3). The tester can judge the performance and operation state of the electronic component 200 under the four conditions of high temperature and high voltage, low temperature and high voltage, high temperature and low voltage and low temperature and low voltage conduction by the electronic component critical condition test data. Thereby completing the electronic components Four corner test.

Please refer to FIG. 5, which is a schematic diagram showing a critical test condition control device for an electronic component according to a second preferred embodiment of the present invention. As shown, the second preferred embodiment of the present invention provides a critical test condition control device 100a for an electronic component. The architecture of the critical test condition control device 100a of the electronic component is approximately the same as that of the critical test condition control device 100 of the electronic component of the first preferred embodiment of the present invention.

The difference is that the electronic component setting module 1a further includes a connecting unit 14. The connecting unit 14 is electrically connected to the electronic component setting unit 12 and disposed on the substrate 11 . In the present embodiment, the connection unit 14 is an integrated circuit (I ² C) connection unit or a serial voltage identification (SVID) connection unit, but is not limited thereto. The voltage regulation module 3a is an external voltage control circuit. The voltage regulation module 3a is electrically connected to the connection unit 14 by being connected to the connection unit 14. Thereby, the voltage regulation module 3a is powered to the electronic component 200 (labeled in the second and third figures).

In summary, in the critical test condition control device provided by the first preferred embodiment and the second preferred embodiment of the present invention, four electronic components are simultaneously mounted to the electronic component setting unit, and the electronic components are assembled. Located in the temperature control space. Next, the electronic component is at a critical temperature and a threshold voltage, thereby causing the electronic component to generate test parameters under critical test conditions. The electronic component test module receives the test parameters and tests the data according to the critical conditions for forming the electronic components.

Compared with the prior art, in the critical test condition control device provided by the first preferred embodiment and the second preferred embodiment of the present invention, the electronic components can be known to be high temperature and turned on one by one without moving the electronic components. The high-voltage, low-temperature and high-voltage, high-temperature and low-voltage and low-temperature conduction and low-voltage conduction performance and operating state, thus solving the need in the prior art, people need to constantly change the environment of memory placement And making the four corner test more time consuming.

In addition, the critical test condition control device provided by the first preferred embodiment and the second preferred embodiment of the present invention has the electronic component critical condition test data, so that the tester does not need to record the test parameters one by one, thereby reducing the complexity of the test. The problem.

The features and spirit of the present invention are more clearly described in the above detailed description of the preferred embodiments, and the scope of the present invention is not limited by the preferred embodiments disclosed herein. On the contrary, it is intended to cover all kinds of changes and equivalences within the scope of the patent application to which the present invention is intended.

100‧‧‧ Critical test condition control device for electronic components

1‧‧‧Electronic component setting module

11‧‧‧Substrate

111‧‧‧Test area

13‧‧‧Component cover

22‧‧‧Temperature processing unit

23‧‧‧Cooling unit

231‧‧‧Cooling gas communication tube

232‧‧‧Cooling gas generator

233‧‧‧Valve components

2331‧‧‧Connected pipe control valve

241‧‧‧Ceramic heater

3‧‧‧Voltage control module

4‧‧‧Electronic component test module

Claims (10)

A critical test condition control device for an electronic component is configured to detect a plurality of test parameters generated when at least one electronic component operates under a critical test rule, the critical test rule including at least one critical test condition, each of the at least one The critical test condition includes a critical temperature and a threshold voltage. The critical test condition control device of the electronic component comprises: an electronic component setting module, comprising: a substrate, the at least one test area is divided; and at least one electronic component setting unit Provided in the at least one test area for electrically connecting the at least one electronic component; and at least one component cover covering the at least one test area and surrounding the substrate at least one closed a temperature control space, each of the at least one temperature control space has an instantaneous temperature; a temperature control module, comprising: at least one temperature sensing unit, respectively disposed in the at least one temperature control space, for sensing each of the At least one temperature of the temperature control space, and generating at least one temperature signal corresponding to the at least one temperature control space; The processing unit is electrically connected to the at least one temperature sensing unit for generating corresponding at least one temperature control according to the at least one critical test condition and each of the at least one temperature signal corresponding to each of the at least one temperature control space One of a cooling signal and a heating signal; a cooling unit electrically connected to the temperature processing unit and connected And the at least one temperature control space is configured to reduce the instantaneous temperature of each of the at least one temperature control space to each of the at least one critical test condition when receiving the temperature decrease signal corresponding to each of the at least one temperature control space And the heating unit is electrically connected to the temperature processing unit and is thermally coupled to the at least one temperature control space for receiving the heating signal corresponding to each of the at least one temperature control space. And increasing the instantaneous temperature of the at least one temperature control space to the critical temperature of each of the at least one critical test condition; a voltage regulation module electrically connected to the electronic component setting units, and each of the at least one threshold The threshold voltage of the test condition supplies power to each of the at least one electronic component; and an electronic component test module electrically connected to the temperature processing unit and the voltage regulation module for generating one according to the at least one critical test condition a temperature control signal and a voltage control signal for controlling the temperature control module and the voltage regulation module, and receiving the test parameters to generate an electronic component threshold Pieces of test data. The critical test condition control device for an electronic component according to claim 1, wherein the heating unit comprises at least one ceramic heater, wherein the at least one ceramic heater is used to separately heat the at least one temperature control space. Increasing the instantaneous temperature of the at least one temperature control space. The critical test condition control device for an electronic component according to claim 1, wherein the heating unit is coupled to the One less component cover. The critical test condition control device for an electronic component according to claim 1, wherein the cooling unit comprises: at least one cooling gas communication tube connected to the at least one temperature control space; and a cooling gas generator Connecting the at least one cooling gas communication tube for generating a cooling gas; and at least one communication tube control valve electrically connected to the temperature processing unit and respectively disposed on the at least one cooling gas communication tube for receiving And the at least one communication pipe control valve is selectively turned on to cause the cooling gas to flow from the cooling gas generator to the at least one temperature control space via the at least one cooling gas communication pipe, so that the at least one control The instantaneous temperature of the warm space is reduced to the critical temperature of each of the at least one critical test condition. The critical test condition control device for an electronic component according to claim 4, wherein the cooling gas generator is a refrigerant cooling gas generator. The critical test condition control device of the electronic component of claim 1, wherein the at least one component cover body is provided with a fan, so that when the at least one component cover covers the at least one test area, a The airflow in the hood that flows in each of the at least one temperature control space. The critical component condition control device of the electronic component of claim 1, wherein the electronic component setting module further comprises a connecting unit electrically connected to the electronic component setting unit and configured The substrate is electrically connected to the voltage regulation module. The critical test condition control device for an electronic component according to claim 7, wherein the connection unit is an integrated circuit (I ² C) connection unit and serial tantalum voltage identification ( Serial Voltage Identification; SVID) One of the connection units. The critical test condition control device for an electronic component according to claim 1, wherein the voltage regulation module is disposed on the substrate. The critical test condition control device for an electronic component according to claim 1, wherein the voltage regulation module is a voltage control circuit.