TWM548361U - Supporting structure and light-emitting device using the same - Google Patents

Supporting structure and light-emitting device using the same Download PDF

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Publication number
TWM548361U
TWM548361U TW106207653U TW106207653U TWM548361U TW M548361 U TWM548361 U TW M548361U TW 106207653 U TW106207653 U TW 106207653U TW 106207653 U TW106207653 U TW 106207653U TW M548361 U TWM548361 U TW M548361U
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Taiwan
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bracket
opening
support structure
hole
covered
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TW106207653U
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Chinese (zh)
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黃國益
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黃國益
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Priority to TW106207653U priority Critical patent/TWM548361U/en
Publication of TWM548361U publication Critical patent/TWM548361U/en

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Abstract

A supporting structure includes a first lead, a second lead, and a body. Each of the first lead and the second lead includes a metal material, in which the first lead is electrically isolated from the second lead. The body includes a non-metal material, and the first and second leads are embedded in the body. The body includes a first opening and a first via. A portion of the first lead and a portion of the second lead are together exposed from the first opening, and another portion of the first lead is exposed from the first via. The first opening and the first via are communicated with each other through at least one air gap which is located between the body and the first lead.

Description

支撐結構以及使用其的發光裝置 Support structure and illuminating device using same

本明是關於一種支撐結構以及使用其的發光裝置。 The present invention relates to a support structure and a light-emitting device using the same.

近年來,發光二極體(light-emitting diode;LED)已經廣泛被使用於一般照明和商業照明的應用之中。當作為光源使用時,發光二極體具有許多優點,例如較低的能量消耗、較長的壽命,更小的尺寸與更快速的開關切換。因此,發光二極體已經逐漸取代白熾光源做為光源使用,並組裝在不同的產品上應用。而在組裝發光二極體時,其會先配置在支撐結構,接著,再將封裝膠填入。對此,在支撐結構、發光二極體、及封裝膠三者間的接合關係將會影響到產品的良率及性能表現。 In recent years, light-emitting diodes (LEDs) have been widely used in general lighting and commercial lighting applications. When used as a light source, the light-emitting diode has many advantages, such as lower energy consumption, longer life, smaller size and faster switching. Therefore, the light-emitting diode has gradually replaced the incandescent light source as a light source and assembled for use in different products. When the light-emitting diode is assembled, it is first placed in the support structure, and then the encapsulant is filled. In this regard, the bonding relationship between the support structure, the light-emitting diode, and the encapsulant will affect the yield and performance of the product.

本創作之一實施方式提供一種支撐結構,包含第一支架、第二支架及本體。第一支架包含金屬材料。第二支架包含金屬材料,其中第一支架與第二支架彼此電性絕緣。本體 包含非金屬材料,並包覆第一支架及第二支架。本體包含第一開口以及第一通孔。第一支架的一部分及第二支架的一部分共同自第一開口裸露,且第一支架的另一部分自第一通孔裸露,其中第一開口與第一通孔透過存在於本體與第一支架之間的至少一第一氣隙而彼此相連通。 One embodiment of the present invention provides a support structure including a first bracket, a second bracket, and a body. The first bracket contains a metallic material. The second bracket includes a metal material, wherein the first bracket and the second bracket are electrically insulated from each other. Ontology The non-metallic material is included and covers the first bracket and the second bracket. The body includes a first opening and a first through hole. A portion of the first bracket and a portion of the second bracket are commonly exposed from the first opening, and another portion of the first bracket is exposed from the first through hole, wherein the first opening and the first through hole are transmitted through the body and the first bracket At least one first air gap therebetween is in communication with each other.

本創作之一實施方式提供一種發光裝置,包含支撐結構、發光元件以及封裝膠。發光元件設置於第一開口內,並包含第一電極及第二電極,其中第一電極及第二電極分別電性連接於第一支架及第二支架。封裝膠設置於第一開口內,並包覆發光元件。 One embodiment of the present invention provides a light emitting device comprising a support structure, a light emitting element, and an encapsulant. The illuminating element is disposed in the first opening and includes a first electrode and a second electrode, wherein the first electrode and the second electrode are electrically connected to the first bracket and the second bracket, respectively. The encapsulant is disposed in the first opening and covers the light emitting component.

100A、100B、100C、100D‧‧‧支撐結構 100A, 100B, 100C, 100D‧‧‧ support structure

110‧‧‧第一支架 110‧‧‧First bracket

112‧‧‧第二支架 112‧‧‧second bracket

114A、114B、114C、114D、114E、114F‧‧‧支架 114A, 114B, 114C, 114D, 114E, 114F‧‧‧ bracket

116‧‧‧第一溝槽 116‧‧‧First groove

118‧‧‧第二溝槽 118‧‧‧Second trench

120‧‧‧本體 120‧‧‧ body

122‧‧‧第一開口 122‧‧‧ first opening

124‧‧‧第二開口 124‧‧‧second opening

126‧‧‧第三開口 126‧‧‧ third opening

128‧‧‧第一通孔 128‧‧‧First through hole

130‧‧‧第二通孔 130‧‧‧Second through hole

132‧‧‧隔離部 132‧‧‧Isolation Department

200‧‧‧發光裝置 200‧‧‧Lighting device

210‧‧‧發光元件 210‧‧‧Lighting elements

212‧‧‧第一電極 212‧‧‧First electrode

214‧‧‧第二電極 214‧‧‧second electrode

220‧‧‧封裝膠 220‧‧‧Package

1-1’、2-2’‧‧‧線段 1-1’, 2-2’‧‧‧ segments

D1‧‧‧方向 D1‧‧ Direction

G1‧‧‧第一氣隙 G1‧‧‧First air gap

G2‧‧‧第二氣隙 G2‧‧‧Second air gap

S1‧‧‧第一上表面 S1‧‧‧ first upper surface

S2‧‧‧第一下表面 S2‧‧‧ first lower surface

S3‧‧‧第二上表面 S3‧‧‧Second upper surface

S4‧‧‧第二下表面 S4‧‧‧Second lower surface

S5‧‧‧第三上表面 S5‧‧‧ third upper surface

S6‧‧‧第三下表面 S6‧‧‧ third lower surface

第1A圖為依據本揭露內容的第一實施方式繪示支撐結構的立體示意圖。 FIG. 1A is a perspective view showing a support structure according to a first embodiment of the present disclosure.

第1B圖繪示第1A圖的支撐結構的上視示意圖。 FIG. 1B is a top plan view showing the support structure of FIG. 1A.

第1C圖繪示第1B圖的線段1-1’的剖面示意圖。 Fig. 1C is a schematic cross-sectional view showing a line segment 1-1' of Fig. 1B.

第1D圖繪示第1A圖的支撐結構的下視示意圖。 FIG. 1D is a schematic bottom view showing the support structure of FIG. 1A.

第1E圖為依據本揭露內容的部分實施方式繪示支撐結構的下視示意圖。 FIG. 1E is a schematic bottom view showing a support structure according to some embodiments of the disclosure.

第1F圖為使用第1A圖的支撐結構所成的發光裝置的剖面示意圖。 Fig. 1F is a schematic cross-sectional view showing a light-emitting device formed using the support structure of Fig. 1A.

第2A圖為依據本揭露內容的第二實施方式繪示支撐結構的上視示意圖。 FIG. 2A is a schematic top view showing the support structure according to the second embodiment of the disclosure.

第2B圖繪示第2A圖的線段2-2’的剖面示意圖。 Fig. 2B is a schematic cross-sectional view showing the line segment 2-2' of Fig. 2A.

第3A圖為依據本揭露內容的第三實施方式繪示支撐結構的上視示意圖。 FIG. 3A is a top view showing the support structure according to the third embodiment of the disclosure.

第3B圖為繪示第3A圖的第一支架的立體示意圖。 FIG. 3B is a perspective view showing the first bracket of FIG. 3A.

第3C圖為繪示沿第3B圖的方向D1看向第一支架的正視示意圖。 FIG. 3C is a front elevational view showing the first bracket viewed in the direction D1 of FIG. 3B.

第4圖為依據本揭露內容的第四實施方式繪示支撐結構的上視示意圖。 4 is a top plan view showing a support structure according to a fourth embodiment of the present disclosure.

以下將以圖式揭露本創作之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本創作。也就是說,在本創作部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 In the following, a plurality of embodiments of the present invention will be disclosed in the drawings. For the sake of clarity, a number of practical details will be described in the following description. However, it should be understood that these practical details are not applied to limit the creation. That is to say, in the implementation part of this creation, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

在本文中,使用第一、第二與第三等等之詞彙,是用於描述各種元件、組件、區域、層是可以被理解的。但是這些元件、組件、區域、層不應該被這些術語所限制。這些詞彙只限於用來辨別單一元件、組件、區域、層。因此,在下文中的一第一元件、組件、區域、層也可被稱為第二元件、組件、區域、層,而不脫離本創作的本意。 The words "first, second, third, etc." are used herein to describe various elements, components, regions, and layers. However, these elements, components, regions, and layers should not be limited by these terms. These terms are used to identify a single element, component, region, or layer. Thus, a singular element, component, region, or layer may also be referred to as a second element, component, region, or layer, without departing from the spirit of the present invention.

請參照第1A圖、第1B圖、第1C圖及第1D圖,其中第1A圖為依據本揭露內容的第一實施方式繪示支撐結構 100A的立體示意圖,第1B圖繪示第1A圖的支撐結構100A的上視示意圖,而第1C圖繪示第1B圖的線段1-1’的剖面示意圖。支撐結構100A包含第一支架110、第二支架112及本體120,且支撐結構100A可用以做為電子元件(未繪示)的支撐結構,其中電子元件例如可以是發光二極體晶片或發光二極體元件。 Please refer to FIG. 1A , FIG. 1B , FIG. 1C and FIG. 1D , wherein FIG. 1A illustrates the support structure according to the first embodiment of the disclosure. FIG. 1B is a schematic top view of the support structure 100A of FIG. 1A, and FIG. 1C is a cross-sectional view of the line segment 1-1' of FIG. 1B. The supporting structure 100A includes a first bracket 110, a second bracket 112 and a body 120, and the supporting structure 100A can be used as a supporting structure of an electronic component (not shown), wherein the electronic component can be, for example, a light emitting diode chip or a light emitting diode. Polar body component.

第一支架110以及第二支架112包含金屬材料,且第一支架110與第二支架112彼此電性絕緣。舉例而言,第一支架110以及第二支架112可由金屬構成,或者是說,第一支架110以及第二支架112可以是由相同或相異的金屬材料構成,例如像是銅、銅合金、黃銅或鐵等。 The first bracket 110 and the second bracket 112 comprise a metal material, and the first bracket 110 and the second bracket 112 are electrically insulated from each other. For example, the first bracket 110 and the second bracket 112 may be made of metal, or the first bracket 110 and the second bracket 112 may be made of the same or different metal materials, such as copper, copper alloy, Brass or iron.

本體120包含非金屬材料,例如像是可以由PPA樹脂、熱硬化性樹脂類材料(如EMC)或熱塑性樹脂類材料(如PCT)構成,並包覆第一支架110及第二支架112。亦即,本體120可透過限制第一支架110及第二支架112的移動,而將第一支架110及第二支架112固定於其內。亦即,本體120相對第一支架110及第二支架112的固定關係可視為一種結構性咬合。因此,本體120與支架之間可能會存有氣隙,例如,如第1C圖所示,本體120與第一支架110之間會存在有第一氣隙G1,或者,本體120與第二支架112之間會存在有第二氣隙G2。 The body 120 includes a non-metallic material such as, for example, a PPA resin, a thermosetting resin-based material (such as EMC), or a thermoplastic resin-based material (such as PCT), and covers the first holder 110 and the second holder 112. That is, the body 120 can fix the first bracket 110 and the second bracket 112 therein by restricting the movement of the first bracket 110 and the second bracket 112. That is, the fixed relationship of the body 120 relative to the first bracket 110 and the second bracket 112 can be regarded as a structural engagement. Therefore, there may be an air gap between the body 120 and the bracket. For example, as shown in FIG. 1C, there may be a first air gap G1 between the body 120 and the first bracket 110, or the body 120 and the second bracket. There will be a second air gap G2 between 112.

本體120包含第一開口122、第二開口124、第三開口126、第一通孔128及第二通孔130。第一開口122與第二開口124相連通,且第一開口122也與第三開口126相連通,其中第二開口124以及第三開口126分別位於第一開口122的相 對兩側。 The body 120 includes a first opening 122 , a second opening 124 , a third opening 126 , a first through hole 128 , and a second through hole 130 . The first opening 122 is in communication with the second opening 124, and the first opening 122 is also in communication with the third opening 126, wherein the second opening 124 and the third opening 126 are respectively located in the phase of the first opening 122. On both sides.

第一支架110的一部分及第二支架112的一部分會共同自第一開口122裸露。具體而言,如第1C圖所示,包覆於本體120內的第一支架110會具有第一上表面S1及第一下表面S2,而包覆於本體120內的第二支架112會具有第二上表面S3及第二下表面S4,其中第一開口122暴露出第一支架110的第一上表面S1的一部分以及第二支架112的第二上表面S3的一部分。此外,第一支架110及第二支架112可由本體120的一部分而達成電性隔離,例如,如第1C圖的本體120的第一開口122內所示,第一支架110及第二支架112可由本體120的隔離部132而達成電性隔離。 A portion of the first bracket 110 and a portion of the second bracket 112 are collectively exposed from the first opening 122. Specifically, as shown in FIG. 1C, the first bracket 110 wrapped in the body 120 has a first upper surface S1 and a first lower surface S2, and the second bracket 112 wrapped in the body 120 has The second upper surface S3 and the second lower surface S4, wherein the first opening 122 exposes a portion of the first upper surface S1 of the first bracket 110 and a portion of the second upper surface S3 of the second bracket 112. In addition, the first bracket 110 and the second bracket 112 can be electrically isolated by a portion of the body 120. For example, as shown in the first opening 122 of the body 120 of FIG. 1C, the first bracket 110 and the second bracket 112 can be The isolation portion 132 of the body 120 is electrically isolated.

另一方面,第一支架110可透過第二開口124自本體120的內部朝本體120的外部延伸,而第二支架112可透過第三開口126自本體120的內部朝本體120的外部延伸,其中朝本體120的外部延伸的第一支架110及第二支架112可透過彎折而再回到本體120的底部,像是如第1C圖及第1D圖所示,其中第1D圖繪示第1A圖的支撐結構100A的下視示意圖。 On the other hand, the first bracket 110 can extend from the interior of the body 120 to the outside of the body 120 through the second opening 124, and the second bracket 112 can extend from the interior of the body 120 to the outside of the body 120 through the third opening 126, wherein The first bracket 110 and the second bracket 112 extending toward the outside of the body 120 can be returned to the bottom of the body 120 by bending, as shown in FIG. 1C and FIG. 1D, wherein FIG. 1D shows the first 1A. A schematic bottom view of the support structure 100A of the drawing.

除此之外,支架也可以是以陣列的形式排列,像是如第1E圖所示,其中第1E圖為依據本揭露內容的部分實施方式繪示支撐結構的下視示意圖。第1E圖中,六個支架114A、114B、114C、114D、114E及114F分別以陣列形式排列於本體120,且各支架114A、114B、114C、114D、114E及114F彼此為電性絕緣。 In addition, the brackets may also be arranged in an array, as shown in FIG. 1E, wherein FIG. 1E is a schematic view showing a support structure according to a part of the embodiment of the disclosure. In FIG. 1E, six brackets 114A, 114B, 114C, 114D, 114E, and 114F are respectively arranged in an array in the body 120, and each of the brackets 114A, 114B, 114C, 114D, 114E, and 114F is electrically insulated from each other.

請再回到第1C圖。本體120的第一通孔128以及 第二通孔130分別位於第一支架110以及第二支架112的上側,且其分別裸露出第一支架110以及第二支架112。具體而言,本體120具有第三上表面S5,其中第一開口122可視為自本體120的第三上表面S5朝本體120的內部延伸,並延伸至第一支架110以及第二支架112所在之處,而第一通孔128以及第二通孔130也同樣是自本體120的第三上表面S5朝本體120的內部延伸,並分別延伸至第一支架110以及第二支架112所在之處。亦即,第一支架110的第一上表面S1的另一部分會自第一通孔128裸露出來,而第二支架112的第二上表面S3的另一部分會自第二通孔130裸露出來。 Please return to Figure 1C. a first through hole 128 of the body 120 and The second through holes 130 are respectively located on the upper sides of the first bracket 110 and the second bracket 112, and respectively expose the first bracket 110 and the second bracket 112. Specifically, the body 120 has a third upper surface S5, wherein the first opening 122 can be seen to extend from the third upper surface S5 of the body 120 toward the inside of the body 120 and extend to the first bracket 110 and the second bracket 112. The first through hole 128 and the second through hole 130 also extend from the third upper surface S5 of the body 120 toward the inside of the body 120 and extend to the first bracket 110 and the second bracket 112 respectively. That is, another portion of the first upper surface S1 of the first bracket 110 may be exposed from the first through hole 128, and another portion of the second upper surface S3 of the second bracket 112 may be exposed from the second through hole 130.

第一通孔128可透過存在於本體120與第一支架110之間的第一氣隙G1,而與第一開口122彼此相連通,同樣地,第二通孔130也可透過存在於本體120與第二支架112之間的第二氣隙G2,而與第一開口122彼此相連通。在此,透過「氣隙」而相連通的開口與通孔所指為,自開口進入的流體(例如水氣)可自通孔離開,或是,自通孔進入的流體也可自開口離開。另一方面,由於第一開口122有與第二開口124以及第三開口126連通,故第一通孔128與第二開口124也可透過第一氣隙G1而彼此相連通,且第二通孔130與第三開口126也同樣可透過第二氣隙G2而彼此相連通。 The first through hole 128 can communicate with the first opening 122 through the first air gap G1 existing between the body 120 and the first bracket 110. Similarly, the second through hole 130 can also exist through the body 120. The second air gap G2 between the second bracket 112 and the first opening 122 communicate with each other. Here, the opening and the through hole that communicate through the "air gap" mean that a fluid (for example, moisture) entering from the opening can be separated from the through hole, or a fluid entering from the through hole can also be separated from the opening. . On the other hand, since the first opening 122 is in communication with the second opening 124 and the third opening 126, the first through hole 128 and the second opening 124 can also communicate with each other through the first air gap G1, and the second pass The hole 130 and the third opening 126 are also communicated with each other through the second air gap G2.

透過上述配置,當支撐結構100A有升溫需求的時候,第一通孔128以及第二通孔130可做為支撐結構100A的洩壓孔。具體而言,當支撐結構100A於製程中因受熱而升溫時,存在於支撐結構100A的氣隙內的流體(例如水氣)可會因 受熱而蒸發且膨脹,並自支撐結構100A向外逸出,此時,存在於氣隙內的流體可透過第一通孔128以及第二通孔130而自支撐結構100A向外逸出,藉以防止逸出的流體於製程中產生不預期的破壞,從而增加支撐結構100A於所進行的製程中的可靠度及良率。 Through the above configuration, when the support structure 100A has a heating demand, the first through hole 128 and the second through hole 130 can serve as pressure relief holes of the support structure 100A. Specifically, when the support structure 100A is heated by heat during the process, the fluid (for example, moisture) existing in the air gap of the support structure 100A may be caused by Evaporating and expanding by heat, and escaping outward from the support structure 100A. At this time, the fluid existing in the air gap can escape from the support structure 100A through the first through hole 128 and the second through hole 130, thereby The escaped fluid is prevented from producing undesired damage during the process, thereby increasing the reliability and yield of the support structure 100A during the process being performed.

舉例來說,請看到第1F圖,其中第1F圖為使用第1A圖的支撐結構100A所成的發光裝置200的剖面示意圖,且第1F圖的剖面位置與第1C圖的剖面相同。第1F圖中,發光裝置包含第1A圖的支撐結構100A、發光元件210以及封裝膠220,其中發光元件210可以是發光二極體元件。發光元件210設置於第一開口122內,並包含第一電極212及第二電極214,其中第一電極212及第二電極214分別電性連接於第一支架110及第二支架112。亦即,包含金屬材料的第一支架110及第二支架112可做為支撐結構100A的電性連接部,使得當有外加電壓分別施加於第一支架110及第二支架112時,發光元件210可藉此而被導通。封裝膠220設置於第一開口122內,並包覆發光元件210,其中封裝膠220的材料可以包含環氧樹脂。 For example, please refer to FIG. 1F. FIG. 1F is a schematic cross-sectional view of the light-emitting device 200 formed by using the support structure 100A of FIG. 1A, and the cross-sectional position of the first F-figure is the same as that of the first C-figure. In FIG. 1F, the light-emitting device includes the support structure 100A of FIG. 1A, the light-emitting element 210, and the encapsulant 220, wherein the light-emitting element 210 may be a light-emitting diode element. The light emitting device 210 is disposed in the first opening 122 and includes a first electrode 212 and a second electrode 214. The first electrode 212 and the second electrode 214 are electrically connected to the first bracket 110 and the second bracket 112 respectively. That is, the first bracket 110 and the second bracket 112 including the metal material can be used as the electrical connection portion of the support structure 100A, so that when an applied voltage is applied to the first bracket 110 and the second bracket 112, respectively, the light-emitting element 210 It can be turned on by this. The encapsulant 220 is disposed in the first opening 122 and covers the light emitting element 210. The material of the encapsulant 220 may include an epoxy resin.

透過以上配置,當進行與支撐結構100A相關的製程(例如像是進行表面貼焊製程(surface mount technology process)時,若所進行的製程有升溫需求,則存在於支撐結構100A氣隙內的流體(例如水氣)可於製程中透過第一通孔128以及第二通孔130而自支撐結構100A向外逸出,藉以防止逸出的流體是從第一開口122逸出,從而防止此些流體對所第一開口122內的發光元件210或封裝膠220產生不預期的破壞。舉 例來說,若逸出的流體是從第一開口122逸出,發光元件210與第一支架110或第二支架112間的貼合會受到影響,並使發光裝置200的色溫或亮度產生改變,或者,封裝膠220將也可能會形成破洞,並使得發光裝置200的使用壽命降低。因此,藉由設置第一通孔128或第二通孔130,可增加發光裝置200於製程中的可靠度及良率,並進一步提升發光裝置200的使用壽命。 Through the above configuration, when the process related to the support structure 100A is performed (for example, when performing a surface mount technology process, if the process performed has a heating demand, the fluid existing in the air gap of the support structure 100A) (eg, moisture) may escape from the support structure 100A through the first through hole 128 and the second through hole 130 during the process, thereby preventing the escaped fluid from escaping from the first opening 122, thereby preventing such The fluid produces an undesired damage to the light-emitting element 210 or the encapsulant 220 in the first opening 122. For example, if the escaped fluid escapes from the first opening 122, the bonding between the light-emitting element 210 and the first bracket 110 or the second bracket 112 is affected, and the color temperature or brightness of the light-emitting device 200 is changed. Alternatively, the encapsulant 220 may also form holes and reduce the useful life of the light emitting device 200. Therefore, by providing the first through hole 128 or the second through hole 130, the reliability and the yield of the light emitting device 200 in the process can be increased, and the service life of the light emitting device 200 can be further improved.

另一方面,本實施方式的支撐結構100A可藉由以下步驟形成。首先,利用非金屬材料包覆金屬製成的支架(例如前述的第一支架110或第二支架112),並將非金屬材料固化為前述所提的本體120,藉以形成支撐結構100A,其中非金屬材料可以是如前述所提的PPA樹脂、熱硬化性樹脂類材料(如EMC)或熱塑性樹脂類材料(如PCT)。於形成本體120後,再於本體120形成開口(例如前述的第一開口122),以裸露出支架的一部分。接著,於支撐結構100A的本體120形成通孔(例如前述的第一通孔128或第二通孔130),以裸露支架的另一部分,其中形成開口的步驟與形成通孔的步驟是透過對本體120的同一表面加工而成。此外,於其他實施方式中,形成開口的步驟與形成通孔的步驟也可以是同時進行。也就是說,形成開口的步驟與形成通孔的步驟可視為互相獨立。 On the other hand, the support structure 100A of the present embodiment can be formed by the following steps. First, a metal-made bracket (for example, the first bracket 110 or the second bracket 112 described above) is coated with a non-metal material, and the non-metal material is solidified into the aforementioned body 120, thereby forming a support structure 100A. The metal material may be a PPA resin, a thermosetting resin-based material (such as EMC) or a thermoplastic resin-based material (such as PCT) as mentioned above. After forming the body 120, an opening (such as the aforementioned first opening 122) is formed in the body 120 to expose a portion of the bracket. Next, a through hole (for example, the aforementioned first through hole 128 or the second through hole 130) is formed in the body 120 of the support structure 100A to expose another portion of the bracket, wherein the step of forming the opening and the step of forming the through hole are through The same surface of the body 120 is machined. Further, in other embodiments, the step of forming the opening and the step of forming the through hole may also be performed simultaneously. That is, the step of forming the opening and the step of forming the through hole can be regarded as being independent of each other.

請再看到第2A圖及第2B圖,其中第2A圖為依據本揭露內容的第二實施方式繪示支撐結構100B的上視示意圖,而第2B圖繪示第2A圖的線段2-2’的剖面示意圖。本實施方式與第一實施方式的至少一個差異點在於,本實施方式的本 體120的第一通孔128以及第二通孔130分別是位於第一支架110以及第二支架112的下側,然而,第一通孔128以及第二通孔130仍分別裸露出第一支架110以及第二支架112。具體而言,本體120具有相對的第三上表面S5以及第三下表面S6,其中第一開口122視為自本體120的第三上表面S5朝本體120的內部延伸,並延伸至第一支架110及第二支架112所在之處,而第一通孔128以及第二通孔130為自本體120的第三下表面S6朝本體120的內部延伸,並分別延伸至第一支架110及第二支架112所在之處。亦即,第一支架110的第一下表面S2的一部分會自第一通孔128裸露出來,而第二支架112的第二下表面S4的一部分會自第二通孔130裸露出來。 2A and 2B, wherein FIG. 2A is a top view of the support structure 100B according to the second embodiment of the present disclosure, and FIG. 2B is a line 2-2 of FIG. 2A. 'The schematic diagram of the section. At least one difference between this embodiment and the first embodiment lies in the present embodiment. The first through hole 128 and the second through hole 130 of the body 120 are respectively located on the lower side of the first bracket 110 and the second bracket 112. However, the first through hole 128 and the second through hole 130 still expose the first bracket respectively. 110 and a second bracket 112. Specifically, the body 120 has an opposite third upper surface S5 and a third lower surface S6, wherein the first opening 122 is viewed from the third upper surface S5 of the body 120 toward the inside of the body 120 and extends to the first bracket The first through hole 128 and the second through hole 130 extend from the third lower surface S6 of the body 120 toward the inside of the body 120 and extend to the first bracket 110 and the second, respectively. Where the bracket 112 is located. That is, a portion of the first lower surface S2 of the first bracket 110 may be exposed from the first through hole 128, and a portion of the second lower surface S4 of the second bracket 112 may be exposed from the second through hole 130.

透過本實施方式的配置,第一通孔128以及第二通孔130仍可做為支撐結構100B的洩壓孔,藉以防止氣隙內流體於製程中會因逸而出產生不預期的破壞,從而增加支撐結構100B於製程中的可靠度及良率。 Through the configuration of the embodiment, the first through hole 128 and the second through hole 130 can still serve as a pressure relief hole of the supporting structure 100B, thereby preventing the fluid in the air gap from being unintentionally damaged due to the escape in the process. Thereby increasing the reliability and yield of the support structure 100B in the process.

另一方面,本實施方式的支撐結構的製作方式可大致與前述所提的製作方式相似,而本實施方式的支撐結構的製作方式與前述所提的製作方式的至少一個差異點在於,於本實施方式的支撐結構的製作方式中,形成開口的步驟與形成通孔的步驟分別是在本體的相對兩個表面(例如本體120的第三上表面S5及第三下表面S6)進行。 On the other hand, the manufacturing method of the support structure of the present embodiment can be substantially similar to the above-described manufacturing method, and at least one difference between the manufacturing method of the support structure of the present embodiment and the aforementioned manufacturing method is that In the manufacturing method of the support structure of the embodiment, the step of forming the opening and the step of forming the through hole are performed on opposite surfaces of the body (for example, the third upper surface S5 and the third lower surface S6 of the body 120).

請再看到第3A圖、第3B圖及第3C圖,其中第3A圖為依據本揭露內容的第三實施方式繪示支撐結構100C的上視示意圖,第3B圖為繪示第3A圖的第一支架110的立體示意 圖,而第3C圖為繪示沿第3B圖的方向D1看向第一支架110的正視示意圖。為了不使圖式過於複雜,未繪示網底於第3B圖及第3C圖的第一支架110。本實施方式與第一實施方式的至少一個差異點在於,本實施方式的第一支架110具有第一溝槽116,而第二支架112具有第二溝槽118,以下將以第一支架110的第一溝槽116為例作做說明。 3A, 3B, and 3C, wherein FIG. 3A is a top view of the support structure 100C according to the third embodiment of the disclosure, and FIG. 3B is a 3A view. Stereoscopic representation of the first bracket 110 FIG. 3C is a front elevational view showing the first bracket 110 viewed in the direction D1 of FIG. 3B. In order not to make the drawing too complicated, the first bracket 110 of the mesh bottom in FIGS. 3B and 3C is not shown. At least one difference between this embodiment and the first embodiment is that the first bracket 110 of the present embodiment has a first groove 116, and the second bracket 112 has a second groove 118, which will be the first bracket 110 The first trench 116 is illustrated by way of example.

第一支架110的第一溝槽116位於第一支架110的第一上表面S1及第一下表面S2,並透過第二開口124而自本體120的內部延伸至本體120的外部。此外,本實施方式中,於本體120內,第一支架110的第一溝槽116會位於第一開口122的相對兩側,即第一支架110的第一溝槽116不會自第一開口122暴露出來。另一方面,第一支架110的第一溝槽116的延伸方向可與第一通孔128以及第二通孔130正交。 The first groove 116 of the first bracket 110 is located on the first upper surface S1 and the first lower surface S2 of the first bracket 110 and extends from the interior of the body 120 to the outside of the body 120 through the second opening 124. In the present embodiment, the first trench 116 of the first bracket 110 is located on opposite sides of the first opening 122, that is, the first trench 116 of the first bracket 110 does not open from the first opening. 122 exposed. On the other hand, the extending direction of the first trench 116 of the first bracket 110 may be orthogonal to the first through hole 128 and the second through hole 130.

第一支架110的第一溝槽116與第二支架112的第二溝槽118可用以做為排氣槽使用。舉例而言,當有對支撐結構100C進行加工製程的需求時,存在於支架與本體120之間的水氣可沿著第一溝槽116或第二溝槽118排出,從而增加支撐結構100C於加工製程中的可靠度及良率。除此之外,雖本實施方式所繪的第一溝槽116以及第二溝槽118的樣式是以倒三角形呈現,然而,於其他實施方式中,第一溝槽116以及第二溝槽118的樣式也可以是倒梯形、圓弧形或是其他凹陷樣式的溝槽。 The first groove 116 of the first bracket 110 and the second groove 118 of the second bracket 112 can be used as a venting groove. For example, when there is a need for a processing process for the support structure 100C, moisture present between the support and the body 120 may be discharged along the first trench 116 or the second trench 118, thereby increasing the support structure 100C. Reliability and yield in the processing process. In addition, although the patterns of the first trench 116 and the second trench 118 depicted in this embodiment are presented in inverted triangles, in other embodiments, the first trench 116 and the second trench 118 The pattern can also be an inverted trapezoid, a circular arc or other recessed groove.

請再看到第4圖,其中第4圖為依據本揭露內容的第四實施方式繪示支撐結構100D的上視示意圖。本實施方式 與第三實施方式的至少一個差異點在於,本實施方式的第一支架110的第一溝槽116以及第二支架112的第二溝槽118會自第一開口122暴露出來。透過此配置,可進一步使存在於支架與本體120之間的水氣沿著第一溝槽116或第二溝槽118排出,從而增加支撐結構100D於加工製程中的可靠度及良率。 4 is a top view of the support structure 100D according to the fourth embodiment of the present disclosure. This embodiment At least one difference from the third embodiment is that the first trench 116 of the first bracket 110 and the second trench 118 of the second bracket 112 of the present embodiment are exposed from the first opening 122. Through this configuration, the moisture present between the bracket and the body 120 can be further discharged along the first trench 116 or the second trench 118, thereby increasing the reliability and yield of the support structure 100D in the processing process.

此外,前述實施方式中,做為洩壓孔的通孔雖是繪示成圓孔狀,然而,通孔也可以是其他樣式。例如,於其他實施方式中,通孔也可為俯視輪廓為三角形、矩形或其他多邊形的樣子。再者,雖前述實施方式中分別裸露兩個支架的通孔的數量為各一個,然而,於其他實施方式中,通孔的數量也可以是多個。舉例而言,單一支架也可以由多個通孔裸露而出。 Further, in the above embodiment, the through hole as the pressure relief hole is illustrated as a circular hole, however, the through hole may have other patterns. For example, in other embodiments, the through holes may also be triangular, rectangular or other polygonal in plan view. Furthermore, although the number of through holes in which the two brackets are exposed in each of the foregoing embodiments is one each, in other embodiments, the number of the through holes may be plural. For example, a single bracket can also be exposed by multiple through holes.

綜上所述,本揭露內容的支撐結構包含第一支架、第二支架及本體,其中本體包覆第一支架及第二支架。第一支架及第二支架可分別做為後續設置在支撐結構上的電子元件的電性連接處。本體包含開口、第一通孔及第二通孔,其中開口用以使第一支架的一部分及第二支架的一部分共同裸露,而第一通孔及第二通孔則用以使第一支架的另一部分及第二支架的另一部分分別裸露。透過此配置,當支撐結構有升溫需求時,第一通孔及第二通孔可做為支撐結構的洩氣孔,使得存在於支撐結構的氣隙內的流體(例如水氣)可於製程中透過第一通孔及第二通孔而自支撐結構內逸出,藉以防止流體會對所進行的製程產生不預期破壞,從而增加支撐結構於製程中的可靠度及良率。 In summary, the support structure of the present disclosure includes a first bracket, a second bracket, and a body, wherein the body covers the first bracket and the second bracket. The first bracket and the second bracket may respectively be used as electrical connections of electronic components that are subsequently disposed on the support structure. The body includes an opening, a first through hole and a second through hole, wherein the opening is used to expose a portion of the first bracket and a portion of the second bracket together, and the first through hole and the second through hole are used to make the first bracket The other part and the other part of the second bracket are respectively exposed. Through this configuration, when the support structure has a heating demand, the first through hole and the second through hole can be used as a vent hole of the support structure, so that the fluid (such as moisture) existing in the air gap of the support structure can be processed in the process. The first through hole and the second through hole escape from the support structure, thereby preventing the fluid from undesirably causing damage to the process performed, thereby increasing the reliability and yield of the support structure in the process.

雖然本創作已以多種實施方式揭露如上,然其並 非用以限定本創作,任何熟習此技藝者,在不脫離本創作之精神和範圍內,當可作各種之更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。 Although this creation has been disclosed above in various embodiments, It is not intended to limit the creation of this work. Anyone who is familiar with this art can make various changes and refinements without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation is defined by the scope of the patent application attached. Prevail.

100A‧‧‧支撐結構 100A‧‧‧Support structure

110‧‧‧第一支架 110‧‧‧First bracket

112‧‧‧第二支架 112‧‧‧second bracket

120‧‧‧本體 120‧‧‧ body

122‧‧‧第一開口 122‧‧‧ first opening

124‧‧‧第二開口 124‧‧‧second opening

126‧‧‧第三開口 126‧‧‧ third opening

128‧‧‧第一通孔 128‧‧‧First through hole

130‧‧‧第二通孔 130‧‧‧Second through hole

Claims (14)

一種支撐結構,包含:一第一支架,包含金屬材料;一第二支架,包含金屬材料,其中該第一支架與該第二支架彼此電性絕緣;以及一本體,包含非金屬材料,並包覆該第一支架及該第二支架,其中該本體包含一第一開口以及一第一通孔,該第一支架的一部分及該第二支架的一部分共同自該第一開口裸露,且該第一支架的另一部分自該第一通孔裸露,其中該第一開口與該第一通孔透過存在於該本體與該第一支架之間的至少一第一氣隙而彼此相連通。 A support structure comprising: a first bracket comprising a metal material; a second bracket comprising a metal material, wherein the first bracket and the second bracket are electrically insulated from each other; and a body comprising a non-metallic material and including Covering the first bracket and the second bracket, wherein the body includes a first opening and a first through hole, a portion of the first bracket and a portion of the second bracket are commonly exposed from the first opening, and the first Another portion of a bracket is exposed from the first through hole, wherein the first opening and the first through hole communicate with each other through at least a first air gap existing between the body and the first bracket. 如申請專利範圍第1項所述之支撐結構,其中包覆於該本體內的該第一支架具有一表面,該第一開口暴露出該表面的一部分,而該第一通孔暴露出該表面的另一部分。 The support structure of claim 1, wherein the first bracket covered in the body has a surface, the first opening exposing a portion of the surface, and the first through hole exposes the surface Another part. 如申請專利範圍第1項所述之支撐結構,其中包覆於該本體內的該第一支架具有一上表面及一下表面,該第一開口暴露出該上表面的一部分,而該第一通孔暴露出該下表面的一部分。 The support structure of claim 1, wherein the first bracket covered in the body has an upper surface and a lower surface, the first opening exposing a portion of the upper surface, and the first pass The aperture exposes a portion of the lower surface. 如申請專利範圍第1項所述之支撐結構,其中該本體更包含: 一第二開口,其中該第一支架透過該第二開口自該本體的內部朝該本體的外部延伸,且該第一通孔與該第二開口透過該第一氣隙而彼此相連通。 The support structure according to claim 1, wherein the body further comprises: a second opening, wherein the first bracket extends from the interior of the body toward the outside of the body through the second opening, and the first through hole and the second opening communicate with each other through the first air gap. 如申請專利範圍第4項所述之支撐結構,其中該第一支架具有至少一溝槽,且該溝槽透過該第二開口而自該本體的內部延伸至該本體的外部,其中該溝槽的延伸方向與該第一通孔的延伸方向正交。 The support structure of claim 4, wherein the first bracket has at least one groove, and the groove extends through the second opening from an interior of the body to an exterior of the body, wherein the groove The extending direction is orthogonal to the extending direction of the first through hole. 如申請專利範圍第5項所述之支撐結構,其中包覆於該本體內的該第一支架具有相對的一上表面及一下表面,該第一開口暴露出該上表面的一部分,其中該些溝槽位於該第一支架的該上表面及該下表面。 The support structure of claim 5, wherein the first bracket covered in the body has an opposite upper surface and a lower surface, the first opening exposing a portion of the upper surface, wherein the The groove is located on the upper surface and the lower surface of the first bracket. 如申請專利範圍第5項所述之支撐結構,其中包覆於該本體內的該第一支架具有一上表面,且該第一開口暴露出該上表面的一部分,其中該溝槽位於該第一支架的該上表面,且該第一開口暴露出該溝槽的一部分。 The support structure of claim 5, wherein the first bracket covered in the body has an upper surface, and the first opening exposes a portion of the upper surface, wherein the groove is located at the first The upper surface of a bracket and the first opening exposes a portion of the trench. 如申請專利範圍第5項所述之支撐結構,其中位於該本體內部的該溝槽係由該本體所覆蓋。 The support structure of claim 5, wherein the groove located inside the body is covered by the body. 如申請專利範圍第1項所述之支撐結構,其中該本體更包含: 一第二通孔,其中該第二支架的另一部分自該第二通孔裸露,且該第一開口與該第二通孔透過存在於該本體與該第二支架之間的至少一第二氣隙而彼此相連通。 The support structure according to claim 1, wherein the body further comprises: a second through hole, wherein another portion of the second bracket is exposed from the second through hole, and the first opening and the second through hole pass through at least a second existing between the body and the second bracket The air gaps are in communication with each other. 如申請專利範圍第9項所述之支撐結構,其中包覆於該本體內的該第二支架具有一表面,該第一開口暴露出該表面的一部分,而該第二通孔暴露出該表面的另一部分。 The support structure of claim 9, wherein the second bracket covered in the body has a surface, the first opening exposing a portion of the surface, and the second through hole exposing the surface Another part. 如申請專利範圍第9項所述之支撐結構,其中包覆於該本體內的該第二支架具有一上表面及一下表面,該第一開口暴露出該上表面的一部分,而該第二通孔暴露出該下表面的一部分。 The support structure of claim 9, wherein the second bracket covered in the body has an upper surface and a lower surface, the first opening exposing a portion of the upper surface, and the second pass The aperture exposes a portion of the lower surface. 如申請專利範圍第9項所述之支撐結構,其中該本體更包含:一第三開口,其中該第二支架透過該第三開口自該本體的內部朝該本體的外部延伸,且該第二通孔與該第三開口透過該第二氣隙而彼此相連通。 The support structure of claim 9, wherein the body further comprises: a third opening, wherein the second bracket extends from the interior of the body toward the outside of the body through the third opening, and the second The through hole and the third opening communicate with each other through the second air gap. 如申請專利範圍第1項所述之支撐結構,其中該第一通孔的俯視輪廓為三角形、矩形、多邊形或圓形。 The support structure of claim 1, wherein the first through hole has a triangular, rectangular, polygonal or circular shape. 一種發光裝置,包含: 如請求項1-13項之其中任一項的支撐結構;一發光元件,設置於該第一開口內,並包含一第一電極及一第二電極,其中該第一電極及該第二電極分別電性連接於該第一支架及該第二支架;以及一封裝膠,設置於該第一開口內,並包覆該發光元件。 A light emitting device comprising: The support structure of any one of the items 1-13, wherein a light-emitting element is disposed in the first opening and includes a first electrode and a second electrode, wherein the first electrode and the second electrode Electrically connected to the first bracket and the second bracket respectively; and an encapsulant disposed in the first opening and covering the light emitting component.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI634676B (en) * 2017-05-26 2018-09-01 黃國益 Supporting structure, light-emitting device using the same, and processing method for the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI634676B (en) * 2017-05-26 2018-09-01 黃國益 Supporting structure, light-emitting device using the same, and processing method for the same

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