TWM545304U - Optoelectronic chip card - Google Patents

Description

Photovoltaic chip card

The present invention relates to a wafer card, in particular to an optoelectronic chip card that applies optical identification technology to a wafer card, and utilizes the characteristics of the light sensing array film to provide a new type of card reading authentication technology, which can be directly contacted by the surface. The method further comprises: sensing and verifying the photo-sensing array film of the optoelectronic chip card and reading the data of the chip card by using the encrypted optical signal emitted by the display panel of the mobile device or the sensing panel of the other device; The safety of the wafer card is easy to read.

According to the French Roland Moreno, the chip card was first invented in 1974. It was first made into a wafer card product by Boolean Computer in 1976. The chip card is generally also referred to as an IC card because the card has an integrated circuit (IC) with storage encryption and data processing capabilities. The simplest structure of the wafer card is formed by laminating a three-layer plastic substrate. The IC chip is usually embedded on the substrate of the intermediate layer. The IC chip includes a microprocessor, an electronic digital signal input/output interface, and a memory. Body, etc., provides data calculation, access control and storage functions; at present, most bank companies or government agencies also issue various chip cards, which store user's personal data or encrypted information in the IC chip. Compared with the traditional magnetic stripe card, it has more storage space and higher security.

Since the chip card mainly uses the electronic digital signal as the basis for identification or authentication, the chip card must be electronically contacted and transmitted by the electronic card reading device to the exposed printed circuit on the chip card, and the chip is completed by the card reading device. The power supply for the power required by the card, such as ATMs at banks and post offices, or through a USB card reader, can read the data of the wafer card on a personal computer for online financial transactions or other operations; however, at home and abroad. There have been many criminal incidents involving the use of counterfeit wafer cards for financial piracy. The system directly attaches the counterfeit wafers to the original wafers, changes the circuit contacts of the original wafers, and intercepts the card readers to the original wafers during the authentication process of the card reading equipment. The password confirmation request directly returns the correct signal to the card reader device, so that the thief can enter the data to gain access to the data.

In order to improve the security of the use of the chip card, many companies have provided different authentication methods to maintain the security and financial security of the original users. Currently, there are common security certifications such as physiological information or dynamic passwords. In this way, physiological information is usually combined with external electronic devices, such as confirmation by photo or fingerprint before obtaining access to data. Republic of China invention patent TW I573035 "Device and method for providing input data for document verification" That is, a verification device that obtains data by using a photo of a document, which first takes a photo of the document, and after obtaining the identification data, the user inputs the verified preset information, and the comparison is judged to be correct to complete the verification; The photographic lens first captures the image before it can continue the verification. The program is not convenient enough, and the photo of the other person's ID is not difficult to obtain, and there is still a lack of security.

The Republic of China new patent TW M514614 "Online Payment Anti-theft Brush System" is a way of online password verification, which is confirmed by dynamic password verification. When the consumer wants to make money payment on the online trading platform, the bank will send a dynamic password to the consumer. The electronic device of the consumer, the consumer enters the dynamic password on the transaction platform, and after confirming, the payment action can be completed; the method of dynamic password authentication has higher security and the password is not easy to copy, but it needs to be used. The user manually enters the dynamic password and needs to wait for the transmission of the dynamic password, and the dynamic password has a limitation on the input time, which is not convenient for the user in use.

Therefore, how to provide a wafer card that is more convenient for users, not cumbersome to use, and has high verification security, protects the user's personal data and financial security, is the direction that the creator thinks.

Nowadays, the creator is still in the light of the indefatigable spirit of the above-mentioned existing wafer card in actual implementation, and it is improved by its rich professional knowledge and years of practical experience. And based on this research and development of this creation.

The main purpose of the present invention is to provide an optoelectronic chip card with a light sensing array film attached thereto, which can directly sense the photoelectric chip card by optical technology, and achieve high security verification by optical signal transmission. The access to the chip card data is provided, and the verification procedure is quite fast and convenient, and the time for the user to manually input the data can be omitted.

In order to achieve the above-mentioned implementation, an optoelectronic chip card is provided, comprising a first substrate having a front surface and a back surface, the front surface of which is attached with a wafer circuit; and a light sensing array film glued to the first base The front side of the chip is adjacent to the position of the chip circuit and electrically connected to the chip circuit; a positioning portion is disposed at a position adjacent to the front surface of the first substrate adjacent to the light sensing array film; and an identification portion is disposed at the first base The front of the film.

In one embodiment of the present invention, the back side of the first substrate is glued to a second substrate.

In one embodiment of the present invention, the light sensing array film is a sensing array formed by a Thin Film Transistor (TFT) photodetecting device.

In one embodiment of the present invention, the light sensing array film is selectively further configured to have a different photonic crystal waveguide structure design.

In one embodiment of the present invention, the optoelectronic chip card further includes a thin film solar cell module and is attached to the first substrate or the second substrate.

In an embodiment of the present invention, the positioning part is a plurality of solid bumps or a positioning mark of a QR code, wherein a plurality of solid bumps or two-dimensional barcode positioning marks are disposed on the light sensing array. Around or adjacent to the film.

In one embodiment of the present invention, the identification portion is an embossed number or text, or a digital or text display is displayed on a thin film display electrically connected to the wafer circuit.

In an embodiment of the present invention, the thin film display can be, for example, a twisted nematic liquid crystal film (TN-LCD), a micro-LED array, or an e-paper, and the like. The chip circuit is electrically connected, and the thin film display can also act as a light emitter to emit an optical signal to provide mutual authentication.

The photo-electricity chip card is read by a display panel having an image sensing array film, and any point on the display panel emits an optical signal; wherein the image sensing array film is also a thin film transistor photodetection A sensing array formed by the device.

The purpose of this creation and its structural and functional advantages will be explained in accordance with the structure shown in the following figure, in conjunction with specific examples, so that the review committee can have a deeper and more specific understanding of the creation.

Referring to FIG. 1 to FIG. 4 , a photovoltaic wafer card includes a first substrate (1) having a front surface and a back surface, a front surface of which is attached with a chip circuit (11), a back surface and a The second substrate (12) is glue-laminated to encapsulate the photovoltaic wafer card; a light sensing array film (13) is glued to the front surface of the first substrate (1) adjacent to the wafer circuit (11), and The chip circuit (11) is electrically connected, wherein the light sensing array film (13) is a sensing array formed by a Thin-Film Transistor (TFT) photodetecting device; a positioning portion (14) is provided The positioning portion (14) may be, for example, a plurality of solid bumps or a positioning mark of a QR code, where the front surface of the first substrate (1) is adjacent to the light sensing array film (13). The solid bumps are disposed around the light sensing array film (13), and are mainly used for sensing, so that the sensing electronic device can acquire the placement position of the photoelectric chip card; and an identification portion (15), It is disposed on the front side of the first substrate (1), and may be, for example, an embossed number or letter.

Furthermore, each of the light sensing array films (13) can be further partitioned or grouped and configured with different photonic crystal waveguide structures (2), which can have different levels of coding combination design according to the requirements of the optoelectronic chip card, for example, It can only accept light signals of a specific wavelength or a specific position, that is, as shown in FIG. 5, it can cooperate with a display panel having an image sensing array film, and emit light from any point of the image sensing array film on the display panel. The signal, which may be, for example, visible or invisible, is used to verify the encrypted encoded message, further enhancing the security of the wafer card.

As shown in the sixth figure, a front side of the first substrate (1) is selectively provided with a thin film display (3), which may be, for example, a twisted nematic liquid crystal film (TN-LCD) or a micro light emitting diode array (Micro). -LED array) or e-paper, etc., and electrically connected to the chip circuit (11), can be used as a feedback optical signal, can achieve the function of two-way encrypted transmission verification, or replace the original identification part (15) The embossed numerals and characters are displayed on the thin film display (3); the photovoltaic chip card may further comprise a thin film solar cell module and attached to the first substrate (1) or the second substrate (12) As a power source for the optoelectronic chip card, since the power consumption of the chip circuit (11) is relatively small, the size of the thin film solar cell module need not be too large.

In addition, the scope of the present invention may be further limited by the following specific embodiments, but is not intended to limit the scope of the present invention in any way.

Please continue to refer to the first picture and the second picture. The created photoelectric chip card can be applied to wafer card products issued by general financial institutions or government agencies, such as credit cards, financial cards, health insurance cards, natural person certificates, and the like. After cutting the large-area light sensing array film (13) prepared by the TFT into an appropriate size, it is attached to the side of the first substrate (1) having the embedded chip circuit (11), and then the wafer. The output input contact of the circuit (11) is connected to the light sensing array film (13), and the data sensed by the optical signal is written by the microprocessor of the chip circuit (11), and the photovoltaic chip card is used as the second substrate ( 12) When encapsulating, together with the physical bump of the imprinting positioning part (14) or the appearance of the QR code in the wafer card, the information of the owner of the optoelectronic chip card can be viewed again, and the embossed account of the imprinting part (15) can be embossed. Number or other text. In general, a conventional wafer card is composed of upper, lower, and lower layers of substrates, and the present invention summarizes the structure of the original substrate and the intermediate substrate by the first substrate (1). It can also be implemented by a conventional three-layer substrate in which a wafer circuit (11) and a light sensing array film (13) are disposed on an intermediate substrate, and the upper substrate is printed or embossed with a positioning portion (14) and The identification portion (15) is exposed by the transparent film to the wafer circuit (11) and the light sensing array film (13).

In actual use, reference may be made to the third and fourth figures, which are read by a display panel having an image sensing array film, which may be a smart phone or a flat screen, or may be mounted on the display panel. For ATM or other reading devices, the main feature is that an image sensing array film including a TFT is required. Taking active organic light-emitting diode (AMOLED) and thin film transistor liquid crystal display (TFT-LCD) as examples, the main structure of AMOLED is organic light-emitting diode (OLED) pixel array, TFT active array and TFT image sensing array. The main structure of the TFT-LCD includes an LCD pixel array, a TFT active array, a TFT image sensing array film, and an LCD backlight module; the display panel has both optical signal receiving and transmitting functions.

In the implementation of this creation, smart phones and credit cards are used as examples. When conducting online transactions on mobile phones, users usually use online trading platforms or financial unit applications. When payment or other status confirmation is required, The front surface of the first substrate (1) of the photovoltaic chip card can be in face-to-face contact with the display panel of the mobile phone, and the image sensing array film of the display panel with the light sensing array senses the position of the position portion (14) (entity The bump or QR code positioning mark), according to the light source of the display panel, tracking the position by the principle of light reflection, can locate the relative orientation between the wafer card and the display panel, confirm the current direction of the card placement and the coverage range, so that The credit card of the display panel and the photoelectric chip card does not need to be arranged in parallel or perpendicular to the four sides or corners, and the user does not need precise alignment, that is, the photoelectric chip card is placed in surface contact with the display panel at any angle, the first base The data of the film (1) can still be correctly sensed, and the identification part (15) can be accurately read directly by the image sensing array film of the display panel. Formula embossed numbers or words, users do not need to manually or otherwise additional input to the application.

Or, after the positioning portion (14) is sensed, the light source of the display panel emits a light signal of a specific wavelength, or emits light several times in a short time in a batch manner, and the type or form of the light signal is mainly According to the photoelectric chip card issuing company, it is necessary to be able to correspond to the data sensed by the optical signal stored in the chip circuit (11); after the light sensing array film (13) of the photoelectric chip card receives the light signal, The optical circuit is decrypted by the chip circuit (11), and after the determination is correct; then, the light source of the display panel is again illuminated. Since the identification portion (15) has an embossed account number, the image sensing array film of the display panel is displayed. Because of the light reflection state of the embossed number, after the diffraction of the pixel array aperture of the display panel, a reflection pattern is generated, and thus the reflection pattern is calculated and reconstructed by an algorithm, and the identification portion (15) is obtained. The correct image of the embossed number is automatically input into the smart phone in the account number automatically read out. By the surface contact method, the display panel with the image sensing array film can accurately recognize the embossed numbers of the positioning portion (14) and the identification portion (15).

In this way, the user can input the information on the card manually or by other input methods, and the identification of the transaction confirmation can be completed quickly and accurately, and the creation of the photoelectric chip card has the function of safety verification and is verified by optical technology. After the authenticity of the chip card, the data is obtained to ensure the user's personal data is safe.

In addition, in order to have higher security, the creator also provides the photo-sensing array film (13) of the photovoltaic chip card with different photonic crystal waveguide structures (2) to achieve a safer verification procedure. Since the substrate of the photoelectric chip card is made of a plastic material, and the material of the thin film transistor is made of amorphous germanium, polycrystalline germanium or indium gallium tin oxide, etc., the light is transmitted through the photo-sensing array film of the photovoltaic wafer card (13). ) The total reflection between the plastic substrate and the plastic substrate is formed to form a waveguide-like perfect light transmission condition. Moreover, the light sensing array film (13) is composed of a plurality of groups of light sensing films, so that light perceptions of different positions can be achieved. The thin film group is separately arranged, and different micro-optical waveguide structures are separately arranged. The micro-optical waveguide structure has a grating grating structure dominated by a light diffraction mechanism, and a micro ring interferometer structure dominated by an optical interference mechanism. Photonic Bandgap structure dominated by photonic crystal waveguides, which allows the received optical signal to be transmitted to a specific location of the thin film photo-sensing array in a small area according to the originally designed optical path. The level at which the optical transmission signal is encrypted.

Referring to the fifth figure, when the display panel senses the photoelectric wafer card, it is necessary to emit an optical signal at a specific position according to the state of the photonic crystal waveguide structure (2) on the photoelectric wafer card, so that the optical signal can follow the correct path. Reaching the light sensing array film (13) for sensing, even requiring a specific wavelength of light to pass light through the path of the photonic crystal waveguide; accordingly, the wafer card issuing company can design more elements on the photovoltaic chip card Encryption coding, using the characteristics of the photonic crystal waveguide structure (2), with different positions (spatial coding) and pixel brightness (time coding) of the light source on the display panel as an encrypted optical signal transmitted to the light sensing array on the wafer card The thin film (13) area, as another verification-encrypted encoded message, further enhances the security of the wafer card to provide a higher level of security verification.

Furthermore, referring to the sixth figure, a thin film display (3) can also be disposed on the photovoltaic chip card, which can be, for example, a monochromatic twisted nematic liquid crystal film (TN-LCD) or a micro light emitting diode array (Micro- LED array) or e-paper, etc., as a light-emitting unit to achieve secure verification of two-way secondary encoding encrypted transmission. In use, the photoelectric chip is received by the optical signal transmitted by the display panel, and the chip circuit (11) performs the first decryption verification. If the verification is passed, the thin film display unit (3) returns a preset optical signal. The image sensing array film to the display panel is verified by the mobile device to transmit the verification code back to the transaction system for verification, and the second decryption verification can be performed, and the optical signal verification is ensured twice to ensure the authenticity of the photoelectric chip card and protect the use. The safety of the person. However, this creation is not limited to bidirectional verification in this way, and the display panel light sensing array can be used for fingerprint recognition, photographic lens for face recognition, or an additional infrared light source photographic lens for iris recognition, etc. To achieve more heavy, higher level security verification.

Moreover, the thin film display (3) of the photovoltaic chip card can directly display the two-dimensional barcode of the positioning portion (14) and the account number or other characters of the identification portion (15) without additionally printing or printing the two-dimensional barcode. Or embossed account numbers.

Accordingly, the present photo-electric wafer card can determine the image of the positioning portion (14) and the identification portion (15) by the surface contact type optical, so that the user can pass the authentication program without any input method; The thin film display (3) is matched with the photoelectric chip card to achieve the effect of two-way authentication, and the biometric identification information of the card holder can also be stored in the memory of the chip circuit (11) during the photocell card bidding process. Through the biometric identification mechanism to protect the user, even if the mobile device and the photoelectric chip card are simultaneously stolen, the anti-theft function that cannot be activated by others can be ensured.

It can be seen from the above description that the present creation has the following advantages compared with the prior art:

1. Since the photo-electricity chip card has a light-sensing array film, it can optically allow the user to directly perform optical card reading and verification procedures by surface contact, and send it through the sensing panel of the display panel or other device. Encrypting the optical signal, sensing and verifying the photo-sensing array film of the photoelectric chip card and reading the data of the chip card identification part can effectively improve the safety of the use of the wafer card, and achieve the convenience of reading the wafer card, saving A program that requires users to enter their own data.

2. The positioning part of the created optoelectronic chip card can assist in sensing the placement position of the photoelectric chip card, confirming the current direction of the card placement and the coverage range, so that the user does not need to deliberately rotate the card to a specific direction, increasing the user. Convenience, reducing the troubles in use.

3. The photo-sensing array film of the optoelectronic chip card can be designed with different photonic crystal waveguide structures. By designing different optical waveguides, the optoelectronic chip card can only receive light at a specific position or a specific wavelength, and increase the photoelectricity. The choice of cryptographically encoded more elements on the chip card provides a more secure method of verification.

4. The photo-electric wafer card can further be provided with a thin-film display, so that the photoelectric chip card can not only receive the optical signal of the display panel, but also can feed different optical signals to the display panel to achieve two-way optical verification, and multiple verifications are ensured. The authenticity of the optoelectronic chip card can better protect the user in the face of money transactions. In addition, the creation of the optoelectronic chip card can be further combined with biometric identification to achieve more weight and higher level. Security verification.

In summary, the photovoltaic chip card of the present invention can achieve the intended use effect by the above disclosed embodiments, and the creation has not been disclosed before the application, and has fully complied with the requirements and requirements of the patent law. . If you apply for a new type of patent in accordance with the law, you are welcome to review it and grant a patent.

However, the illustrations and descriptions disclosed above are only preferred embodiments of the present invention, and are not intended to limit the scope of protection of the present invention; those who are familiar with the skill are otherwise characterized by the scope of the creation. Equivalent changes or modifications shall be considered as not departing from the design of this creation.

(1)‧‧‧First substrate
(11)‧‧‧ Wafer Circuit

(12)‧‧‧Second substrate
(13) ‧‧‧Light Sense Array Film

(14) ‧ ‧ Positioning Department
(15)‧‧‧ Identification Department

(2) ‧‧‧Photonic crystal waveguide structure
(3) ‧‧‧Film display

First Figure: Schematic diagram of the preferred embodiment of the present invention.

Second Figure: A schematic view of the overall appearance of the preferred embodiment of the present invention.

Third figure: A schematic diagram of the actual operation of the preferred embodiment of the present invention (1).

Figure 4: Schematic diagram of the actual operation of the preferred embodiment of the present invention (2).

Fifth Figure: Schematic diagram of a photonic crystal waveguide of another preferred embodiment of the present invention.

Figure 6 is a schematic view showing the overall appearance of still another preferred embodiment of the present invention.

(1)‧‧‧First substrate

(11)‧‧‧ Wafer Circuit

(12)‧‧‧Second substrate

(13) ‧‧‧Light Sense Array Film

(15)‧‧‧ Identification Department

Claims (9)

An optoelectronic chip card comprising: a first substrate having a front surface and a back surface, the front surface of which is attached with a wafer circuit; and a light sensing array film glued to the front side of the first substrate The position of the chip circuit is electrically connected to the chip circuit; a positioning portion is disposed at a position of the front surface of the first substrate adjacent to the light sensing array film; and an identification portion is disposed at the first The front side of the substrate. The photovoltaic wafer card of claim 1, wherein the back surface of the first substrate is glued to a second substrate. The photoelectric chip card of claim 1, wherein the light sensing array film is a sensing array formed by a thin film transistor (TFT) photodetecting device. The photovoltaic wafer card of claim 1, wherein the light sensing array film is selectively further configured with a different photonic crystal waveguide structure design. The photovoltaic chip card of claim 1, wherein the photovoltaic chip card further comprises a thin film solar cell module attached to the first substrate or the second substrate. The photoelectric wafer card of claim 1, wherein the positioning portion is a plurality of solid bumps or a positioning mark of a QR code. The photoelectric chip card of claim 1, wherein the identification portion is an embossed digital or text, or a digital display is displayed on a thin film display electrically connected to the wafer circuit. The photoelectric wafer card of claim 7, wherein the thin film display is a twisted nematic liquid crystal film (TN-LCD), a micro-LED array or an e-paper. one of them. The photovoltaic chip card of claim 7, wherein the thin film display is also a light emitter.