TWM544373U - Vapor chamber - Google Patents
Vapor chamber Download PDFInfo
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- TWM544373U TWM544373U TW106205261U TW106205261U TWM544373U TW M544373 U TWM544373 U TW M544373U TW 106205261 U TW106205261 U TW 106205261U TW 106205261 U TW106205261 U TW 106205261U TW M544373 U TWM544373 U TW M544373U
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- Prior art keywords
- plate
- temperature equalizing
- lower plate
- solder
- upper plate
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 43
- 238000005530 etching Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 5
- 238000005219 brazing Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Coating With Molten Metal (AREA)
- Molten Solder (AREA)
Abstract
Description
本創作係關於一種散熱裝置，特別是一種均溫板。 This creation is about a heat sink, especially a temperature equalization plate.
均溫板(Vapor chamber)是一種散熱裝置，其工作原理與熱管相近，差異在於熱管的導熱為一維方向上線的傳遞，均溫板則為二維方向上面的傳遞。均溫板在結構上，主要係由上板、下板以及作用腔所組成，當下板與熱源例如發熱的電子元件接觸後，作用腔內的工作介質便會由液體轉換為氣體並往上板方向傳遞，最後藉由上板外側的散熱裝置例如鰭片而傳遞出去，此時工作介質會轉換回液體而回流到下板，重新下一次的循環。 The Vapor chamber is a heat sink. Its working principle is similar to that of a heat pipe. The difference is that the heat transfer of the heat pipe is transmitted in the one-dimensional direction, and the temperature plate is transmitted in the two-dimensional direction. The structure of the temperature equalizing plate is mainly composed of an upper plate, a lower plate and an action cavity. When the lower plate is in contact with a heat source such as a heating electronic component, the working medium in the working cavity is converted into a gas by the liquid and goes to the upper plate. The direction is transmitted and finally transmitted by the heat sink outside the upper plate, such as a fin. At this time, the working medium is converted back to the liquid and returned to the lower plate, and the next cycle is repeated.
不過，習知的均溫板，其上板跟下板在封邊時，容易因為焊料向外溢出而影響到產品的外觀，或是向內滲透到作用腔內而影響到均溫版的正常運作，因此，習知的均溫板封邊設計，仍有很大可以改善的空間。 However, the conventional uniform temperature plate, when the upper plate and the lower plate are edged, is likely to affect the appearance of the product due to the outward overflow of the solder, or penetrates into the action cavity inwardly to affect the normal temperature version. Operation, therefore, the conventional uniform temperature plate edge design, there is still much room for improvement.
針對習知均溫板在封邊時焊料容易往外溢出或往內滲透等缺失，本創作提出一種均溫板設計，特別針對均溫板的下板，提供了一種可中止毛細現象的焊料槽設計，可用來防止焊料往外溢出或往內滲透。此 外，下板的焊料槽也可與作用腔或是支撐結構藉由蝕刻方式同時完成，簡化均溫板的加工的步驟而提高生產效率。 In view of the fact that the conventional uniform temperature plate is easy to overflow or infiltrate in the case of edge sealing, the present invention proposes a uniform temperature plate design, especially for the lower plate of the uniform temperature plate, and provides a solder groove design capable of stopping the capillary phenomenon. It can be used to prevent the solder from overflowing or infiltrating into the outside. this In addition, the solder bath of the lower plate can also be completed simultaneously with the active cavity or the support structure by etching, and the step of processing the uniform temperature plate is simplified to improve the production efficiency.
為達上述目的，於一實施例中，本創作提供一種均溫板，包括一上板以及一下板，上板與下板之間夾設有一作用腔以及一接合區，並且下板於接合區凹設有一焊料槽，焊料槽內容置有一焊料，其中，焊料槽具有一底部以及一擴張部，擴張部位於底部與上板之間，且擴張部的寬度大於底部的寬度。 In order to achieve the above object, in one embodiment, the present invention provides a temperature equalizing plate comprising an upper plate and a lower plate, wherein an upper working chamber and a lower plate sandwich an active cavity and a joint region, and the lower plate is in the joint region. A solder bath is recessed, and the solder bath is provided with a solder. The solder bath has a bottom portion and an expansion portion. The expansion portion is located between the bottom portion and the upper plate, and the width of the expansion portion is greater than the width of the bottom portion.
在本創作一實施例中，擴張部的至少一側壁為導圓角外型。 In an embodiment of the present invention, at least one side wall of the expansion portion is a rounded shape.
在本創作一實施例中，擴張部的至少一側壁為斜角外型。 In an embodiment of the present invention, at least one side wall of the expansion portion has a beveled shape.
在本創作一實施例中，擴張部為一階梯狀外型。 In an embodiment of the present creation, the expansion portion is a stepped shape.
在本創作一實施例中，下板係藉由蝕刻製程而同時形成該作用腔以及該焊料槽。 In an embodiment of the present invention, the lower plate simultaneously forms the active cavity and the solder bath by an etching process.
在本創作一實施例中，蝕刻製程為銅箔蝕刻。 In an embodiment of the present invention, the etching process is copper foil etching.
在本創作一實施例中，上板與下板可選自下列之一封邊方式接合而成：硬焊、軟焊、高週波以及電阻焊。 In an embodiment of the present invention, the upper and lower plates may be joined by one of the following sides: brazing, soldering, high frequency, and electric resistance welding.
在本創作一實施例中，上板與下板為同一材質，並選自下列之一材質：銅、鋁以及不鏽鋼。 In an embodiment of the present invention, the upper plate and the lower plate are made of the same material and are selected from the following materials: copper, aluminum, and stainless steel.
在本創作一實施例中，上板與下板為不同材質，並選自下列之兩種材質的組合：銅、鋁以及不鏽鋼。 In an embodiment of the present invention, the upper plate and the lower plate are made of different materials and are selected from the combination of the following two materials: copper, aluminum, and stainless steel.
在本創作一實施例中，作用腔包括複數個自下板往上板方向延伸之支撐結構，並且下板係藉由蝕刻製程而同時形成支撐結構以及焊料槽。 In an embodiment of the present invention, the working cavity includes a plurality of supporting structures extending from the lower plate toward the upper plate, and the lower plate simultaneously forms the supporting structure and the solder grooves by an etching process.
在本創作一實施例中，蝕刻製程為銅箔蝕刻。 In an embodiment of the present invention, the etching process is copper foil etching.
1‧‧‧均溫板 1‧‧‧Wall plate
2‧‧‧上板 2‧‧‧Upper board
3‧‧‧下板 3‧‧‧ Lower board
31‧‧‧焊料槽 31‧‧‧ solder bath
311‧‧‧底部 311‧‧‧ bottom
312‧‧‧擴張部 312‧‧‧Expanding Department
312A‧‧‧側壁 312A‧‧‧ side wall
32‧‧‧支撐結構 32‧‧‧Support structure
4‧‧‧作用腔 4‧‧‧Action chamber
5‧‧‧接合區 5‧‧‧ junction area
6‧‧‧焊料 6‧‧‧ solder
第1圖係本創作第一實施例所提供的均溫板其側面示意圖以及部分放大示意圖。 1 is a side view and a partially enlarged schematic view of a temperature equalizing plate provided by a first embodiment of the present invention.
第2A圖係本創作第一實施例所提供的均溫板的部分放大示意圖，其顯示焊料槽的擴張部其側壁為斜角外型時之結構。 Fig. 2A is a partially enlarged schematic view showing the temperature equalizing plate provided in the first embodiment of the present invention, showing a structure in which the expanded portion of the solder groove has a beveled outer side wall.
第2B圖係本創作第一實施例所提供的均溫板的部分放大示意圖，其顯示焊料槽的擴張部為階梯狀外型時之結構。 Fig. 2B is a partially enlarged schematic view showing the temperature equalizing plate provided in the first embodiment of the present invention, showing a structure in which the expanded portion of the solder groove is a stepped shape.
第2C圖與第2D圖係本創作第一實施例所提供的均溫板的部分放大示意圖，其顯示焊料槽的擴張部僅在一側壁形成有導圓角外型時之結構。 2C and 2D are partial enlarged views of the temperature equalizing plate provided by the first embodiment of the present invention, showing a structure in which the expanded portion of the solder groove is formed with a rounded shape only on one side wall.
第3圖係本創作第二實施例所提供的均溫板其側面示意圖。 Fig. 3 is a side view showing the temperature equalizing plate provided by the second embodiment of the present invention.
第4A圖與第4B圖係本創作第三實施例所提供的均溫板其側面示意圖。 4A and 4B are schematic side views of the temperature equalizing plate provided by the third embodiment of the present creation.
依據本創作之第一實施例係提供一種均溫板，請參照第1圖關於均溫板的側面示意圖以及部分放大示意圖。均溫板1，包括一上板2以及一下板3，上板2與下板3之間夾設有一作用腔4以及一接合區5。作用腔4為均溫板1內的工作介質(圖中未示)進行兩相變化的空間，接合區5則是上板2與下板3互相接合而將該作用腔4予以封閉的區域。 According to the first embodiment of the present invention, a temperature equalizing plate is provided. Please refer to FIG. 1 for a side view of a temperature equalizing plate and a partially enlarged schematic view. The temperature equalizing plate 1 includes an upper plate 2 and a lower plate 3. An active chamber 4 and a joint region 5 are interposed between the upper plate 2 and the lower plate 3. The action chamber 4 is a space in which the working medium (not shown) in the temperature equalizing plate 1 changes in two phases, and the joining portion 5 is a region where the upper plate 2 and the lower plate 3 are joined to each other to close the working chamber 4.
在本實施例中，均溫板1的下板3，係在接合區5的位置向下凹設有一焊料槽31，容置用以接合上板與下板的焊料6。特別的是，本實施 例所提供的焊料槽31，具有一底部311以及一擴張部312，此擴張部312位於底部311與上板2之間，且擴張部312的寬度大於底部311的寬度。擴張部312的設計，可用來中止毛細現象，使得熔化後的焊料6，因為其毛細半徑已遠大於接觸面，因此不會往外溢出而影響均溫板1的外觀，也不會往內滲入作用腔4而影響均溫板1的正常運作。 In the present embodiment, the lower plate 3 of the temperature equalizing plate 1 is recessed downwardly at a position of the land 5 to receive a solder groove 31 for accommodating the solder 6 for bonding the upper and lower plates. In particular, this implementation The solder bath 31 provided by the example has a bottom portion 311 and an expansion portion 312 located between the bottom portion 311 and the upper plate 2, and the width of the expansion portion 312 is greater than the width of the bottom portion 311. The design of the expansion portion 312 can be used to stop the capillary phenomenon, so that the molten solder 6 has a capillary radius which is much larger than the contact surface, so that it does not overflow and affects the appearance of the temperature equalizing plate 1 and does not penetrate into the inside. The cavity 4 affects the normal operation of the temperature equalization plate 1.
本實施例所提供形成於焊料槽31的擴張部312，其側壁312A可如第1圖所示，為一導圓角外型，也可如第2A圖所示，為一斜角外型，甚至於是分段地分別由導圓角和斜角所共同組成，本實施例也都不予以限制，只要能夠讓焊料槽31往上擴張，越接近上板2處寬度越寬即可。再者，本實施例所提供形成於焊料槽31的擴張部312也可如第2B圖所示，為一階梯狀的結構，其同樣也具有中止毛細現象的功能，防止熔化的焊料6往外溢出或往內滲入作用腔4。 The expansion portion 312 formed in the solder bath 31 of the present embodiment has a side wall 312A which is a rounded shape as shown in FIG. 1 or a beveled shape as shown in FIG. 2A. Even in the case of segmentally formed by the rounded corners and the beveled corners, the present embodiment is not limited as long as the solder tank 31 can be expanded upward, and the width is wider as the upper plate 2 is wider. Further, the expanded portion 312 formed in the solder bath 31 of the present embodiment may have a stepped structure as shown in FIG. 2B, and also has a function of stopping the capillary phenomenon to prevent the molten solder 6 from overflowing. Or infiltrate into the action chamber 4 inward.
此外，本實施例所提供形成於焊料槽31的擴張部312，除了可在兩側壁312A形成有導圓角或斜角等結構之外，也可僅在一側壁312A形成有導圓角或斜角等外擴結構，例如可如第2C圖所示，在靠近均溫板1內部的該側壁312A，也就是靠近作用腔4的該側，形成有導圓角結構(或是斜角、階梯狀結構)，或者如第2D圖所示，在靠近均溫板1的外緣，也就是遠離作用腔4的該側，形成有導圓角結構(或是斜角、階梯狀結構)，本實施例並不予以限制，可視需求與產品特性而予以選擇性地採用。 In addition, the expanded portion 312 formed in the solder bath 31 of the present embodiment may have a rounded corner or a bevel formed on only one side wall 312A except that a structure such as a rounded corner or a bevel may be formed on the two side walls 312A. An outer expansion structure such as an angle, for example, as shown in FIG. 2C, a side rounded structure (or a bevel, a step) is formed on the side wall 312A near the inside of the temperature equalizing plate 1, that is, on the side close to the working chamber 4. Shaped structure), or as shown in Fig. 2D, near the outer edge of the temperature equalizing plate 1, that is, the side away from the working chamber 4, a rounded corner structure (or a beveled, stepped structure) is formed. The examples are not limited and may be selectively employed depending on the requirements and product characteristics.
請參照第1圖，在本實施例中，當下板3會凹設或彎折出作用腔4，並且下板3也會在與上板2的接合區凹設有焊料槽31的情況時，本實施例可利用蝕刻製程(例如銅箔蝕刻製程)來同時形成作用腔4以及焊料槽 31，此舉可簡化均溫板1的加工步驟而提高生產的效率。此外，上板2與下板3也可選自下列之一的接合手段，包括有硬焊、軟焊、高週波以及電阻焊等。 Referring to FIG. 1, in the present embodiment, when the lower plate 3 is recessed or bent out of the action chamber 4, and the lower plate 3 is also recessed with the solder groove 31 in the joint region with the upper plate 2, This embodiment can utilize an etching process (such as a copper foil etching process) to simultaneously form the active cavity 4 and the solder bath. 31. This simplifies the processing steps of the temperature equalizing plate 1 and improves the efficiency of production. In addition, the upper plate 2 and the lower plate 3 may also be selected from the joining means of one of the following, including brazing, soldering, high frequency, and electric resistance welding.
依據本創作之第二實施例係提供一種均溫板1，請參照第3圖關於均溫板的側面示意圖。本實施例係沿用上述第一實施例所提供的均溫板1中關於焊料槽31的設計原則，此部分不再贅述。而第二實施例與第一實施例的差別，在於第二實施例所提供的均溫板1，其作用腔4內設置有支撐結構32，並且此支撐結構32係從下板3往上板2方向延伸而成，因此，在本實施例中，位於下板3的作用腔4、支撐結構32以及焊料槽31，也可利用蝕刻製程(例如銅箔蝕刻製程)來同時一次形成，達到簡化加工步驟提高生產效率的目的。此外，在本實施例中，上板2與下板3也可選自下列之一的接合手段，包括有硬焊、軟焊、高週波以及電阻焊等。 According to a second embodiment of the present invention, a temperature equalizing plate 1 is provided. Please refer to FIG. 3 for a side view of the temperature equalizing plate. This embodiment is based on the design principle of the solder bath 31 in the temperature equalizing plate 1 provided by the above first embodiment, and this part will not be described again. The second embodiment differs from the first embodiment in that the temperature equalizing plate 1 provided in the second embodiment is provided with a supporting structure 32 in the working chamber 4, and the supporting structure 32 is from the lower plate 3 to the upper plate. The two directions are extended. Therefore, in the embodiment, the working cavity 4, the supporting structure 32 and the soldering groove 31 of the lower plate 3 can also be formed at the same time by an etching process (for example, a copper foil etching process), thereby simplifying Processing steps increase the efficiency of production. In addition, in the present embodiment, the upper plate 2 and the lower plate 3 may also be selected from the joining means of one of the following, including brazing, soldering, high frequency, and electric resistance welding.
依據本創作之第三實施例係提供一種均溫板1，請參照第4A圖與第4B圖所示關於均溫板1的側面示意圖。在本實施例中，係沿用上述第一實施例所提供的均溫板1中關於焊料槽31的設計原則，此部分不再贅述。而第三實施例與第一實施例的差別，在於第三實施例所提供的均溫板1，其作用腔4可由上板2凹設或彎折而成，例如可如第4A圖所示，單獨由上板2凹設或彎折而成，或者如第4B圖所示，由上板2跟下板3共同凹設或彎折而成，其均可依照本創作而具體實施。 According to a third embodiment of the present invention, a temperature equalizing plate 1 is provided. Please refer to the side views of the temperature equalizing plate 1 shown in Figs. 4A and 4B. In the present embodiment, the design principle of the solder bath 31 in the temperature equalizing plate 1 provided by the above first embodiment is used, and this part will not be described again. The difference between the third embodiment and the first embodiment lies in the temperature equalizing plate 1 provided by the third embodiment. The working chamber 4 can be recessed or bent by the upper plate 2, for example, as shown in FIG. 4A. The upper plate 2 is separately recessed or bent, or as shown in FIG. 4B, the upper plate 2 and the lower plate 3 are collectively recessed or bent, and can be embodied in accordance with the present invention.
本創作所提供的均溫板1，可視產品特性或規格而選擇上板2與下板3由同一材質或是相異材質所組成，例如當選自相同材質時，可選擇均由銅、鋁或是不鏽鋼等材質所組成，而若選自不同材質，則由銅、鋁和不鏽鋼等材質中，選出兩相異的材質來組合搭配。 The temperature equalizing plate 1 provided by the present invention can be selected from the same material or different materials according to product characteristics or specifications. For example, when selected from the same material, the copper plate, aluminum or It is made of stainless steel and other materials. If it is selected from different materials, two different materials are selected from copper, aluminum and stainless steel.
上述依據本創作之較佳具體實施例，其均溫板1的設計概念，係在下板3的焊料槽31中設置有擴張部312此種可以中止毛細現象的結構，讓熔化的焊料6，因為其毛細半徑已遠大於接觸面，因此不致往外溢出或往內滲入作用腔4。此外，焊料槽31也可與作用腔4藉由蝕刻製程同時完成，簡化均溫板1的加工的步驟而提高生產效率。 According to a preferred embodiment of the present invention, the design concept of the temperature equalizing plate 1 is provided in the solder bath 31 of the lower plate 3 with an expansion portion 312 which can stop the capillary phenomenon, allowing the molten solder 6 to be The capillary radius is much larger than the contact surface, so that it does not overflow or penetrates into the action chamber 4 inward. In addition, the solder bath 31 can also be completed simultaneously with the active chamber 4 by an etching process, which simplifies the processing of the uniform temperature plate 1 to improve production efficiency.
1‧‧‧均溫板 1‧‧‧Wall plate
2‧‧‧上板 2‧‧‧Upper board
3‧‧‧下板 3‧‧‧ Lower board
31‧‧‧焊料槽 31‧‧‧ solder bath
311‧‧‧底部 311‧‧‧ bottom
312‧‧‧擴張部 312‧‧‧Expanding Department
312A‧‧‧側壁 312A‧‧‧ side wall
4‧‧‧作用腔 4‧‧‧Action chamber
5‧‧‧接合區 5‧‧‧ junction area
6‧‧‧焊料 6‧‧‧ solder
Claims (11)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106205261U TWM544373U (en) | 2017-04-14 | 2017-04-14 | Vapor chamber |
| CN201720426115.6U CN206728475U (en) | 2017-04-14 | 2017-04-21 | Temperature equalizing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106205261U TWM544373U (en) | 2017-04-14 | 2017-04-14 | Vapor chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM544373U true TWM544373U (en) | 2017-07-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106205261U TWM544373U (en) | 2017-04-14 | 2017-04-14 | Vapor chamber |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN206728475U (en) |
| TW (1) | TWM544373U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11835299B2 (en) | 2020-07-03 | 2023-12-05 | Delta Electronics, Inc. | Thin vapor-chamber structure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112325683A (en) * | 2020-11-05 | 2021-02-05 | 广东思泉新材料股份有限公司 | Vapor chamber and manufacturing method thereof |
-
2017
- 2017-04-14 TW TW106205261U patent/TWM544373U/en not_active IP Right Cessation
- 2017-04-21 CN CN201720426115.6U patent/CN206728475U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11835299B2 (en) | 2020-07-03 | 2023-12-05 | Delta Electronics, Inc. | Thin vapor-chamber structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN206728475U (en) | 2017-12-08 |
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| MM4K | Annulment or lapse of a utility model due to non-payment of fees |