TWM544124U - LED lead frame structure - Google Patents

Description

Light-emitting diode lead frame structure

The present invention relates to a lead frame structure, and more particularly to a light-emitting diode lead frame structure that utilizes a ring-shaped metal ring to avoid overflow.

Light-emitting diodes (LEDs) have excellent performances such as long service life, low power consumption, no need for warm-up time and fast response time, so the application products of light-emitting diodes are increasing. In the lighting application products for making LEDs, in addition to the necessary diode bonding process, they must be packaged before they can be applied to protect the LED chips from the external environment. And then electrically connected to the outside world.

One of the modes used in the conventional LED manufacturing process is as shown in FIG. 1. A metal wiring layer 20 is formed on the surface of the ceramic substrate 10, and the metal wiring layer 20 has at least a gap 30. It is divided into two electrodes 22 and 24. At the opening of the gap 30 between the electrodes 22, 24, a resin 50 or other similar material is applied in advance to avoid overflow. However, after the subsequent process and the molding of the resin 50, the functional area of the light-emitting diode (not shown) may still cause a process such as poor glue overflow at the gap of the gap 30. Due to the processing characteristics of the coating resin 50, minute gaps are still formed in the gaps of the gap 30, so that the problem of poor glue overflow cannot be effectively solved, and the light emitted from the LED chip cannot be concentrated, the brightness is lowered, and the process reliability is not Good question.

In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

One of the purposes of the present invention is to provide a light-emitting diode lead frame structure that makes the metal (line) layer of the functional area without any gaps and avoids overflowing, thereby effectively improving the brightness, quality and reliability of the packaged product.

To achieve the above object, the present invention provides a light-emitting diode lead frame structure including a ceramic substrate, a metal layer and a plastic seat. The ceramic substrate has a corresponding first surface and a second surface. The metal layer includes a first metal circuit region, a second metal circuit region, a gap separating the first metal circuit region and the second metal circuit region, and an annular surrounding gap, the first metal circuit region and the second metal a metal ring of the circuit region, wherein the first metal circuit region, the second metal circuit region and the metal ring are respectively formed on the first surface of the ceramic substrate. The rubber seat is formed on the first surface and partially covers the metal ring, and the rubber seat has a functional area of the recess, wherein the first metal circuit area, the second metal circuit area and a part of the metal ring expose the functional area.

In a preferred embodiment, the metal ring further includes an inner ring metal ring and an annular space separating the inner ring metal ring and the gap, the first metal circuit region, and the second metal circuit region. In a further preferred embodiment, the metal ring is a peripheral region of a portion of the first metal circuit region. When the injection molding of the rubber seat is performed, the metal ring or the inner ring metal ring which is annular and seamless can effectively block and prevent the rubber seat of the liquid colloid from penetrating into the gap of the metal (line) layer.

The creation further comprises an outer ring metal ring and a plurality of ribs respectively connecting the outer ring metal ring and the inner ring metal ring (metal ring). Each rib can increase the strength of the outer ring metal ring and the bonding strength with the rubber seat, thereby avoiding the risk of the outer ring metal ring falling off during the subsequent etching process.

The present invention also has the following effects. Through the above technical means, the metal layer of the present invention is a direct metal plating forming a first metal circuit region, a second metal circuit region, and a ring-shaped metal ring without gaps or gaps. The metal layer of the creation can achieve the effect of distinguishing positive and negative polarity by a single process of electroplating, sputtering, evaporation, electroless plating, etc., and has the advantages of effectively simplifying the process steps and reducing the process cost, wherein the metal ring further has Prevent the gap between the functional areas from producing the technical effect of overflowing glue.

100‧‧‧Ceramic substrate

102‧‧‧ first surface

104‧‧‧ second surface

106‧‧‧Perforation

110‧‧‧metal layer

120‧‧‧First metal circuit area

130‧‧‧Second metal circuit area

140‧‧‧ gap

150‧‧‧Metal ring

152‧‧‧ inner ring metal ring

154‧‧‧ annular interval

156‧‧ ‧ ribs

158‧‧‧ space

160‧‧‧Outer ring metal ring

170‧‧‧Glass

172‧‧‧ functional area

180‧‧‧ grain

182‧‧‧ wire

FIG. 1 is a schematic view showing the generation of overflow glue between electrodes of a conventional metal wiring layer.

2 is a schematic view showing a metal layer of a first preferred embodiment of the present invention.

FIG. 3 is a schematic diagram showing a first preferred embodiment of the present creation.

4 is a cross-sectional view showing a first preferred embodiment of the present creation.

FIG. 5 is a schematic view showing a metal layer of a second preferred embodiment of the present invention.

FIG. 6 is a schematic view showing a second preferred embodiment of the present creation.

Figure 7 is a cross-sectional view showing a second preferred embodiment of the present invention.

The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation.

As shown in FIG. 2 to FIG. 4, related diagrams of the first preferred embodiment of the present creation are shown. As shown in the figure, the present embodiment provides a light-emitting diode lead frame structure including a ceramic substrate 100, a metal layer 110, and a plastic holder 170. The ceramic substrate 100 has a corresponding first surface 102 and a second surface 104. The metal layer 110 includes a first metal circuit region 120, a second metal circuit region 130, a gap 140 separating the first metal circuit region 120 and the second metal circuit region 130, and an annular gap-free enclosing gap 140, A metal ring 150 of the first metal circuit region 120 and the second metal circuit region 130. The first metal circuit region 120, the second metal circuit region 130, and the metal ring 150 are formed on the first surface 102 of the ceramic substrate 100, respectively.

The metal layer 110 described above is preferably directly formed on the first surface 102 of the ceramic substrate 100 by electroplating, sputtering, vapor deposition, electroless plating, etc., and the material thereof is preferably, for example, gold or copper having good conductivity. Silver, aluminum or alloys thereof. As shown in FIG. 4, the ceramic substrate 100 is further provided with at least two through holes 106 spaced apart from each other and penetrating the first surface 102 and the second surface 104. When the metal layer 110 is formed on the ceramic substrate 100, the first metal circuit region 120 and the second metal circuit region 130 are individually filled in the respective through holes 106 and formed on the second surface 104 to provide the ceramic substrate 100 two phases. The corresponding first surface 102 and second surface 104 are electrically conductive.

Further, when the first metal circuit region 120 and the second metal circuit region 130 are formed on the corresponding first surface 102 and second surface 104, the ceramic substrate 100 passes through the gap 140 to make the first metal circuit region 120 and the second The metal circuit regions 130 are spaced apart from each other to distinguish between positive and negative polarities. When the first metal circuit region 120 and the second metal circuit region 130 respectively penetrate the corresponding through holes 106 and are formed on the second surface 104, the first metal circuit region 120 and the second metal circuit region 130 are still separated from each other. , will not touch.

In this embodiment, since the metal layer 110 is preferably formed by electroplating, sputtering, evaporation, electroless plating, etc., the first metal circuit region 120, the second metal circuit region 130, and the metal ring 150 are respectively protruded. First surface 102. The first metal circuit region 120, the second metal circuit region 130, and the metal ring 150 are all of the same height, and the planes thereof are flush with each other, so that the process of the LED array of the present invention is simplified, the structure is simple, and the cost can be effectively reduced. .

In addition, the metal ring 150 of the present embodiment further includes an inner ring metal ring 152 and an annular space 154 separating the inner ring metal ring 152 and the gap 140, the first metal circuit region 120 and the second metal circuit region 130. The inner ring metal ring 152 as shown in the figure is preferably capable of blocking the overflow of the rubber seat 170, which will be described in detail later. In this embodiment, an outer ring metal ring 160 and a plurality of ribs 156 respectively connecting the outer ring metal ring 160 and the inner ring metal ring 152 are further included. The outer ring metal ring 160 is capable of reinforcing the bond with the rubber seat 170, which will be described in detail later. Each of the ribs 156 can increase the strength of the outer ring metal ring 160 and the bonding strength with the rubber seat 170, thereby avoiding the risk of separation and falling of the outer ring metal ring 160 and the inner ring metal ring 152 in the subsequent etching process.

As shown in Figures 2 and 3, the outer ring metal ring 160 and the inner ring metal ring 152 have substantially the same width, about 0.5 to 1 mm. The outer ring metal ring 160 and the inner ring metal ring 152 are integrally formed with the first metal circuit region 120 and the second metal circuit region 130 in the manufacturing process. In addition, the outer ring metal ring 160 and the inner ring metal ring 152 also form a plurality of spaces 158, each of which passes through each of the spaces 158 to connect with the outer ring metal ring 160 and the inner ring metal ring 152.

After the first metal circuit region 120 and the second metal circuit region 130 are formed on the first surface 102 and the second surface 104 of the ceramic substrate 100 by electroplating, sputtering, evaporation, electroless plating, or the like, the fixed die 180 is performed. And put on the wire 182 and other processes. Then, the inner ring metal ring 152 in the corresponding functional area 172 is completely attached to the mold (not shown), and the rubber seat 170 is formed in an injection molding manner.

Since the metal ring 150 of the embodiment is annular and has no gap, when the mold is pressed down to the metal ring 150 of the functional area 172, the protruding inner ring metal ring 152 can block the metal seat of the liquid colloid 170 from penetrating into the metal. In the gap 140 of the (line) layer 110, the problem of overflowing glue is effectively avoided and solved. Thereby, the metal (line) layer 110 of the functional area 172 is prevented from being overflowed to improve the brightness (light-emitting efficiency), quality and reliability of the packaged product.

The embodiment shown in FIG. 3 and FIG. 4 further includes a die 180 disposed on the first metal circuit region 120 and two wires 182 electrically connected to the die 180 and the second metal circuit region 130, respectively. In particular, in the present embodiment, the first metal circuit region 120 preferably occupies a large area as the die 180 (solid crystal) for arranging the light emitting diode, and the second metal circuit region 130 occupies a small area. The die 180/first metal circuit region 120 and the second metal circuit region 130 are respectively connected by two wires 182. The power is transmitted through the first metal circuit region 120 and the second metal circuit region 130 to cause the crystal grains 180 to emit light. However, in other different embodiments, the area of the first metal circuit region 120 and the second metal circuit region 130 and the number thereof may be changed as needed or designed, and are not limited.

The rubber seat 170 is formed on the first surface 102 by means of injection molding and partially covers the metal ring 150. The glue holder 170 has a recessed functional area 172 which is then encapsulated thereon with silicone or other suitable colloid containing phosphor powder. The first metal circuit region 120, the second metal circuit region 130, and a portion of the metal ring 150 may expose the functional region 172.

The rubber seat 170 described herein is preferably made of a polymer material comprising high density polyethylene (HDPE), low density polyethylene (LDPE), polyethylene (PE), polypropylene ( Polypropylene, PP), Polyethylene terephthalate (PET), Polystyrene (PS), Acrylonitrile butadiene styrene (ABS), Polyvinyl chloride (Polyvinyl chloride, PVC), polycarbonate (Polycarbonate, PC), Ortho-Phenyl phenol (OPP), Oriented Polystyrene (OPS), Linear Low-Density Polyethy (LLDPE), Polyacetal (POM) And polymerized siloxanes or polysiloxanes (generally known as silicone) or other suitable materials are not limited to this.

Please refer to FIG. 5 to FIG. 7 together for a related illustration of the second preferred embodiment of the present invention. As shown in the figure, the main difference between the present embodiment and the foregoing embodiment is that the metal ring 150 is preferably a peripheral portion of a portion of the first metal circuit region 120, that is, the metal ring 150 does not have the inner ring metal ring 152 and the annular space 154. . A gap 140 that separates the first metal circuit region 120 and the second metal circuit region 130 is preferably a ring-shaped ring. The rest of the structure is described in the foregoing embodiment, and details are not described herein.

The outer ring metal ring 160 of the present embodiment is preferably directly connected to the metal ring 150 by the ribs 156, so that the strength of the outer ring metal ring 160 and the bonding strength with the rubber seat 170 can be increased to avoid the subsequent etching process. The outer ring metal ring 160 and the metal ring 150 are at risk of separation and falling off. In addition, the outer ring metal ring 160 and the metal ring 150 also form a plurality of spaces 158 through which the ribs 156 pass to connect the outer ring metal ring 160 and the metal ring 150, respectively.

In the embodiment shown in FIG. 5 to FIG. 7, when the injection molding of the rubber seat 170 is performed, the outer circumference of the first metal circuit region 120 in the corresponding functional region 172 is completely adhered to the mold (not shown). (ie metal ring 150). The protruding, annular and gapless metal ring 150 can penetrate the gap 140 of the metal (circuit) layer 110 into the gap 140 of the metal (circuit) layer 110, and does not penetrate into the gap 140 due to excessive pressure of the injected liquid colloid. This can effectively avoid and solve the problem of overflowing glue. Thereby, the metal (line) layer 110 of the functional area 172 is prevented from being overflowed to improve the brightness (light-emitting efficiency), quality and reliability of the packaged product.

It should be noted that, since the metal layer 110 of the present invention is directly electroplated, the first metal circuit region 120, the second metal circuit region 130, and the annular metal ring 150 without gaps or gaps are formed. Benchuang The metal layer 110 can achieve the effect of distinguishing positive and negative polarity by a single plating, sputtering, vapor deposition, electroless plating process, etc., and has the advantages of effectively simplifying the process steps and reducing the process cost, wherein the metal ring 150 further has The gap 140 in the functional zone 172 is prevented from producing the technical effect of overflowing.

In summary, the embodiments disclosed herein are to be considered as illustrative of the present invention and are not intended to limit the present invention. The scope of this creation is defined by the scope of the appended patent application and covers its legal equivalents and is not limited to the foregoing description.

100‧‧‧Ceramic substrate

102‧‧‧ first surface

110‧‧‧metal layer

120‧‧‧First metal circuit area

130‧‧‧Second metal circuit area

140‧‧‧ gap

150‧‧‧Metal ring

152‧‧‧ inner ring metal ring

154‧‧‧ annular interval

156‧‧ ‧ ribs

158‧‧‧ space

160‧‧‧Outer ring metal ring

170‧‧‧Glass

180‧‧‧ grain

182‧‧‧ wire

Claims (12)

A light-emitting diode lead frame structure includes: a ceramic substrate having a corresponding first surface and a second surface; a metal layer including a first metal circuit region, a second metal circuit region, and the separation a gap between the first metal circuit region and the second metal circuit region, and a ring-shaped metal ring surrounding the gap, the first metal circuit region and the second metal circuit region, wherein the first metal circuit region The second metal circuit region and the metal ring are respectively formed on the first surface of the ceramic substrate; and a plastic seat is formed on the first surface and partially covers the metal ring, and the rubber seat has a function of recessing a region, wherein the first metal circuit region, the second metal circuit region, and a portion of the metal ring expose the functional region. The light-emitting diode lead frame structure of claim 1, wherein the first metal circuit region, the second metal circuit region and the metal ring respectively protrude from the first surface, and the first metal circuit region, The second metal circuit region and the metal ring have the same height. The light-emitting diode lead frame structure of claim 1, wherein the metal ring further comprises an inner ring metal ring and the inner ring metal ring and the gap, the first metal circuit region and the second metal circuit region An annular interval. The light-emitting diode lead frame structure of claim 3, further comprising an outer ring metal ring and a plurality of ribs respectively connecting the outer ring metal ring and the inner ring metal ring, wherein the outer ring metal ring and the inner ring The width of the ring metal rings is approximately equal. The light-emitting diode lead frame structure of claim 3, wherein the outer ring metal ring and the inner ring metal ring are integrally formed with the first metal circuit region and the second metal circuit region. The light-emitting diode lead frame structure of claim 4, wherein the outer ring metal ring and the inner ring metal ring further form a plurality of spaces, each of the ribs passing through each of the spaces to form a ring with the outer ring metal ring The inner ring metal ring is connected. The light-emitting diode lead frame structure of claim 1, wherein the metal ring is a peripheral portion of the first metal circuit region. The light-emitting diode lead frame structure of claim 7, further comprising an outer ring metal ring and a plurality of ribs respectively connecting the outer ring metal ring and the metal ring, wherein the outer ring metal ring is the first The metal circuit region and the second metal circuit region are integrally formed. The light-emitting diode lead frame structure of claim 8, wherein the outer ring metal ring and the metal ring further form a plurality of spaces, each of the ribs passing through each of the spaces to respectively form the outer ring metal ring and the metal Ring connection. The light-emitting diode lead frame structure of claim 1, further comprising a die disposed in the first metal circuit region and two wires electrically connected to the die and the second metal circuit region, respectively. The illuminating diode lead frame structure of claim 1, wherein the ceramic substrate further comprises at least two perforations spaced apart from each other through the first surface and the second surface, the first metal circuit region and the second The metal circuit regions are individually filled in respective ones of the perforations and formed on the second surface. The light-emitting diode lead frame structure according to claim 1, wherein the rubber seat is made of a polymer material.