TWM540401U - Optoelectronic package - Google Patents

Abstract

An optoelectronic package includes a carrier, a light emitting die, a cover, and an encapsulation material. The carrier has a holding plane and a wiring layer formed on the holding plane. The light emitting die is mounted on the holding plan and electrically connected to the wiring layer. The cover is connected to carrier. A cavity is formed between the cover and the carrier, and the light emitting die is within the cavity. The encapsulation material formed on the carrier surrounds the cover. The encapsulation material completely covers the junction between the cover and carrier. The water vapor transmission rate (WVTR) of the encapsulation material is less than 1 g/m2/day.

Description

Photoelectric package

The present invention relates to an optoelectronic component, and in particular to an optoelectronic package.

Light Emitting Diode Die (LED Die) has been widely used as a light source in today's lighting fixtures. However, moisture and oxygen adversely affect the light-emitting diode wafer, so that the light-emitting diode wafer exposed to moisture and oxygen for a long time is easily damaged, resulting in a shortened life of the light-emitting diode wafer. Therefore, current light-emitting diode chips are encapsulated so that the light-emitting diode wafer is insulated from the outside water and oxygen as much as possible, and some lighting fixtures used in humid environments, such as fishing boat lamps, The inside of the LED chip needs a good seal to effectively prevent the infiltration of moisture and oxygen.

The present invention provides an optoelectronic package that uses a low permeation sealing material to effectively shield the inside of the luminescent wafer from moisture and oxygen from the outside.

The optoelectronic package provided by one embodiment of the present invention includes a carrier, a light emitting chip, a cover, and a sealing material. The carrier has a carrier plane and a circuit layer on the carrier plane. The light emitting chip is mounted on the carrying plane and electrically connected to the circuit layer. The cover connects the carrier, wherein a cavity is formed between the cover and the carrier, and the light-emitting chip is located in the cavity. A sealing material is formed on the carrier and around the cover, wherein the sealing material completely covers the junction between the cover and the carrier, and the sealing material has a water vapor permeability of less than 1 g/m ² /day.

In an embodiment of the present invention, the carrier further has an outer side. The outer side surface and the sealing material both surround the bearing plane, and the sealing material has an outer surface that is aligned with the outer side surface.

In an embodiment of the present creation, the carrier includes a retaining wall. The retaining wall protrudes from the carrying plane and surrounds the illuminating wafer. The retaining wall connects the cover, and the retaining wall, the bearing plane and the cover define a cavity.

In an embodiment of the present invention, the carrier further includes a plate body connecting the retaining walls. The plate body has a bearing plane and is integrally formed with the retaining wall.

In an embodiment of the present invention, the cover body includes a cover plate and a retaining wall. The retaining wall is coupled between the cover and the carrier and surrounds the illuminating wafer, wherein the cover, the retaining wall and the carrying plane define a cavity.

In an embodiment of the present invention, the carrier member further has an outer side surface and an annular groove adjacent the outer side surface. The outer side surface, the annular groove and the sealing material surround the retaining wall, and the sealing material fills the annular groove and has an outer surface that is aligned with the outer side surface.

In an embodiment of the present creation, the cover plate is integrally formed with the retaining wall.

In an embodiment of the present creation, the cover is transparent or opaque.

This creation uses the above low water vapor permeability (less than 1g/m ² /day) sealing material, which can effectively isolate the light-emitting chip in the photoelectric package from the outside water and oxygen, and make the photoelectric package of the present invention. Suitable for lighting fixtures (such as fishing boat lights) that can be used for long periods of time in humid environments.

The above and other objects, features and advantages of the present invention will become more apparent and understood.

20‧‧‧Tools

100, 300, 400, 600‧‧‧ photoelectric package

110,410‧‧‧Ship

111, 411h‧‧‧ bearing plane

112a, 112b‧‧‧ circuit layer

112r‧‧‧ring groove

112s, 411s‧‧‧ outside side

120‧‧‧Lighting chip

130, 330, 430, 630‧‧ ‧ cover

131, 331‧‧ ‧ cover

132, 412‧‧ ‧ retaining wall

132s‧‧‧ wall

140, 140i‧‧‧ sealing material

141s‧‧‧ outer surface

200, 500‧‧‧Package package collection

210, 510‧‧‧Package board

211c‧‧‧ pre-cut

331a, 331b‧‧‧ plane

411‧‧‧ board

C1, C2‧‧‧ cavity

J1, J2‧‧‧ Connection

T1, T2‧‧‧ Ditch

1A is a top plan view of an optoelectronic package of an embodiment of the present invention.

Figure 1B is a schematic cross-sectional view taken along line 1B-1B of Figure 1A.

2A to 2E are schematic views of a method of manufacturing the optoelectronic package of Fig. 1B.

3 is a schematic cross-sectional view of an optoelectronic package of another embodiment of the present invention.

4 is a schematic cross-sectional view of an optoelectronic package of another embodiment of the present invention.

5A to 5C are schematic cross-sectional views showing a method of manufacturing the optoelectronic package of Fig. 4.

6 is a schematic cross-sectional view of an optoelectronic package of another embodiment of the present invention.

1A is a top plan view of a photovoltaic package according to an embodiment of the present invention, and FIG. 1B is a schematic cross-sectional view taken along line 1B-1B of FIG. 1A. Referring to FIGS. 1A and 1B , the optoelectronic package 100 includes a carrier 110 , which may be a circuit board, such as a printed circuit board (PCB), and a dielectric layer (not labeled) of the carrier 110 may be a resin sheet. Made of (prepreg) or ceramic. In the embodiment of FIG. 1B, carrier member 110 is a double sided circuit board and has two layers of wiring layers 112a and 112b. However, in other embodiments, the carrier 110 can also be a single sided circuit board or a multilayer circuit board, so the circuit layer included in the carrier 110 (eg, the circuit layers 112a and 112b) The number can be only one layer or at least three layers.

The optoelectronic package 100 also includes an emissive wafer 120 mounted on the carrier 110 that electrically connects the carrier 110. Specifically, the carrier 110 also has a carrier plane 111, and the circuit layer 112a is located. The carrying plane 111 is mounted on the carrying plane 111 and electrically connected to the wiring layer 112a. Taking FIG. 1B as an example, the light-emitting wafer 120 is mounted on the carrying plane 111 by wire bonding and electrically connected to the wiring layer 112a. However, in other embodiments, the luminescent wafer 120 can also be mounted on the carrier plane 111 using a flip chip. The luminescent wafer 120 can be a light emitting diode (LED Die) that can act as a visible light source. Alternatively, the luminescent wafer 120 can also function as an invisible light source, such as an infrared source or an ultraviolet source.

The optoelectronic package 100 further includes a cover 130 connected to the carrier 110, wherein a cavity C1 is formed between the cover 130 and the carrier 110, and the luminescent wafer 120 is located in the cavity C1. In detail, the cover body 130 includes a cover plate 131 and a retaining wall 132, wherein the cover plate 131 is connected to the retaining wall 132. As seen from FIG. 1B, the retaining wall 132 extends downward from the lower side of the cover plate 131, and the retaining wall 132 has a ring shape, so that the retaining wall 132 and the cover plate 131 define a receiving slot (not labeled). ).

The cover 130 is fixed on the carrying plane 111, and the cover illuminates the wafer 120, wherein the retaining wall 132 is connected between the cover 131 and the carrier 110 and surrounds the luminescent wafer 120. In this manner, the carrier 110 will close the retaining groove defined by the retaining wall 132 and the cover plate 131 to form the cavity C1, that is, the cover plate 131, the retaining wall 132 and the bearing plane 111 define the cavity C1. Further, the cover plate 131 may have a function of converging or diverging a light beam. Taking FIG. 1B as an example, the cover plate 131 has a convex surface, so that the cover plate 131 can converge the light beam emitted by the light-emitting chip 120.

In this embodiment, the cover plate 131 and the retaining wall 132 may be integrally formed, that is, both the cover plate 131 and the retaining wall 132 may be made of the same material, and no boundary or joint is formed between the two. . For example, the cover plate 131 and the retaining wall 132 may be formed by machining or chemical etching of a sheet of material, or formed by injection molding of the same sheet, wherein the sheet may be glass, so the sheet may be glass, so The cover plate 131 may be transparent.

However, in other embodiments, since the illuminating wafer 120 can also serve as an infrared light source, and the prior art has developed an opaque material that can penetrate infrared light, the cover plate 131 for infrared light penetration can also be opaque. . In addition, the cover plate 131 and the retaining wall 132 may not be integrally formed, that is, an interface or a joint may be formed between the cover plate 131 and the retaining wall 132, and both the cover plate 131 and the retaining wall 132 may be made of different materials. to make. Therefore, the cover plate 131 and the retaining wall 132 are not necessarily integrally formed.

The optoelectronic package 100 further includes a sealing material 140, which may be a cured adhesive, and the main constituent material of the sealing material 140 may be epoxy. The sealing material 140 is formed on the carrier 110 and around the cover 130 and completely covers the joint J1 between the cover 130 and the carrier 110, wherein the sealing material 140 can contact the cover 130 and the carrier 110. The water vapor transmission rate (WVTR) of the sealing material 140 is less than 1 g/m ² /day, so the sealing material 140 can effectively block the outside water and oxygen, and can prevent the moisture and oxygen from the junction J1. It penetrates into the cavity C1 to effectively isolate the luminescent wafer 120 from moisture and oxygen.

In addition, the sealing material 140 can have good corrosion resistance and can be verified by the ASTM B-117 salt spray test for 300 hours of reliability. It can be seen that the sealing material 140 not only has good ability to insulate moisture and oxygen, but also has good corrosion resistance, so as to effectively block the infiltration of moisture, oxygen and corrosive substances (such as seawater vapor) to make the optoelectronic package. 100 is suitable for long-term use in a humid environment, that is, the optoelectronic package 100 can be not only made into general lighting fixtures such as street lamps and table lamps, but also suitable for lighting fixtures that can be used for a long time in a humid environment, such as fishing boat lamps.

In addition, the carrier 110 may further have an outer side 112s and an annular groove 112r. The outer side surface 112s, the annular groove 112r and the sealing material 140 both surround the bearing plane 111 and the retaining wall 132, and the annular groove 112r abuts the outer side surface 112s. In the embodiment shown in FIG. 1B, the outer side 112s extends downwardly from the lower edge of the annular groove 112r. The carrier member 110 protrudes from the wall surface 132s of the retaining wall 132, and the cover body 130 does not protrude from the outer side of the carrier member 110. 112s, so that the sealing material 140 is formed on the carrier 110 and surrounds the retaining wall 132. Further, the sealing material 140 fills the annular groove 112r and has an outer surface 141s that is aligned with the outer side 112s.

2A to 2E are schematic views of a method of manufacturing the optoelectronic package of Fig. 1B. Referring to FIG. 2A, in the method of fabricating the optoelectronic package 100, first, a package carrier 200 is provided. The package carrier set 200 includes a package panel 210 and a plurality of light emitting chips 120, and the light emitting chips 120 are mounted on the package board 210.

The package board 210 includes a plurality of carriers 110 (not labeled in FIG. 2A), and the carriers 110 are formed by cutting the package board 210. In other words, the package board 210 is a panel or a strip formed by connecting the carriers 110 to each other, and thus the package board 210 also has a multi-face bearing plane 111 and includes a plurality of wiring layers 112a and 112b. In addition, the package board 210 may have a plurality of pre-cut slots 211c located around the light-emitting wafers 120.

2B and 2C, wherein FIG. 2C is a top view of FIG. 2B, and FIG. 2B is a cross-sectional view taken along line 2B-2B of FIG. 2C. Then, the plurality of covers 130 are connected to the package board 210. The method for connecting the cover 130 to the package board 210 is various. For example, the cover 130 may be joined to the package board 210 by means of adhesion or eutectic bonding. The cover bodies 130 respectively cover the light-emitting chips 120. After the cover bodies 130 are connected to the package-connecting plates 210, a plurality of trenches T1 are formed between the cover bodies 130, and between the two adjacent covers 130 are stored. There is a ditch T1. The pre-cut grooves 211c are respectively located at the bottoms of the trenches T1, and in the embodiment shown in FIGS. 2B and 2C, the trenches T1 and the pre-cut grooves 211c are arranged in a grid shape and formed on the cover bodies 130. around.

Referring to FIG. 2D, a sealing material 140i is formed around the cover bodies 130, that is, a sealing material 140i is formed along the trenches T1, wherein the sealing material 140i fills the trenches T1 and fills the pre-cutting grooves 211c. The shape of the sealing material 140i may also be a grid shape. The sealing material 140i can be The polymer adhesive material, whose main constituent material is, for example, an epoxy resin, and the method of forming the sealing material 140i may include the following steps. First, the sealing material 140i is dispensed onto the package board 210. Thereafter, the sealing material 140i on the package board 210 is cured, wherein the sealing material 140i can be cured by ultraviolet light irradiation or heating. In addition, the sealing material 140i completely covers the joint J1 between the respective cover body 130 and the package board 210.

Referring to FIG. 2D and FIG. 2E, the package board 210 is then cut along the trenches T1. For example, the package 20 can be aligned and diced along the trenches T1 to divide the package carrier 200 into a plurality of optoelectronic packages 100. So far, the plurality of optoelectronic packages 100 have been substantially completed. In addition, the cutter 20 cuts the package board 210 along the trenches T1, so the cutter 20 directly cuts the sealing material 140i so that the sealing material 140i becomes the sealing material 140 in the optoelectronic package 100, wherein the outer surface of the sealing material 140i The outer surface 112s of the 141s and the carrier 110 are both cut by the cutter 20, so the outer surface 141s is aligned with the outer side 112s. In addition, the cutter 20 also cuts the pre-cut grooves 211c so that the pre-cut grooves 211c become the annular grooves 112r in the optoelectronic packages 100, as shown in Fig. 2E.

It is worth mentioning that in the embodiment shown in FIG. 1B, the cover 130 includes a cover plate 131 having a convex surface to converge the light beam emitted by the light-emitting chip 120, but in other embodiments, the cover plate 131 may not There is any convex or concave surface, like the optoelectronic package 300 shown in FIG. Referring to FIG. 3 , the optoelectronic package 300 shown in the embodiment of FIG. 3 is similar to the optoelectronic package 100 described above, and the only difference between the two is only the cover 331 included in the cover 330 of the optoelectronic package 300 . Specifically, the cover plate 331 has planes 331a and 331b opposed to each other, but does not have any convex or concave surface. Therefore, the cover 331 does not substantially converge or diverge the light beam emitted by the luminescent wafer 120. In addition, the constituent material and the forming method of the cover 330 may be the same as the cover plate 131, and the cover plate 331 and the retaining wall 132 in the cover 330 may also be integrally formed, as described in the embodiment of FIG. 1A and FIG. 1B above. .

4 is a schematic cross-sectional view of an optoelectronic package of another embodiment of the present invention. Referring to FIG. 4, the optoelectronic package 400 is similar to the optoelectronic package 100 of the previous embodiment. For example, the optoelectronic package 400 also includes a carrier 410, an illuminating wafer 120, a cover 430, and a sealing material 140, and a top view of the optoelectronic package 400 of FIG. 4 is similar to that of FIG. 1A. The manner in which the light-emitting chip 120 is mounted on the carrier 410 is also the same as the manner in which the light-emitting chip 120 is mounted on the carrier 110 in FIG. 1B, and the sealing material 140 also completely covers the joint J2 between the cover 430 and the carrier 410. However, there is still a difference between the optoelectronic package 400 and the optoelectronic package 100, such as the carrier 410 and the cover 430.

The cover 430 is a flat plate, such as a glass plate, and the cover 430 is made of the same material as the cover 131, so the cover 430 may also be transparent or opaque. When the cover 430 is opaque, the cover 430 may be made of an opaque material that can be penetrated by infrared light. The carrier 410 includes a plate body 411 and a retaining wall 412, wherein the plate body 411 is connected to the retaining wall 412. The plate body 411 is substantially identical to the carrier 110 shown in FIG. 1B and has a bearing plane 411h and an outer side surface 411s, wherein the outer side surface 411s and the sealing material 140 both surround the bearing plane 411h. The carrier plane 411h is also provided for the light-emitting wafer 120, and the barrier wall 412 protrudes from the carrier plane 411h and surrounds the light-emitting wafer 120.

In this embodiment, the plate body 411 and the retaining wall 412 may be integrally formed, that is, both the plate body 411 and the retaining wall 412 may be made of the same material without forming an interface or a joint therebetween. For example, the material constituting both the plate body 411 and the retaining wall 412 may include ceramic, and the plate body 411 and the retaining wall 412 may be formed through the same sintering process. In addition, the retaining wall 412 is coupled to the cover 430, and the retaining wall 412, the bearing plane 411h and the cover 430 define a cavity C2 in which the luminescent wafer 120 is located within the cavity C2.

5A to 5C are schematic cross-sectional views showing a method of manufacturing the optoelectronic package of Fig. 4. Referring to FIG. 5A, the optoelectronic package 400 and the optoelectronic package 100 are manufactured in a similar manner. In the manufacturing method of the optoelectronic package 400, first, a package carrier set 500 is provided, which includes a package board 510 and a plurality of The light emitting chip 120 is mounted on the package board 510. The package board 510 includes a plurality of carriers 410 (not labeled in FIG. 5A) and is a panel or substrate strip formed by the carriers 410 being connected to each other. Therefore, these carriers 410 can be formed by cutting the package board 510. Different from the package board 210 in FIG. 2A, since the package board 510 includes a plurality of carriers 410, the package board 510 may have a plurality of protruding retaining walls 412, and the package board 510 does not have any precut. Slot 211c.

Please refer to Figure 5B. Next, the plurality of covers 430 are connected to the package board 510, wherein the cover 430 can be bonded to the package board 510 by adhesive or eutectic bonding. After the cover 430 is connected to the package board 510, a plurality of trenches T2 are formed between the cover bodies 430, and one of the trenches T2 is formed between the adjacent two covers 430, wherein the trenches T2 can be arranged in a net. Grid shape. Thereafter, a sealing material 140i is formed around the cover bodies 430, and the sealing material 140i is filled in the trenches T2, wherein the sealing material 140i completely covers the joint J2 between the respective cover bodies 430 and the package board 510. The method of forming the sealing material 140i has been described in the foregoing embodiments, so it will not be described again here.

Referring to FIG. 5B and FIG. 5C, the package board 510 is then cut along the trenches T2. For example, the package board 510 is aligned with and along the trenches T2 to divide the package carrier assembly 500 into a plurality of optoelectronic packages 400, and to divide the encapsulation material 140i into a plurality of sealing materials 140. So far, the plurality of optoelectronic packages 400 have been substantially completed. Further, the outer surface 141s of the sealing material 140i and the outer side surface 411s of the plate body 411 are both cut by the cutter 20, so the outer surface 141s is aligned with the outer side surface 411s.

In particular, in the embodiment shown in FIG. 4, the cover 430 is a flat plate, but in other embodiments, the cover 430 may have a convex or concave surface to converge the light beam emitted by the luminescent wafer 120. As shown in FIG. 6, the optoelectronic package 600. Referring to FIG. 6, the optoelectronic package 600 is similar to the optoelectronic package 400. The only difference is that the cover 630 of the optoelectronic package 600 has a convex surface, so the cover 630 has a light beam that converges from the light emitting chip 120. The function.

In summary, since the sealing material completely covers the joint between the cover and the carrier, and has a good ability to block moisture and oxygen (water vapor permeability is less than 1g/m ² /day), the external moisture and It is difficult for oxygen to penetrate into the luminescent wafer within the cavity from the junction between the cover and the carrier. Thus, the sealing material disclosed in the present invention can effectively protect the light-emitting wafer from moisture and oxygen, so that the photoelectric package is suitable for being made into a lighting fixture (such as a fishing boat lamp) that can be used for a long time in a humid environment.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those skilled in the art to which the present invention pertains may have some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this new type is subject to the definition of the scope of the patent application.

100‧‧‧Optoelectronic package

110‧‧‧Ship

111‧‧‧bearing plane

112a, 112b‧‧‧ circuit layer

112r‧‧‧ring groove

112s‧‧‧ outside side

120‧‧‧Lighting chip

130‧‧‧ cover

131‧‧‧ Cover

132‧‧‧Retaining wall

132s‧‧‧ wall

140‧‧‧ Sealing material

141s‧‧‧ outer surface

C1‧‧‧ cavity

J1‧‧‧ Connection

Claims (10)

An optoelectronic package includes: a carrier member having a carrier plane and a circuit layer on the carrier plane: an illuminating chip mounted on the carrier plane and electrically connected to the circuit layer; a cover body connected to the a carrier, wherein a cavity is formed between the cover and the carrier, and the light emitting chip is located in the cavity; and a sealing material is formed on the carrier and around the cover, wherein the sealing material is completely covered a joint between the cover and the carrier. The optoelectronic package of claim 1, wherein the sealing material has a water vapor permeability of less than 1 g/m 2 /day. The optoelectronic package of claim 1, wherein the carrier further has an outer side, the outer side and the sealing material surround the bearing plane, and the sealing material has an outer surface that is aligned with the outer side. The optoelectronic package of claim 1, wherein the carrier comprises a retaining wall protruding from the carrying plane and surrounding the illuminating wafer, the retaining wall connecting the cover, and the retaining wall and the carrying The plane defines the cavity with the cover. The optoelectronic package of claim 4, wherein the carrier further comprises a plate body connected to the retaining wall, the plate body having the bearing plane and integrally formed with the retaining wall. The optoelectronic package of claim 1, wherein the cover comprises: a cover; and a retaining wall connected between the cover and the carrier and surrounding the light emitting chip, wherein the cover, the cover The retaining wall defines the cavity with the bearing plane. The optoelectronic package of claim 6, wherein the carrier further has an outer side surface and an annular groove adjacent to the outer side surface, the outer side surface, the annular groove and the sealing material surround the retaining wall, and the seal The material fills the annular groove and has an outer surface that is aligned with the outer side. The optoelectronic package of claim 6, wherein the cover is integrally formed with the retaining wall. The optoelectronic package of claim 6, wherein the cover is transparent. The optoelectronic package of claim 6, wherein the cover is opaque.