TWM539424U - Lapping machine - Google Patents

Description

Surface grinder

The present invention relates to a plane grinder, in particular to adding an ultrasonic oscillator on a lower positioning disc on which an object to be polished is placed, so that the whole positioning disc is oscillated, and the grinding speed of the object to be polished is improved without affecting The creation of its surface flatness.

In order to smooth the surface of the glass, glass surface grinding is usually carried out. Refer to the Republic of China Invention Patent No. I290877 "Glass Grinding Device and Grinding System", which includes: a grinding frame; a lower top plate, the lower top plate is detachable The method is coupled to the grinding frame, and is provided with an adhesive thereon; an upper top plate, the upper top plate and the lower top plate are disposed facing each other, and a polishing pad is attached to the opposite surface of the lower top plate, and a polishing liquid conduit is provided inside for allowing the slurry to pass through; a driving device for rotating the upper top plate; a conveying device for conveying the driving device; and a polishing liquid supply device provided by the polishing liquid conduit of the upper top plate Slurry.

In order to improve the flatness of the polished glass, refer to the Republic of China new patent No. M400382 "Ultra-sonic assisted chemical mechanical polishing mechanism", in which the ultrasonic generator is installed on the bracket for fixing the grinding tool to make the grinding After the polishing pad is installed, the polishing pad may be oscillated due to ultrasonic vibration to improve the flatness of the object to be polished after grinding. However, the ultrasonic pad is used to oscillate the polishing pad. When the polishing pad grinds the glass, only the glass contacting the polishing pad is affected by the oscillation, which is a single point oscillation, and thus it is difficult to control the flatness of the polished glass.

Therefore, in order to improve the aforementioned deficiency, the present invention proposes a plane grinder comprising:

a first rotating unit is disposed on the base, the first rotating unit has a rotating shaft; a lower positioning plate is connected to the rotating shaft; an ultrasonic unit is connected to the lower positioning plate; and a second rotating unit is Disposed on the base; an upper positioning plate is connected to the second rotating unit, and the upper positioning plate can be moved to correspond to the lower positioning plate.

Further, the shaft has a hydraulic bearing.

Further, the second rotating unit is coupled to a displacement unit, so that the upper positioning plate can be moved through the displacement unit to correspond to the lower positioning plate. Further, the displacement unit has an optical scale for controlling the moving position of the upper positioning disc.

Further, a laser range finder is disposed on the base, and the laser range finder has a detecting connector extending above the lower positioning plate.

Further, the rotation speed of the second rotating unit is from 1000 revolutions per minute to 4000 revolutions per minute. Further, the rotation speed of the first rotating unit is from 1 revolution per minute to 60 revolutions per minute.

According to the above technical features, the following effects can be achieved:

When the object to be polished is ground, the whole object to be polished is oscillated by the ultrasonic unit, and the surface roughness Ra of the object to be polished after grinding is not more than 0.03 micrometer, and the surface unevenness is not more than ten percent.

In combination with the above technical features, the main effects of the present invention will be clearly demonstrated in the following embodiments.

Referring to the first figure and the second figure, the embodiment includes:

a base (1); a first rotating unit (2) disposed on the base (1), the first rotating unit (2) has a rotating shaft (21), and the rotating shaft (21) has a hydraulic bearing ( 211); the positioning disk (3) is connected to the rotating shaft (21); an ultrasonic unit (4) is connected to the lower positioning plate (3); a second rotating unit (5) is transmitted through a displacement unit (6) And disposed on the base (1), the displacement unit (6) has an optical scale (61); an upper positioning plate (7) connected to the second rotating unit (5); a laser range finder ( 8), disposed on the base (1), the laser range finder (8) has a detecting joint (81) extending above the lower positioning plate (3).

Referring to the third figure, a workpiece to be polished (9) is taken as an example, wherein the wafer has a thickness of 725 μm, and is placed on the lower positioning plate (3), and then the laser is measured. The detecting joint (81) of the distance meter (8) is rotated above the object (9) corresponding to the object to be polished, and the object to be polished (9) is rotated, so that the laser range finder (8) detects the object to be ground ( 9) The upper eight points are used to calculate the thickest and thinnest portions of the object to be polished (9), and the amount of grinding is converted.

Referring to the fourth figure, the upper positioning plate (7) is then moved to the corresponding lower positioning plate (3) through the displacement unit (6), wherein the upper positioning plate can be precisely controlled by the optical ruler (61). The moving position of (7) further polishes the wafer. During the grinding process, the rotation speed of the first rotating unit (2) is changed from 1 rotation per minute to 60 revolutions per minute to drive the lower positioning plate (3) to rotate, so that the rotation speed of the second rotating unit (5) is between 1000 revolutions per minute to 4000 revolutions per minute to drive the upper positioning disc (7) to rotate, and the axial grinding speed during grinding is between 15 micrometers and 20 micrometers per minute, and the ultrasonic unit (4) is used to The whole wafer is oscillated with an amplitude ranging from 1 micrometer to 5 micrometers. This embodiment takes 3 micrometers as an example, so that the amplitude on the wafer can be made uniform, wherein when the wafer is ground to 90% of the thickness to be polished to At 95%, the ultrasonic unit (4) is stopped. In this embodiment, when the wafer is ground to a thickness of 300 μm, the ultrasonic unit (4) is stopped, and the wafer is continuously ground. Until the wafer is ground to a predetermined thickness of 250 μm ± 2.5 μm, the surface roughness Ra is not more than 0.03 μm, and the surface unevenness is not more than 10%, so that the surface flatness of the wafer is better after grinding. The effect. The laser range finder (8) can then be used to further detect whether the thickness of the object to be polished (9) is up to standard. Wherein, the auxiliary grinding by the ultrasonic unit (4) can achieve the effect of rough grinding the wafer, and when the ultrasonic unit (4) is stopped, the grinding is continued, and the fine grinding effect can be achieved. Therefore, the creation of the wafer can be coarsely ground and finely ground simultaneously through a single machine. Relatively known, when the rough grinding of the wafer is completed, the machine needs to be replaced to finely grind the wafer, which requires repositioning and calibration level, which may cause the yield to drop. This creation does not require the wafer replacement machine to Rough grinding and fine grinding will greatly increase product yield.

It should be further noted that the hydraulic bearing (211) can prevent the vibration of the motor of the first rotating unit (2) from being uploaded to the lower positioning plate (3) during grinding, and can also prevent the ultrasonic unit (4) from being The generated amplitude is transmitted down to the base (1), so that stability during processing can be improved.

In view of the above description of the embodiments, the above-described embodiments are merely a preferred embodiment of the present invention, and the implementation of the present invention is not limited thereto. The scope, that is, the simple equivalent changes and modifications made in accordance with the scope of the patent application and the content of the creation of the creation, are within the scope of this creation.

(1) ‧ ‧ pedestal
(2)‧‧‧First rotating unit
(21) ‧‧ ‧ shaft
(211)‧‧‧Hydraulic bearings
(3) ‧‧‧ positioning plate
(4) ‧‧‧Ultrasonic unit
(5) ‧‧‧Second rotating unit
(6) ‧‧‧displacement unit
(61)‧‧‧ optical ruler
(7) ‧ ‧ upper positioning plate
(8)‧‧‧Laser rangefinder
(81)‧‧‧Detecting joints
(9) ‧‧‧ objects to be ground

[The first picture] is a three-dimensional appearance of the creation.

[Second figure] is a configuration relationship diagram of the first rotating unit, the lower positioning disk, and the ultrasonic unit in the present embodiment.

[Third image] is a schematic diagram of the operation of the laser range finder in the present embodiment.

[Fourth figure] is a schematic diagram of the upper positioning disk corresponding to the lower positioning disk in the present embodiment.

(1) ‧ ‧ pedestal

(2)‧‧‧First rotating unit

(21) ‧‧ ‧ shaft

(3) ‧‧‧ positioning plate

(5) ‧‧‧Second rotating unit

(6) ‧‧‧displacement unit

(61)‧‧‧ optical ruler

(7) ‧ ‧ upper positioning plate

(8)‧‧‧Laser rangefinder

(81)‧‧‧Detecting joints

Claims (7)

A plane grinder comprising: a base; a first rotating unit disposed on the base, the first rotating unit having a rotating shaft; a lower positioning plate connecting the rotating shaft; and an ultrasonic unit connecting the lower positioning plate a second rotating unit is disposed on the base; an upper positioning plate is coupled to the second rotating unit, and the upper positioning plate is movable to correspond to the lower positioning plate. The surface grinder of claim 1, wherein the rotating shaft has a hydraulic bearing. The plane grinder of claim 1, wherein the second rotating unit is coupled to a displacement unit such that the upper positioning plate is movable through the displacement unit to correspond to the lower positioning plate. The plane grinder of claim 3, wherein the displacement unit has an optical scale for controlling the moving position of the upper positioning disc. A plane grinder as described in claim 3, further comprising a laser range finder disposed on the base, the laser range finder having a detection joint extending above the lower locating disc. The surface grinder of claim 1, wherein the second rotating unit has a rotational speed of from 1000 revolutions per minute to 4000 revolutions per minute. The surface grinder of claim 1, wherein the first rotating unit has a rotational speed of from 1 revolution per minute to 60 revolutions per minute.