TWM536829U - De-bonding type flexible substrate - Google Patents

Description

Releaseable flexible substrate

The present invention relates to a detachable flexible substrate and a method of manufacturing the same, and particularly to a flexible substrate applied to an electronic component, which can be detached from a support carrier to obtain a flexible substrate having electronic components.

Conventional flat panel displays use thick and fragile glass substrates, which have been gradually replaced by plastic flexible substrates due to thinning and cost reduction, and the manufacture of plastic flexible substrate displays includes a support carrier for forming on the support carrier. The plastic flexible substrate and the integrated circuit or various electronic circuits formed on the flexible substrate are then subjected to a peeling process to separate the flexible substrate from the support carrier to obtain a plastic flexible substrate display.

A method for separating a flexible substrate from a support carrier is performed by using a laser for peeling. However, the laser stripping method causes damage to the flexible substrate and the integrated circuit thereon due to thermal effects, and the laser device is expensive. It is a considerable burden for the cost of the operator.

TWI444114 is a flexible substrate having a release layer and a manufacturing method thereof, wherein a release layer is detachably attached to a support carrier, and a flexible substrate is coated on the release layer. Then, after the display element is set, the release layer is stripped from the support carrier to obtain a flexible substrate having the display element.

However, in the above flexible substrate having a release layer and a method for manufacturing the same, when a flexible substrate is to be produced, a release layer must be produced first, and the production process is cumbersome and costly.

The present invention provides a removable substrate and a method of manufacturing the same, comprising a support carrier; a release layer attached to the support carrier, comprising a polyimine comprising the main structure of the release layer, a binder and a release agent, wherein the polyimide is formed by reacting a diamine and a dianhydride, and the adhesive is used to improve the adhesion between the release layer and the support carrier; The diamine and the dianhydride are reacted and attached to the release layer, wherein the release agent is used to increase the release force of the polyimide layer and the release layer, so that the release layer and the release layer The adhesion of the support carrier is greater than the adhesion of the polyimide layer to the release layer, and the polyimide layer can be peeled off from the release layer, and the release layer is still attached to the support carrier. on.

10‧‧‧Support carrier

12‧‧‧ release layer

14‧‧‧ Polyimine layer

16‧‧‧Adhesive

18‧‧‧ Release agent

Figure 1 is a cross-sectional view of a flexible substrate that can be dispensed.

Fig. 2 is a first schematic view showing a method of manufacturing a flexible substrate which can be released.

Fig. 3 is a second schematic view showing a method of manufacturing a flexible substrate which can be released.

Fig. 4 is a third schematic view showing a method of manufacturing a flexible substrate which can be released.

The present invention provides a cross-sectional view of a flexible substrate that includes a support carrier 10, a release layer 12, and a polyimide layer 14.

The support carrier 10 can be a glass or metal or germanium wafer.

The release layer 12 is attached to the support carrier and comprises a polyimide, an adhesive 16 and a release agent 18 which form the main structure of the release layer.

The polyimine is formed by reacting a diamine and a dianhydride. In the embodiment, the diamine monomer may be 4,4'-diaminodiphenyl ether (4,4'-oxydianiline (4,4). '-ODA)), phenylenediamine (p-PDA), 2,2'-Bis (trifluoromethyl)benzidine (TFMB), 1 , 3-bis(4-aminophenoxy)benzene (TPER), 1,4-bis(4-aminophenoxy)benzene (1, 4-bis(4-aminophenoxy)benzene(TPEQ)), 4,4'-diamino-2,2'-dimethyl-1,1'-biphenyl (2,2'-dimethyl[1,1 '-biphenyl]-4,4'-diamine(m-TB-HG)), 1,3-bis(3-aminophenoxy)benzene (1,3'-Bis(3-aminophenoxy)benzene (APBN )), 3,5-Diaminobenzotrifluoride (DABTF), 2,2'-bis[4-(4-aminophenoxyphenyl)]propane (2,2) '-bis[4-(4-aminophenoxy)phenyl]propane (BAPP)), 6-amino-2-(4-aminophenyl)-benzoxazole (6-amino-2-(4-aminophenyl) ) benzoxazole (6PBOA)), 5-amino-2-(4-aminophenyl)benzoxazole (5PBOA), etc., may be used alone or Used in combination.

In an embodiment, the dianhydride monomer may be 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 2,2 -2[2-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (2,2-bis[4-(3,4dicarboxyphenoxy)phenyl]propane dianhydride (BPADA)), pyromellitic acid II Pyromellitic dianhydride (PMDA), 4,4'-Bis-(3,4-Dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), diphenyl ether tetracarboxylic acid Diacid anhydride (4,4-Oxydiphthalic anhydride (ODPA)), Benzophenone tetracarboxylic dianhydride (BTDA), 3,3',4,4'-dicyclohexyltetracarboxylic dianhydride (3,3', 4,4'-dicyclohexyltetracarboxylic acid dianhydride (HBPDA), etc., may be used singly or in combination.

The adhesive agent 16 is a decane compound, which accounts for 1-10% by weight of the total weight of the release layer 12, for improving the adhesion of the release layer 12 and the support carrier 10. The adhesion is tested by the strength test with a hundred-square knife, showing 5B. Representative value (5B: the edge of the slit is completely smooth, and the edge of the lattice is not peeled off). The detailed 100-gauge knife strength test is described later.

The release agent 18 can be a fluorine-containing filler which is 5 to 45 wt% based on the total weight of the release layer 12, or can be a hafnoid-containing filler which is 5 to 45 wt% based on the total weight of the release layer 12.

The polyimine layer 14 is formed by reacting a diamine and a dianhydride, and is attached to the release layer 12, wherein the release agent 18 is used to increase the distance between the polyimide layer 14 and the release layer 12. The force is such that the peel strength is less than 0.1 kgf/cm, so that the polyimide layer 14 can be peeled off from the release layer 12, and the adhesion of the release layer 12 to the support carrier 10 is greater than that of the polyimide layer 14 and The adhesion of the layer 12 allows the polyimide layer 14 to be peeled off the release layer 12, while the release layer 12 remains attached to the support carrier 10, allowing the release layer 12 to be reused to reduce production. cost.

In embodiments, the polyimine layer may use the same, partially identical, or different monomers as the support carrier 10.

In an embodiment, the present invention can be used to fabricate a flexible substrate manufacturing method. Please refer to FIGS. 2-4, which includes the following steps: providing a support carrier 10 to prepare a first polyaminic acid solution, which is composed of a diamine. After the reaction of the monomer and the dianhydride monomer is completed, the adhesive 16 and the release agent 18 are added, and the first polyaminic acid solution is coated on the support carrier 10 to form a release layer 12; An amine acid solution, which is prepared by reacting a diamine monomer and a dianhydride monomer, is applied to the release layer 12 to dry the polyamic acid solution into a polyimine layer.

The flexible substrate manufacturing method of the present invention can be formed by thermal conversion or chemical conversion. If chemical conversion is employed, the dehydrating agent and catalyst can be added to the polyaminic acid solution prior to the coating step. The solvent, dehydrating agent and catalyst used in the foregoing may be those skilled in the art. The solvent may be an aprotic polar solvent such as dimethylacetamide (DMAC), N,N'-dimethylformamide (DMF), N-methylpyrrolidone (NMP), dimethylene碸 (DMSO), tetramethyl hydrazine, N, N'-dimethyl-N, N'-propenyl urea (DMPU), and the like. The dehydrating agent may be an aliphatic acid anhydride (such as acetic anhydride and propionic anhydride), an aromatic acid anhydride (such as phthalic anhydride and phthalic anhydride), or the like. The catalyst may be a heterocyclic tertiary amine (such as picoline, pyridine, etc.), an aliphatic tertiary amine (such as triethylamine (TEA), etc.), an aromatic tertiary amine (such as xylylene, etc.). Wait. Polylysine: Dehydrating agent: The catalyst has a molar ratio of 1:2:1, i.e., about 2 moles of dehydrating agent and about 1 mole of catalyst per mole of polyamic acid.

In the present invention, a diamine monomer and a dianhydride monomer are subjected to a condensation reaction to form a polyimine, and the diamine and the dianhydride are reacted at a ratio of about equimolar (1:1), for example, 0.9: 1.1, or 0.98: 1.02.

The polyimine of the polyimine and the polyimide layer constituting the main structure of the underlayer is not particularly limited.

The following examples detail the creation.

Example 1

The soft substrate which can be separated from the creation is prepared.

<Example 1>

Preparation of first polyaminic acid solution

52.63 g of ODA and 440 g of DMAc of the solvent were placed in a three-necked flask, and after stirring until completely dissolved, 57.4 g of PMDA was added, wherein the monomer accounted for 20 wt% of the total weight of the reaction solution. Then, stirring was continued at 25 ° C for 25 hours. After the reaction, 1 wt% of a decane compound and 20 wt% of a fluorine-containing filler were added to obtain a first polyaminic acid solution.

Preparation of second polyaminic acid solution

71.67 g of TFMB and 412.5 g of DMAc of the solvent were placed in a three-necked flask, and after stirring until completely dissolved, 65.84 g of BPDA was added, wherein the monomer accounted for 25 wt% of the total weight of the reaction solution. Then, stirring was continued at 25 ° C for 25 hours to obtain a second polyaminic acid solution.

Polyimine layer preparation

The obtained first polyaminic acid solution was coated on a glass substrate and heated in an oven at 80 ° C for about 30 minutes to remove most of the solvent, and then the first polylysine was coated thereon. The glass substrate of the solution was placed in an oven at 170 ° C to 370 ° C and heated for about 4 hours to form a release layer. Applying a second polyaminic acid solution to the release layer, and heating in an oven at 80 ° C for about 30 minutes, and then placing the glass substrate coated with the second polyaminic acid solution at 170 ° C to 370 ° C The oven was heated for about 4 hours to allow the polyamic acid solution to be dried to form a polyimide layer. The peel strength of the polyimide layer and the release layer is less than 0.1 kgf/cm, and the polyimide layer 14 can be peeled off from the release layer 12. The adhesion strength test of the release layer 12 with the support carrier 10 was 5B.

Strength test

The adhesion strength test was performed using a hex cutter, and the test method was as follows. Prepare a polythene film with a length of 5cm and a width of 5cm. Cut a cross-grid pattern on the coating surface with a squeegee and a knife tip. The incision is made up to the base material. In the middle square shape, it is 100 small cells, each length is 1mm. 1mm wide. Then use a brush to brush the painted surface five times in a diagonal direction to gently clean the painted surface and the concave surface. Finally, use standard tape (3M Transparent Tape 600 or 610), stick to the surface of 100 small cells, and press the surface with one end of the eraser (for example, using a pencil with an eraser at one end) to make the tape completely close and flat, in an instant 180°. Tear off the tape. The method of determination uses ASTM D3359-95, 5B: the edges of the slits are completely smooth and the edges of the lattice are free of any peeling. 4B: There is a small piece of peeling at the intersection of the incisions, and the actual damage in the cross-cut area 5%. 3B: The edges and/or intersections of the incisions are peeled off, and the area is greater than 5% to 15%. 2B: Partial peeling or peeling off along the edge of the slit, or part of the lattice is peeled off. The area of peeling is more than 15% to 35%. 1B: Large pieces of the edge of the slit are peeled off or some of the square parts are partially or completely peeled off, and the area is larger than 35% to 65% of the cross-cut area. 0B: There is a piece of paint peeling off at the edge and intersection of the line, and the total area of shedding is greater than 65%. In the present invention, the definition 5B is the basic requirement of the strength.

Example 2

The procedure of Example 1 was repeated except that the components of the first polyaminic acid solution were changed to 5 wt% decane compound and 20 wt% fluorine-containing filler.

Example 3

The procedure of Example 1 was repeated except that the components of the first polyamic acid solution were changed to 5 wt% decane compound and 5 wt% fluorine-containing filler.

Example 4

The procedure of Example 1 was repeated except that the components of the first polyamic acid solution were changed to 5 wt% decane compound and 45 wt% fluorine-containing filler.

Example 5

The procedure of Example 1 was repeated except that the components of the first polyaminic acid solution were changed to 5 wt% decane compound and 5 wt% decane alkane filler.

Example 6

The procedure of Example 1 was repeated except that the components of the first polyamidonic acid solution were changed to 5 wt% decane compound and 20 wt% decane alkane filler.

Example 7

The procedure of Example 1 was repeated except that the components of the first polyaminic acid solution were changed to 5 wt% decane compound and 45 wt% decane alkane filler.

Example 8

The procedure of Example 1 was repeated except that the components of the first polyaminic acid solution were changed to 5 wt% decane compound and 20 wt% fluorine-containing filler.

Comparative example 1

The procedure of Example 1 was repeated except that the components of the first polyamic acid solution were changed without the addition of a decane compound and a 4 wt% fluorine-containing filler.

Comparative example 2

The procedure of Example 1 was repeated except that the components of the first polyamic acid solution were changed to 1 wt% decane compound and 4 wt% decane alkane filler.

Comparative example 3

The procedure of Example 1 was repeated except that the components of the first polyamic acid solution were changed to 15 wt% decane compound and 20 wt% decane alkane filler.

Comparative example 4

The procedure of Example 1 was repeated, except that the components of the first polyamidonic acid solution were changed to add 5 wt% of a decane compound and 50 wt% of a decane alkane filler.

Comparative Example 5

The procedure of Example 1 was repeated except that the components of the first polyaminic acid solution were changed to add 5 wt% of a decane compound and 50 wt% of a fluorine-containing filler.

Peel strength test: measured using a universal material testing machine (Hounsfield H10ks) according to IPC-TM650 2.4.9.

Then the strength and peelability test results are shown in the table below.

The above specific embodiments are intended to describe the present invention in detail, however, these embodiments are for illustrative purposes only and are not intended to limit the present invention. It will be understood by those skilled in the art that various changes or modifications to the present invention are within the scope of the present invention without departing from the scope of the appended claims.

10‧‧‧Support carrier

12‧‧‧ release layer

14‧‧‧ Polyimine layer

16‧‧‧Adhesive

18‧‧‧ Release agent

Claims (6)

A detachable flexible substrate comprising: a support carrier; a release layer attached to the support carrier, comprising a polyimine, an adhesive and a release agent constituting the main structure of the release layer, The polyimide is formed by reacting a diamine and a dianhydride, the adhesive is used to improve the adhesion of the release layer to the support carrier; and the polyimine layer is reacted by a diamine and a dianhydride. The release agent is attached to the release layer, wherein the release agent is used to increase the release force of the polyimide layer and the release layer, so that the adhesion of the release layer to the support carrier is greater than The adhesion of the polyimide layer to the release layer allows the polyimide layer to be peeled off from the release layer while the release layer remains attached to the support carrier. The detachable flexible substrate of claim 1, wherein the support carrier is a glass or a metal or germanium wafer. The detachable flexible substrate according to claim 1, wherein the release agent is a fluorine-containing filler, which accounts for 5 to 45 wt% of the total weight of the release layer, and the adhesive is a decane compound. It accounts for 1~10wt% of the total weight of the release layer. The detachable flexible substrate according to claim 1, wherein the release agent is a decane-filled filler, and the siloxane-containing filler comprises 5 to 45 wt% of the total weight of the release layer. The subsequent agent is a decane compound which accounts for 1 to 10% by weight based on the total weight of the release layer. The detachable flexible substrate according to claim 1, wherein the polyimine layer is selected from the group consisting of 4,4'-diaminodiphenyl ether (4,4'-ODA), a diamine in the group consisting of phenylenediamine (p-PDA) and 2,2'-bis(trifluoromethyl)benzidine (TFMB) and selected from pyromellitic dianhydride (PMDA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA) is obtained by reacting a group of dianhydrides. The detachable flexible substrate according to claim 1, wherein the polyimine constituting the main structure of the release layer is selected from the group consisting of 4,4'-diaminodiphenyl ether (4, 4'-ODA), diamines in the group consisting of p-phenylenediamine (p-PDA), 2,2'-bis(trifluoromethyl)benzidine (TFMB), and selected from pyromellitic dianhydride ( PMDA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride ( BPADA) is obtained by reacting a group of dianhydrides.