TWM536428U - Connector reinforced structure - Google Patents
Connector reinforced structure Download PDFInfo
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- TWM536428U TWM536428U TW105213929U TW105213929U TWM536428U TW M536428 U TWM536428 U TW M536428U TW 105213929 U TW105213929 U TW 105213929U TW 105213929 U TW105213929 U TW 105213929U TW M536428 U TWM536428 U TW M536428U
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- modules
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/7064—Press fitting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Combinations Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
本創作係有關於一種連結器強化結構，尤其是指一種透過框體以及補強件抵靠於連結器模組之連結器強化結構。 The present invention relates to a connector reinforcing structure, and more particularly to a connector reinforcing structure that passes through a frame and a reinforcing member against the connector module.
一般而言，電腦的主機板中係設有複數個用於插設記憶體之連結器模組，以供使用者根據自身的需求插設記憶體。其中，使用者在插拔記憶體後，經常會對記憶體左右搖晃，長期下來易導致連結器模組自主機板上脫離而損壞，因此，如何強化連結器模組成為業者所欲解決之課題之一。 Generally, the motherboard of the computer is provided with a plurality of connector modules for inserting memory, so that the user can insert the memory according to the requirements of the user. Among them, after the user inserts and removes the memory, the memory is often shaken left and right. In the long run, the connector module is easily detached from the motherboard and damaged. Therefore, how to strengthen the connector module becomes a problem that the manufacturer wants to solve. one.
另外，在如記憶體之工作元件裝設於連結器模組後且電腦開機時，記憶體在運作的過程中會對主機板上的其他元件造成電磁干擾(Electro Magnetic Interference；EMI)，進而造成其他元件傳遞信號時受到雜訊的干擾而易出錯，因此，如何降低記憶體對其他元件的電磁干擾也成為業者所欲改善之課題之一。 In addition, when the working component of the memory is installed in the connector module and the computer is turned on, the memory may cause electromagnetic interference (EMI) to other components on the motherboard during the operation, thereby causing When other components transmit signals, they are disturbed by noise and are prone to errors. Therefore, how to reduce the electromagnetic interference of other components in the memory has become one of the problems that the industry wants to improve.
有鑒於現有之連結器模組中，普遍具有易 損壞且在插設記憶體後易有電磁干擾之問題。緣此，本創作主要係提供一種連結器強化結構，其主要係透過框體以及連結於框體之補強件抵靠於連結器模組，以達到強化連結器模組之目的。 In view of the existing connector modules, it is generally easy to Damaged and susceptible to electromagnetic interference after plugging in memory. Therefore, the present invention mainly provides a connector reinforcing structure, which mainly relies on a frame body and a reinforcing member connected to the frame body to abut the connector module to achieve the purpose of reinforcing the connector module.
基於上述目的，本創作所採用之主要技術手段係提供一種連結器強化結構，係用以設置於複數個位於一電路板之連結器模組，該些連結器模組之任二相鄰者之間具有一相鄰空間，連結器強化結構包含一框體以及至少一補強件。框體係具有一第一框體端以及一對應於第一框體端之第二框體端，並具有一第一框體側部與對應於第一框體側部之一第二框體側部，第一框體端、第二框體端、第一框體側部與第二框體側部係圍構出一圍繞空間。該至少一補強件係自第一框體端經過圍繞空間而延伸至第二框體端。其中，在連結器強化結構設置於連結器模組時，該至少一補強件係在該至少一相鄰空間中對應地抵靠於該些連結器模組中之二相鄰者，第一框體側部與第二框體側部係分別鄰近於該些連結器模組中相距最遠之二者。 Based on the above objectives, the main technical means adopted by the present invention is to provide a connector reinforcing structure for being disposed on a plurality of connector modules located on a circuit board, and any two adjacent ones of the connector modules There is an adjacent space between the connectors, and the connector reinforcing structure comprises a frame body and at least one reinforcing member. The frame system has a first frame end and a second frame end corresponding to the first frame end, and has a first frame side and a second frame side corresponding to one of the first frame side portions The first frame body end, the second frame body end, the first frame body side portion and the second frame body side portion form a surrounding space. The at least one reinforcing member extends from the first frame end to the second frame end through the surrounding space. Wherein, when the connector reinforcement structure is disposed on the connector module, the at least one reinforcement member correspondingly abuts two adjacent ones of the connector modules in the at least one adjacent space, the first frame The body side portion and the second frame body side are respectively adjacent to the farthest distances among the connector modules.
在上述必要技術手段的基礎下，上述連結器強化結構還包含以下所述的較佳附屬技術手段。框體之第一框體端係沿一延伸方向延伸出一第一板體，第二框體端係沿延伸方向延伸出一第二板體，在連結器強化結構設置於連結器模組時，第一板體係抵靠於該些連結器模組之端部，第二板體係抵靠於該些連結器模組之另一端部。 Based on the above-mentioned necessary technical means, the above-mentioned connector reinforcing structure further includes the following preferred technical means. The first frame end of the frame body extends a first plate body along an extending direction, and the second frame body end extends a second plate body along the extending direction, when the connector reinforcing structure is disposed on the connector module. The first plate system abuts the ends of the connector modules, and the second plate system abuts the other ends of the connector modules.
在上述必要技術手段的基礎下，上述連結 器強化結構還包含以下所述的較佳附屬技術手段。各補強件之兩側部係沿一延伸方向分別延伸有一側面補強結構，在連結器強化結構設置於連結器模組時，該兩側部之側面補強結構係抵靠於該些連結器模組之側壁。 Based on the above necessary technical means, the above link The reinforced structure also includes the preferred sub-technical means described below. Each side of each reinforcing member has a side reinforcing structure extending along an extending direction. When the connector reinforcing structure is disposed on the connector module, the side reinforcing structures of the two sides are abutted against the connector modules. Side wall.
在上述必要技術手段的基礎下，上述連結器強化結構還包含以下所述的較佳附屬技術手段。第一框體側部係沿一延伸方向延伸出一第一框體壁，第二框體側部係沿延伸方向延伸出一第二框體壁，在該連結器強化結構設置於連結器模組時，第一框體壁與第二框體壁係分別鄰近於該些連結器模組中相距最遠之二者。此外，第一框體壁係沿延伸方向延伸出至少一第一接地腳體，第二框體壁係沿延伸方向延伸出至少一第二接地腳體，在連結器強化結構設置於連結器模組時，該至少一第一接地腳體與該至少一第二接地腳體係設置於電路板之一接地層。另外，該些連結器模組為一雙列直插式記憶體模組(Dual In-line Memory Module；DIMM)。 Based on the above-mentioned necessary technical means, the above-mentioned connector reinforcing structure further includes the following preferred technical means. The first frame body side extends a first frame body wall along an extending direction, and the second frame body side portion extends a second frame body wall along the extending direction, and the connector reinforcing structure is disposed on the connector mold. In the group, the first frame wall and the second frame wall are respectively adjacent to the farthest of the connector modules. In addition, the first frame wall extends at least one first grounding leg body along the extending direction, and the second frame body wall extends at least one second grounding leg body along the extending direction, and the connector reinforcing structure is disposed on the connector die. In the group, the at least one first grounding leg body and the at least one second grounding leg system are disposed on one of the grounding layers of the circuit board. In addition, the connector modules are a dual in-line memory module (DIMM).
在採用本創作所提供之連結器強化結構之主要技術手段後，由於在連結器強化結構設置於連結器模組時，補強件於相鄰空間中抵靠於該些連結器模組中之二相鄰者，第一框體側部與第二框體側部分別鄰近於該些連結器模組中相距最遠之二者，因而可有效地強化連結器模組而增加連結器模組的使用壽命。 After the main technical means of the connector reinforced structure provided by the present invention is adopted, since the reinforcing member is disposed in the connector module when the connector reinforcing structure is disposed, the reinforcing member abuts against the two of the connector modules in the adjacent space. Adjacent, the side of the first frame and the side of the second frame are respectively adjacent to the farthest of the connector modules, thereby effectively strengthening the connector module and increasing the connector module. Service life.
此外，在採用本創作所提供之連結器強化結構之附屬技術手段後，由於該至少一第一接地腳體與該 至少一第二接地腳體設置於電路板之一接地層，因而在記憶體插設於連結器模組時，可透過接地層降低電磁干擾，進而有效降低其他元件的出錯率，因而可大幅增加使用上之便利性。 In addition, after using the accessory technology of the connector strengthening structure provided by the present invention, the at least one first grounding body and the At least one second grounding leg is disposed on one of the grounding layers of the circuit board, so that when the memory is inserted into the connector module, electromagnetic interference can be reduced through the grounding layer, thereby effectively reducing the error rate of other components, thereby greatly increasing Convenience in use.
本創作所採用的具體實施例，將藉由以下之實施例及圖式作進一步之說明。 The specific embodiments used in the present application will be further illustrated by the following examples and drawings.
1‧‧‧連結器強化結構 1‧‧‧Connector Strengthening Structure
11‧‧‧框體 11‧‧‧ frame
111‧‧‧圍繞空間 111‧‧‧ Around the space
112‧‧‧第一框體端 112‧‧‧ first frame end
1121‧‧‧第一板體 1121‧‧‧ first board
113‧‧‧第二框體端 113‧‧‧ second frame end
1131‧‧‧第二板體 1131‧‧‧Second plate
114‧‧‧第一框體側部 114‧‧‧The side of the first frame
1141‧‧‧第一框體壁 1141‧‧‧ first frame wall
11411‧‧‧第一接地腳體 11411‧‧‧First grounding foot
115‧‧‧第二框體側部 115‧‧‧ Side of the second frame
1151‧‧‧第二框體壁 1151‧‧‧ second frame wall
11511‧‧‧第二接地腳體 11511‧‧‧Second grounding body
12、12a、12b‧‧‧補強件 12, 12a, 12b‧‧‧ reinforcements
121、121a、121b‧‧‧側部 121, 121a, 121b‧‧‧ side
1211、1211a、1211b‧‧‧側面補強結構 1211, 1211a, 1211b‧‧‧ side reinforcement structure
2‧‧‧電路板 2‧‧‧ boards
21、21a、21b、21c‧‧‧連結器模組 21, 21a, 21b, 21c‧‧‧ connector module
22‧‧‧接地層 22‧‧‧ Grounding layer
100、100a、100b‧‧‧相鄰空間 100, 100a, 100b‧‧‧ adjacent space
L‧‧‧延伸方向 L‧‧‧ Extension direction
第一圖係顯示本創作較佳實施例之連結器強化結構與電路板之立體示意圖。 The first figure shows a perspective view of the connector reinforcing structure and the circuit board of the preferred embodiment of the present invention.
第二圖係顯示本創作較佳實施例之連結器強化結構與電路板之剖面示意圖。 The second figure shows a schematic cross-sectional view of the connector reinforcing structure and the circuit board of the preferred embodiment of the present invention.
第三圖係顯示本創作較佳實施例之連結器強化結構設置於連結器模組之立體示意圖。 The third figure shows a perspective view of the connector reinforcement structure of the preferred embodiment of the present invention.
第四圖係顯示本創作較佳實施例之連結器強化結構設置於連結器模組之剖面示意圖。 The fourth figure shows a schematic cross-sectional view of the connector reinforcement structure of the preferred embodiment of the present invention.
第五圖係顯示本創作較佳實施例之連結器強化結構設置於連結器模組之側視圖。 The fifth figure shows a side view of the connector reinforcing structure of the preferred embodiment of the present invention disposed on the connector module.
由於本創作所提供之連結器強化結構中，其組合實施方式不勝枚舉，故在此不再一一贅述，僅列舉一個較佳實施例加以具體說明。 Since the combined implementation of the connector reinforcement structure provided by the present invention is numerous, it will not be repeated here, and only a preferred embodiment will be specifically described.
請一併參閱第一圖至第五圖，第一圖係顯示本創作較佳實施例之連結器強化結構與電路板之立體示意圖，第二圖係顯示本創作較佳實施例之連結器強化結構與電路板之剖面示意圖，第三圖係顯示本創作較佳實施例之連結器強化結構設置於連結器模組之立體示意圖，第四圖係顯示本創作較佳實施例之連結器強化結構設置於連結器模組之剖面示意圖，第五圖係顯示本創作較佳實施例之連結器強化結構設置於連結器模組之側視圖。 Please refer to the first to fifth figures. The first figure shows a perspective view of the connector reinforcing structure and the circuit board of the preferred embodiment of the present invention, and the second figure shows the connector strengthening of the preferred embodiment of the present invention. A schematic view of a structure and a circuit board, a third diagram showing a connector reinforcement structure of the preferred embodiment of the present invention is shown in a perspective view of the connector module, and a fourth diagram showing the connector reinforcement structure of the preferred embodiment of the present invention. A cross-sectional view of the connector module is provided. The fifth figure shows a side view of the connector reinforcement structure of the preferred embodiment of the present invention.
如圖所示，本創作較佳實施例之連結器強化結構1係用以設置於複數個位於一電路板2之連結器模組21、21a、21b與21c(圖中僅為示意，並非為完整之結構)，電路板2例如為主機板，該些連結器模組21、21a、21b與21c之任二相鄰者之間具有一相鄰空間100、100a與100b，且該些連結器模組21、21a、21b與21c為一雙列直插式記憶體模組(Dual In-line Memory Module；DIMM)，但其他實施例中不限於此。具體來說，連結器模組21與21a之間具有相鄰空間100，連結器模組21a與21b之間具有相鄰空間100a，連結器模組21b與21c之間具有相鄰空間100b(如第二圖所示)。 As shown in the figure, the connector reinforcing structure 1 of the preferred embodiment of the present invention is configured to be disposed on a plurality of connector modules 21, 21a, 21b, and 21c located on a circuit board 2 (only the schematic is shown, not The complete structure), the circuit board 2 is, for example, a motherboard, and an adjacent space 100, 100a and 100b is disposed between any two adjacent ones of the connector modules 21, 21a, 21b and 21c, and the connectors The modules 21, 21a, 21b, and 21c are a dual in-line memory module (DIMM), but other embodiments are not limited thereto. Specifically, there is an adjacent space 100 between the connector modules 21 and 21a, an adjacent space 100a between the connector modules 21a and 21b, and an adjacent space 100b between the connector modules 21b and 21c (eg, The second picture shows).
連結器強化結構1包含一框體11以及至少一補強件12、12a與12b。框體11可為金屬材質，並圍構出一圍繞空間111，框體11具有一第一框體端112以及一對應於第一框體端112之第二框體端113，並具有一第一框體側部114與對應於第一框體側部114之一第二框體側部115，具 體來說，第一框體端112、第二框體端113、第一框體側部114與第二框體側部115係圍構出圍繞空間111。 The connector reinforcing structure 1 includes a frame 11 and at least one reinforcing member 12, 12a and 12b. The frame 11 can be made of a metal material and surrounds a surrounding space 111. The frame 11 has a first frame end 112 and a second frame end 113 corresponding to the first frame end 112, and has a first a frame side portion 114 and a second frame side portion 115 corresponding to one of the first frame side portions 114 The first frame end 112 , the second frame end 113 , the first frame side portion 114 and the second frame side portion 115 surround the space 111 .
框體11之第一框體端112係沿一延伸方向L延伸出一第一板體1121，第二框體端113係沿延伸方向L延伸出一第二板體1131。第一框體側部114係沿延伸方向L延伸出一第一框體壁1141，第一框體壁1141係沿延伸方向L延伸出至少一第一接地腳體11411(圖中繪示三個)，第二框體側部115係沿延伸方向L延伸出一第二框體壁1151，第二框體壁1151係沿該延伸方向L延伸出至少一第二接地腳體11511(圖中繪示兩個)。 The first frame end 112 of the frame 11 extends along a direction L of the first plate body 1121, and the second frame end 113 extends a second plate body 1131 along the extending direction L. The first frame body portion 114 extends along the extending direction L to form a first frame body wall 1141. The first frame body wall 1141 extends at least one first grounding leg body 11411 along the extending direction L (three figures are shown) The second frame body portion 115 extends along the extending direction L to form a second frame body wall 1151. The second frame body wall 1151 extends along the extending direction L to extend at least one second grounding leg body 11511. Show two).
需要一提的是，第一框體側部114與第二框體側部115雖然同樣係沿延伸方向L分別延伸出第一框體壁1141與第二框體壁1151，但其他實施例中可為沿相反於延伸方向L之方向或是其他方向分別延伸出第一框體壁1141與第二框體壁1151，其係視實務上之設計而定。另外，第一接地腳體11411與第二接地腳體11511的數量可視實務上電路板2上的佈線而定，且在其他實施例中，第一板體1121與第二板體1131也可延伸有上述之接地腳體。 It should be noted that, the first frame side portion 114 and the second frame side portion 115 extend from the first frame body wall 1141 and the second frame body wall 1151 respectively in the extending direction L, but in other embodiments, The first frame wall 1141 and the second frame wall 1151 may be respectively extended in a direction opposite to the extending direction L or in other directions, depending on the practical design. In addition, the number of the first grounding leg body 11411 and the second grounding leg body 11511 may be determined by the wiring on the circuit board 2 in practice, and in other embodiments, the first board body 1121 and the second board body 1131 may also be extended. There is a grounding body as described above.
該至少一補強件12、12a與12b也可為金屬材質，並自第一框體端112經過圍繞空間111中延伸至第二框體端113，也就是說，該至少一補強件12、12a與12b係連結於第一框體端112與第二框體端113，且各補強件12、12a與12b之兩側部121、121a與121b(圖中僅各標示一個)係沿延伸方向L分別延伸有一側面補強結構1211、1211a與 1211b，使得側面補強結構1211、1211a與1211b分別與補強件12、12a與12b形成類似n字型結構。同樣地，兩側部121、121a與121b係可分別沿相反於延伸方向L之方向或是其他方向延伸出側面補強結構1211、1211a與1211b，其係視實務上之設計而定。 The at least one reinforcing member 12, 12a and 12b may also be made of metal and extend from the first frame end 112 through the surrounding space 111 to the second frame end 113, that is, the at least one reinforcing member 12, 12a And 12b are connected to the first frame end 112 and the second frame end 113, and the two side portions 121, 121a and 121b of each of the reinforcing members 12, 12a and 12b (only one is shown in the figure) are along the extending direction L. Extending a side reinforcing structure 1211, 1211a and 1211b, the side reinforcing structures 1211, 1211a and 1211b form an n-shaped structure with the reinforcing members 12, 12a and 12b, respectively. Similarly, the side portions 121, 121a, and 121b can extend the side reinforcing structures 1211, 1211a, and 1211b in directions opposite to the extending direction L or in other directions, respectively, depending on the practical design.
其中，實務上使用時，使用者係將連結器強化結構1設置於連結器模組21、21a、21b與21c，具體來說是連結於電路板2上，而在連結器強化結構1設置於連結器模組21、21a、21b與21c時，第一板體1121係抵靠於該些連結器模組21、21a、21b與21c之端部，第二板體1131係抵靠於該些連結器模組21、21a、21b與21c之另一端部，該至少一補強件12、12a與12b係在該至少一相鄰空間100、100a與100b中對應地抵靠於該些連結器模組21、21a、21b與21c中之二相鄰者，各補強件12、12a與12b之該兩側部121、121a與121b之側面補強結構1211、1211a與1211b係抵靠於該些連結器模組21、21a、21b與21c之側壁，透過上述抵靠方式可防止連結器模組21、21a、21b與21c左右搖晃或是前後活動。 Wherein, in practical use, the user sets the connector reinforcing structure 1 to the connector modules 21, 21a, 21b, and 21c, specifically, to the circuit board 2, and the connector reinforcing structure 1 is disposed on the connector When the connector modules 21, 21a, 21b, and 21c are connected, the first plate body 1121 abuts against the end portions of the connector modules 21, 21a, 21b, and 21c, and the second plate body 1131 is abutted against the plurality of connector modules 21, 21a, 21b, and 21c. The other end portions of the connector modules 21, 21a, 21b, and 21c, the at least one reinforcing member 12, 12a, and 12b correspondingly abut the connector molds in the at least one adjacent space 100, 100a, and 100b Two of the groups 21, 21a, 21b and 21c, the side reinforcing structures 1211, 1211a and 1211b of the two side portions 121, 121a and 121b of the reinforcing members 12, 12a and 12b are abutted against the connectors The side walls of the modules 21, 21a, 21b, and 21c can prevent the connector modules 21, 21a, 21b, and 21c from shaking side to side or back and forth through the abutting manner.
具體來說，補強件12係在相鄰空間100對應地抵靠於連結器模組21與21a的側壁，兩側部121的側面補強結構1211抵靠於連結器模組21與21a，補強件12a係在相鄰空間100a對應地抵靠於連結器模組21a與21b，兩側部121a的側面補強結構1211a抵靠於連結器模組21a與21b的側壁，補強件12b係在相鄰空間100b對應地抵靠於連結器模 組21b與21c，兩側部121c的側面補強結構1211c抵靠於連結器模組21b與21c的側壁。 Specifically, the reinforcing member 12 is correspondingly abutted against the side walls of the connector modules 21 and 21a in the adjacent space 100, and the side reinforcing structures 1211 of the side portions 121 abut against the connector modules 21 and 21a, and the reinforcing member The 12a is correspondingly abutted against the connector modules 21a and 21b in the adjacent space 100a, the side reinforcing structures 1211a of the side portions 121a abut against the side walls of the connector modules 21a and 21b, and the reinforcing members 12b are adjacent to each other. 100b correspondingly abuts the connector mold The groups 21b and 21c, the side reinforcing structures 1211c of the side portions 121c abut against the side walls of the connector modules 21b and 21c.
此外，在連結器強化結構1設置於連結器模組21、21a、21b與21c時，第一框體側部114與第二框體側部115係分別鄰近於該些連結器模組21、21a、21b與21c中相距最遠之二者，第一框體壁1141與第二框體壁1151係分別鄰近於該些連結器模組21、21a、21b與21c中相距最遠之二者，也就是說，本創作較佳實施例中，第一框體側部114與第一框體壁1141鄰近於連結器模組21(其他實施例中，第一框體側部114與第一框體壁1141係抵靠於連結器模組21)，第二框體側部115與第二框體壁1151鄰近於連結器模組21c(其他實施例中，第二框體側部115與第二框體壁1151係抵靠於連結器模組21c)。 In addition, when the connector reinforcement structure 1 is disposed on the connector modules 21, 21a, 21b, and 21c, the first frame side portion 114 and the second frame side portion 115 are respectively adjacent to the connector modules 21, The farthest distance between 21a, 21b and 21c, the first frame wall 1141 and the second frame wall 1151 are respectively adjacent to the farthest of the connector modules 21, 21a, 21b and 21c. That is, in the preferred embodiment of the present invention, the first frame side portion 114 and the first frame body wall 1141 are adjacent to the connector module 21 (in other embodiments, the first frame side portion 114 and the first portion) The frame body wall 1141 is abutted against the connector module 21), and the second frame side portion 115 and the second frame body wall 1151 are adjacent to the connector module 21c (in other embodiments, the second frame side portion 115 is The second frame body wall 1151 is abutted against the connector module 21c).
另外，該至少一第一接地腳體11411與該至少一第二接地腳體11511係設置於電路板2之一接地層22，其中，該至少一第一接地腳體11411與該至少一第二接地腳體11511係以雙列直插封裝(Dual In-line Package；DIP)的製程設置於接地層22，其他實施例中可以表面貼焊技術(Surface Mount Technology；SMT)設置於接地層22，其係視實務上之設計而定。 In addition, the at least one first grounding leg body 11411 and the at least one second grounding leg body 11511 are disposed on one of the grounding layers 22 of the circuit board 2, wherein the at least one first grounding leg body 11411 and the at least one second The grounding leg 11511 is disposed on the ground layer 22 in a dual in-line package (DIP) process. In other embodiments, a surface mount technology (SMT) can be disposed on the ground layer 22. It depends on the design of the practice.
綜合以上所述，在採用本創作所提供之連結器強化結構後，由於補強件係抵靠於該些連結器模組之間，第一框體側部與第二框體側部分別抵靠於該些連結器模組中相距最遠之二者，因而可有效地強化連結器模組的 使用壽命，且透過接地腳體設置於接地層的方式可在記憶體插設於連結器模組時，可透過接地層降低電磁干擾，進而有效降低其他元件的出錯率，因而可大幅增加使用上之便利性。 In summary, after the connector reinforcement structure provided by the present invention is used, since the reinforcement member abuts between the connector modules, the first frame side portion and the second frame body portion respectively abut each other. The farthest distance between the connector modules, thus effectively strengthening the connector module The service life and the grounding layer are disposed on the grounding layer. When the memory is inserted into the connector module, the electromagnetic interference can be reduced through the grounding layer, thereby effectively reducing the error rate of other components, thereby greatly increasing the use. Convenience.
藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本創作之特徵與精神，而並非以上述所揭露的較佳具體實施例來對本創作之範疇加以限制。相反地，其目的是希望能涵蓋各種改變及具相等性的安排於本創作所欲申請之專利範圍的範疇內。 The features and spirit of the present invention are more clearly described in the above detailed description of the preferred embodiments, and the scope of the present invention is not limited by the preferred embodiments disclosed herein. On the contrary, it is intended to cover all kinds of changes and equivalences within the scope of the patent application to which the present invention is intended.
1‧‧‧連結器強化結構 1‧‧‧Connector Strengthening Structure
11‧‧‧框體 11‧‧‧ frame
111‧‧‧圍繞空間 111‧‧‧ Around the space
112‧‧‧第一框體端 112‧‧‧ first frame end
1121‧‧‧第一板體 1121‧‧‧ first board
113‧‧‧第二框體端 113‧‧‧ second frame end
1131‧‧‧第二板體 1131‧‧‧Second plate
114‧‧‧第一框體側部 114‧‧‧The side of the first frame
1141‧‧‧第一框體壁 1141‧‧‧ first frame wall
11411‧‧‧第一接地腳體 11411‧‧‧First grounding foot
115‧‧‧第二框體側部 115‧‧‧ Side of the second frame
1151‧‧‧第二框體壁 1151‧‧‧ second frame wall
11511‧‧‧第二接地腳體 11511‧‧‧Second grounding body
12、12a、12b‧‧‧補強件 12, 12a, 12b‧‧‧ reinforcements
121、121a、121b‧‧‧側部 121, 121a, 121b‧‧‧ side
2‧‧‧電路板 2‧‧‧ boards
21、21a、21b、21c‧‧‧連結器模組 21, 21a, 21b, 21c‧‧‧ connector module
100、100a、100b‧‧‧相鄰空間 100, 100a, 100b‧‧‧ adjacent space
L‧‧‧延伸方向 L‧‧‧ Extension direction
Claims (6)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105213929U TWM536428U (en) | 2016-09-09 | 2016-09-09 | Connector reinforced structure |
| DE202016105614.4U DE202016105614U1 (en) | 2016-09-09 | 2016-10-07 | Slot-amplifying device |
| JP2016004880U JP3208084U (en) | 2016-09-09 | 2016-10-07 | Reinforced structure for connectors |
| CN201621231454.0U CN206163791U (en) | 2016-09-09 | 2016-11-16 | Connector reinforcing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105213929U TWM536428U (en) | 2016-09-09 | 2016-09-09 | Connector reinforced structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM536428U true TWM536428U (en) | 2017-02-01 |
Family
ID=57537548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105213929U TWM536428U (en) | 2016-09-09 | 2016-09-09 | Connector reinforced structure |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3208084U (en) |
| CN (1) | CN206163791U (en) |
| DE (1) | DE202016105614U1 (en) |
| TW (1) | TWM536428U (en) |
-
2016
- 2016-09-09 TW TW105213929U patent/TWM536428U/en unknown
- 2016-10-07 JP JP2016004880U patent/JP3208084U/en active Active
- 2016-10-07 DE DE202016105614.4U patent/DE202016105614U1/en active Active
- 2016-11-16 CN CN201621231454.0U patent/CN206163791U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN206163791U (en) | 2017-05-10 |
| DE202016105614U1 (en) | 2016-11-23 |
| JP3208084U (en) | 2016-12-22 |
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