TWM535400U - Carrier tape of electronic component - Google Patents

Description

Electronic component carrying tape

The present invention provides an electronic component carrying tape, especially a tape body that can accommodate electronic components.

Nowadays, the electronic technology industry is becoming more and more developed, and the electronic components are becoming more and more small. In the process of transporting or using electronic components, stronger and more precise packaging is required. The electronic component carrying tape has become the key to the packaging of the existing electronic components market. Material, the conventional electronic component package is a strip of electronic component carrying tape and a cover tape, and the electronic component carrying tape forms a plurality of grooves through the stamper, and the distance between the grooves is equally arranged and The space for accommodating electronic components, each of the recesses can accommodate an electronic component, and the cover tape covers the electronic component carrying tape to achieve the effect of packaging the electronic components, and the packaged electronic component carrying tape can be The material is loaded on a plastic disc, wherein the material of the electronic component carrying tape has different materials due to different functions and requirements of electronic components, and the common materials are polystyrene (PS) and polycarbonate. (Polycarbonate, PC for short), Acrylonitrile Butadiene Styrene (ABS), polyethylene terephthalate Polyethylene Terephthalate (PET), Amorphous Polyethylene Terephthalate (A-PET), etc., a single-layer electronic component carrying tape formed by the above materials, The nature of the distance between the grooves of the carrier is equally arranged, which can meet the requirement of the electronic device to take the connector regularly to extract the electronic component.

In the above, in order to avoid other factors such as electrostatic adsorption of fine particles or Electro Static Discharge, the electronic component carrying tape may be doped with conductive carbon (Carbon, referred to as C) in the material. It is called modification, and the modified electronic component carrying tape can provide electronic components for transportation protection, or the automatic equipment can extract electronic components without being contaminated by fine particles adsorbed by static electricity, and can be doped with conductive carbon. The static electricity accumulated on the electronic component carrier tape is guided out of the electronic component carrying tape to prevent the electronic component from being affected by static electricity.

However, with the rapid development of electronic component technology, the take-up joints used to extract electronic components in automated equipment require the force of the electronic component carrying tape to be larger and larger, and the stretching of the electronic component carrying tape. The strength, tensile strength and tensile strength are increasing. The modified materials will reduce the characteristics of the raw materials according to the proportion of the modified materials. The electronic components of the single-layer structure will be modified to make the original materials. The characteristics are reduced, the tensile strength, the tensile strength and the tensile strength are insufficient. The single-layer electronic component carrying tape is often used in the use of an automated device to cause deformation of the grooves of the electronic component carrying tape during operation. Even breaking, forcing the subsequent process of the electronic component to suspend, affecting the operation of the automation equipment.

The main purpose of the present invention is to provide an electronic component carrying tape, thereby improving the tensile strength, tensile strength and tensile strength of the electronic component carrying tape of the existing single-layer structure, and maintaining the function of preventing static interference.

In order to achieve the foregoing, the electronic component carrying tape of the present invention comprises: a plate body comprising a 10 to 20 volume percent first conductive layer, a 60 to 80 volume percent toughness layer and a 10 to 20 a volume percentage of the second conductive layer, the tough layer is located between the first conductive layer and the second conductive layer, wherein the first conductive layer and the second conductive layer are made of a modified conductive material The toughness layer is made of a material that is not modified or tough, and the toughness of the tough layer is greater than the toughness of the first conductive layer and the toughness of the second conductive layer.

The electronic component carrying tape of the present invention can accommodate electronic components and can be applied to subsequent automation devices, and the first conductive layer and the second conductive layer of the electronic component carrying tape can achieve antistatic purpose, and the electronic component carrier material The tough layer of the belt is not modified, and the original characteristics of the material still maintain sufficient tensile strength, tensile strength and tensile strength. Therefore, when the electronic component carrying tape is impacted by an automatic device, the electronic component The shape of the carrier tape can remain unchanged, so that the subsequent process of the electronic component can be smoothly performed without affecting the operation of the automation device, so the electronic component carrying tape takes into consideration the antistatic and structural strength requirements.

As shown in FIG. 1 to FIG. 3, in a preferred embodiment of the present electronic component carrying tape, the electronic component carrying tape comprises a plate body 10 comprising a 10 to 20 volume percent first conductive layer. 11. A 60 to 80 volume percent toughness layer 12 and a 10 to 20 volume percent second conductive layer 13 between the first conductive layer 11 and the second conductive layer 13, the first The conductive layer 11 and the second conductive layer 13 are made of a modified and electrically conductive material, and the tough layer 12 is made of an unmodified and still tough material. The tough layer 12 is The toughness is greater than the toughness of the first conductive layer 11 and the toughness of the second conductive layer 13.

In the above, the plate body 10 further includes a plurality of conveying holes 20, a plurality of grooves 30, and a plurality of inspection holes 31. The conveying holes 20 extend through the plate body 10, and the conveying holes 20 are along the The long sides of one side of the board body 10 are arranged at equal intervals. The recesses 30 are disposed on the board body 10 and are equally spaced along the long side of the other side of the board body 10. The check holes are arranged. 31 is formed at the bottom of the grooves 30 and penetrates the plate body 10, respectively.

The first conductive layer 11 , the tough layer 12 , and the second conductive layer 13 are sequentially stacked, because the first conductive layer 11 and the second conductive layer 13 are located on the board 10 . The outer side needs to be electrically conductive, so the material needs to be modified. The first conductive layer 11 and the second conductive layer 13 may be modified polycarbonate (Polycarbonate, PC for short) or polystyrene (Polystyrene, PS), PC or PS may be reduced in size after the modification, but the surface layer may be derivatized according to the conductivity of carbon, and the first conductive layer 11 and the second conductive layer 13 are added. Antistatic property, the above mentioned PC or PS materials can satisfy the outer layer of the first conductive layer 11 and the second conductive layer 13 which are required to be electrically conductive. The tough layer 12 can be an unmodified PC, PC system. For plastics with good impact strength and excellent dimensional stability, the unmodified PC can retain the original characteristics and provide the tough support function of the board.

As shown in FIG. 2 and FIG. 4, when the electronic component carrying material is packaged in the electronic component 50, the packaged finished product is composed of the electronic component carrying tape and a cover tape 40, and wherein the electronic component carries the tape. An electronic component 50 is packaged in each of the recesses 30, wherein each of the recesses 30 can be inspected by the inspection aperture 31 to mount the electronic component 50, and the finished product is mounted on an automated device, and the delivery holes 20 are assembled to the automation. On the device, the automation device moves the plurality of conveying holes 20 to drive the electronic component carrying tape, and the electronic component carries the tape during the process of carrying the electronic component to take the electronic component on the electronic component carrying tape. The component 50 has a high speed, so that the take-up joint gives an impact force to the electronic component carrying tape, because the tough layer 12 is an unmodified PC, and the PC system has good impact strength and dimensional stability. The excellent plastic has sufficient tensile strength, tensile strength and tensile strength because the tough layer 12 has not been modified, and can maintain the shape of the grooves 30 without being deformed by the impact of the take-up joint. Pull off.

As shown in FIG. 2, the tough layer 12 of the electronic component carrying tape of the present invention is an unmodified PC, which is a material without carbon doping, and the tough layer 12 accounts for 60 to 80 volumes in the plate 10. The percentage, the material cost of carbon is much higher than that of the material without carbon doping, so the production cost of the electronic component carrying tape can be reduced, and the material without carbon doping accounts for 60 to 80 volume percent of the plate 10 The electronic component carrier has a carbon reduction effect compared to a single-layer structure in which all of the carbon is doped.

In the above, when the electronic component carrying tape of the present invention is installed in an automatic device, the plate 10 of the electronic component carrying tape adopts a stacked first conductive layer 11, a tough layer 12 and a second conductive layer 13 A conductive layer 11 and a second conductive layer 13 achieve antistatic purposes, and the tough layer 12 sandwiched in the middle has no tensile properties, and the original properties of the material have sufficient tensile strength, tensile strength and tensile strength. When subjected to the impact of the automation device, the shape of the electronic component carrying tape can remain unchanged, so that the subsequent process of the electronic component can be smoothly performed without affecting the operation of the automation device, and The carbon material cost is much higher than the material without carbon doping, and the tough layer 12 without carbon doping accounts for 60 to 80 volume percent of the electronic component carrying tape, and the manufacturing cost of the electronic component carrying tape is reduced. A single-layer structure that is carbon-doped all has the effect of reducing carbon.

10‧‧‧ board
11‧‧‧First conductive layer
12‧‧‧Tough layer
13‧‧‧Second conductive layer
20‧‧‧ delivery hole
30‧‧‧ Groove
31‧‧‧Check hole
40‧‧‧ Covering tape
50‧‧‧Electronic components

Figure 1 is a perspective view showing the appearance of a preferred embodiment of the electronic component carrying tape of the present invention. Figure 2 is a side elevational cross-sectional view of a preferred embodiment of the present electronic component carrying tape. Figure 3 is a top plan view of a preferred embodiment of the present electronic component carrying tape. Figure 4 is a side cross-sectional view showing the state of use of the preferred embodiment of the electronic component carrying tape of the present invention.

10‧‧‧ board

11‧‧‧First conductive layer

12‧‧‧Tough layer

13‧‧‧Second conductive layer

20‧‧‧ delivery hole

30‧‧‧ Groove

31‧‧‧Check hole

Claims (4)

An electronic component carrying tape comprising a plate body comprising a 10 to 20 volume percent first conductive layer, a 60 to 80 volume percent toughness layer and a 10 to 20 volume percent second conductive layer The tough layer is located between the first conductive layer and the second conductive layer, and the first conductive layer and the second conductive layer are both made of a modified conductive material, and the tough layer is The toughness of the tough layer is greater than the toughness of the first conductive layer and the toughness of the second conductive layer. The electronic component carrying tape according to claim 1, wherein the plate body comprises a plurality of conveying holes, a plurality of grooves and a plurality of inspection holes, wherein the conveying holes are formed through the plate body, and the plates are formed The conveying holes are arranged at equal intervals along one long side of the plate body, and the grooves are arranged on the plate body and are equally spaced along the long side of the other side of the plate body. The inspection holes are respectively formed at the bottoms of the grooves and penetrate the plate body. The electronic component carrying tape according to claim 1, wherein the material of the first conductive layer and the second conductive layer comprises polycarbonate and carbon, and the tough layer is made of polycarbonate. The electronic component carrying tape according to claim 1, wherein the material of the first conductive layer and the second conductive layer comprises polystyrene and carbon, and the tough layer is made of polycarbonate.