TWM532950U - Metal film and laminated film - Google Patents
Metal film and laminated filmInfo
- Publication number
- TWM532950U TWM532950U TW105210426U TW105210426U TWM532950U TW M532950 U TWM532950 U TW M532950U TW 105210426 U TW105210426 U TW 105210426U TW 105210426 U TW105210426 U TW 105210426U TW M532950 U TWM532950 U TW M532950U
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- micro structure
- metal
- film
- protecting
- Prior art date
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Laminated Bodies (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
A metal film including a metal layer, a first micro structure layer, a second micro structure layer, a first protecting layer and a second protecting layer. The metal layer has a first surface and a second surface opposite to each other. The first micro structure layer and the second micro structure layer respectively are disposed on the first surface and the second surface of the metal layer, wherein the first micro structure layer and the second micro structure layer have a plurality of first pores. The first protecting layer and the second protecting layer respectively are disposed on the first micro structure layer and the second micro structure layer, wherein the first protecting layer and the second protecting layer have a plurality of second pores. The first micro structure layer is located between the metal layer and the first protecting layer, and the second micro structure layer is located between the metal layer and the second protecting layer. Furthermore, a laminated film having the aforementioned metal film is also provided.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105210426U TWM532950U (en) | 2016-07-12 | 2016-07-12 | Metal film and laminated film |
CN201620903865.3U CN206003846U (en) | 2016-07-12 | 2016-08-19 | Metal film and stacked film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105210426U TWM532950U (en) | 2016-07-12 | 2016-07-12 | Metal film and laminated film |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM532950U true TWM532950U (en) | 2016-12-01 |
Family
ID=58196647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105210426U TWM532950U (en) | 2016-07-12 | 2016-07-12 | Metal film and laminated film |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN206003846U (en) |
TW (1) | TWM532950U (en) |
-
2016
- 2016-07-12 TW TW105210426U patent/TWM532950U/en not_active IP Right Cessation
- 2016-08-19 CN CN201620903865.3U patent/CN206003846U/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN206003846U (en) | 2017-03-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |