TWM531580U - Heat dissipation fins - Google Patents

Description

Heat sink fin

The present invention relates to a heat dissipating fin, in particular to a heat dissipating fin having a phase change material.

In recent years, electronic technology has developed rapidly. The high frequency and high speed operation of electronic components and the intensive and miniaturization of integrated circuits have caused electronic components to continuously generate heat during operation. Therefore, it is necessary to attach a heat sink to the electronic component to carry away the heat generated by the electronic component to ensure stable operation of the electronic component.

The conventional heat dissipation method is to provide a metal heat sink above the heat generating electronic component. The heat sink has a base. The lower surface of the pedestal is in contact with the electronic component, and the upper surface thereof is provided with a plurality of heat dissipating fins. The susceptor absorbs heat generated by the electronic components and transmits them to the heat sink fins. The heat is dissipated into the surrounding air by the fins. However, for some electronic devices with high heat generation, the heat dissipation performance of the heat sink is not enough to take away the heat generated by the high heat generating electronic device, thereby increasing the operating temperature of the high heat generating electronic device. When the operating temperature of the high-heating electronic device exceeds the upper temperature limit of the self-loading, the high temperature may cause the performance of the high-heating electronic device to decrease or even force the high-heating electronic device to shut down.

The present invention provides a heat dissipating fin to solve the problem of insufficient heat dissipation performance of the conventional heat sink, thereby enabling the electronic device matched with the heat sink fin to operate stably.

The heat dissipation fin disclosed in one embodiment of the present invention comprises a fin body and a phase change material layer. The fin body includes a base portion and a plurality of fin portions. The base is provided for a heat source. These fin portions protrude from the base. The phase change material layer is in thermal contact with the fin portions of the fin body. When the base of the fin body absorbs the thermal energy of the heat source, the heat source of the heat source is conducted to the phase change material layer to cause the phase change material layer to undergo a phase change reaction.

According to the heat dissipation fin of the above embodiment, the heat dissipation fin is to thermally contact the phase change material layer to the fin body, so that the heat dissipation fin can balance heat conduction and heat dissipation, thereby improving the heat dissipation performance of the heat dissipation fin.

Please refer to FIG. 1. FIG. 1 is a cross-sectional view of a heat dissipating fin according to an embodiment of the present invention. In the embodiment, the heat dissipation fin 10 includes a fin body 100 and a phase change material layer 200. The fin body 100 includes a base portion 110 and a plurality of fin portions 120. The base 110 has a first surface 110a and a second surface 110b opposite to each other. The fin portions 120 are spaced apart and protrude from the second surface 110b of the base portion 110 to form a plurality of air flow paths 130 between the fin portions 120. The first surface 110a of the base 110 is for thermal contact with a heat source 20, such as a central processing unit, a display wafer, or a north-south bridge wafer. In the present embodiment, the material of the fin main body 100 is, for example, a material having excellent thermal conductivity such as gold, silver, copper, iron or aluminum, and an alloy of the above materials.

In the present embodiment, the phase change material layer 200 is filled inside the fin body 100 and simultaneously thermally contacts the base portion 110 of the fin body 100 and the fin portions 120. However, it is not limited thereto. In other embodiments, the phase change material layer 200 may also be in thermal contact only with the base portion 110 of the fin body 100 or only with the fin portions 120 of the fin body 100. The phase change material layer 200 is solid at normal temperature. When the base 110 of the fin body 100 absorbs the thermal energy of the heat source 20, the heat source of the heat source 20 is conducted to the phase change material layer 200 to cause the phase change material layer 200 to undergo a phase change reaction, that is, to melt from a solid state into a liquid state. This phase change reaction mainly increases the heat dissipation performance of the heat dissipation fins 10 by the latent heat required for the solid state to change to a liquid state.

Further, the phase change material layer 200 is, for example, an organic phase change material (Organic PCMs), an inorganic phase change material (Inorganic PCMs), a eutectic phase change material (Eutectics), or a hygroscopic phase change material (Hygroscopic materials). It is worth noting that when selecting the material of the phase change material layer 200, the melting point of the material should be selected to be lower than the upper limit of the operating temperature at which the heat source 20 can operate stably. As a result, the melting point of the phase change material layer 200 is reached before the temperature of the heat source 20 reaches the upper limit of the operating temperature for stable operation, so as to ensure phase change before the temperature of the heat source 20 reaches the upper limit of the operating temperature for stable operation. The reaction reduces the operating temperature of the heat source 20, thereby allowing the heat source 20 to operate stably.

In the embodiment of FIG. 1 above, the phase change material layer 200 is filled in the interior of the fin body, but is not limited thereto. Please refer to FIG. 2. FIG. 2 is a cross-sectional view of a heat dissipation fin according to an embodiment of the present invention.

The heat dissipation fin 10a of the embodiment includes a fin body 100 and a phase change The material layer 200 and a heat conduction and leakage preventing layer 300. The fin body 100 includes a base portion 110 and a plurality of fin portions 120. The base 110 has a first surface 110a and a second surface 110b opposite to each other. The fin portions 120 are spaced apart and protrude from the second surface 110b of the base portion 110 to form a plurality of air flow paths 130 between the fin portions. The first surface 110a of the base 110 is for thermal contact with a heat source 20, such as a central processing unit, a display wafer, or a north-south bridge wafer. In the present embodiment, the material of the fin main body 100 is, for example, a material having excellent thermal conductivity such as gold, silver, copper, iron or aluminum, and an alloy of the above materials.

In the present embodiment, the phase change material layer 200 encapsulates the fin body 100 therein. That is, the phase change material layer 200 is simultaneously in thermal contact with the base portion 110 of the fin body 100 and the fin portions 120. The phase change material layer 200 of the present embodiment is not filled between the fin portions 120, so that the air passages 130 are still provided between the fin portions 120. In addition, the phase change reaction of the phase change material layer 200 of the present embodiment is similar to the phase change reaction of the phase change material layer 200 of FIG. 1 and will not be described again.

The heat conduction and leakage preventing layer 300 is, for example, aluminum foil, and covers the fin body 100 and the phase change material layer 200. Moreover, one side of the heat conduction and leakage prevention layer 300 is in thermal contact with the phase change material layer 200, and the opposite side of the heat conduction and leakage prevention layer 300 is used to thermally contact the heat source 20. That is, the base portion 110 of the fin body 100 is connected to the heat conduction and leakage preventing layer 300 and the heat source 20 through the phase change material layer 200.

In addition, since the heat conduction performance of the fin body 100 is superior to that of the phase change material layer 200, the heat dissipation performance of the phase change material layer 200 is better than that of the fin body 100, so that the heat dissipation fin 10a is integrated. The heat dissipation performance and the overall heat conduction performance are described below for the dimensional relationship between the fin body and the phase change material layer 200.

In the present embodiment, the thickness D of the phase change material layer 200 attached to the first surface 110a of the base 110 is greater than 0.0 mm and less than or equal to 10.0 mm.

Further, the thickness ratio (T2 ratio T1) of the phase change material layer 200 and the fin portion 120 which are attached to the fin portion 120 is 1.0 to 20.0.

It should be noted that the further coating of the thermal conductive leakage preventing layer 300 outside the phase change material layer 200 in this embodiment is a problem that the phase change material layer 200 may leak when it changes from a solid state to a liquid state. However, it is not limited thereto. In other embodiments, if the temperature is properly controlled, the layer of the thermally variable leakage preventing layer 300 is not required to be coated with the phase change material layer 200.

Please refer to Figure 3. 3 is a cross-sectional view of a heat sink fin according to an embodiment of the present invention.

The difference from the embodiment of FIG. 2 is that in the heat dissipation fin 10b of the embodiment of FIG. 3, the phase change material layer 200 is filled between the fin portions 120. That is to say, there is no longer an air flow path between the fin portions 120. The remaining structure and principle of the embodiment of FIG. 3 are similar to those of the embodiment of FIG. 2, and therefore will not be described again.

According to the heat dissipation fin of the above embodiment, the heat dissipation fin is to thermally contact the phase change material layer to the fin body, so that the heat dissipation fin can balance heat conduction and heat dissipation, thereby improving the heat dissipation performance of the heat dissipation fin.

Although the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the present invention, and it is intended that those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. The scope of the new patent protection shall be subject to the definition of the scope of the patent application attached to this specification.

10, 10a, 10b‧‧‧ heat sink fins

20‧‧‧heat source

100‧‧‧Fin body

110‧‧‧ base

110a‧‧‧ first surface

110b‧‧‧ second surface

120‧‧‧Fin section

130‧‧ Airflow Channel

200‧‧‧ phase change material layer

300‧‧‧thermal leakproof layer

1 is a schematic cross-sectional view of a heat sink fin according to an embodiment of the present invention. 2 is a schematic cross-sectional view of a heat sink fin according to an embodiment of the present invention. 3 is a cross-sectional view of a heat sink fin according to an embodiment of the present invention.

10‧‧‧ Heat sink fins

20‧‧‧heat source

100‧‧‧Fin body

110‧‧‧ base

110a‧‧‧ first surface

110b‧‧‧ second surface

120‧‧‧Fin section

130‧‧ Airflow Channel

200‧‧‧ phase change material layer

Claims (10)

A heat dissipating fin comprising: a fin body comprising a base portion and a plurality of fin portions, wherein the base portion is provided for a heat source, the fin portions protrude from the base portion; and a phase change material layer, heat Contacting the fin portions of the fin body, when the base portion of the fin body absorbs thermal energy of the heat source, thermal energy of the heat source is conducted to the phase change material layer, so that the phase change material layer performs phase Change response. The heat dissipation fin of claim 1, wherein the phase change material layer is in thermal contact with the base of the fin body. The heat dissipation fin of claim 2, wherein the phase change material layer is filled in the fin body, and the base of the fin body is used for thermal contact of the heat source. The heat dissipation fin of claim 2, wherein the phase change material layer covers the fin body, and the base of the fin body is connected to the heat source through the phase change material layer. The heat dissipation fin according to claim 4, further comprising a heat conduction and leakage preventing layer, the heat conduction and leakage preventing layer covering the fin body and the phase change material layer, and one side of the heat conduction and leakage prevention layer is hot Contacting the layer of phase change material, and the opposite side of the thermally conductive leak-preventing layer is in thermal contact with the heat source. The heat dissipation fin according to claim 5, wherein the phase change material layer is an organic phase change material (Organic PCMs), an inorganic phase change material (Inorganic PCMs), a eutectic phase change material (Eutectics), or a hygroscopic phase change. Hygroscopic materials, the heat conduction and leakage preventing layer is aluminum foil paper. The heat dissipation fin of claim 4, wherein the base has an opposite first surface and a second surface, the fin portions are spaced apart and protrude from the second surface, and the phase change material is laminated Thermally contacting the first surface and the second surface, the thickness of the phase change material layer attached to the second surface is greater than 0.0 mm and less than or equal to 10.0 mm. The heat dissipation fin of claim 4, wherein a plurality of airflow paths are formed between the fin portions. The heat dissipation fin of claim 4, wherein the phase change material layer is filled between the fin portions. The heat dissipation fin according to claim 1, wherein a thickness ratio of the phase change material layer and the fin portion attached to the fin portion is 1.0 to 20.0.