TWM527386U - Housing structure for electronic device - Google Patents

Housing structure for electronic device Download PDF

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Publication number
TWM527386U
TWM527386U TW105206279U TW105206279U TWM527386U TW M527386 U TWM527386 U TW M527386U TW 105206279 U TW105206279 U TW 105206279U TW 105206279 U TW105206279 U TW 105206279U TW M527386 U TWM527386 U TW M527386U
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Taiwan
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layer
plastic
metal
shell structure
housing structure
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TW105206279U
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Chinese (zh)
Inventor
wen-tong Zhang
zhong-yi Su
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Coxon Precise Ind Co Ltd
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Priority to TW105206279U priority Critical patent/TWM527386U/en
Publication of TWM527386U publication Critical patent/TWM527386U/en

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Description

殼體結構Shell structure

本創作係有關一種殼體結構,特別是指一種將不同材質黏合在一起之殼體結構。The present invention relates to a housing structure, in particular to a housing structure in which different materials are bonded together.

按,射出成型已廣泛應用於生活周遭的各個領域,舉凡塑膠杯、布丁杯等食品業,藥水瓶、針筒等醫療業,手機殼、記憶卡的外殼等電子業,面霜罐、化妝水瓶等消費用品,及高精密度的光學塑膠產業,如鏡片,都離不開塑膠射出成型的應用範疇。According to injection molding, it has been widely used in various fields of life, such as plastic cups, pudding cups and other food industries, medicine bottles, syringes and other medical industries, mobile phone cases, memory card shells and other electronics industries, cream jars, lotions Such consumer products, and high-precision optical plastics industry, such as lenses, are inseparable from the application of plastic injection molding.

雖然塑膠射出成型技術已經很成熟,但仍有難點,例如很多物件是將塑膠射出成型在金屬上,但金屬本身很難與其他材質黏合,故必須先在金屬上塗佈一層黏著層,如雙面膠或膠水,之後才能將金屬放入模具中進行射出成型作業,如此一來黏著劑有可能會汙染模具,且會增加成品的厚度,但很多成品追求輕薄短小,如金屬手機殼,其內部或轉角處仍有部分塑膠孔隙,便是在金屬上進行塑膠射出成型,若使用黏著劑將使其厚度增加。除了此缺失之外,黏著劑應用在金屬與塑膠的接合上強度不足,常發生塑膠與金屬剝離的情況,而使成品損壞。Although the plastic injection molding technology is very mature, there are still difficulties. For example, many objects are molded out of metal on the metal, but the metal itself is difficult to bond with other materials, so it is necessary to first apply an adhesive layer on the metal, such as double After the glue or glue, the metal can be put into the mold for injection molding. As a result, the adhesive may contaminate the mold and increase the thickness of the finished product. However, many finished products are light and thin, such as metal mobile phone cases. There is still some plastic pores inside or at the corners, which is plastic injection molding on the metal. If an adhesive is used, the thickness will increase. In addition to this deficiency, the application of the adhesive to the joint of metal and plastic is insufficient, and the peeling of the plastic and the metal often occurs, and the finished product is damaged.

因此,本創作即提出一種殼體結構,其不需利用黏著劑就可將兩層不同材質緊密接合成一個殼體,有效解決上述該等問題,具體架構及其實施方式將詳述於下:Therefore, the present invention proposes a casing structure which can directly join two different materials into one casing without using an adhesive, which effectively solves the above problems, and the specific structure and its implementation will be described in detail below:

本創作之主要目的在提供一種殼體結構,其在第一層的表面形成眾多奈米微孔,使諸如金屬、碳纖維、玻璃纖維等平常不易與塑膠緊密附著的材質可藉由奈米微孔而與塑膠高度結合,形成第二層塑膠層,第一層與第二層的結合度高於利用雙面膠、膠水黏合。The main purpose of the present invention is to provide a shell structure which forms a plurality of nanopores on the surface of the first layer, so that materials such as metal, carbon fiber, glass fiber and the like which are not easily adhered to the plastic can be made by nanopores. Combined with the height of the plastic, a second layer of plastic is formed, and the degree of bonding between the first layer and the second layer is higher than that by using double-sided tape and glue.

本創作之另一目的在提供一種殼體結構,其中第一層表面的奈米微孔係利用電化學方式所形成,不會對環境造成污染。Another object of the present invention is to provide a casing structure in which the nanoporous system of the surface of the first layer is formed by electrochemical means without causing environmental pollution.

本創作之再一目的在提供一種殼體結構,其不但可使金屬或碳纖維、玻璃纖維材質之第一層可與射出成型之第二層塑料達到接近於一體成型的緊密度,且成本低、節省塑膠用量。A further object of the present invention is to provide a casing structure which can not only achieve the closeness of the first layer of metal or carbon fiber or glass fiber material and the second layer of plastic injection molding, and has low cost. Save on plastic usage.

為達上述目的,本創作提供一種殼體結構,包括一第一層及第二層,其中第一層又包括相對之一第一面及一第二面,於第二面上以電化學處理之方式形成有複數奈米微孔:第二層係以射出成型之方式形成於第一層之第二面上,第二層與第一層之第二面上的奈米微孔緊密結合成雙層之殼體結構,其緊密程度宛如一體成型。To achieve the above object, the present invention provides a housing structure including a first layer and a second layer, wherein the first layer further includes a first surface and a second surface, and is electrochemically treated on the second surface. The method is formed with a plurality of nanopores: the second layer is formed on the second surface of the first layer by injection molding, and the second layer is tightly combined with the nanopores on the second surface of the first layer. The double-layered shell structure is as close as one piece.

第一層之材質為鋁、鎂、銅、不銹鋼、鈦或鐵等金屬,或碳纖維、玻璃纖維等基材。The material of the first layer is a metal such as aluminum, magnesium, copper, stainless steel, titanium or iron, or a substrate such as carbon fiber or glass fiber.

第二層為聚苯硫醚(PPS)、聚對苯二甲酸二丁酯(PBT)或聚醯胺樹脂(PA66)等塑料。The second layer is a plastic such as polyphenylene sulfide (PPS), polybutylene terephthalate (PBT) or polyamide resin (PA66).

第一層與第二層之結合強度為200~220公斤力/平方公分(kgf /cm 2)。 The bonding strength between the first layer and the second layer is 200 to 220 kilograms per square centimeter (kgf / cm 2 ).

奈米微孔之大小為20~80奈米。The size of the nanopore is 20~80 nm.

殼體結構可為手機殼、電腦螢幕邊框、或任何其他將金屬與塑膠結合之物件、或是其他碳纖維、玻璃纖維等基材與塑膠結合之物件。The housing structure can be a mobile phone case, a computer screen frame, or any other object that combines metal and plastic, or other materials such as carbon fiber, glass fiber, and the like.

電化學處理係為電解,其電解參數為10~65伏特。The electrochemical treatment is electrolysis with an electrolysis parameter of 10 to 65 volts.

本創作提供一種殼體結構,第1圖及第2圖為本創作一實施例之立體圖及分解圖,此實施例中的殼體結構10為手機背蓋,殼體結構10包括一第一層12及一第二層14,其中第一層12又包括相對之一第一面122及一第二面124,於此實施例中,第一面122為外表面,第二面124為內表面,於第二面124上以電化學處理之方式形成有複數奈米微孔126,這些奈米微孔126分佈於需要被覆蓋第二層14的地方,而不會被第二層14覆蓋之處則可以不形成奈米微孔126:第二層14係以射出成型之方式形成於第一層12之第二面124上,第二層14與第一層12之第二面124上的奈米微孔緊密結合成雙層之一殼體結構10。The present invention provides a housing structure. FIGS. 1 and 2 are a perspective view and an exploded view of an embodiment of the present invention. The housing structure 10 in this embodiment is a mobile phone back cover, and the housing structure 10 includes a first layer. 12 and a second layer 14, wherein the first layer 12 further includes a first surface 122 and a second surface 124. In this embodiment, the first surface 122 is an outer surface and the second surface 124 is an inner surface. On the second side 124, a plurality of nanopores 126 are formed by electrochemical treatment, and the nanopores 126 are distributed in a place where the second layer 14 needs to be covered without being covered by the second layer 14. The nanopores 126 may not be formed: the second layer 14 is formed on the second side 124 of the first layer 12 by injection molding, and the second layer 14 is on the second side 124 of the first layer 12. The nanopores are tightly bonded into a double shell structure 10.

第一層12為鋁、鎂、銅、不銹鋼、鈦或鐵等金屬,或碳纖維、玻璃纖維等材質,相同特徵都是不易與塑膠結合,而第二層14為聚苯硫醚(PPS)、聚對苯二甲酸二丁酯(PBT)或聚醯胺樹脂(PA66)等塑料,第二層14的塑料在射出成型的過程中會深入到第一層12的第二面124的奈米微孔126中,類似於在第二面124扎根,使第一層12與第二層14可達到高度緊密的結合程度。The first layer 12 is made of metal such as aluminum, magnesium, copper, stainless steel, titanium or iron, or carbon fiber, glass fiber, etc., the same feature is not easy to combine with plastic, and the second layer 14 is polyphenylene sulfide (PPS), Plastics such as polybutylene terephthalate (PBT) or polyamide resin (PA66), the plastic of the second layer 14 will penetrate deep into the second surface 124 of the first layer 12 during the injection molding process. In the aperture 126, similar to the rooting of the second side 124, the first layer 12 and the second layer 14 are brought to a highly tight degree of bonding.

第一層12的電化學處理係為電解,將第一層12浸泡在一電解質溶液中,當通電到電解質溶液中的時候,電解質溶液分解並會與第一層12產生化學反應,將第一層12解離出一個一個的孔洞,進而於第一層12表面產生奈米級的微細孔洞,因應不同的材質及所需的奈米微孔大小,會搭配使用不同的電解參數及電解質溶液,在一實施例中,電解參數為10~65伏特,而奈米微孔126之大小範圍為20~80奈米。The electrochemical treatment of the first layer 12 is electrolysis, the first layer 12 is immersed in an electrolyte solution, and when energized into the electrolyte solution, the electrolyte solution decomposes and chemically reacts with the first layer 12, which will be the first The layer 12 dissociates the holes one by one, and then produces nano-scale micro-holes on the surface of the first layer 12. According to different materials and the required size of the nano-pore, different electrolysis parameters and electrolyte solutions are used together. In one embodiment, the electrolysis parameter is 10 to 65 volts, and the nanopore 126 has a size ranging from 20 to 80 nm.

本創作藉由在第一層12的第二面124電解所形成的眾多奈米微孔126,使第二層14在射出成型到第一層12的第二面124時,會滲入到奈米微孔126中,進而增強第一層12和第二層14之間的黏著力,使第一層12和第二層14之結合強度可達到200~220公斤力/平方公分(kgf /cm 2),較雙面膠或膠水黏著的結合強度增加50倍。 By creating a plurality of nano-micropores 126 formed on the second side 124 of the first layer 12, the second layer 14 is infiltrated into the nano-layer 124 when it is injection molded onto the second side 124 of the first layer 12. In the micropores 126, the adhesion between the first layer 12 and the second layer 14 is further enhanced, so that the bonding strength between the first layer 12 and the second layer 14 can reach 200 to 220 kgf / cm 2 (kgf / cm 2 ). ), the bonding strength of the double-sided adhesive or glue is increased by 50 times.

本創作之殼體結構可廣泛應用在手機殼、電腦螢幕邊框、機車車殼、汽車骨架、或任何將金屬與塑膠結合之物件、或是碳纖維、玻璃纖維等基材與塑膠結合之物件,可將第一層與塑料材質的第二層無縫接合到幾近一體成型。The shell structure of the present invention can be widely applied to a mobile phone case, a computer screen frame, a locomotive car shell, a car skeleton, or any object combining metal and plastic, or a combination of a substrate such as carbon fiber and glass fiber and plastic. The first layer can be seamlessly joined to the second layer of plastic material to form a nearly one-piece.

第3圖為本創作以智慧型手機之外殼為實施例之示意圖,智慧型手機的外殼為金屬材質,但其內部射出成型有塑膠的構件,如按鈕、電池槽等,金屬材質的外殼即為第一層12,而塑膠部分則為第二層14,構成本創作之殼體結構。The third figure is a schematic diagram of an embodiment of a smart phone case. The outer casing of the smart phone is made of metal, but the inside of the smart phone is molded with plastic components, such as buttons, battery slots, etc., the metal casing is The first layer 12 and the plastic portion are the second layer 14, forming the shell structure of the present invention.

第4圖為本創作以手機電池蓋為實施例之示意圖。手機的外殼為金屬材質,電池蓋本身亦為金屬材質的第一層12,但為了避免漏電,其內側射出成型有塑膠層,即為第二層14。Fig. 4 is a schematic view showing an embodiment of a mobile phone battery cover. The outer casing of the mobile phone is made of metal, and the battery cover itself is also the first layer 12 of metal material. However, in order to avoid leakage, the inner layer is formed with a plastic layer, which is the second layer 14.

第5圖為本創作以相機之外殼為實施例之示意圖。相機的外殼中,方形的機身從外觀看是金屬材質的第一層12,但同樣為了避免漏電或電磁干擾,其內側射出成型有塑膠層,即為第二層14。Fig. 5 is a schematic view showing an embodiment of a camera casing as an embodiment. In the outer casing of the camera, the square body is the first layer 12 of metal material viewed from the outside, but also in order to avoid leakage or electromagnetic interference, the plastic layer is formed on the inner side, which is the second layer 14.

第6圖為本創作以電腦螢幕之外框為實施例之示意圖。電腦螢幕之外框是金屬的,但若將外框拆解,可看到裡面是有塑膠片做為外框的卡合結構,金屬材質為第一層12,而塑膠片即為在第一層12上射出成型產生的第二層14。Figure 6 is a schematic diagram of the creation of a computer screen outside the frame. The outer frame of the computer screen is made of metal, but if the outer frame is disassembled, it can be seen that there is a plastic structure as the outer frame of the engaging structure, the metal material is the first layer 12, and the plastic piece is the first. The second layer 14 produced by the molding is sprayed onto the layer 12.

第7圖為本創作以滑鼠之外殼為實施例之示意圖,滑鼠表面為塑膠,但其左右按鍵的內側設有電性接點,此電性接點為金屬材質,因此滑鼠亦為本創作之應用,可避免因滑鼠使用時間長、過度點擊而使電性接點脫落,又可減少滑鼠殼的厚度。Figure 7 is a schematic view of the creation of the mouse case. The surface of the mouse is plastic, but the inner side of the left and right buttons are provided with electrical contacts. The electrical contacts are made of metal, so the mouse is also The application of this creation can avoid the use of the mouse for a long time, excessive clicks to make the electrical contacts fall off, and reduce the thickness of the mouse shell.

第8圖為本創作以機車車殼為實施例之示意圖。機車的車殼為塑膠材質,但為了保護線路和油箱,在前擋板和車身兩側板的內側具有金屬結構用以加固機車的堅固程度,此亦為本創作殼體結構中第一層12與第二層14結合的應用。Figure 8 is a schematic view showing the locomotive case as an embodiment. The locomotive's car shell is made of plastic material, but in order to protect the line and the fuel tank, there is a metal structure on the inner side of the front baffle and the side plates of the body to reinforce the sturdiness of the locomotive. The application of the second layer 14 is combined.

請參考第9圖,其為本創作以汽車車殼為實施例之示意圖,汽車前側的出風口亦為本創作可應用的範疇,蓋因其為金屬與塑膠的結合,利用本創作的殼體結構,可避免出風口的擋板因撞擊而使金屬和塑膠剝落分離。Please refer to Figure 9, which is a schematic diagram of the automobile car shell as an example. The air outlet on the front side of the car is also applicable to the creation. The cover is made of metal and plastic. The structure can prevent the baffle of the air outlet from peeling off the metal and the plastic due to the impact.

綜上所述,本創作提供一種殼體結構,其利用電化學方式在第一層的表面形成奈米微孔,並在第一層表面射出成型一第二層,使諸如金屬、碳纖維、玻璃纖維等平常不易與塑膠緊密附著的材質可藉由奈米微孔而與塑膠材質的第二層高度結合,結合強度比利用雙面膠或膠水黏合的強度提高50倍,且成本低、節省塑膠用量。In summary, the present invention provides a casing structure that electrochemically forms nanopores on the surface of the first layer and forms a second layer on the surface of the first layer to make materials such as metal, carbon fiber, and glass. Fibers and other materials that are not easily adhered to plastics can be combined with the second layer of plastic material by nano-pores. The bonding strength is 50 times higher than that of double-sided adhesive or glue. The cost is low and the amount of plastic is saved. .

唯以上所述者,僅為本創作之較佳實施例而已,並非用來限定本創作實施之範圍。故即凡依本創作申請範圍所述之特徵及精神所為之均等變化或修飾,均應包括於本創作之申請專利範圍內。The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Therefore, any change or modification of the characteristics and spirit described in the scope of this application shall be included in the scope of the patent application for this creation.

10‧‧‧殼體結構
12‧‧‧第一層
122‧‧‧第一面
124‧‧‧第二面
126‧‧‧奈米微孔
14‧‧‧第二層
10‧‧‧Shell structure
12‧‧‧ first floor
122‧‧‧ first side
124‧‧‧ second side
126‧‧Nemi micropores
14‧‧‧ second floor

第1圖為本創作之一實施例之立體圖。 第2圖為本創作之一實施例之分解圖。 第3圖為本創作以智慧型手機之外殼為實施例之示意圖。 第4圖為本創作以手機電池蓋為實施例之示意圖。 第5圖為本創作以相機之外殼為實施例之示意圖。 第6圖為本創作以電腦螢幕之外框為實施例之示意圖。 第7圖為本創作以滑鼠之外殼為實施例之示意圖。 第8圖為本創作以機車車殼為實施例之示意圖。 第9圖為本創作以汽車車殼為實施例之示意圖。Figure 1 is a perspective view of an embodiment of the present invention. Figure 2 is an exploded view of one embodiment of the present invention. The third figure is a schematic diagram of an embodiment in which the outer casing of the smart phone is created. Fig. 4 is a schematic view showing an embodiment of a mobile phone battery cover. Fig. 5 is a schematic view showing an embodiment of a camera casing as an embodiment. Figure 6 is a schematic diagram of the creation of a computer screen outside the frame. Fig. 7 is a schematic view showing the creation of a mouse case as an embodiment. Figure 8 is a schematic view showing the locomotive case as an embodiment. Figure 9 is a schematic view of an automobile car shell as an embodiment.

12‧‧‧第一層 12‧‧‧ first floor

122‧‧‧第一面 122‧‧‧ first side

124‧‧‧第二面 124‧‧‧ second side

126‧‧‧奈米微孔 126‧‧Nemi micropores

14‧‧‧第二層 14‧‧‧ second floor

Claims (8)

一種殼體結構,包括: 一第一層,包括相對之一第一面及一第二面,於該第二面上以電化學處理之方式形成有複數奈米微孔:以及 一第二層,以射出成型之方式形成於該第一層之該第二面上,該第二層與該第一層之該第二面上的該等奈米微孔緊密結合成雙層之一殼體結構。A housing structure comprising: a first layer comprising a first surface and a second surface opposite to each other, wherein the second surface is electrochemically formed with a plurality of nanopores: and a second layer Formed on the second side of the first layer by injection molding, the second layer and the nano micropores on the second side of the first layer are tightly combined to form a double shell structure. 如請求項1所述之殼體結構,其中該第一層之材質為鋁、鎂、銅、不銹鋼、鈦或鐵等金屬,或碳纖維、玻璃纖維等基材。The shell structure according to claim 1, wherein the material of the first layer is a metal such as aluminum, magnesium, copper, stainless steel, titanium or iron, or a substrate such as carbon fiber or glass fiber. 如請求項1所述之殼體結構,其中該第二層為聚苯硫醚(PPS)、聚對苯二甲酸二丁酯(PBT)或聚醯胺樹脂(PA66)等塑料。The shell structure of claim 1, wherein the second layer is a plastic such as polyphenylene sulfide (PPS), polybutylene terephthalate (PBT) or polyamide resin (PA66). 如請求項1所述之殼體結構,其中該第一層與該第二層之結合強度為200~220公斤力/平方公分(kgf /cm 2)。 The shell structure according to claim 1, wherein the first layer and the second layer have a bonding strength of 200 to 220 kgf / cm 2 . 如請求項1所述之殼體結構,其中該奈米微孔之大小為20~80奈米。The shell structure of claim 1, wherein the nanopore has a size of 20 to 80 nm. 如請求項1所述之殼體結構,其中該殼體結構可為手機殼、電腦螢幕邊框、或任何其他將金屬與塑膠結合之物件、或是其他碳纖維、玻璃纖維等基材與塑膠結合之物件。The housing structure of claim 1, wherein the housing structure can be a mobile phone case, a computer screen frame, or any other metal or plastic bonded object, or other carbon fiber, glass fiber and other substrates combined with plastic. Objects. 如請求項1所述之殼體結構,其中該電化學處理係為電解。The housing structure of claim 1, wherein the electrochemical treatment is electrolysis. 如請求項7所述之殼體結構,其中該電解處理之電解參數為10~65伏特。The shell structure of claim 7, wherein the electrolytic parameter of the electrolytic treatment is 10 to 65 volts.
TW105206279U 2016-05-03 2016-05-03 Housing structure for electronic device TWM527386U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106657506A (en) * 2017-03-10 2017-05-10 上海传英信息技术有限公司 Metal-plastic double-layer mobile phone shell and manufacturing method thereof
TWI787956B (en) * 2021-08-13 2022-12-21 超邁工業股份有限公司 Communication panel

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106657506A (en) * 2017-03-10 2017-05-10 上海传英信息技术有限公司 Metal-plastic double-layer mobile phone shell and manufacturing method thereof
CN106657506B (en) * 2017-03-10 2023-09-22 上海传英信息技术有限公司 Metal-plastic double-layer mobile phone shell and manufacturing method thereof
TWI787956B (en) * 2021-08-13 2022-12-21 超邁工業股份有限公司 Communication panel

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