TWM525836U - Magnetic conductance soft mold core and manufacturing system thereof - Google Patents
Magnetic conductance soft mold core and manufacturing system thereof Download PDFInfo
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本創作係關於一種磁導軟模仁及其製造系統,特別是關於應用於壓印的一種磁導軟模仁及其製造系統。 The present invention relates to a magnetic soft mold and a manufacturing system thereof, and more particularly to a magnetic soft mold core and a manufacturing system thereof for use in imprinting.
奈米壓印微影技術不受光學微影的物理限制,可以用低的成本且在大尺寸矽晶圓上很快地製作奈米圖案,是一項相當受到矚目的奈米製造技術。奈米壓印微影技術目前主要可分為四種方式:熱壓型、光硬化型、軟微影型與雷射輔助直接壓印型等多種。利用奈米壓印技術時,基本上需要採用不同的模具和蝕刻阻礙層,而模具的部分必須先用聚焦離子束或電子束等等的方式,製作出模具上奈米等級的幾何圖案與結構。奈米壓印技術可以應用在半導體元件的製程、光學、機械以及生化的領域等。例如,在顯示器技術方面,利用奈米壓印技術與使用液晶做為壓印塗料來製作液晶配向膜,除了可以獲得與一般塗料相同的表面條狀溝紋之外,還可以讓壓印模內達到分子自排的效果。利用熱壓成形或奈米壓印技術製作成形品時,壓力及模仁成型面的因素十分重要。當壓力控制不良或模仁成型面的強度不足時,常常壓印出品質不良的成品。 The nanoimprint lithography technology is not limited by the physical limitations of optical lithography, and the nano-pattern can be quickly produced on a large-sized enamel wafer at a low cost, and is a highly attractive nano-manufacturing technology. The nanoimprint lithography technology can be mainly divided into four types: hot pressing type, light hardening type, soft lithography type and laser assisted direct embossing type. When using nanoimprint technology, it is basically necessary to use different molds and etch barrier layers, and the mold part must first use the method of focusing ion beam or electron beam to make the nano-level geometric pattern and structure on the mold. . Nano imprint technology can be applied to the process, optical, mechanical and biochemical fields of semiconductor components. For example, in the display technology, the nano-imprinting technology and the use of liquid crystal as an imprinting coating to produce a liquid crystal alignment film can be obtained in the imprinting mold in addition to the same surface strip groove as the general coating. Achieve the effect of molecular self-discharge. When forming a molded article by hot press forming or nanoimprinting, the factors of pressure and mold forming surface are important. When the pressure control is poor or the strength of the mold forming surface is insufficient, the finished product of poor quality is often embossed.
為了改善上述問題,本案發明人經悉心之研究,並一本鍥而不捨的精神,終創作出本案之『磁導軟模仁及其製造系統』。 In order to improve the above problems, the inventor of this case, through careful research and a perseverance spirit, finally created the "Magnetic Guided Soft Mould and Its Manufacturing System" in this case.
本案之一目的為提出一種磁導軟模仁及其製造系統,利用表面改質製程將一導磁層與一強化補強層結合於一模板,以達到強化模板的複製成形面及磁力壓印的功效。 One of the objectives of the present invention is to provide a magnetic permeability soft mold and a manufacturing system thereof, which use a surface modification process to bond a magnetic conductive layer and a strengthening reinforcing layer to a template to achieve a replica forming surface of the reinforced template and magnetic imprinting. efficacy.
本案之第一構想為提出一種磁導軟模仁,其包括一成形層、一強化補強層、一包覆層與一導磁層。成形層具有一初複製成形面與一第一接觸面;強化補強層經過一第一表面改質製程設置於初複製成形面上,以形成一複製成形面;包覆層具有一第二接觸面;導磁層經過一第二表面改質製程結合於第一接觸面與第二接觸面之間。 The first concept of the present invention is to provide a magnetically conductive soft mold core comprising a forming layer, a strengthening reinforcing layer, a cladding layer and a magnetic conductive layer. The forming layer has an initial replica forming surface and a first contact surface; the strengthening reinforcing layer is disposed on the initial replica forming surface through a first surface modification process to form a replica forming surface; the cladding layer has a second contact surface The magnetically permeable layer is coupled between the first contact surface and the second contact surface via a second surface modification process.
本案之第二構想為提出一種磁導軟模仁的製造系統,其包括下列步驟:經過一第一表面改質製程,設置一強化補強層於一成形層的一初複製成形面上;及,經過一第二表面改質製程,結合一導磁層於該成形層的一第一接觸面與一包覆層的一第二接觸面之間。 The second concept of the present invention is to provide a manufacturing system for a magnetically conductive soft mold, comprising the steps of: providing a reinforcing reinforcing layer on an initial replica forming surface of a forming layer through a first surface modification process; After a second surface modification process, a magnetic conductive layer is bonded between a first contact surface of the forming layer and a second contact surface of a cladding layer.
100‧‧‧磁導軟模仁 100‧‧‧Magnetic soft mold
31‧‧‧成形層 31‧‧‧ Forming layer
311‧‧‧初複製成形面 311 ‧ ‧ initial copy forming surface
312‧‧‧第一接觸面 312‧‧‧ first contact surface
32‧‧‧強化補強層 32‧‧‧Strengthening reinforcement
321‧‧‧複製成形面 321‧‧‧Replicating the forming surface
33‧‧‧包覆層 33‧‧‧Cladding
111‧‧‧第二接觸面 111‧‧‧Second contact surface
112‧‧‧導熱裝置 112‧‧‧heat conduction device
1121‧‧‧對流管 1121‧‧‧ convection tube
34‧‧‧導磁層 34‧‧‧ magnetically conductive layer
35‧‧‧可塑體 35‧‧‧plastic body
36‧‧‧模板 36‧‧‧ Template
361‧‧‧複製成形面 361‧‧‧Replicating the forming surface
37‧‧‧磁化源 37‧‧‧Magnetization source
371‧‧‧電磁鐵 371‧‧‧Electromagnet
200‧‧‧磁導軟模仁的應用系統 200‧‧‧Application system of magnetic soft mold
第一圖:本案第一實施例所提磁導軟模仁的示意分解圖;及第二圖:本案第二實施例所提磁導軟模仁的應用系統示意圖。 The first figure is a schematic exploded view of the magnetic permeability soft mold core according to the first embodiment of the present invention; and the second figure: a schematic diagram of the application system of the magnetic permeability soft mold core according to the second embodiment of the present invention.
為了敘述清楚本案所提磁導軟模仁及其製造系統,下面列舉數個較佳實施例加以說明。 In order to clarify the magnetic flux soft mold and its manufacturing system as described in the present invention, several preferred embodiments are described below.
請參閱第一圖,其為本案第一實施例所提磁導軟模仁的示意 分解圖。如圖所示,磁導軟模仁100包括一成形層31、一強化補強層32、一包覆層33與一導磁層34,而磁導模仁100用於,例如,一壓印製程。 Please refer to the first figure, which is a schematic diagram of the magnetic permeability soft mold of the first embodiment of the present invention. Exploded map. As shown, the magnetic soft mold core 100 includes a shaping layer 31, a reinforcing reinforcing layer 32, a cladding layer 33 and a magnetic conductive layer 34, and the magnetic guiding mold 100 is used, for example, for an imprint process. .
成形層31具有一初複製成形面311與一第一接觸面312,其中初複製成形面311可利用多種方法製備,包括,例如,X光深刻電鑄模造技術(LIGA技術)、準分子雷射電鑄模造技術、灰階光罩微影電鑄模造技術或電子束直接刻寫技術等等。成形層31的材質可為一聚二甲基矽氧烷(PDMS)材料、一石英材料、一聚合物材料或一金屬材料等等;當成形層31的材質為透光時,其材質選自一SU8光阻材料或一PMMA材料等等。 The forming layer 31 has an initial replica forming surface 311 and a first contact surface 312, wherein the initial replica forming surface 311 can be prepared by various methods including, for example, X-ray deep electroforming molding technology (LIGA technology), excimer laser power Molding technology, gray-scale reticle lithography electroforming technology or electron beam direct writing technology. The material of the forming layer 31 may be a polydimethyl siloxane (PDMS) material, a quartz material, a polymer material or a metal material, etc.; when the material of the forming layer 31 is transparent, the material is selected from the material selected from the group consisting of A SU8 photoresist material or a PMMA material, etc.
強化補強層32經過一第一表面改質製程設置於初複製成形面311上,以形成一複製成形面321,其中複製成形面321用以成形一可塑體(未顯示)。常見的可塑體材料包括熱塑性材料、熱硬性材料或光硬化性材料等,例如,PMMA(Poly(methyl methacrylate))材料為熱塑性材料的一種。當強化補強層32與成形層31的材料特性不同時,會有強化補強層32與成形層31之間難以結合或結合不牢的情況,於是在將強化補強層32設置於初複製成形面311之前,可先對初複製成形面311實施第一表面改質製程,例如,利用一表面改質劑在初複製成形面311上實施一疏水性改質,除了疏水性改質之外,亦可對初複製成形面311實施硬度、耐磨與黏著等改質製程。本實施例利用一蒸鍍製程、一濺鍍製程與一塗佈製程中的至少一製程將強化補強層32設置於初複製成形面311上,其中常用的塗佈製程為一旋轉塗佈製程。 The reinforcing reinforcing layer 32 is disposed on the initial replica forming surface 311 via a first surface modification process to form a replica forming surface 321 for forming a moldable body (not shown). Common plastic body materials include thermoplastic materials, thermosetting materials or photocurable materials, etc. For example, PMMA (Poly (methyl methacrylate)) material is one of thermoplastic materials. When the material properties of the reinforcing reinforcing layer 32 and the forming layer 31 are different, there is a case where the reinforcing reinforcing layer 32 and the forming layer 31 are difficult to bond or are not firmly bonded, and thus the reinforcing reinforcing layer 32 is placed on the initial replica forming surface 311. Previously, the first surface modification process may be performed on the first replication molding surface 311. For example, a surface modification agent may be used to perform a hydrophobic modification on the initial replication molding surface 311, in addition to hydrophobic modification. The initial replication molding surface 311 is subjected to a modification process such as hardness, wear resistance, and adhesion. In this embodiment, the reinforcing reinforcing layer 32 is disposed on the initial replica forming surface 311 by using at least one of an evaporation process, a sputtering process, and a coating process, wherein the commonly used coating process is a spin coating process.
強化補強層32設置於初複製成形面311上,可使複製成形面321達到硬度高、彈性模數大與具切削性的效果。可使用的強化補強層32材質包括一導磁性材料;為了達到硬度高,而使強化補強層32材質的硬度大 於成形層31材質的硬度;為了達到彈性模數大,而使強化補強層32材質的彈性模數大於成形層31材質的彈性模數。 The reinforcing reinforcing layer 32 is provided on the initial replica forming surface 311, so that the replica forming surface 321 can have a high hardness, a large elastic modulus, and a machinability. The material of the reinforcing reinforcing layer 32 that can be used includes a magnetic conductive material; in order to achieve high hardness, the hardness of the material of the reinforcing reinforcing layer 32 is large. The hardness of the material of the forming layer 31; in order to achieve a large elastic modulus, the elastic modulus of the material of the reinforcing reinforcing layer 32 is larger than the elastic modulus of the material of the forming layer 31.
包覆層33具有一第二接觸面111且包覆層33的材質可為一PDMS材料、一石英材料、一聚合物材料或一金屬材料等等。導磁層34經過一第二表面改質製程結合於第一接觸面312與第二接觸面111之間;而導磁層34的形狀可為平板狀、曲板狀、波浪狀、多孔狀或其他形狀;導磁層34的材質包括一軟磁性材料或一永磁性材料,而導磁層34亦可為一導磁材料與其他材料的複合體。當導磁層34和成形層31或包覆層33的材料特性不同時,會有導磁層34與成形層31之間或導磁層34與包覆層33之間難以結合或結合不牢的情況,於是在將導磁層34結合於第一接觸面312與第二接觸面111間之前,可先對第一接觸面312與第二接觸面111實施第二表面改質製程,例如,利用一表面改質劑在第一接觸面312與第二接觸面111上實施一疏水性改質,除了疏水性改質之外,亦可分別對第一接觸面312與第二接觸面111實施硬度、耐磨與黏著等改質製程。本實施例利用一蒸鍍製程、一濺鍍製程與一塗佈製程中的至少一製程將導磁層34結合於第一接觸面312與第二接觸面111之間。 The cladding layer 33 has a second contact surface 111 and the material of the cladding layer 33 can be a PDMS material, a quartz material, a polymer material or a metal material, or the like. The magnetic conductive layer 34 is coupled between the first contact surface 312 and the second contact surface 111 via a second surface modification process; and the magnetic conductive layer 34 may have a flat shape, a curved shape, a wave shape, a porous shape or Other shapes; the material of the magnetic conductive layer 34 includes a soft magnetic material or a permanent magnetic material, and the magnetic conductive layer 34 may also be a composite of a magnetic conductive material and other materials. When the material properties of the magnetic conductive layer 34 and the shaping layer 31 or the cladding layer 33 are different, there is a difficulty in bonding or bonding between the magnetic conductive layer 34 and the shaping layer 31 or between the magnetic conductive layer 34 and the cladding layer 33. The second surface modification process may be performed on the first contact surface 312 and the second contact surface 111 before the magnetic conductive layer 34 is bonded between the first contact surface 312 and the second contact surface 111. For example, A hydrophobic modification is performed on the first contact surface 312 and the second contact surface 111 by using a surface modifying agent. In addition to the hydrophobic modification, the first contact surface 312 and the second contact surface 111 may be respectively implemented. Hardening, wear and adhesion and other modification processes. In this embodiment, the magnetic conductive layer 34 is bonded between the first contact surface 312 and the second contact surface 111 by at least one of an evaporation process, a sputtering process and a coating process.
在第一圖中,包覆層33中設有用以加熱或冷卻的一導熱裝置112,而導熱裝置112包括至少一對流管1121,當流體經過對流管1121時,將攜帶熱量進入或離開磁導軟模仁100。為了適應透光壓印製程的需求,包覆層33、導磁層34、成形層31與強化補強層32分別具有至少一種材質,並選擇該材質與控制該材質的區域分佈,使磁導軟模仁100是部分可透光的。 In the first figure, a heat conducting device 112 for heating or cooling is provided in the cladding layer 33, and the heat conducting device 112 includes at least one pair of flow tubes 1121 that carry heat into or out of the magnetic permeability as the fluid passes through the convection tube 1121. Soft mold kernel 100. In order to meet the requirements of the transparent imprint process, the cladding layer 33, the magnetic conductive layer 34, the shaping layer 31 and the reinforcing reinforcing layer 32 respectively have at least one material, and the material is selected and the area distribution of the material is controlled to make the magnetic permeability soft. The mold core 100 is partially permeable to light.
請參閱第二圖,其為本案第二實施例所提磁導軟模仁的應用 系統示意圖。如圖所示,磁導軟模仁的應用系統200包括一磁導軟模仁100、一可塑體35、一模板36與一磁化源37,其中磁導軟模仁100包括一成形層31、一強化補強層32、一包覆層33與一導磁層34。模板36具有一複製成形面361,且可塑體35在複製成形面321與複製成形面361之間成形;磁化源37設置於模板36中且包括,例如,至少一電磁鐵371,導磁層34與磁化源37共同作用產生一作用磁力分佈FA1;當強化補強層32包括一導磁性材料時,導磁層34、強化補強層32與磁化源37共同作用產生作用磁力分佈FA1。 Please refer to the second figure, which is the application of the magnetic permeability soft mold in the second embodiment of the present invention. System schematic. As shown, the magnetic soft mold core application system 200 includes a magnetic soft mold core 100, a plastic body 35, a template 36 and a magnetization source 37, wherein the magnetic soft mold core 100 includes a shaping layer 31, A reinforcing layer 32, a cladding layer 33 and a magnetically permeable layer 34 are provided. The template 36 has a replication forming surface 361, and the plastic body 35 is formed between the replication molding surface 321 and the replication molding surface 361; the magnetization source 37 is disposed in the template 36 and includes, for example, at least one electromagnet 371, the magnetic permeability layer 34 Cooperating with the magnetization source 37 to generate an active magnetic force distribution FA1; when the reinforcing reinforcing layer 32 includes a magnetic conductive material, the magnetic conductive layer 34 and the strengthening reinforcing layer 32 cooperate with the magnetization source 37 to generate an active magnetic force distribution FA1.
磁導軟模仁的應用系統200可適用於熱壓型、光硬化型、軟微影型與雷射輔助直接壓印型的奈米壓印技術。在熱壓型磁導軟模仁的應用系統中,可塑體35的材質可為一熱塑性材料或一熱硬性材料,強化補強層32的材質可為,例如,鎳金屬、聚合物、矽或二氧化矽等;利用作用磁力分佈FA1使複製成形面321與複製成形面361之間具有壓力而使可塑體35成形。 The magnetic soft mold application system 200 can be applied to the nanoimprint technology of hot pressing type, light hardening type, soft lithography type and laser assisted direct imprint type. In the application system of the hot-press type magnetic permeability soft mold, the material of the plastic body 35 may be a thermoplastic material or a thermosetting material, and the material of the reinforcing reinforcing layer 32 may be, for example, nickel metal, polymer, tantalum or two. The ruthenium oxide or the like is formed by applying a pressure between the replication molding surface 321 and the replication molding surface 361 by the action magnetic force distribution FA1.
在光硬化型磁導軟模仁的應用系統中,可塑體35的材質為一光固化材料;磁導軟模仁100包括至少一透光部位(未顯示),其中一紫外光穿過透光部位與複製成形面321而到達可塑體35,並利用作用磁力分佈FA1輔助施壓而使可塑體35成形。 In the application system of the photohardenable magnetic soft mold, the plastic body 35 is made of a photocurable material; the magnetic soft mold 100 includes at least one light transmitting portion (not shown), wherein an ultraviolet light passes through the light. The portion and the replica forming surface 321 are reached to the moldable body 35, and the plastic body 35 is molded by the application of the magnetic force distribution FA1 to assist the pressing.
在軟微影型磁導軟模仁的應用系統中,可塑體35的材質為,例如,位於複製成形面361上的一金箔;強化補強層32的材質為,例如,軟性的聚二甲基矽氧烷(PDMS),且複製成形面321沾附有機高分子硫醇(Thiol),並利用作用磁力分佈FA1微壓而使金箔成形。 In the application system of the soft lithography magnetic permeability soft mold, the material of the plastic body 35 is, for example, a gold foil on the replica forming surface 361; the material of the reinforcing reinforcing layer 32 is, for example, a soft polydimethyl group. The oxime (PDMS), and the replication molding surface 321 is adhered to the organic polymer thiol (Thiol), and the gold foil is formed by the micro-pressure of the magnetic force distribution FA1.
在雷射輔助直接壓印型磁導軟模仁的應用系統中,可塑體35 的材質為,例如,位於複製成形面361表面上的矽(Si)、銅(Cu)或碳化矽(SiC)等;磁導軟模仁100包括至少一透光部位(未顯示),其中軟化可塑體35的一準分子雷射光穿過透光部位與複製成形面321而到達可塑體35,並利用作用磁力分佈FA1直接壓印而使可塑體35成形。 In the application system of laser-assisted direct-imprinted magnetic permeability soft mold, plastic body 35 The material is, for example, bismuth (Si), copper (Cu) or tantalum carbide (SiC) on the surface of the replica forming surface 361; the magnetic soft mold core 100 includes at least one light transmitting portion (not shown) in which softening A quasi-molecular laser light of the plastic body 35 passes through the light transmitting portion and the replica forming surface 321 to reach the moldable body 35, and is directly embossed by the working magnetic force distribution FA1 to shape the plastic body 35.
接著,以第一圖說明本案所提磁導軟模仁100的製造系統,其包括下列步驟:經過一第一表面改質製程,設置一強化補強層32於一成形層31的一初複製成形面311上;及,經過一第二表面改質製程,結合一導磁層34於成形層31的一第一接觸面312與一包覆層33的一第二接觸面111之間。 Next, a manufacturing system of the magnetic permeability soft mold 100 according to the present invention will be described in the first drawing, which comprises the following steps: a first surface modification process is performed, and an initial reinforcement forming of the reinforcing reinforcing layer 32 on a forming layer 31 is performed. And a second surface modification process is coupled between a first contact surface 312 of the shaping layer 31 and a second contact surface 111 of a cladding layer 33 via a second surface modification process.
綜上所述,本案所提磁導軟模仁及其製造系統確實能達到發明構想所設定的功效。唯,以上所述者僅為本案之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本案精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the magnetic permeability soft mold and its manufacturing system in this case can indeed achieve the effect set by the invention concept. The above descriptions are only the preferred embodiments of the present invention. Any equivalent modifications or variations made by those skilled in the art of the present invention should be included in the scope of the following patent application.
100‧‧‧磁導軟模仁 100‧‧‧Magnetic soft mold
31‧‧‧成形層 31‧‧‧ Forming layer
311‧‧‧初複製成形面 311 ‧ ‧ initial copy forming surface
312‧‧‧第一接觸面 312‧‧‧ first contact surface
32‧‧‧強化補強層 32‧‧‧Strengthening reinforcement
321‧‧‧複製成形面 321‧‧‧Replicating the forming surface
33‧‧‧包覆層 33‧‧‧Cladding
111‧‧‧第二接觸面 111‧‧‧Second contact surface
112‧‧‧導熱裝置 112‧‧‧heat conduction device
1121‧‧‧對流管 1121‧‧‧ convection tube
34‧‧‧導磁層 34‧‧‧ magnetically conductive layer
Claims (19)
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TW105202194U TWM525836U (en) | 2016-02-16 | 2016-02-16 | Magnetic conductance soft mold core and manufacturing system thereof |
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TWM525836U true TWM525836U (en) | 2016-07-21 |
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