TWM525084U - Heat-generating shoe pad structure - Google Patents
Heat-generating shoe pad structure Download PDFInfo
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- TWM525084U TWM525084U TW105204280U TW105204280U TWM525084U TW M525084 U TWM525084 U TW M525084U TW 105204280 U TW105204280 U TW 105204280U TW 105204280 U TW105204280 U TW 105204280U TW M525084 U TWM525084 U TW M525084U
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- heat
- top surface
- bottom gasket
- insole
- heat generating
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- Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
Description
本創作新型係涉及一種保暖用品,特別是指一種用於足部保暖的發熱鞋墊之構造設計。 The novelty relates to a warming article, in particular to a structural design of a heating insole for warming the foot.
天氣寒冷時,傳統的鞋墊保護腳掌溫度的方式,係以不易導熱的材料,藉其減少熱量散發流失,致達到保暖的效果,然而,此種方式的要件,就是使用者足部還能夠產生一定的體溫,才適合使用,倘若使用者的血液循環欠佳,腳掌末梢溫度冰冷,隔熱效果再好的鞋墊,也成了無用武之地,依然無法有效達到禦寒保暖的作用,此時鞋襪中若能有一個主動發熱的裝置,就可以讓腳掌溫暖起來,而使身體更健康。 When the weather is cold, the traditional insole protects the temperature of the sole of the foot. It is a material that is not easy to conduct heat, so as to reduce the loss of heat and heat, so as to achieve the effect of warmth. However, the requirement of this method is that the user's foot can also produce certain The body temperature is suitable for use. If the user's blood circulation is poor, the temperature of the sole of the foot is cold, and the insole with better heat insulation effect becomes useless. It still cannot effectively achieve the effect of keeping warm in the cold. If you have an active heating device, you can warm your feet and make your body healthier.
是以,本創作人有鑑於上述習知不易導熱材料的鞋墊實用上仍具瑕疵及有待改善,盼能提供一突破性構造設計,以增進更臻實用效果,乃潛心研思、設計組製,綜集多年從事相關產品之製造開發與設計經驗,終研究出本創作「發熱鞋墊之構造」,實在為廣大消費者所殷切企盼。 Therefore, the creator has in fact that the above-mentioned insole, which is not easy to be made of thermal conductive material, is still practical and needs to be improved, and it is hoped that a breakthrough structural design can be provided to enhance the more practical effect, which is a thought-by-thinking and design system. The company has been engaged in the manufacturing development and design experience of related products for many years, and finally researched the creation of the "heating insole structure", which is really eagerly awaited by consumers.
於是,本新型一種『發熱鞋墊之構造』,其發熱鞋墊主要包括 底墊片、發熱構件及頂墊面等構件,係於底墊片之上面膠黏、車縫頂墊面形成鞋墊之構造,提供設置在鞋子之中,其特徵在於:該底墊片之頂面設有凹陷容納穴,俾裝設發熱構件之電路基板與電池;該發熱構件大體上係由電路基板、負極導電片、壓觸開關、發熱線及電池元件所組成,係裝置於底墊片與頂墊面之間;該發熱線係為撓性線,環列在底墊片與頂墊面之間,其兩端分別焊接在電路基板上而形成迴路,前述發熱鞋墊之構造,於腳跟踩壓該壓觸開關時,即通電至發熱線發熱讓腳掌溫暖起來,且兼具有使身體更健康的效果,是本新型之主要目的者。 Therefore, the present invention is a "heating insole structure", and the heating insole mainly includes The bottom gasket, the heat generating component and the top pad surface are made of a glued on the bottom gasket, and the top surface of the seam is formed into an insole structure, and is provided in the shoe, and is characterized in that: the top of the bottom gasket The surface is provided with a recessed receiving hole, and the circuit board and the battery of the heat generating component are disposed; the heat generating component is substantially composed of a circuit substrate, a negative electrode conductive sheet, a pressure contact switch, a heating wire and a battery component, and is disposed on the bottom gasket. Between the top surface and the top surface; the heating wire is a flexible wire, and the ring is arranged between the bottom gasket and the top surface, and the two ends are respectively soldered on the circuit substrate to form a circuit, and the heat insole is constructed on the heel. When the pressure switch is pressed, the heat is applied to the heating wire to warm the soles of the feet, and the effect of making the body healthier is the main purpose of the present invention.
有關本創作之前述目的及其他技術內容、特點與功效,在以下配合參考圖式之較佳實施例的詳細說明中,將可更清楚的明白。 The above and other technical contents, features, and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments.
(10)‧‧‧發熱鞋墊 (10) ‧‧‧heating insoles
(11)‧‧‧底墊片 (11) ‧‧‧ bottom gasket
(111)‧‧‧容納穴 (111)‧‧‧ Reception
(12)‧‧‧發熱構件 (12) ‧‧‧Fever components
(121)‧‧‧電路基板 (121)‧‧‧ circuit board
(122)‧‧‧負極導電片 (122)‧‧‧Negative Conductive Sheet
(123)‧‧‧壓觸開關 (123)‧‧‧Clamp switch
(124)‧‧‧發熱線 (124) ‧ ‧ heating line
(125)‧‧‧電池 (125)‧‧‧Battery
(13)‧‧‧頂墊面 (13)‧‧‧Top surface
第一圖所示係本創作之分解立體圖。 The first figure shows an exploded perspective view of the creation.
第二圖所示係本創作之分解側面圖。 The second figure shows an exploded side view of the creation.
第三圖所示係本創作之組合剖開及局部放大圖。 The third figure shows a combination of the creation and a partial enlargement of the creation.
敬請配合參閱第一圖至第三圖所示,本創作係應用於一種『發熱鞋墊之構造』,其發熱鞋墊(10)主要係包括:底墊片(11)、發熱構件(12)及頂墊面(13)等構件,係於該底墊片(11)之上面膠黏、車縫頂墊面(13)而形成鞋墊之構造,適用於設置在鞋子之中,而本創作「發熱鞋墊之構造」的特徵係在於:該底墊片(11)頂面設有凹陷之容納穴(111),俾能裝設發熱構件 (12)之電路基板(121)與電池(125);該發熱構件(12)大體上係由電路基板(121)、負極導電片(122)、壓觸開關(123)、發熱線(124)及電池(125)等元件所組合而成,係被包覆於該底墊片(11)與頂墊面(13)之間;該發熱線(124)係為撓性線,環列在底墊片(11)與頂墊面(13)之間,其二端分別焊接在電路基板(121)上而形成迴路;上述發熱鞋墊之構造,於腳跟踩壓該壓觸開關(123)時即通電至發熱線(124)發熱,溫暖腳掌者。 Please refer to the first to third figures. The creation is applied to a “heating insole structure”. The heating insole (10) mainly includes a bottom gasket (11) and a heat generating component (12). The top surface (13) and the like are attached to the bottom gasket (11), and the top surface of the top surface (13) is formed to form an insole structure, which is suitable for being placed in the shoe, and the creation "heating" The structure of the insole is characterized in that the top surface of the bottom gasket (11) is provided with a recessed receiving hole (111), and the crucible can be provided with a heat generating member. (12) a circuit board (121) and a battery (125); the heat generating member (12) is substantially a circuit board (121), a negative electrode conductive piece (122), a pressure contact switch (123), and a heating wire (124) And a combination of components such as a battery (125) are wrapped between the bottom gasket (11) and the top surface (13); the heating wire (124) is a flexible wire, and the ring is at the bottom. Between the gasket (11) and the top surface (13), the two ends are respectively soldered on the circuit board (121) to form a circuit; the heat insole structure is configured when the heel presses the pressure switch (123) Power on to the heating line (124) to heat, warm the feet.
至於本創作所提到的電路基板(121)及其各項電源控制迴路以及功效,係為一般習知技藝,並不在本創作之範圍內,容於此不再加以贅述。 As for the circuit substrate (121) mentioned in the present application and its various power control loops and functions, it is a general skill, and is not within the scope of the present invention, and will not be further described herein.
上列詳細說明係針對本創作之可行實施例之具體說明,惟該實施例並非用以限制本創作之專利範圍,凡未脫離本創作技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。 The detailed description above is for the specific description of the possible embodiments of the present invention, but the embodiment is not intended to limit the scope of the patents of the present invention, and equivalent implementations or changes that are not departing from the spirit of the present invention should be included in the present case. In the scope of patents.
綜上所述,本創作係提供一種『發熱鞋墊之構造』,確實為一甚具新穎性、進步性及可供產業上應用之創作,實已符合新型專利之給予要件,爰依法提出專利申請,尚祈 貴審查委員能詳予審查,並早日賜准本案專利,實為德便。 In summary, the creation department provides a "heating insole structure", which is indeed a novelty, progressive and industrially applicable creation, which has already met the requirements of the new patent, and filed a patent application according to law. The Shangqigui review committee can review the case in detail and give the patent in this case as soon as possible.
(10)‧‧‧發熱鞋墊 (10) ‧‧‧heating insoles
(11)‧‧‧底墊片 (11) ‧‧‧ bottom gasket
(111)‧‧‧容納穴 (111)‧‧‧ Reception
(12)‧‧‧發熱構件 (12) ‧‧‧Fever components
(121)‧‧‧電路基板 (121)‧‧‧ circuit board
(122)‧‧‧負極導電片 (122)‧‧‧Negative Conductive Sheet
(123)‧‧‧壓觸開關 (123)‧‧‧Clamp switch
(124)‧‧‧發熱線 (124) ‧ ‧ heating line
(125)‧‧‧電池 (125)‧‧‧Battery
(13)‧‧‧頂墊面 (13)‧‧‧Top surface
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW105204280U TWM525084U (en) | 2016-03-28 | 2016-03-28 | Heat-generating shoe pad structure |
Applications Claiming Priority (1)
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TW105204280U TWM525084U (en) | 2016-03-28 | 2016-03-28 | Heat-generating shoe pad structure |
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TWM525084U true TWM525084U (en) | 2016-07-11 |
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TW105204280U TWM525084U (en) | 2016-03-28 | 2016-03-28 | Heat-generating shoe pad structure |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107583200A (en) * | 2017-09-06 | 2018-01-16 | 深圳丽之健电子科技有限公司 | A kind of foot's physical therapy apparatus |
CN109275982A (en) * | 2018-11-09 | 2019-01-29 | 上海出版印刷高等专科学校 | A kind of heat generating insole based on printed electronic |
-
2016
- 2016-03-28 TW TW105204280U patent/TWM525084U/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107583200A (en) * | 2017-09-06 | 2018-01-16 | 深圳丽之健电子科技有限公司 | A kind of foot's physical therapy apparatus |
CN109275982A (en) * | 2018-11-09 | 2019-01-29 | 上海出版印刷高等专科学校 | A kind of heat generating insole based on printed electronic |
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