TWM523965U - Flip chip tray structure with scrape-resistance and high heat dissipation - Google Patents

Description

Chip-on-board mechanism with scratch resistance and high heat dissipation

This creation is about the flip-chip carrier mechanism, especially a flip-chip carrier mechanism with scratch resistance and high heat dissipation.

1 and 2 show a conventional flip-chip carrier structure with a flip-chip semiconductor substrate, the main structure of which comprises a substrate 10' for carrying a semiconductor structure positioned thereon. The surface of the substrate 10' has a plurality of penetrating holes 11'. The substrate 10' is used to carry a semiconductor structure located above it. Also, various pins and solder structures of the wafer may be formed on the substrate 10' such that the wafer 30' may be coupled to other components of a circuit board (not shown). A wafer 30' is positioned on the substrate 10'. A plurality of pins 31' are stretched under the wafer 30', and the plurality of pins 31' pass through the hole 11' of the substrate 10', and a plurality of contacts are displayed at the bottom of the substrate 10'. The electrical signal of the wafer 30' is transmitted to the external device through the plurality of pins 31'. The positions of the plurality of holes 11' of the substrate 10' correspond to the plurality of pins 31' of the wafer 30'. In the mounted state, the plurality of pins 31' of the wafer 30' traverse the corresponding hole positions 11' on the substrate 10', and The bottom side of the substrate 10' forms a plurality of contacts that electrically connect external lines such that external signals can be input into the wafer 30'.

As semiconductor wafers become faster and smaller, the heat dissipation creates a rather serious problem that must be solved. However, the above-mentioned prior art does not have an additional heat dissipating device, and the heat dissipating efficiency is limited, which is not enough to quickly and effectively transfer the heat radiated from the semiconductor wafer to the outside. If a heat dissipating structure is required to increase the heat dissipating area, the The whole volume has increased, but the requirements of today's electronic equipment are getting smaller and smaller, but the heat-dissipating equipment is larger and heavier, and it cannot meet the demands of the current semiconductor wafer organization for increasing weight. Therefore, there is a need for a heat dissipation method that does not occupy a volume and is highly efficient, so as to solve the problem of heat dissipation of semiconductor wafers today.

Furthermore, the anti-scratch effect of the prior art structure is not good, so that scratches are likely to occur when the entire wafer or its substrate is hit by an external force.

Therefore, the present invention hopes to propose a brand new flip-chip carrier mechanism with scratch resistance and high heat dissipation to solve the defects of the prior art.

Therefore, the purpose of the present invention is to solve the above-mentioned problems in the prior art. In the present invention, a flip-chip carrier mechanism with scratch resistance and high heat dissipation is proposed, which is to apply an organic or inorganic polymer material to a wafer and a substrate. A polymer coating is formed. The polymer coating has the functions of dissipating heat and scratching, so that heat is not accumulated in the wafer and the inside of the substrate, and the wafer and the inside of the substrate are damaged. Electronic components. The scratch-resistant property of the polymer coating can effectively absorb the sharp external force, and does not cause the force to form scratches on the wafer and the substrate. Furthermore, the polymer coating provides a high degree of toughness of the entire flip-chip carrier mechanism so that it does not easily break when subjected to an external force. In this case, the polymer coating is a relatively thin layer and does not significantly increase the thickness of the wafer and the substrate. Therefore, compared with the conventional flip-chip semiconductor carrier structure, no additional heat dissipation structure is disposed, and the present invention has better heat dissipation efficiency and scratch resistance, and achieves the purpose of weight reduction.

In order to achieve the above object, a flip chip carrier mechanism with scratch resistance and high heat dissipation is proposed in the present invention, comprising: a substrate having a plurality of penetrating holes on its surface for carrying a semiconductor structure located thereon; a wafer is attached to the substrate; a plurality of pins are drawn through the hole of the substrate under the wafer, and a plurality of contacts are displayed at the bottom of the substrate to transmit the electrical signal of the chip to the outside a polymer coating applied to a layer formed on the wafer and the substrate to form a high degree of protection for the wafer and the substrate; the polymer coating is tightly attached to the wafer and the Forming an integrated structure above the substrate; basically the polymer coating is a relatively thin layer, and does not significantly increase the thickness of the wafer and the substrate; the polymer coating has a heat dissipation and prevention The role of scraping; and provides the high toughness of the entire flip-chip carrier mechanism, so that it will not easily break when subjected to external force. .

The features of the present invention and its advantages can be further understood from the description below, and please refer to the attached drawings when reading.

10‧‧‧Substrate

10'‧‧‧Substrate

11‧‧‧ hole position

11’‧‧‧ hole

12‧‧‧Contacts

30‧‧‧ wafer

30’‧‧‧ wafer

31‧‧‧ pins

31’‧‧‧ feet

50‧‧‧ polymer coating

Figure 1 shows a combination of components of a conventional flip chip carrier mechanism.

Figure 2 shows a cross-sectional view of a component combination of a conventional flip chip carrier mechanism.

Figure 3 shows the component combination diagram of this case.

Figure 4 shows a side cross-sectional view of the component combination of the present invention.

Figure 5 shows a top view of the component combination of the present case.

Figure 6 shows a bottom view of the component combination of the present case.

Fig. 7 is a view showing another illustrative example of a side sectional view of the component combination diagram of the present invention.

In view of the structural composition of the case, and the functions and advantages that can be produced, in conjunction with the drawings, a preferred embodiment of the present invention is described in detail below.

Please refer to FIG. 3 to FIG. 7 , which shows the scratch-carrying and high heat-dissipating flip-chip carrier mechanism of the present invention, which includes the following components: A substrate 10 is used to carry a semiconductor structure over it. The surface of the substrate 10 has a plurality of penetrating holes 11 . The substrate 10 is used to carry a semiconductor structure located above it. Also, various pins and solder structures of the wafer can be formed on the substrate 10 such that the wafer can be bonded to other components of a circuit board (not shown).

A wafer 30 is attached to the substrate 10. A plurality of pins 31 are drawn under the wafer 30, and the plurality of pins 31 pass through the hole 11 of the substrate 10, and a plurality of contacts 12 are displayed at the bottom of the substrate 10. Making the signal of the wafer 30 The device can be transmitted to the outside through the plurality of pins 31.

The positions of the plurality of holes 11 of the substrate 10 correspond to the plurality of pins 31 of the wafer 30. In the mounted state, the plurality of pins 31 of the wafer 30 traverse the corresponding hole positions 11 on the substrate 10, and the plurality of contacts 12 are formed on the bottom side of the substrate 10, and the plurality of contacts 12 can be The external wiring is electrically connected so that an external signal can be input into the wafer 30.

A polymer coating 50 is a layer formed by coating an organic or inorganic polymer material on the wafer 30 and the substrate 10 to form a high degree of protection for the wafer 30 and the substrate 10. The polymer coating 50 is closely attached to the wafer 30 and the substrate 10 to form an integrated structure. Basically, the polymer coating 50 is a relatively thin layer and does not significantly increase the thickness of the wafer 30 and the substrate 10.

In the present case, the polymer coating 50 may be an organic polymer coating or an inorganic polymer coating. At least one of boron nitride powder, tantalum carbide powder, aluminum oxide powder, diamond powder and graphene powder may be added to the polymer coating 50 to enhance the heat dissipation effect.

The polymer coating 50 has a function of heat dissipation and scratch resistance. The polymer coating 50 can quickly remove the heat generated inside the wafer 30 and the substrate 10, so that heat is not accumulated in the wafer 30 and the substrate 10, thereby damaging the wafer 30 and the Electronic components inside the substrate 10. The scratch-resistant property of the polymer coating 50 can effectively absorb the sharp external force of the outside, and does not make The urging force forms a scratch on the wafer 30 and the substrate 10. Furthermore, the polymer coating 50 provides a high degree of toughness of the entire flip chip carrier mechanism, so that it does not easily break when subjected to an external force collision, mainly because the polymer coating 50 strongly adheres to the wafer 30 and the substrate. 10 above, so that stress generated when a collision does not easily pass along the wafer 30 and the substrate 10 to cause chipping.

As shown in FIG. 7, the polymer coating 50 can also coat the peripheral side of the substrate 10 for better protection.

As semiconductor wafers become faster and smaller, the heat dissipation creates a rather serious problem that must be solved. The traditional heat dissipation method has limited efficiency, and is not enough to quickly and effectively transfer the heat emitted by the semiconductor wafer. In addition, the conventional heat dissipation structure often increases the entire volume in order to increase the heat dissipation area, but the requirements of today's electronic equipment. The volume is getting smaller and smaller, so it is necessary to have a heat dissipation method that does not occupy a volume and is efficient, so as to solve the problem of heat dissipation of the current semiconductor wafer.

The advantage of the present invention is that an organic or inorganic polymer material is coated on the wafer and the substrate to form a polymer coating. The polymer coating has a function of dissipating heat and scratching, so that heat is not accumulated in the wafer and the inside of the substrate, and the electronic components inside the wafer and the substrate are damaged. The scratch-resistant property of the polymer coating can effectively absorb the sharp external force, and does not cause the force to form scratches on the wafer and the substrate. Furthermore, the polymer coating provides the entire flip chip The toughness of the carrier mechanism is such that it does not easily break when subjected to an external force. In this case, the polymer coating is a relatively thin layer and does not significantly increase the thickness of the wafer and the substrate. Therefore, compared with the conventional flip-chip carrier structure, no additional heat dissipation structure is disposed, and the present invention has better heat dissipation efficiency and scratch resistance, and achieves the purpose of weight reduction.

In summary, the humanized design of this case is quite in line with actual needs. The specific improvement of the existing defects is obviously a breakthrough improvement advantage compared with the prior art, and it has an improvement in efficacy and is not easy to achieve. The case has not been disclosed or disclosed in domestic and foreign literature and market, and has complied with the provisions of the Patent Law.

The detailed description above is a detailed description of one of the possible embodiments of the present invention, and the embodiment is not intended to limit the scope of the patents, and the equivalent implementations or modifications that are not included in the spirit of the present invention should be included in The patent scope of this case.

10‧‧‧Substrate

30‧‧‧ wafer

50‧‧‧ polymer coating

Claims (5)

A flip chip carrier mechanism having scratch resistance and high heat dissipation, comprising: a substrate for carrying a semiconductor structure positioned thereon; a surface of the substrate having a plurality of penetrating holes; the substrate is for carrying a semiconductor structure thereon; and various pins and solder structures of the wafer are also formed on the substrate such that the wafer can be bonded to other components of the circuit board; a wafer is attached to the substrate; and the wafer is stretched below a plurality of pins, wherein the plurality of pins pass through the hole of the substrate, and a plurality of contacts are displayed at the bottom of the substrate; so that the electrical signals of the chip can be transmitted to the external device through the plurality of pins; a polymer coating layer coated on the wafer and the substrate to form a high degree of protection for the wafer and the substrate; the polymer coating is tightly attached to the wafer and the substrate Above, forming an integrated structure; basically the polymer coating is a relatively thin layer, and does not significantly increase the thickness of the wafer and the substrate; the polymer coating has heat dissipation and scratch resistance; the polymer The layer can quickly remove the heat generated inside the wafer and the inside of the substrate; the scratch resistance of the polymer coating can effectively absorb the sharp external force, and the force is not applied to the wafer and the substrate. The scratch is formed on the upper surface; further, the polymer coating provides the high toughness of the entire flip-chip carrier mechanism, so that the chip does not easily break when subjected to an external force. Such as the application of patent scope 1 of the scratch-resistant and high heat-dissipation The plate mechanism, wherein the polymer coating is an organic polymer coating. For example, in the patent application scope, the flip-chip carrier mechanism having scratch resistance and high heat dissipation, wherein the polymer coating is an inorganic polymer coating. For example, in the patent application scope, the flip chip and the high heat dissipation flip chip carrier mechanism, wherein the polymer coating is added with boron nitride powder, tantalum carbide powder, aluminum oxide powder, diamond powder and graphene. At least one of the powders to enhance heat dissipation. For example, in the patent application scope, the flip-chip carrier mechanism having scratch resistance and high heat dissipation, wherein the polymer coating also covers the peripheral side of the substrate, thereby achieving better protection effect.