TWM523580U - Electroplated sticker structure - Google Patents
Electroplated sticker structure Download PDFInfo
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- TWM523580U TWM523580U TW104221209U TW104221209U TWM523580U TW M523580 U TWM523580 U TW M523580U TW 104221209 U TW104221209 U TW 104221209U TW 104221209 U TW104221209 U TW 104221209U TW M523580 U TWM523580 U TW M523580U
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Description
本創作係一種電鍍貼紙的結構方面的技術領域,尤指一種具有良好耐磨性與耐酸鹼性,而且不易氧化、老化及不易髒污,而能大幅提高使用壽命之電鍍貼紙的結構者。 This creation is a technical field of the structure of electroplated stickers, especially a structure of electroplated stickers which has good wear resistance and acid and alkali resistance, and is not easy to be oxidized, aged and not easily soiled, and can greatly improve the service life.
請參閱第1圖所示,係顯示一種習知電鍍貼紙的製法及結構主要為於一基材10的底面塗佈背膠11後貼附上一離型紙12,再於該基材10的頂面以真空蒸鍍之方式形成一電鍍層13,然後再以印刷方式於該電鍍層13上印刷出呈正像圖樣之油墨層14,而後利用鹼性腐蝕液將未被油墨層14覆蓋保護之電鍍層13腐蝕去除,乾燥後即完成。其在使用時,係需將離型紙12撕開,然後利用該背膠11將整面基材10含電鍍層13、油墨層14一起貼於物品表面上。 Referring to FIG. 1 , it is shown that the manufacturing method and structure of a conventional electroplating sticker are mainly to apply a release paper 12 to the bottom surface of a substrate 10 and then attach a release paper 12 to the top of the substrate 10 . A plating layer 13 is formed by vacuum evaporation, and then the ink layer 14 of the positive pattern is printed on the plating layer 13 by printing, and then the plating is not covered by the ink layer 14 by using an alkaline etching solution. Layer 13 is removed by etching and is completed after drying. When it is used, it is necessary to tear the release paper 12, and then the backing substrate 11 is used to apply the plating layer 13 and the ink layer 14 together on the surface of the article.
由於該習知電鍍貼紙貼附於物品上時,該油墨層14及電鍍層13係會顯露於外而未受任何保護,因此很容易有磨損或受到其它酸鹼性溶液侵蝕而損壞脫落之情形,尤其是該顯露於外未受保護之油墨層14與電鍍層13更是容易受到天候環境(如氣溫、濕度)的變化而發生老化、氧化的情形,且其亦很容易受到 髒污。另外,當該習知電鍍貼紙貼附於物品上時,其基材10係整面貼附於物品上,因此非圖樣之部份係會顯露於外,而會影響到整體的精緻美觀效果。 Since the conventional electroplated sticker is attached to the article, the ink layer 14 and the electroplated layer 13 are exposed to the outside without being protected, so that it is easily worn or damaged by other acid-alkaline solutions. In particular, the exposed unprotected ink layer 14 and the plating layer 13 are more susceptible to aging and oxidation due to changes in weather conditions (such as temperature and humidity), and are also susceptible to Dirty. In addition, when the conventional electroplating sticker is attached to the article, the substrate 10 is attached to the article on the entire surface, so that the non-pattern portion is exposed, which affects the overall delicate and beautiful effect.
習知電鍍貼紙之結構係存在著不耐磨、不耐酸鹼、不耐髒污、易受天候環境變化影響、易老化及氧化等之諸多缺點。 The structure of the conventional electroplating sticker has many shortcomings such as non-wear resistance, acid and alkali resistance, dirt resistance, weather resistance, aging and oxidation.
本創作提供一種電鍍貼紙的結構,包括至少一黏貼單元及一離型紙。其中,該黏貼單元係依序由一透光基材、一電鍍層、一油墨層及一背膠層疊結合而成。該離型紙係貼附於該黏貼單元具背膠之一側面上。。 The present invention provides a structure for an electroplated sticker comprising at least one pasting unit and a release paper. The adhesive unit is sequentially formed by laminating a light-transmitting substrate, a plating layer, an ink layer and a backing layer. The release paper is attached to one side of the adhesive unit with the backing. .
本創作所提供之電鍍貼紙的結構,係使得該電鍍貼紙之黏貼單元轉貼於物體表面後,該電鍍層及油墨層會被該透光基材保護於內側,因此藉由該透光基材的保護可使其具有良好耐磨性與耐酸鹼性,而且亦使其因此不易受天候變化影響,因而不易氧化、老化及不易髒污,而能大幅提高使用壽命。尤其是,該黏貼單元轉貼於物體表面時,僅會有所欲之圖樣造型印附於其上,而不會有其他不屬於圖樣之部分同時顯露於外,所以可較具美觀及質感。 The structure of the electroplated sticker provided by the present invention is such that after the adhesive unit of the electroplated sticker is affixed to the surface of the object, the electroplated layer and the ink layer are protected by the transparent substrate, so that the transparent substrate is The protection can make it have good wear resistance and acid and alkali resistance, and also makes it less susceptible to weather changes, so it is not easy to be oxidized, aged and not easily soiled, and can greatly improve the service life. In particular, when the adhesive unit is attached to the surface of the object, only the desired pattern is printed on it, and there is no other part that does not belong to the pattern and is exposed at the same time, so that it can be more beautiful and textured.
10‧‧‧基材 10‧‧‧Substrate
11‧‧‧背膠 11‧‧‧ Back glue
12‧‧‧離型紙 12‧‧‧ release paper
13‧‧‧電鍍層 13‧‧‧Electroplating
14‧‧‧油墨層 14‧‧‧Ink layer
20‧‧‧透光基材 20‧‧‧Light transmissive substrate
30‧‧‧電鍍層 30‧‧‧Electroplating
31‧‧‧圖形層 31‧‧‧Graphic layer
32‧‧‧可透光油墨層 32‧‧‧Light transmissive ink layer
40‧‧‧油墨層 40‧‧‧Ink layer
50‧‧‧背膠 50‧‧‧back adhesive
60‧‧‧離型紙 60‧‧‧ release paper
70‧‧‧襯材 70‧‧‧ lining
80‧‧‧物品 80‧‧‧ items
A‧‧‧黏貼單元 A‧‧‧adhesive unit
第1圖係習知電鍍貼紙的製作流程示意圖。 The first figure is a schematic diagram of the production process of the conventional electroplating sticker.
第2圖係本創作之製作流程的方塊示意圖。 Figure 2 is a block diagram of the production process of this creation.
第3圖係本創作之製作流程示意圖。 Figure 3 is a schematic diagram of the production process of this creation.
第4圖係本創作貼附於物品上之動作示意圖。 Figure 4 is a schematic diagram of the action of the creation attached to the item.
第5圖係本創作印刷呈鏡像圖樣之油墨層的立體示意圖。 Figure 5 is a perspective view of the ink layer of the mirror image in this creation.
第6圖係本創作貼附於物品上之立體示意圖。 Figure 6 is a three-dimensional illustration of the creation of the creation on the item.
第7圖係本創作之第二實施例。 Figure 7 is a second embodiment of the present creation.
第8圖係本創作之第三實施例。 Figure 8 is a third embodiment of the present creation.
請參閱第2、3圖所示,係顯示本創作所述之電鍍貼紙的製作方法包括:(a)真空蒸著電鍍層30:以真空蒸著電鍍方式於一透光基材20之一側面上形成一電鍍層30,該透光基材20為耐磨材質,且為透明或半透明狀;(b)印刷鏡像圖樣之油墨層40:以印刷方式(如網版、凸版、平版印刷)於該電鍍層30上印刷出呈鏡像圖樣之油墨層40(如第5圖所示),該鏡像圖樣可為各種文字、圖形或花紋......等;(c)退鍍處理:以具腐蝕性之鹼性溶液將該電鍍層30上未被該油墨層40覆蓋保護之區域予以腐蝕,然後利用酸性溶液將鹼性腐蝕液作酸鹼中和動作後,再利用清水洗淨所有化學溶液,之後乾燥;(d)結合背膠50:於該透光基材20去除掉電鍍層30的一側面上與該油墨層40上塗佈或貼合背膠50; (e)貼附離型紙60:將一離型紙60貼附於該背膠50上;(f)裁形處理:順著該鏡像圖案之油墨層40的外形裁切,以去除掉鏡像圖案以外區域之透光基材20與背膠50等多餘邊料,在裁形處理時係可沿著該鏡像圖案的輪廓裁切,亦可略大於該鏡像圖案的輪廓裁切;(g)貼附襯材70:將一襯材70具有黏性之一側面貼附於該透光基材20異於該電鍍層30之一側面上,且該襯材70的黏性係小於該背膠50的黏性。 Referring to FIGS. 2 and 3, the method for manufacturing the electroplated sticker according to the present invention includes: (a) vacuum evaporation plating layer 30: vacuum evaporation plating on one side of a transparent substrate 20 Forming a plating layer 30 on the wear-resistant material, which is transparent or translucent; (b) printing the mirror layer of the ink layer 40: by printing (such as screen, letterpress, lithography) An ink layer 40 (shown in FIG. 5) in a mirror image is printed on the plating layer 30, and the mirror image can be various characters, figures or patterns, etc.; (c) Deplating treatment: The area of the plating layer 30 that is not covered by the ink layer 40 is corroded by a corrosive alkaline solution, and then the alkaline etching solution is neutralized by an acidic solution, and then washed with water. a chemical solution, followed by drying; (d) bonding backing 50: on the side of the transparent substrate 20 removed the plating layer 30 and the ink layer 40 coated or bonded backing 50; (e) attaching the release paper 60: attaching a release paper 60 to the adhesive 50; (f) cutting treatment: cutting along the outer shape of the ink layer 40 of the mirror image to remove the mirror image The excess material of the transparent substrate 20 and the adhesive 50 in the region may be cut along the contour of the mirror pattern during the cutting process, or may be slightly larger than the contour of the mirror image; (g) attached Lining material 70: one side of the lining material 70 having adhesiveness is attached to the light-transmitting substrate 20 on one side of the plating layer 30, and the adhesiveness of the lining material 70 is smaller than that of the adhesive 50. Sticky.
上述製作完成之電鍍貼紙的結構係包含至少一黏貼單元A、一離型紙60及一襯材70。其中,該每一黏貼單元A係依序由一透光基材20、一電鍍層30、一油墨層40及一背膠50層疊結合而成,該襯材70係一側面具有黏性且貼附於該複數黏貼單元A異於該離型紙60的一側面上。在本創作中,該黏貼單元A亦可為複數個。 The structure of the above-mentioned fabricated electroplated sticker comprises at least one pasting unit A, a release paper 60 and a lining material 70. Each of the adhesive units A is sequentially formed by laminating a light-transmitting substrate 20, a plating layer 30, an ink layer 40 and a backing adhesive 50. The lining material 70 is viscous and affixed on one side. The plurality of pasting units A are attached to one side of the release paper 60. In the present creation, the pasting unit A may also be plural.
請參閱第4圖所示,係指出本創作在使用時,僅需將該離型紙60由該背膠50上撕離後,該複數黏貼單元A便可利用該背膠50貼附於一物品80的表面上,而在貼附時可利用該襯材70之輔助以避免其在貼附時產生歪斜、偏移之情形,而當該複數黏貼單元A完全貼妥於該物品80之適當位置後,便可撕去該襯材70,因該襯材70的黏性小於該背膠50的黏性,因此在撕去襯材70時,該複數黏貼單元A便不會隨其被撕離,而是會貼附於物品80 上而且亦會呈正像之狀態(如第6圖所示),如此便可達到將電鍍貼紙之複數黏貼單元A轉貼於物品80上之目的。 Referring to FIG. 4, it is pointed out that when the present invention is used, the multiple adhesive sheet A can be attached to an article by using the adhesive 50 after the release paper 60 is peeled off from the adhesive 50. 80 on the surface, and the attachment of the lining material 70 can be utilized to prevent it from being skewed or offset when attached, and when the plurality of pasting units A are completely attached to the appropriate position of the article 80 After that, the lining material 70 can be torn off, because the lining material 70 has less viscosity than the adhesive 50, so when the lining material 70 is torn off, the plurality of affixing units A will not be detached therefrom. But will be attached to item 80 It will also be in a positive state (as shown in Fig. 6), so that the purpose of transferring the multiple pasting unit A of the electroplated sticker to the article 80 can be achieved.
在本創作中,(g)步驟之襯材70主要係為方便使用者將該複數黏貼單元A貼黏於物品80表面上以避免其在貼附時產生歪斜、偏移之情形,所以在實際實施中亦可省略該(g)步驟,使本創作之電鍍貼紙不包含該襯材70。如此,其在使用時使用者便需直接將該複數黏貼單元A一個個依序由該離型紙60上撕離後,再利用其之背膠50將其一個個貼附於物品80的表面上。 In the present invention, the lining material 70 of the step (g) is mainly for facilitating the user to stick the plurality of pasting unit A on the surface of the article 80 to avoid skewing and offset when attached, so in practice This step (g) may also be omitted in the implementation so that the embossed sticker 70 of the present invention is not included. In this way, the user needs to directly peel the plurality of pasting units A one by one from the release paper 60 in sequence, and then attach the adhesive sheets 50 to the surface of the article 80 by using the adhesive 50. .
請參閱第7圖所示,係為本創作所述的第二實施例,其之步驟與上述實施例大致相同,差別僅在於第二實施例係於步驟(c)退鍍處理後先進行步驟(c1)印刷圖形層31後再進行步驟(d)結合背膠50步驟。該步驟(c1)印刷圖形層31係為於該透光基材20上經退鍍去除電鍍層30的區域上,再以印刷方式形成一圖形層31,其中該圖形層31係呈鏡像狀態,而且可依需要具有各種顏色,藉此係可增加整體產品的多樣化與多變化。 Please refer to FIG. 7 , which is a second embodiment of the present invention, and the steps thereof are substantially the same as those of the above embodiment, except that the second embodiment is in the step (c) after the deplating process. (c1) After printing the pattern layer 31, the step (d) is combined with the backing 50 step. In the step (c1), the printed pattern layer 31 is formed on the transparent substrate 20 by deplating and removing the plating layer 30, and then a graphic layer 31 is formed by printing, wherein the graphic layer 31 is in a mirror image state. Moreover, various colors can be provided as needed, thereby increasing the variety and variety of the overall product.
請參閱第8圖所示,係為本創作的第三實施例,其之步驟與上述實施例大致相同,差別僅在於第三實施例係於步驟(d)結合背膠50步驟之前先進行步驟(c2)形成可透光油墨層32。該步驟(c2)形成可透光油墨層32係為於該透光基材20異於該電鍍層30的一側面上,以印刷或塗佈之方式形成具有顏色之一可透光油墨層32,使人可由該複數黏貼單元A的外側透過該可透光油墨層32看到該電鍍層30,藉此該可透光油墨層32與該電鍍層30的配 合係可增加整體產品之顏色的多樣化與多變化。 Referring to FIG. 8, it is a third embodiment of the present invention, and the steps thereof are substantially the same as those of the above embodiment, except that the third embodiment is in the step (d) before the step of bonding the adhesive 50. (c2) forming a light transmissive ink layer 32. The step (c2) forms the permeable ink layer 32 on the side of the transparent substrate 20 different from the plating layer 30, and forms a light transmissive ink layer 32 by printing or coating. The plating layer 30 can be seen from the outside of the plurality of pasting units A through the permeable ink layer 32, whereby the permeable ink layer 32 is matched with the plating layer 30. The combination can increase the variety and variety of colors of the overall product.
由於本創作之結構使得該電鍍貼紙之複數黏貼單元A轉貼於物品80表面後,該電鍍層30及油墨層40係會被該透光基材20保護於內側,因此係藉由該透光基材20的保護可使其具有良好耐磨性與耐酸鹼性,而且亦可使其因此不易受天候變化影響,因而有不易氧化、老化及不易髒污之功效,進而能大幅提高使用壽命。尤其是,該黏貼單元A轉貼於物品80表面時,僅會有所欲之圖樣造型貼附於其上,如第6圖所示。而不會有其他不屬於圖樣之部分同時顯露於外,所以係可因此而較具美感及質感。 Since the structure of the present invention causes the plurality of pasting units A of the electroplated sticker to be affixed to the surface of the article 80, the plating layer 30 and the ink layer 40 are protected by the transparent substrate 20 on the inner side, and thus the transparent substrate is The protection of the material 20 can make it have good wear resistance and acid and alkali resistance, and can also make it less susceptible to weather changes, so that it is not easy to be oxidized, aged and not easily soiled, thereby greatly improving the service life. In particular, when the pasting unit A is attached to the surface of the article 80, only the desired pattern is attached thereto, as shown in Fig. 6. There is no other part that is not part of the pattern and it is exposed at the same time, so the system can be more aesthetic and textured.
20‧‧‧透光基材 20‧‧‧Light transmissive substrate
30‧‧‧電鍍層 30‧‧‧Electroplating
40‧‧‧油墨層 40‧‧‧Ink layer
50‧‧‧背膠 50‧‧‧back adhesive
80‧‧‧物品 80‧‧‧ items
A‧‧‧黏貼單元 A‧‧‧adhesive unit
Claims (7)
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TW104221209U TWM523580U (en) | 2015-12-31 | 2015-12-31 | Electroplated sticker structure |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI717284B (en) * | 2020-05-28 | 2021-01-21 | 詠昱科技有限公司 | Manufacturing method and structure of three-dimensional embossed electroplating sticker |
TWI722911B (en) * | 2020-05-28 | 2021-03-21 | 詠昱科技有限公司 | Manufacturing method and structure of laminated three-dimensional electroplating stickers |
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2015
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI717284B (en) * | 2020-05-28 | 2021-01-21 | 詠昱科技有限公司 | Manufacturing method and structure of three-dimensional embossed electroplating sticker |
TWI722911B (en) * | 2020-05-28 | 2021-03-21 | 詠昱科技有限公司 | Manufacturing method and structure of laminated three-dimensional electroplating stickers |
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