TWM520721U - Photoresist spraying system - Google Patents

Description

Photoresist system

The present invention relates to a photoresist ejection system, and more particularly to a photoresist ejection system that avoids wasting photoresist when replacing a photoresist filter.

Coating coating plays a very important role in the field of semiconductor manufacturing. For example, in the etching process, the photoresist layer is used as a mask for the etched film to keep the desired pattern from being removed by the etching reaction. . In the ion implantation process, the photoresist also has the function of a mask, so that the dopant is only incorporated into a predetermined area.

Please refer to Figure 1, which is a schematic diagram of a photoresist ejection system. The photoresist ejection system mainly includes a storage tank 10, a liquid ejector 12, a pump 13, a photoresist filter 11, a control valve 14, and a nozzle 15. The pump 13 filters the photoresist liquid through the photoresist filter 11, and controls the flow rate of the photoresist liquid discharged from the nozzle 15 by the control valve 14, and the photoresist liquid is ejected from the nozzle 15 to be placed in the rotary coating machine ( Spin Coater's wafer (not shown) allows the spin coater to rotate the wafer, and the photoresist can be uniformly applied to the surface of the wafer by centrifugal force.

However, in the photoresist coating process, Poor Coating and Range too Hight phenomenon of wafer coating are often caused by bubbles or impurities in the photoresist solution, which will result in good etching of the wafer. Rate or reliability drop Low, severe cases even caused wafer scrapping. Therefore, the photoresist filter 14 needs to be periodically replaced to ensure the filtration quality.

At present, the replacement timing of the photoresist filter 11 is changed every three months at a fixed frequency, and the photoresist filter 11 needs to be subjected to a pre-wetting process through which the photoresist flow passes, and a photoresist of 500 cc to 1000 cc is discharged. The wetted photoresist filter can be used normally. However, in the pre-wet process, the photoresist filter 11 generates bubbles due to the influence of speed, pressure or temperature. If the coating operation is directly carried out, the coating effect is inevitably affected, and if the exhausting operation is performed after the pre-wetting, it takes time and Increasing the cost of using photoresist reduces the replacement of the photoresist filter 11 into a time consuming and costly process.

Therefore, the main purpose of the present invention is to provide a photoresist ejection system capable of eliminating microbubbles generated during pre-wetting without pre-wetting, without additionally consuming a photoresist dose, and saving work time.

The present invention relates to a photoresist ejection system comprising: a storage tank for storing photoresist liquid; a photoresist filter for filtering impurities in the photoresist liquid; and a liquid retarder for removing photoresist a microbubble in the liquid; a pump for extracting the photoresist from the storage tank and controlling the flow of the photoresist to the photoresist filter; and a control valve for controlling the flow of the photoresist from a nozzle flow.

Therefore, after the new photoresist filter is replaced, when the photoresist filter is pre-wetted by the photoresist liquid, the photoresist liquid pumped from the storage tank by the pump is pre-wet and the impurities are removed in the filter. The microbubbles generated in the programs are discharged when the photoresist leaves the photoresist filter and reaches the liquid buffer, without pre-wetting. The use of additional photoresist to carry out the bubble removal operation not only saves time, but also saves the use of photoresist and achieves cost saving.

(known)

10‧‧‧ storage tank

11‧‧‧Photoresist filter

12‧‧‧Liquid cooler

13‧‧‧ pump

14‧‧‧Control valve

15‧‧‧ nozzle

(this creation)

100‧‧‧ storage tank

110‧‧‧Photoresist filter

120‧‧‧Liquid cooler

130‧‧‧ pump

140‧‧‧Control valve

150‧‧‧ nozzle

1 is a schematic view of a conventional photoresist discharge system.

Figure 2 is a schematic view of the created photoresist ejection system.

The detailed description of the present invention and the technical description are further described in the following examples, but it should be understood that these examples are for illustrative purposes only and are not to be construed as limiting.

Please refer to FIG. 2 , which is a schematic diagram of the created photoresist discharge system. A photoresist ejection system includes a storage tank 100 for storing photoresist liquid, a photoresist filter 110 for filtering photoresist impurities, and a microbubble-liquid retarder 120 for removing microbubbles a pump 130 for draining the photoresist from the storage tank and a control valve 140 for controlling the flow rate of the photoresist from the nozzle 150, wherein the photoresist filter 110 is disposed at the The microbubbles generated during the pre-wetting and filtering of the photoresist filter 110 are removed between the storage tank 100 and the liquid buffer 120 by the liquid buffer 120.

At present, the replacement timing of the photoresist filter 110 is changed every three months at a fixed frequency, but the actual situation is different depending on factors such as the utilization rate and viscosity of the photoresist liquid, and the blocking condition of the photoresist filter 110 is also different. The safe service life requires control of the photoresist filter 110 for a minimum of three months.

The material of the photoresist is mainly composed of a resin, a sensitizer and a solvent mixed in different proportions, so the viscosity of the photoresist is often changed by the mixing ratio of the resin, the sensitizer and the solvent. Therefore, when the current photoresist filter 110 is replaced, it needs to pass through the photoresist flow, and the photoresist liquid of 500 cc to 1000 cc is discharged, and the wetted photoresist filter 110 can be used normally.

For semiconductor manufacturing, because the photoresist is quite expensive, during the pre-wetting process, the micro-bubbles naturally generated by the surface of the photoresist filter 110 may be completely wetted, or because of the filtration speed and the transport of the photoresist. The microbubbles are generated by the influence of factors such as bending and turning, instantaneous compression and expansion of the pump 130, and after the photoresist filter 110 is disposed after the pump 130 in a conventional manner, after the replacement of the photoresist filter 110 is performed, It takes time and the use of excess photoresist to remove microbubbles generated during the pre-wetting process, which will result in wasted use of the photoresist and increase manufacturing costs.

Therefore, in the implementation, when the new photoresist filter 110 is switched to the transfer line of the photoresist ejection system, the pre-wet operation is performed, firstly compressed by the pump 130, and the photoresist in the storage tank 100 is removed. The liquid is taken out and sent to the photoresist filter 110 through the conveying pipe, the pre-wetting operation is performed by the photoresist filter 110, and the impurities are filtered, and then the filtered photoresist liquid is drained to the liquid retarder 120 via the conveying pipe. The liquid ejector 120 is configured to prevent the pump 130 from continuously idling and causing damage to the configured snubber device after the photoresist solution of the storage tank 100 is used up, and the liquid damper 120 can remove air during operation. Therefore, the microbubbles generated during the pre-wetting process of the photoresist filter 110 can be removed by the liquid buffer 120 and sent to the nozzles to be ejected. Therefore, the microbubbles generated by the photoresist filter 110 due to the pre-wetting are all blocked in the liquid buffer 120, and the photoresist coating is not caused.

The present invention has been disclosed in the above preferred embodiments, and it should be understood by those skilled in the art that the present invention is only intended to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application below.

100‧‧‧ storage tank

110‧‧‧Photoresist filter

120‧‧‧Liquid cooler

130‧‧‧ pump

140‧‧‧Control valve

150‧‧‧ nozzle

Claims (1)

A photoresist jetting system comprising a storage tank for storing photoresist liquid, a photoresist filter for filtering photoresist impurities, a liquid buffer for removing microbubbles, and a control valve for draining the photoresist from the storage tank and a control valve for controlling the flow rate of the photoresist from the nozzle, wherein the photoresist filter is disposed in the storage tank and the liquid is slowed down The microbubbles generated during the pre-wetting of the photoresist filter and during the filtration process are eliminated between the chargers.