TWM516826U - Heat dissipation module buckling device and heat dissipation module having the same - Google Patents
Heat dissipation module buckling device and heat dissipation module having the same Download PDFInfo
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- TWM516826U TWM516826U TW104212400U TW104212400U TWM516826U TW M516826 U TWM516826 U TW M516826U TW 104212400 U TW104212400 U TW 104212400U TW 104212400 U TW104212400 U TW 104212400U TW M516826 U TWM516826 U TW M516826U
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Description
本創作係與電子晶片的散熱裝置有關，特別是指一種散熱模組扣持裝置及具有扣持裝置的散熱模組。The present invention relates to a heat sink of an electronic chip, and particularly relates to a heat sink module holding device and a heat sink module having the holding device.
美國US 7,903,411號專利揭露了一種散熱器扣持裝置。該專利中主要是藉由一彈性板組合(spring plate assembly)來將散熱鰭片固定在電子晶片上，而彈性板(spring plate)必須藉由一彈性銷(spring pin)來在一個槽(slot)中滑動，藉由旋轉中央的作用螺絲(actuation screw)來調整該彈性板對其彈性板組合的底板的壓力。這樣的結構雖然可以達到讓彈性板在上下升降時必須沿著彈性銷與槽的配合關係來移動，然而，這樣的結構在組裝上較為麻煩，且結構較為複雜。U.S. Patent No. 7,903,411 discloses a heat sink holding device. The patent mainly uses a spring plate assembly to fix the heat sink fins on the electronic chip, and the spring plate must be in a slot by a spring pin (slot). The middle slide is used to adjust the pressure of the elastic plate to the bottom plate of the elastic plate combination by rotating the central action screw. Although such a structure can be moved so that the elastic plate must move along the elastic pin and the groove when lifting up and down, such a structure is cumbersome to assemble and complicated in structure.
本創作之主要目的乃在於提供一種散熱模組扣持裝置及具有扣持裝置的散熱模組，其可達到將散熱體扣持於電子晶片上的功效，還可以達到調整扣持力的效果，此外，本創作之結構不同於先前技術，而較先前技術更為簡單。The main purpose of the present invention is to provide a heat dissipation module holding device and a heat dissipation module having a fastening device, which can achieve the effect of holding the heat sink on the electronic wafer, and can also achieve the effect of adjusting the holding force. Moreover, the structure of the present creation is different from the prior art and is simpler than the prior art.
緣是，依據本創作所提供之一種散熱模組扣持裝置，包含有：一長形體，兩端分別具有至少一導引部，中央具有一螺接部；至少二栓件，可活動地由上而下穿經該二至少一導引部，而使該長形體在外力作用時藉由該二至少一導引部沿該至少二栓件之軸向位移，該至少二栓件之頂部分別具有一限位部，限制該二至少一導引部不會由該至少二栓件之頂部向上脫離；以及一作用螺栓，由上而下螺接並穿經該螺接部，該作用螺栓之底部形成一抵接部。The heat dissipation module holding device provided by the present invention comprises: an elongated body having at least one guiding portion at each end and a screwing portion at the center; at least two bolts movablely Passing through the two at least one guiding portion, and causing the elongated body to be displaced along the axial direction of the at least two bolts by the external force when the external force acts, the tops of the at least two bolts respectively Having a limiting portion that restricts the at least one guiding portion from being detached upward from the top of the at least two bolt members; and a functioning bolt that is screwed from above and through the threaded portion, the action bolt An abutment is formed at the bottom.
藉此，本創作可用來將散熱體扣持於電子晶片上，還可以藉由旋轉該作用螺栓來達到調整扣持力的效果，此外，本創作之結構不同於先前技術，而較先前技術更為簡單。Thereby, the present invention can be used to hold the heat sink on the electronic chip, and the effect of adjusting the holding force can be achieved by rotating the action bolt. Moreover, the structure of the present creation is different from the prior art, and is more than the prior art. For the sake of simplicity.
依據本創作所提供之一種具有扣持裝置的散熱模組，包含有：一散熱體，具有一底板，以及設於該底板上的複數鰭片，該等鰭片係彼此結合而於結合體的中央形成一上下貫通的貫孔；一長形體，位於該底板上方，兩端分別具有至少一導引部，中央具有一螺接部；至少二栓件，可活動地由上而下穿經該二至少一導引部，而使該長形體在外力作用時藉由該二至少一導引部沿該至少二栓件之軸向位移，該至少二栓件之頂部分別具有一限位部，限制該二至少一導引部不會由該至少二栓件之頂部向上脫離；以及一作用螺栓，由上而下螺接並穿經該螺接部，且亦穿過該貫孔，該作用螺栓之底部形成一抵接部而抵接於該底板。According to the present invention, a heat dissipation module having a fastening device includes: a heat sink having a bottom plate and a plurality of fins disposed on the bottom plate, the fins being coupled to each other and coupled to each other a centrally formed through hole extending through the upper and lower sides; an elongated body located above the bottom plate, each of the two ends having at least one guiding portion, the center having a screwing portion; at least two bolts movablely from top to bottom And at least one guiding portion, wherein the elongated body is displaced along the axial direction of the at least two bolts by the external force, and the tops of the at least two bolts respectively have a limiting portion. Limiting that the at least one guiding portion is not detached upward from the top of the at least two bolts; and a functioning bolt is screwed up and down through the threaded portion and also passes through the through hole, the function The bottom of the bolt forms an abutting portion to abut the bottom plate.
藉此，本創作可將該散熱體扣持於電子晶片上，還可以藉由旋轉該作用螺栓來達到調整扣持力的效果，此外，本創作之結構不同於先前技術，而較先前技術更為簡單。Thereby, the creation can hold the heat sink on the electronic chip, and can also achieve the effect of adjusting the holding force by rotating the action bolt. In addition, the structure of the present creation is different from the prior art, and is more than the prior art. For the sake of simplicity.
為了詳細說明本創作之技術特點所在，茲舉以下之較佳實施例並配合圖式說明如後，其中：In order to explain in detail the technical features of the present invention, the following preferred embodiments are described below with reference to the following:
如第1圖所示，本創作第一較佳實施例所提供之一種散熱模組扣持裝置10，主要由一長形體11、至少二栓件21以及一作用螺栓31所組成，其中：As shown in FIG. 1 , a heat dissipation module holding device 10 according to a first preferred embodiment of the present invention is mainly composed of an elongated body 11 , at least two bolts 21 , and an action bolt 31 .
該長形體11，兩端分別具有至少一導引部12，中央具有一螺接部14。於本第一實施例中，該至少一導引部12在數量上係以一個為例，且該至少一導引部12係以穿孔形態為例；此外，於本第一實施例中，該長形體11係由二板體重疊所形成。The elongated body 11 has at least one guiding portion 12 at each end and a screwing portion 14 at the center. In the first embodiment, the at least one guiding portion 12 is exemplified by one, and the at least one guiding portion 12 is exemplified by a perforated shape; further, in the first embodiment, the first embodiment The elongated body 11 is formed by overlapping two plates.
該至少二栓件21，於本第一實施例中在數量上係以二為例。該二栓件21可活動地由上而下穿經該二導引部12，而使該長形體11在外力作用時藉由該二導引部12沿該二栓件21之軸向位移，該二栓件21之頂部分別具有一限位部22，限制該二導引部12不會由該二栓件21之頂部向上脫離。The at least two bolts 21 are exemplified by two in the first embodiment. The two bolts 21 are movably moved through the two guiding portions 12 from top to bottom, so that the elongated body 11 is displaced along the axial direction of the two bolts 21 by the two guiding portions 12 when an external force is applied. The tops of the two bolts 21 respectively have a limiting portion 22, which limits the two guiding portions 12 from being detached upward from the top of the two bolts 21.
該作用螺栓31，由上而下螺接並穿經該螺接部14，該作用螺栓31之底部形成一抵接部32。The action bolt 31 is screwed up and down through the screw portion 14 , and an abutting portion 32 is formed at the bottom of the action bolt 31 .
於本第一實施例中，係更包含有一固定座41，該固定座41係由二座體42所組成，該二栓件21係以其底部固設於該二座體42。在實施上，可以在各該座體42設置一固定孔43，並使該二栓件21之底部插入各該固定孔43或以螺接的關係來固定於該二座體42。In the first embodiment, the fixing base 41 is further composed of two bases 42 fixed to the two bases 42 by the bottom thereof. In the implementation, a fixing hole 43 may be disposed in each of the bases 42 , and the bottom of the two bolts 21 may be inserted into each of the fixing holes 43 or fixed to the two seats 42 in a screwed relationship.
以上說明了本第一實施例的架構，接下來說明本第一實施例的使用方式。The architecture of the first embodiment has been described above, and the mode of use of the first embodiment will be described next.
請再參閱第2圖至第4圖，在使用前，須先將本創作與一散熱體91結合於一電子晶片99(例如中央處理器, CPU)上。其中，該電子晶片99係設置於一電路板95上，該固定座41之二座體42係設置於該電路板95上， 該散熱體91係由一底板92以及設於該底板92上的複數鰭片94所組成，該等鰭片94係彼此結合而於結合體的中央形成一上下貫通的貫孔941。該長形體11係設置於該鰭片94下方所預設的一容置空間942內，並且該長形體11係位於該底板92上方，且使該作用螺栓31穿過該貫孔941而螺接於該螺接部14，並且使該作用螺栓31之抵接部32抵接於該底板92。此外，該二栓件21係以其底部固定於該二座體42。藉此，即完成利用本創作來將該散熱體91結合於該電子晶片99上的動作。Please refer to FIG. 2 to FIG. 4 again. Before use, the present invention must be combined with a heat sink 91 on an electronic chip 99 (for example, a central processing unit, CPU). The electronic chip 99 is disposed on a circuit board 95. The two bases 42 of the fixing base 41 are disposed on the circuit board 95. The heat sink 91 is disposed on a bottom plate 92 and on the bottom plate 92. The plurality of fins 94 are formed, and the fins 94 are coupled to each other to form a through hole 941 penetrating through the center of the combined body. The elongate body 11 is disposed in a predetermined accommodating space 942 below the fin 94, and the elongate body 11 is located above the bottom plate 92, and the action bolt 31 is threaded through the through hole 941. The screwing portion 14 abuts the abutting portion 32 of the action bolt 31 against the bottom plate 92. Further, the two bolts 21 are fixed to the two seats 42 with their bottoms. Thereby, the operation of bonding the heat sink 91 to the electronic chip 99 by the present creation is completed.
在使用時，如第2圖至第4圖所示，藉由旋轉該作用螺栓31來調整該長形體11的高度。由於該作用螺栓31的抵接部32抵接於該底板92，因此旋緊該作用螺栓31時會造成該長形體11上升，該長形體11上升至其兩端抵住於該二栓件21的限位部22時，由於該二栓件21是固定於該二座體42，因此該長形體11即無法再上升。此時，若仍繼續旋緊該作用螺栓31，則會造成該長形體11中央上升而兩端不上升的狀況，這會使得該長形體11本身形成一股向下的復歸壓力，進而作用於該作用螺栓31來對該底板92造成更大的壓制力，藉此即將該散熱體91壓制於該電子晶片99上。藉由旋緊或旋鬆該作用螺栓31，即可調整該作用螺栓31作用於該底板92的力量，進而調整該散熱體91壓制於該電子晶片99的力量。In use, as shown in Figs. 2 to 4, the height of the elongated body 11 is adjusted by rotating the action bolt 31. Since the abutting portion 32 of the action bolt 31 abuts against the bottom plate 92, the elongated body 11 is caused to rise when the action bolt 31 is tightened, and the elongated body 11 is raised to the both ends thereof to abut against the two bolts 21 In the limiting portion 22, since the two bolts 21 are fixed to the two bases 42, the elongated body 11 cannot be raised any more. At this time, if the action bolt 31 is still tightened, the center of the elongated body 11 rises and the both ends do not rise, which causes the elongated body 11 itself to form a downward return pressure, thereby acting on the The bolt 31 is actuated to cause a greater pressing force on the bottom plate 92, whereby the heat sink 91 is pressed onto the electronic chip 99. By tightening or loosening the action bolt 31, the force of the action bolt 31 acting on the bottom plate 92 can be adjusted, thereby adjusting the force of the heat sink 91 pressed against the electronic chip 99.
須補充說明的是，於本第一實施例中，該二至少一導引部以及該至少二栓件雖在數量上以二為例，然而，數量更多(例如四栓件)的情況下亦是可以實施的。在四個的情況下，即是該長形體兩端分別具有二導引部(即以第2圖中長形體一端之一個孔改為設置為兩個孔)，藉此該長形體即總共具有四個導引部，再使該四個栓件穿經該等導引部而固定於該等座體即可。此種數量上的設計改變仍應為本創作之專利範圍所涵蓋。It should be noted that, in the first embodiment, the at least one guiding portion and the at least two bolts are exemplified by two numbers, however, in the case of a larger number (for example, four bolts). It can also be implemented. In the case of four, that is, the two ends of the elongated body respectively have two guiding portions (ie, one hole at one end of the elongated body in FIG. 2 is instead set to two holes), whereby the elongated body has a total of The four guiding portions are further fixed to the seats by the four bolts passing through the guiding portions. Such quantitative design changes should still be covered by the scope of this creation.
由上可知，本創作不僅可以達到將散熱體91扣持於電子晶片99上的功效，還可以達到調整扣持力的效果，此外，本創作之結構不同於先前技術，而較先前技術更為簡單。As can be seen from the above, the creation can not only achieve the effect of holding the heat sink 91 on the electronic chip 99, but also achieve the effect of adjusting the holding force. In addition, the structure of the creation is different from the prior art, and is more than the prior art. simple.
如第5圖至第6圖所示，本第一實施例中，可更增設二墊片16，而在數量上對應於該二栓件21。各該墊片16之一側係具有向下延伸的長形凸垣161，且各該墊片16具有一穿孔162。As shown in FIGS. 5 to 6, in the first embodiment, two spacers 16 may be further added, corresponding in number to the two bolts 21. One side of each of the spacers 16 has an elongated tenon 161 extending downward, and each of the spacers 16 has a through hole 162.
在組裝時，該二栓件21係穿過該二墊片16之穿孔162，而使得該二墊片16位於該二栓件21之限位部22與該長形體11之間，並且使該二墊片16之長形凸垣161位於該導引部12與該螺接部14之間。When assembled, the two bolts 21 pass through the through holes 162 of the two washers 16 such that the two washers 16 are located between the limiting portion 22 of the two bolts 21 and the elongated body 11 and The elongate tenon 161 of the two spacers 16 is located between the guiding portion 12 and the screwing portion 14.
藉此，該長形體11上升至頂端時，其兩端係藉由該二墊片16來抵住於該二栓件21的限位部22，該限位部22對該長形體11所形成的壓制力，即會藉由該墊片16的長形凸垣161以及該墊片16相對於該長形凸垣161的另一端來傳遞至該長形體11。因此，該二限位部22藉由該二墊片16來對該長形體11提供壓制力，可以使得力量的傳遞面積更大且傳遞位置更多，可避免在沒有該二墊片16的情況下，該二限位部22可能對該長形體11形成單點施力而導致該長形體11變形的問題。Therefore, when the elongated body 11 is raised to the top end, the two ends of the elongated body 11 are pressed against the limiting portion 22 of the two bolts 21, and the limiting portion 22 is formed on the elongated body 11. The pressing force is transmitted to the elongated body 11 by the elongated tenon 161 of the spacer 16 and the spacer 16 with respect to the other end of the elongated tenon 161. Therefore, the two limiting portions 22 provide the pressing force to the elongated body 11 by the two spacers 16, so that the transmission area of the force is larger and the transmission position is more, and the situation without the two spacers 16 can be avoided. Next, the two limiting portions 22 may form a single point of force on the elongated body 11 to cause deformation of the elongated body 11.
請再參閱第7圖至第9圖，本創作第二較佳實施例係提供之一種具有扣持裝置的散熱模組50，主要由一散熱體91’、一長形體11’、至少二栓件21’、以及一作用螺栓31’所組成，其中：Please refer to FIG. 7 to FIG. 9 again. The second preferred embodiment of the present invention provides a heat dissipation module 50 having a fastening device, which mainly comprises a heat sink 91', an elongated body 11', and at least two bolts. a piece 21', and an action bolt 31', wherein:
該散熱體91’，具有一底板92’，以及設於該底板92’上的複數鰭片94’，該等鰭片94’之中央形成一上下貫通的貫孔941’。The heat dissipating body 91' has a bottom plate 92' and a plurality of fins 94' disposed on the bottom plate 92'. The center of the fins 94' forms a through hole 941' which is vertically penetrated.
該長形體11’，位於該底板92’上方，兩端分別具有至少一導引部12’，中央具有一螺接部14’。於本第二實施例中，該長形體11’一端的該至少一導引部12’在數量上仍以一個為例，該長形體11’係由一板體彎折形成，該長形體11’係於兩端向下延伸後再向外水平延伸而分別形成一該導引部12’，且於中央向下彎曲而形成該螺接部14’。該長形體11’係位於該散熱體91’的該等鰭片94’上，且該螺接部14’係藉由向下彎曲的結構而位於該貫孔941’內。The elongated body 11' is located above the bottom plate 92', and has at least one guiding portion 12' at each end and a screwing portion 14' at the center. In the second embodiment, the at least one guiding portion 12' at one end of the elongated body 11' is still exemplified by one. The elongated body 11' is formed by bending a plate body, and the elongated body 11 is formed. The system is formed by extending downwardly at both ends and extending horizontally outward to form a guiding portion 12', and is bent downward at the center to form the screw portion 14'. The elongated body 11' is located on the fins 94' of the heat sink 91', and the screw portion 14' is located in the through hole 941' by a downwardly curved structure.
該至少二栓件21’，於本實施例中在數量上係以二為例，其可活動地由上而下穿經該二導引部12’，而使該長形體11’在外力作用時藉由該二導引部12’沿該二栓件21’之軸向位移，該二栓件21’之頂部分別具有一限位部22’，限制該二導引部12’不會由該二栓件21’之頂部向上脫離。於本第二實施例中，各該栓件21’具有一彈簧24’，各該彈簧24’係套置於其所設置之栓件21’，而位於該限位部22’與該長形體11’之間。The at least two bolts 21' are exemplified by two in the embodiment, and are movable to pass through the two guiding portions 12' from top to bottom, so that the elongated body 11' acts on an external force. When the two guiding portions 12' are displaced along the axial direction of the two bolts 21', the tops of the two bolts 21' respectively have a limiting portion 22', which limits the two guiding portions 12' from being The top of the two bolts 21' is detached upward. In the second embodiment, each of the bolts 21' has a spring 24', and each of the springs 24' is sleeved on the bolt 21' provided thereon, and is located at the limiting portion 22' and the elongated body. Between 11'.
該作用螺栓31’，由上而下螺接並穿經該螺接部14’，且亦穿過該貫孔941’，該作用螺栓31’之底部形成一抵接部32’而抵接於該底板92’。The action bolt 31' is screwed up and down through the threaded portion 14' and also passes through the through hole 941'. The bottom of the action bolt 31' forms an abutting portion 32' to abut The bottom plate 92'.
在組裝時，該等栓件21’係直接固定於一電路板95’上，而該作用螺栓31’係先螺接於該長形體11’之螺接部14’再穿過該貫孔941’而以其抵接部32’抵接於該底板92’，其餘的組裝方式則與前揭第一實施例相同。When assembled, the bolts 21' are directly fixed to a circuit board 95', and the action bolts 31' are first screwed to the screw joints 14' of the elongated body 11' and pass through the through holes 941. 'With the abutting portion 32' abutting against the bottom plate 92', the remaining assembly manner is the same as that of the first embodiment.
本第二實施例在使用時，該長形體11’上升的過程中，係藉由該等彈簧24’提供對該長形體11’下壓的力量，藉此可藉由該等彈簧24’來提供適當的壓制力，而可避免壓力過大的問題。In the second embodiment, during use, the elongated body 11' is raised by the springs 24' to provide a force for pressing the elongated body 11', whereby the springs 24' can be used Provide appropriate compression force to avoid excessive pressure problems.
本第二實施例之其餘所能達成的功效均概同於前揭第一實施例，容不贅述。The remaining efficiencies of the second embodiment are the same as those of the first embodiment, and are not described herein.
請再參閱第10圖至第11圖，本創作第三較佳實施例係提供之一種具有扣持裝置的散熱模組60，主要概同於前揭第二實施例，不同之處在於：Please refer to FIG. 10 to FIG. 11 again. The third preferred embodiment of the present invention provides a heat dissipation module 60 having a fastening device, which is mainly similar to the second embodiment, except that:
本第三實施例中的各該栓件21’’並不設置彈簧。Each of the bolts 21'' in the third embodiment is not provided with a spring.
本第三實施例中除了具有一散熱體91’’、一長形體11’’、二栓件21’’、以及一作用螺栓31’’之外，還更包含有一彈片固定座61’’，該彈片固定座61’’上係設有二彈片62’’，該二彈片62’’在數量上係對應於該二栓件21’’，並且該二彈片62’’中央固設有二螺接件64’’，該二彈片62’’分別對應於該二栓件21’’，該二栓件21’’係以底部設置內螺紋槽(圖中未示)而螺接於該二螺接件64’’，藉由旋轉該二栓件21’’來對該二螺接件64’’形成上下移動的動態，進而作用於該二彈片62’’使其上下移動，該二彈片62’’愈上升則向下之復歸彈力愈大，藉此可作用於該長形體11’’來對該散熱體91’’形成下壓之壓制力。In addition to having a heat sink 91'', an elongated body 11'', two bolts 21", and an action bolt 31", the third embodiment further includes a spring mount 61''. The elastic fixing piece 61'' is provided with two elastic pieces 62'', the two elastic pieces 62'' are corresponding in number to the two locking pieces 21'', and the two elastic pieces 62'' are fixed with two screws in the center. The connecting piece 64'', the two elastic pieces 62'' respectively correspond to the two bolts 21'', and the two bolts 21'' are screwed to the two screws with an internal thread groove (not shown) at the bottom. The connecting member 64'' rotates the two bolts 21'' to form a dynamic movement of the two screwing members 64'', and acts on the two elastic pieces 62'' to move up and down. The two elastic pieces 62 The larger the returning force is, the larger the elastic force is, so that it can act on the elongated body 11'' to form a pressing force for pressing the heat sink 91''.
本第三實施例之其餘所能達成的功效均概同於前揭第一實施例，容不贅述。The other achievable functions of the third embodiment are the same as those of the first embodiment, and are not described here.
10‧‧‧散熱模組扣持裝置
11‧‧‧長形體
12‧‧‧導引部
14‧‧‧螺接部
16‧‧‧墊片
161‧‧‧長形凸垣
162‧‧‧穿孔
21‧‧‧栓件
22‧‧‧限位部
31‧‧‧作用螺栓
32‧‧‧抵接部
41‧‧‧固定座
42‧‧‧座體
43‧‧‧固定孔
91‧‧‧散熱體
92‧‧‧底板
94‧‧‧鰭片
941‧‧‧貫孔
942‧‧‧容置空間
95‧‧‧電路板
99‧‧‧電子晶片
50‧‧‧散熱模組扣持裝置
11’‧‧‧長形體
12’‧‧‧導引部
14’‧‧‧螺接部
21’‧‧‧栓件
22’‧‧‧限位部
24’‧‧‧彈簧
31’‧‧‧作用螺栓
32’‧‧‧抵接部
91’‧‧‧散熱體
92’‧‧‧底板
94’‧‧‧鰭片
941’‧‧‧貫孔
95’‧‧‧電路板
60‧‧‧散熱模組扣持裝置
11’’‧‧‧長形體
21’’‧‧‧栓件
31’’‧‧‧作用螺栓
61’’‧‧‧彈片固定座
62’’‧‧‧彈片
64’’‧‧‧螺接件
91’’‧‧‧散熱體10‧‧‧Dissipation module holding device
11‧‧‧Long body
12‧‧‧ Guidance Department
14‧‧‧ screw joint
16‧‧‧shims
161‧‧‧Elongated crown
162‧‧‧Perforation
21‧‧‧Bolts
22‧‧‧Limited
31‧‧‧Action bolt
32‧‧‧Apartment
41‧‧‧ Fixed seat
42‧‧‧ body
43‧‧‧Fixed holes
91‧‧‧ Heat sink
92‧‧‧floor
94‧‧‧Fins
941‧‧‧through hole
942‧‧‧ accommodating space
95‧‧‧ boards
99‧‧‧electronic chip
50‧‧‧Dissipation module holding device
11'‧‧‧Long body
12'‧‧‧Guide
14'‧‧‧ screw joint
21'‧‧‧Bolts
22'‧‧‧Limited
24'‧‧‧ Spring
31'‧‧‧Action bolt
32'‧‧‧Apartment
91'‧‧‧ Heat sink
92'‧‧‧floor
94'‧‧‧Fins
941'‧‧‧Tongkong
95'‧‧‧ boards
60‧‧‧Dissipation module holding device
11''‧‧‧Long body
21''‧‧‧Bolts
31''‧‧‧Action bolt
61''‧‧‧Shrap mount
62''‧‧‧Shrap
64''‧‧‧ Screws
91''‧‧‧ Heat sink
第1圖係本創作第一較佳實施例之爆炸圖。 第2圖係本創作第一較佳實施例之使用狀態組合圖。 第3圖係本創作第一較佳實施例之使用狀態爆炸圖。 第4圖係沿第2圖中4-4剖線之剖視圖。 第5圖係本創作第一較佳實施例之另一使用狀態組合圖。 第6圖係第5圖之爆炸圖。 第7圖係本創作第二較佳實施例之使用狀態組合圖。 第8圖係本創作第二較佳實施例之使用狀態爆炸圖。 第9圖係沿第7圖中9-9剖線之剖視圖。 第10圖係本創作第三較佳實施例之使用狀態組合圖。 第11圖係本創作第三較佳實施例之使用狀態爆炸圖。Figure 1 is an exploded view of the first preferred embodiment of the present invention. Fig. 2 is a view showing a combination of use states of the first preferred embodiment of the present invention. Figure 3 is an exploded view of the state of use of the first preferred embodiment of the present invention. Figure 4 is a cross-sectional view taken along line 4-4 of Figure 2; Fig. 5 is a view showing another use state combination of the first preferred embodiment of the present invention. Figure 6 is an exploded view of Figure 5. Figure 7 is a combination of use states of the second preferred embodiment of the present invention. Figure 8 is an exploded view of the state of use of the second preferred embodiment of the present invention. Figure 9 is a cross-sectional view taken along line 9-9 of Figure 7. Fig. 10 is a view showing a combination of use states of the third preferred embodiment of the present creation. Figure 11 is an exploded view of the state of use of the third preferred embodiment of the present invention.
10‧‧‧散熱模組扣持裝置 10‧‧‧Dissipation module holding device
11‧‧‧長形體 11‧‧‧Long body
12‧‧‧導引部 12‧‧‧ Guidance Department
14‧‧‧螺接部 14‧‧‧ screw joint
21‧‧‧栓件 21‧‧‧Bolts
22‧‧‧限位部 22‧‧‧Limited
31‧‧‧作用螺栓 31‧‧‧Action bolt
32‧‧‧抵接部 32‧‧‧Apartment
41‧‧‧固定座 41‧‧‧ Fixed seat
42‧‧‧座體 42‧‧‧ body
43‧‧‧固定孔 43‧‧‧Fixed holes
91‧‧‧散熱體 91‧‧‧ Heat sink
92‧‧‧底板 92‧‧‧floor
94‧‧‧鰭片 94‧‧‧Fins
941‧‧‧貫孔 941‧‧‧through hole
942‧‧‧容置空間 942‧‧‧ accommodating space
95‧‧‧電路板 95‧‧‧ boards
99‧‧‧電子晶片 99‧‧‧electronic chip
Claims (14)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104212400U TWM516826U (en) | 2015-07-31 | 2015-07-31 | Heat dissipation module buckling device and heat dissipation module having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104212400U TWM516826U (en) | 2015-07-31 | 2015-07-31 | Heat dissipation module buckling device and heat dissipation module having the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM516826U true TWM516826U (en) | 2016-02-01 |
Family
ID=55810979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104212400U TWM516826U (en) | 2015-07-31 | 2015-07-31 | Heat dissipation module buckling device and heat dissipation module having the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM516826U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111029317A (en) * | 2019-11-21 | 2020-04-17 | 深圳兴奇宏科技有限公司 | Water cooling head fastener structure |
| TWI729582B (en) * | 2019-11-21 | 2021-06-01 | 大陸商深圳興奇宏科技有限公司 | Water cooling head buckle structure |
-
2015
- 2015-07-31 TW TW104212400U patent/TWM516826U/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111029317A (en) * | 2019-11-21 | 2020-04-17 | 深圳兴奇宏科技有限公司 | Water cooling head fastener structure |
| TWI729582B (en) * | 2019-11-21 | 2021-06-01 | 大陸商深圳興奇宏科技有限公司 | Water cooling head buckle structure |
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| MM4K | Annulment or lapse of a utility model due to non-payment of fees |