TWM516815U - Cooling pressing machine with uniform cooling effect - Google Patents
Cooling pressing machine with uniform cooling effect Download PDFInfo
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- TWM516815U TWM516815U TW104212855U TW104212855U TWM516815U TW M516815 U TWM516815 U TW M516815U TW 104212855 U TW104212855 U TW 104212855U TW 104212855 U TW104212855 U TW 104212855U TW M516815 U TWM516815 U TW M516815U
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Description
本新型涉及一種冷卻壓合機,尤指一種具均勻冷卻效果的冷卻壓合機。 The invention relates to a cooling press machine, in particular to a cooling press machine with uniform cooling effect.
一般的印刷電路板(Print Circuit Board;PCB)是依電路設計將電路零件佈線製成的圖形,以表面處理及機械加工等方式製成的電路板,常使用於數位相機、筆記型電腦或其他3C產品,現有的印刷電路板以玻纖布為基材,且該基材表面再疊合有至少一張由玻璃纖維布及銅箔所製成的多層板,在量產製程中會一次堆疊多層,在量產製程中一次堆疊多層經過高溫壓合製程後,因銅箔與玻纖布之熱膨脹及冷卻收縮率不同,使得該多層板之間為非均勻收縮,使各相結合的多層板產生翹曲的現象,進而影響印刷電路板的良率,因此,需仰賴一如圖6所示的冷卻壓合機90將多層板印刷電路板進行冷卻及壓平的動作。 A general printed circuit board (PCB) is a circuit board that is formed by circuit designing circuit parts, and is formed by surface processing and machining, and is often used in digital cameras, notebook computers, or the like. 3C products, the existing printed circuit board is made of glass fiber cloth, and the surface of the substrate is further laminated with at least one multi-layer board made of glass fiber cloth and copper foil, which is stacked once in the mass production process. Multi-layer, after stacking multiple layers in a mass production process, after high-temperature pressing process, the thermal expansion and cooling shrinkage of the copper foil and the fiberglass cloth are different, so that the multi-layer boards are non-uniformly contracted, so that the combined multi-layer boards The phenomenon of warpage is generated, which in turn affects the yield of the printed circuit board. Therefore, it is necessary to cool and flatten the multilayer printed circuit board by a cooling presser 90 as shown in FIG.
如圖6與圖7所示,現有冷卻壓合機90包括一架體91、一壓缸92、一固定冷卻壓板93、複數個活動冷卻壓板94以及一水冷單元95,該壓缸92固接於該架體91並設有一可相對該架體91升降的活塞桿920,且該活塞桿920向上設置,該固定冷卻壓板93水平固接於該架體91的頂部,該複數個活動冷卻壓板94與該架體91相連結且位於該固定冷卻壓板93下方,且最下方的活動冷卻壓板94與該壓缸92的活塞桿920相互抵靠,使得各活動冷卻壓板94可透過該活塞桿920的作動而相對該固定冷卻壓板93升降,其中,各冷卻壓板93、94內均設有一冷卻流道(圖未示),各冷卻壓板93、94的冷卻水道分別設有一入水口931、941以及一出水口932、942,各入水口931、941與相對應的出水口932、942相 連通,該水冷單元95固接於該架體91上且包括一入水主管951以及一出水主管952,該入水主管951透過複數個進水副管953與各冷卻壓板93、94的入水口931、941相連通,該出水主管952透過複數個出水副管954與各冷卻壓板93、94的出水口932、942相連通。 As shown in FIG. 6 and FIG. 7, the conventional cooling and pressing machine 90 includes a frame body 91, a pressure cylinder 92, a fixed cooling platen 93, a plurality of movable cooling platens 94, and a water cooling unit 95. The cylinders 92 are fixed. The frame body 91 is provided with a piston rod 920 movable up and down relative to the frame body 91, and the piston rod 920 is disposed upwardly. The fixed cooling platen 93 is horizontally fixed to the top of the frame body 91. The plurality of movable cooling platens are disposed. 94 is coupled to the frame body 91 and located below the fixed cooling platen 93, and the lowermost movable cooling platen 94 and the piston rod 920 of the pressure cylinder 92 abut each other, such that each movable cooling platen 94 can pass through the piston rod 920. The cooling platen 93 is provided with a cooling flow path (not shown), and the cooling water channels of each of the cooling platens 93 and 94 are respectively provided with a water inlet 931, 941 and a water outlet 932, 942, each water inlet 931, 941 and the corresponding water outlet 932, 942 In connection, the water cooling unit 95 is fixed to the frame body 91 and includes a water inlet main pipe 951 and a water discharge main pipe 952. The water inlet main pipe 951 passes through a plurality of water inlet auxiliary pipes 953 and water inlets 931 of the cooling platens 93 and 94, The 941 is in communication, and the outlet main pipe 952 communicates with the water outlets 932 and 942 of the respective cooling plates 93 and 94 through a plurality of outlet water pipes 954.
該冷卻壓合機90將複數個多層印刷電路板96加壓冷卻的過程係如圖6與圖7所示,先將複數個多層印刷電路板96多層疊合並置於各上、下間隔的冷卻壓板93、94之間,啟動該壓缸92藉由該複數個活動冷卻壓板94對該複數個多層印刷電路板96加壓,並由該入水主管951輸入一低溫冷卻液,便於加速該複數個多層印刷電路板96的降溫速度並防止其變形,即各多層印刷電路板96的熱能透過熱傳導的方式由各冷卻壓板93、94傳出,然而,各多層印刷電路板96的周緣直接暴露於外部空氣中,故各多層印刷電路板96周緣的熱量可藉由熱對流的方式快速的散熱至周圍的空氣中,使得各多層印刷電路板96的周緣區域的溫度較其中心區域的溫度為低,導致各多層印刷電路板96因區域溫差的不同,而容易造成各多層印刷電路板96的各區域具有不平均的收縮現象,若各多層印刷電路板96於製造時均切割為一矩形,則各多層印刷電路板96在因周緣區域及中心區域的溫差,造成各多層印刷電路板96的周緣區域與中心區域產生不平均的冷卻收縮現象,進而產生會如圖8所示形成兩梯形組合狀(梯形漸縮現象),導致各多層印刷電路板96變形產生大量不良品而報廢,尤其目前電路板要求越來越精細,電路線寬、線距及尺寸之脹縮要求電路板越來越薄,故現有的冷卻壓合機90誠有改良之必要。 The process of pressurizing and cooling a plurality of multilayer printed circuit boards 96 by the cooling and pressing machine 90 is as shown in FIG. 6 and FIG. 7. First, a plurality of multilayer printed circuit boards 96 are stacked and placed in each of the upper and lower spaces for cooling. Between the pressure plates 93, 94, the pressure cylinder 92 is activated to pressurize the plurality of multilayer printed circuit boards 96 by the plurality of movable cooling platens 94, and a low temperature coolant is input from the water inlet main pipe 951 to facilitate the acceleration of the plurality of The temperature drop rate of the multilayer printed circuit board 96 is prevented from being deformed, that is, the heat energy of each of the multilayer printed circuit boards 96 is transmitted from the respective cooling platens 93, 94 by heat conduction, however, the periphery of each of the multilayer printed circuit boards 96 is directly exposed to the outside. In the air, the heat of the periphery of each of the multilayer printed circuit boards 96 can be quickly dissipated into the surrounding air by means of thermal convection, so that the temperature of the peripheral region of each of the multilayer printed circuit boards 96 is lower than the temperature of the central portion thereof. As a result of the difference in temperature of the regions of the multilayer printed circuit board 96, it is easy to cause uneven shrinkage in each region of each of the multilayer printed circuit boards 96, if each of the multilayer printed circuit boards 96 is When the manufacturing time is cut into a rectangle, the temperature difference between the peripheral printed circuit board 96 and the central region of the multilayer printed circuit board 96 causes uneven cooling and shrinkage of the peripheral region and the central region of each of the multilayer printed circuit boards 96, thereby generating a phenomenon such as Figure 8 shows the formation of two trapezoidal combinations (trapezoidal tapering phenomenon), resulting in deformation of each multilayer printed circuit board 96 to produce a large number of defective products and scrapped, especially the current circuit board requirements are more and more fine, circuit line width, line spacing and size The expansion and contraction requires the board to become thinner and thinner, so the existing cooling and pressing machine 90 is indispensable for improvement.
為解決現有的冷卻壓合機在冷卻過程中,因各多層印刷電路板的中心區域與周緣區域的降溫速度差距,造成其周緣區域的收縮幅大於中心區 域的收縮幅度,導致多層印刷電路板變形而需報廢的缺失,本新型的主要目的在於提供一種具均勻冷卻效果的冷卻壓合機,本新型主要在該架體的環側面外部設置複數個加熱單元,並讓各加熱單元上的各加熱件之熱氣方向朝向各容置室,以控制各多層印刷電路板周緣溫度,使其周緣區域與中心區域能夠同步均衡的降溫,讓各多層印刷電路板整體能均勻地收縮,而維持最佳形狀,藉以提升各多層印刷電路板在冷卻壓合製程後的良率。 In order to solve the difference in the cooling speed between the central region and the peripheral region of each multilayer printed circuit board during the cooling process of the existing cooling press, the shrinkage width of the peripheral region is greater than the central region. The shrinkage of the domain causes the multilayer printed circuit board to be deformed and needs to be scrapped. The main purpose of the present invention is to provide a cooling and pressing machine with uniform cooling effect. The present invention mainly provides a plurality of heating outside the ring side of the frame body. Units, and let the hot gas direction of each heating element on each heating unit face each accommodating chamber to control the peripheral temperature of each multilayer printed circuit board, so that the peripheral area and the central area can be cooled synchronously and evenly, so that each multilayer printed circuit board The overall shrinkage is uniform, while maintaining the optimum shape, thereby improving the yield of each multilayer printed circuit board after the cooling and pressing process.
本新型解決先前技術問題所提出的具均勻冷卻效果的冷卻壓合機,其包括:一機體,該機體包括一架體、至少一驅動裝置、複數個冷卻壓板以及一水冷單元,該至少一驅動裝置固接於該架體,該複數個冷卻壓板上、下間隔地與該架體相結合,至少一冷卻壓板與該架體相固接,其餘的至少一冷卻壓板與該至少一驅動裝置相結合,各冷卻壓板內部均設有一冷卻流道,且兩上、下間隔的冷卻壓板之間形成一容置室,該水冷單元與該架體相固接且包括一進水主管以及一出水主管,該進水主管與該出水主管均與各冷卻壓板的冷卻流道相連通;以及複數個加熱單元,該複數個加熱單元環繞位於該機體之架體的環周面外部,各加熱單元包括一支撐座以及複數個加熱件,該複數個支撐座分別環繞位於該機體之架體的環周面外部,該複數個加熱件固接於各支撐座的內側面並設有一朝向一相對應容置室的熱出口。 The cooling press machine with uniform cooling effect proposed by the prior art includes: a body comprising a frame body, at least one driving device, a plurality of cooling platens and a water cooling unit, the at least one driving The device is fixed to the frame body, and the plurality of cooling platens are combined with the frame body at intervals, at least one cooling platen is fixed to the frame body, and the remaining at least one cooling platen is coupled to the at least one driving device. In combination, a cooling flow channel is disposed inside each of the cooling platens, and an accommodation chamber is formed between the two upper and lower spaced cooling platens. The water cooling unit is fixed to the frame body and includes a water inlet main pipe and a water discharge main pipe. The water inlet main pipe and the water discharge main pipe are both connected to the cooling flow passages of the cooling platens; and a plurality of heating units surrounding the outer circumferential surface of the frame body of the machine body, each heating unit includes a heating unit a support base and a plurality of heating elements, the plurality of support seats respectively surrounding the outer circumferential surface of the frame body of the body, the plurality of heating elements being fixed in the support seats And a surface facing the outlet is provided with a heat corresponding accommodating chamber.
前述的具均勻冷卻效果的冷卻壓合機,其中該複數個冷卻壓板包含一固定冷卻壓板以及複數個活動冷卻壓板,該固定冷卻壓板固接於該架體頂部,該複數個活動冷卻壓板位於該固定冷卻壓板下方,且最下方的活動冷卻壓板與該至少一驅動裝置相互連結。 The above-mentioned cooling and pressing machine with uniform cooling effect, wherein the plurality of cooling platens comprise a fixed cooling platen and a plurality of movable cooling platens fixed to the top of the frame body, wherein the plurality of movable cooling platens are located at the A cooling cooling platen is fixed below, and a lowermost movable cooling platen is coupled to the at least one driving device.
前述的具均勻冷卻效果的冷卻壓合機,其中各加熱單元上的各加熱件為上、下間隔設置並分別對應不同高度的容置室。 In the above-mentioned cooling and pressing machine with uniform cooling effect, each heating element on each heating unit is disposed at an interval of upper and lower intervals and respectively corresponding to the accommodation chambers of different heights.
前述的具均勻冷卻效果的冷卻壓合機,其中該至少一驅動裝置包含複數個上壓缸以及複數個下壓缸,該複數個冷卻壓板包含兩固定冷卻壓板以及兩活動冷卻壓板,該兩固定冷卻壓板係上、下間隔設置,其中一活動冷卻壓板位於上方的固定冷卻壓板上方,另一活動冷卻壓板位於上方的固定冷卻壓板與下方的固定冷卻壓板之間,且上方的活動冷卻壓板與該複數個上壓缸相連結,下方的活動冷卻壓板與該複數個下壓缸相連結。 The above-mentioned cooling press with uniform cooling effect, wherein the at least one driving device comprises a plurality of upper pressing cylinders and a plurality of lower pressing cylinders, the plurality of cooling pressing plates comprising two fixed cooling pressing plates and two movable cooling pressing plates, the two fixings The cooling platen is arranged at an upper and lower interval, wherein a movable cooling platen is located above the upper fixed cooling platen, and another movable cooling platen is located between the upper fixed cooling platen and the lower fixed cooling platen, and the upper movable cooling platen and the upper A plurality of upper pressure cylinders are coupled, and a lower movable cooling pressure plate is coupled to the plurality of lower pressure cylinders.
前述的具均勻冷卻效果的冷卻壓合機,其中該兩固定冷卻壓板與兩相對應的活動冷卻壓板之間分別形成一上容置室以及一下容置室,且各支撐座上設有至少三個與該上容置室相對應的加熱件,且各支撐座上另設有至少三個與該下容置室相對應的加熱件。 The above-mentioned cooling and pressing machine with a uniform cooling effect, wherein an upper receiving chamber and a lower receiving chamber are respectively formed between the two fixed cooling pressing plates and the corresponding movable cooling pressing plates, and each supporting seat is provided with at least three And a heating member corresponding to the upper accommodating chamber, and each supporting seat is further provided with at least three heating members corresponding to the lower accommodating chamber.
前述的具均勻冷卻效果的冷卻壓合機,其中該至少一驅動裝置係一壓缸。 The aforementioned cooling press with uniform cooling effect, wherein the at least one driving device is a pressure cylinder.
前述的具均勻冷卻效果的冷卻壓合機,其中各加熱件係一熱風機。 The aforementioned cooling press with uniform cooling effect, wherein each heating member is a hot air blower.
前述的具均勻冷卻效果的冷卻壓合機,其中各加熱件係一鹵素燈。 The aforementioned cooling press with uniform cooling effect, wherein each heating member is a halogen lamp.
本新型的技術手段可獲得的功效增進及優點為:本新型藉由在該架體的環周面架設複數個加熱單元,讓各加熱單元上的各加熱件之加熱口朝向相對應的容置室,即讓各加熱件對各多層印刷電路板的周緣加溫,使各多層印刷電路板中心區域與周緣區域能均衡的降溫,則各多層印刷電路板整體均勻的冷卻降溫,而能維持其最後的形狀,達到提升各多層印刷電路板良率的效果。 The utility model has the advantages of enhanced efficiency and advantages: the present invention allows a plurality of heating units to be arranged on the circumferential surface of the frame body, so that the heating ports of the heating elements on the heating units are oriented toward corresponding ones. Room, that is, letting each heating element warm the periphery of each multilayer printed circuit board, so that the central area and the peripheral area of each multilayer printed circuit board can be cooled uniformly, the entire multilayer printed circuit board can be uniformly cooled and cooled, and the temperature can be maintained. The final shape achieves the effect of increasing the yield of each multilayer printed circuit board.
10‧‧‧機體 10‧‧‧ body
11‧‧‧架體 11‧‧‧ ‧ frame
12、12A‧‧‧驅動裝置 12, 12A‧‧‧ drive
120‧‧‧移動桿 120‧‧‧moving rod
121A‧‧‧上壓缸 121A‧‧‧Upper cylinder
122A‧‧‧下壓缸 122A‧‧‧lower cylinder
13、13A‧‧‧冷卻壓板 13, 13A‧‧‧Cooling plate
131、131A‧‧‧固定冷卻壓板 131, 131A‧‧‧Fixed cooling plate
132、132A‧‧‧活動冷卻壓板 132, 132A‧‧‧ activities cooling plate
133‧‧‧冷卻流道 133‧‧‧Cooling runner
134‧‧‧溫度感應探針 134‧‧‧Temperature sensing probe
135‧‧‧入水口 135‧‧ ‧ water inlet
136‧‧‧出水口 136‧‧‧Water outlet
14‧‧‧水冷單元 14‧‧‧Water cooling unit
141‧‧‧進水主管 141‧‧‧Water Intake Supervisor
142‧‧‧進水副管 142‧‧‧Water inlet pipe
143‧‧‧出水主管 143‧‧‧Water Director
144‧‧‧出水副管 144‧‧‧Water discharge pipe
15‧‧‧容置室 15‧‧‧ housing room
151A‧‧‧上容置室 151A‧‧‧上容室
152A‧‧‧下容置室 152A‧‧‧下容室
20‧‧‧加熱單元 20‧‧‧heating unit
21、21A‧‧‧支撐座 21, 21A‧‧‧ support
22、22A‧‧‧加熱件 22, 22A‧‧‧heating parts
220‧‧‧熱出口 220‧‧‧Hot export
30‧‧‧印刷電路板 30‧‧‧Printed circuit board
90‧‧‧冷卻壓合機 90‧‧‧Cooling press
91‧‧‧架體 91‧‧‧ ‧ frame
92‧‧‧壓缸 92‧‧‧pressure cylinder
920‧‧‧活塞桿 920‧‧‧ piston rod
93‧‧‧固定冷卻壓板 93‧‧‧Fixed cooling plate
931、941‧‧‧入水口 931, 941‧‧ ‧ water inlet
94‧‧‧活動冷卻壓板 94‧‧‧Active cooling platen
932、942‧‧‧出水口 932, 942‧‧ ‧ water outlet
95‧‧‧水冷單元 95‧‧‧Water cooling unit
951‧‧‧入水主管 951‧‧‧Water Director
952‧‧‧出水主管 952‧‧‧Water Director
953‧‧‧進水副管 953‧‧‧Water inlet pipe
954‧‧‧出水副管 954‧‧‧Water discharge pipe
96‧‧‧印刷電路板 96‧‧‧Printed circuit board
圖1係本新型第一較佳實施例的前視示意圖。 1 is a front elevational view of a first preferred embodiment of the present invention.
圖2係本新型第一較佳實施例的側視示意圖。 Figure 2 is a side elevational view of the first preferred embodiment of the present invention.
圖3係本新型第一較佳實施例的冷卻壓板的剖面示意圖。 Figure 3 is a cross-sectional view showing the cooling platen of the first preferred embodiment of the present invention.
圖4係本新型第二較佳實施例的前視示意圖。 Figure 4 is a front elevational view of a second preferred embodiment of the present invention.
圖5係本新型第二較佳實施例的側視示意圖。 Figure 5 is a side elevational view of a second preferred embodiment of the present invention.
圖6係現有冷卻壓合機的前視示意圖。 Figure 6 is a front elevational view of a prior art cooling press.
圖7係現有冷卻壓合機的側視示意圖。 Figure 7 is a side elevational view of a prior art cooling press.
圖8係現有多層印刷電路板因冷卻不平均收縮的俯視示意圖。 Fig. 8 is a top plan view showing the conventional multilayer printed circuit board which is unevenly shrunk due to cooling.
為能詳細瞭解本新型的技術特徵及實用功效,並可依照新型內容來實現,玆進一步以如圖式所示的較佳實施例,詳細說明如后:本新型所提供的具均勻冷卻效果的冷卻壓合機的第一較佳實施例係如圖1與圖2所示,該具均勻冷卻效果的冷卻壓合機包括一機體10以及複數個加熱單元20,其中:該機體10包括一架體11、至少一驅動裝置12、複數個冷卻壓板13以及一水冷單元14,該架體11係一矩形架體而具有四個側面,該至少一驅動裝置12固接於該架體11且設有一可相對架體11升降的移動桿120,該移動桿120向上設置,較佳的是,該驅動裝置12係一壓缸,該複數個冷卻壓板13上、下間隔地與該架體11相結合,較佳的是,該複數個冷卻壓板13包含一固定冷卻壓板131以及至少一活動冷卻壓板132,該固定冷卻壓板131水平固接於該架體11頂部,該複數個活動冷卻壓板132與該架體11相結合且位於該固定冷卻壓板131下 方,且最下方的活動冷卻壓板132與該驅動裝置12的移動桿120相互抵靠,使得各活動冷卻壓板132可相對該固定冷卻壓板131升降,且上、下間隔的冷卻壓板13之間形成一容置室15,請參看如圖3所示,各冷卻壓板13內部設有一冷卻流道133以及複數個溫度感應探針134,該冷卻流道133呈S字型的蜿蜒設計並設有一入水口135與一出水口136,該複數個溫度感應探針134水平間隔嵌設於各冷卻壓板13內部,且該複數個溫度感應探針134位於該冷卻流道133的蜿蜒段之間,使得該複數個溫度感應探針134能夠量測各冷卻壓板13不同區域的溫度。 In order to understand the technical features and practical effects of the present invention in detail, and in accordance with the novel content, the following further exemplifies the following: the present invention provides a uniform cooling effect. A first preferred embodiment of the cooling press is shown in FIG. 1 and FIG. 2. The cooling press having a uniform cooling effect includes a body 10 and a plurality of heating units 20, wherein: the body 10 includes a frame The body 11 , the at least one driving device 12 , the plurality of cooling platens 13 , and a water cooling unit 14 , the frame body 11 is a rectangular frame body having four sides, and the at least one driving device 12 is fixed to the frame body 11 and provided There is a moving rod 120 that can be raised and lowered relative to the frame body 11. The moving rod 120 is disposed upward. Preferably, the driving device 12 is a pressure cylinder, and the plurality of cooling platens 13 are spaced apart from the frame body 11 at intervals. Preferably, the plurality of cooling platens 13 include a fixed cooling platen 131 and at least one movable cooling platen 132. The fixed cooling platen 131 is horizontally fixed to the top of the frame body 11. The plurality of movable cooling platens 132 and The frame 11 Binding and is located under the stationary platen 131 is cooled The lowermost movable cooling platen 132 and the moving rod 120 of the driving device 12 abut each other, so that the movable cooling platens 132 can be lifted and lowered relative to the fixed cooling platen 131, and the upper and lower spaced cooling platens 13 are formed. As shown in FIG. 3, each of the cooling platens 13 is provided with a cooling flow path 133 and a plurality of temperature sensing probes 134. The cooling flow path 133 has an S-shaped design and is provided with a The water inlet 135 and the water outlet 136 are horizontally spaced apart from each other in the cooling plate 13 , and the plurality of temperature sensing probes 134 are located between the cooling channels 133 . The plurality of temperature sensing probes 134 are enabled to measure the temperature of different regions of each of the cooling platens 13.
該水冷單元14包括一進水主管141、複數個進水副管142、一出水主管143以及至少一出水副管144,該進水主管141與該架體11相固接,各進水副管142設有兩端,各進水副管142的其中一端與該進水主管141相連通,各進水副管142的另一端與各冷卻壓板13的入水口135相連通,該出水主管143與該架體11相固接,各出水副管144設有兩端,各出水副管144的其中一端與該出水主管143相連通,各出水副管144的另一端與各冷卻壓板13的出水口136相連通。 The water cooling unit 14 includes a water inlet main pipe 141, a plurality of water inlet auxiliary pipes 142, an water discharge main pipe 143, and at least one water discharge auxiliary pipe 144. The water inlet main pipe 141 is fixed to the frame body 11, and each water inlet pipe is connected. 142 is provided at two ends, one end of each water inlet auxiliary pipe 142 is in communication with the water inlet main pipe 141, and the other end of each water inlet auxiliary pipe 142 is connected with the water inlet 135 of each cooling platen 13, and the water discharge main pipe 143 and The frame body 11 is fixedly connected, and each of the water outlet sub-tubes 144 is provided with two ends, one end of each of the water outlet sub-pipes 144 is in communication with the water discharge main pipe 143, and the other end of each of the water outlet sub-pipes 144 and the water outlet of each of the cooling platens 13 136 is connected.
該複數個加熱單元20環繞位於該機體10之架體11的環周面外部,較佳的是,本新型設有四個加熱單元20,讓各加熱單元20分別位於該架體11的其中一側面的外側,各加熱單元20包括一支撐座21以及複數個加熱件22,該四個支撐座21的底部均固接於該機體10的架體11底部,該四個支撐座21分別對應設置於該架體11的四個側面外部,該複數個加熱件22上、下間隔地固接於各支撐座21的內側面並設有複數個熱出口220,各加熱單元20上的各加熱件22分別對應不同高度的容置室15,並讓各加熱件22的熱出口220均朝向高度相對應的容置室15,該加熱件22可為一熱風機、一電熱管、一紅外線燈管、一鹵素燈管或陶瓷加熱等等。 The plurality of heating units 20 surround the outer circumferential surface of the frame body 11 of the body 10. Preferably, the present invention is provided with four heating units 20, and the heating units 20 are respectively located in one of the frame bodies 11. On the outer side of the side, each heating unit 20 includes a support base 21 and a plurality of heating elements 22, and the bottoms of the four support bases 21 are fixed to the bottom of the frame body 11 of the body 10, and the four support bases 21 are respectively arranged correspondingly. Outside the four sides of the frame body 11, the plurality of heating elements 22 are fixedly spaced on the inner side of each support seat 21 at intervals and are provided with a plurality of heat outlets 220, and heating elements on each heating unit 20 22, respectively, corresponding to the accommodating chambers 15 of different heights, and the heat outlets 220 of the heating elements 22 are all oriented toward the corresponding accommodating chambers 15, which can be a hot air blower, an electric heat pipe, and an infrared light pipe. , a halogen tube or ceramic heating, etc.
如圖1至3所示,本新型操作使用時,將複數個多層印刷電路板30疊合後置放於各容置室15中,並啟動該驅動裝置12,該驅動裝置12的移動桿120帶動各活動冷卻壓132板向上移動並與該固定冷卻壓板131相貼靠而可壓縮各多層印刷電路板30,且於該主進水管141輸入一低溫的冷卻液,該冷卻液經由各副進水管142進入各冷卻壓板13內的冷卻流道133流動,該冷卻液再經由各副出水管144流動至該主出水管143內,則該冷卻液可將各多層印刷電路板30傳遞至各冷卻壓板13的熱量帶出,且各加熱單元20的加熱件22啟動,透過各加熱件22的熱出口220朝向相對應的容置室15,讓各加熱件22的熱量傳遞至各多層印刷電路板30的周緣,其中各加熱件22的設定溫度參照各溫度感應探針134所量測各冷卻壓板13內不同區域的溫度,使各多層印刷電路板30的中心區域與周緣區域能均衡的降溫,使得各多層印刷電路板30整體均勻的加壓冷卻,而能維持其最後的形狀。 As shown in FIG. 1 to FIG. 3, when the present invention is used, a plurality of multi-layer printed circuit boards 30 are stacked and placed in each of the accommodating chambers 15, and the driving device 12 is activated. The moving rod 120 of the driving device 12 is activated. The movable cooling pressure 132 plate is moved upward and abuts against the fixed cooling pressure plate 131 to compress the multilayer printed circuit board 30, and a low temperature coolant is input into the main water inlet pipe 141, and the coolant is fed through each auxiliary The water pipe 142 flows into the cooling flow passage 133 in each of the cooling platens 13, and the coolant flows into the main water outlet pipe 143 through the respective outlet pipes 144, and the coolant can transfer the respective multilayer printed circuit boards 30 to each cooling. The heat of the pressure plate 13 is taken out, and the heating elements 22 of the heating units 20 are activated, and the heat outlets 220 of the heating elements 22 are directed toward the corresponding accommodating chambers 15, so that the heat of the heating elements 22 is transferred to the respective multilayer printed circuit boards. The peripheral edge of 30, wherein the set temperature of each heating element 22 is measured by the temperature sensing probes 134 to measure the temperature of different regions in each cooling platen 13, so that the central region and the peripheral region of each multilayer printed circuit board 30 can be cooled uniformly. Make each Layer printed circuit board 30 overall uniformity of pressurized cooling, and can maintain its final shape.
如圖4與圖5所示的本新型第二較佳實施例,該實施例的結構設計大致與前述第一較佳實施例相同,本實施例的差異部分係在於:至少一驅動裝置12A包含複數個上壓缸121A以及複數個下壓缸122A,該複數個冷卻壓板13A包含兩固定冷卻壓板131A以及兩活動冷卻壓板132A,該兩固定冷卻壓板131A係上、下間隔設置,其中一活動冷卻壓板132A位於上方的固定冷卻壓板131A上方,另一活動冷卻壓板132A位於上方的固定冷卻壓板131A與下方的固定冷卻壓板131A之間。 As shown in FIG. 4 and FIG. 5, the structural design of the embodiment is substantially the same as that of the first preferred embodiment. The difference between the embodiment is that at least one driving device 12A includes a plurality of upper pressure cylinders 121A and a plurality of lower pressure cylinders 122A. The plurality of cooling pressure plates 13A include two fixed cooling pressure plates 131A and two movable cooling pressure plates 132A. The two fixed cooling pressure plates 131A are arranged at an upper and lower intervals, wherein one of the movable cooling plates is arranged. The platen 132A is located above the upper fixed cooling platen 131A, and the other movable cooling platen 132A is located between the upper fixed cooling platen 131A and the lower fixed cooling platen 131A.
該兩固定冷卻壓板131A與兩相對應的活動冷卻壓板132A之間分別形成一上容置室151A以及一下容置室152A,且上方的活動冷卻壓板132A與該複數個上壓缸121A的移動桿相固接,而可相對上方的固定冷卻壓板131A升降,且下方的活動冷卻壓板132A與該複數個下壓缸122A的移動桿相固接,而可相對下方的固定冷卻壓板131A升降,該架體11的每一側面的外部設有兩支撐 座21A,且各支撐座21A上設有至少三個與該上容置室151A相對的應加熱件22A,且各支撐座21A上另設有至少三個與該下容置室151A相對應的加熱件22A;該第二較佳實施例的操作方式大致與第一較佳實施例相同,其差別在於:因各支撐座21A上的至少三加熱件22A朝向該上容置室151A,且各支撐座21A上的另外至少三加熱件22A朝向該下容置室152A,因各支撐座21A上的加熱件22A數量增加,讓各容置室151A、152A內的各多層印刷電路板30周緣均勻的提升溫度,並同步保持與中心部及內部材料溫度相同,使得整個印刷電路板30能同步均勻降溫。 An upper receiving chamber 151A and a lower receiving chamber 152A are respectively formed between the two fixed cooling platens 131A and the corresponding movable cooling platens 132A, and the upper movable cooling platen 132A and the moving rods of the plurality of upper pressing cylinders 121A are respectively formed. The fixed cooling platen 131A can be lifted and lowered, and the lower movable cooling platen 132A is fixedly connected to the moving rods of the plurality of pressing cylinders 122A, and can be lifted and lowered relative to the lower fixed cooling platen 131A. Two supports on the outside of each side of the body 11 The seat 21A is provided with at least three heating elements 22A opposite to the upper receiving chamber 151A, and each supporting seat 21A is further provided with at least three corresponding to the lower receiving chamber 151A. The heating element 22A; the second preferred embodiment operates in substantially the same manner as the first preferred embodiment, with the difference that at least three heating elements 22A on each of the support seats 21A face the upper receiving chamber 151A, and each The other at least three heating members 22A on the support base 21A face the lower accommodating chamber 152A, and the number of the heating members 22A on each of the supporting seats 21A increases, so that the periphery of each of the multilayer printed circuit boards 30 in each of the accommodating chambers 151A, 152A is uniform. The temperature is raised and kept at the same temperature as the center portion and the internal material, so that the entire printed circuit board 30 can be uniformly cooled uniformly.
藉由上述的技術特徵,本新型主要利用各加熱件22、22A對各多層印刷電路板30的周緣加熱,使得各多層印刷電路板30中心區域的溫度與其周緣區域的溫度相同,則各多層印刷電路板30在冷卻壓合過程中,各多層印刷電路板30的中心與周緣能均勻冷卻,相較於現有冷卻壓合機90在對各多層印刷電路板96的冷卻壓合過程中,因各多層印刷電路板96的周緣區域與中心區域不均勻冷卻而產生不同脹縮及過度變形導致報廢,本新型明確而有效確保各多層印刷電路板30在冷卻的過程中能均勻有效的加壓冷卻,達到提升生產良率及減少報廢的效果。 With the above technical features, the present invention mainly uses the heating elements 22, 22A to heat the periphery of each of the multilayer printed circuit boards 30 such that the temperature of the central region of each of the multilayer printed circuit boards 30 is the same as the temperature of the peripheral region thereof, and the multilayer printing is performed. During the cooling and pressing process of the circuit board 30, the center and the periphery of each of the multilayer printed circuit boards 30 can be uniformly cooled, compared with the conventional cooling and pressing machine 90 in the process of cooling and pressing the respective multilayer printed circuit boards 96, The peripheral region and the central region of the multilayer printed circuit board 96 are unevenly cooled to produce different expansion and contraction and excessive deformation, resulting in scrapping. The present invention clearly and effectively ensures uniform and effective pressure cooling of each of the multilayer printed circuit boards 30 during cooling. Achieve increased production yield and reduced scrap.
10‧‧‧機體 10‧‧‧ body
11‧‧‧架體 11‧‧‧ ‧ frame
12‧‧‧驅動裝置 12‧‧‧ drive
120‧‧‧移動桿 120‧‧‧moving rod
13‧‧‧冷卻壓板 13‧‧‧Cooling platen
131‧‧‧固定冷卻壓板 131‧‧‧Fixed cooling platen
132‧‧‧活動冷卻壓板 132‧‧‧Active cooling platen
135‧‧‧入水口 135‧‧ ‧ water inlet
14‧‧‧水冷單元 14‧‧‧Water cooling unit
141‧‧‧進水主管 141‧‧‧Water Intake Supervisor
142‧‧‧進水副管 142‧‧‧Water inlet pipe
15‧‧‧容置室 15‧‧‧ housing room
20‧‧‧加熱單元 20‧‧‧heating unit
21‧‧‧支撐座 21‧‧‧ Support
22‧‧‧加熱件 22‧‧‧heating parts
220‧‧‧熱出口 220‧‧‧Hot export
30‧‧‧軟性印刷電路板 30‧‧‧Soft printed circuit board
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