TWM514181U - A flexible printed circuit board (FPC) and a touch device using the same - Google Patents

A flexible printed circuit board (FPC) and a touch device using the same Download PDF

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Publication number
TWM514181U
TWM514181U TW104214125U TW104214125U TWM514181U TW M514181 U TWM514181 U TW M514181U TW 104214125 U TW104214125 U TW 104214125U TW 104214125 U TW104214125 U TW 104214125U TW M514181 U TWM514181 U TW M514181U
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Taiwan
Prior art keywords
circuit board
alignment
panel
flexible circuit
line segments
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TW104214125U
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Chinese (zh)
Inventor
Zhi-Feng Wang
Shui-Hui Che
Hong-Hua Xie
jian-fei Sun
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Tpk Touch Solutions Xiamen Inc
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Publication of TWM514181U publication Critical patent/TWM514181U/en

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Abstract

The invention relates to a flexible printed circuit board (FPC) and a touch device using the same. The FPC has a mounting region, multiple golden fingers and at least two positioning labels are disposed in the mounting region, wherein each positioning label is inserted between the golden fingers. The FPC is correspondingly pressed on and electrically connected to a touch panel (TP) to form the touch device. Because the positioning label is formed on a relatively inner position of the mounting region, when using the positioning label to align the FPC with the TP, the accumulated deviation of position shift between the golden fingers and signal contacts of the TP will be reduced. Therefore, the positioning accuracy between the FPC and the TP is increased to ensure a good electrically connection therebetween.

Description

軟性電路板及其應用之觸控裝置Flexible circuit board and touch device thereof

本創作是有關於一種軟性電路板(FPC)及其應用之觸控裝置,尤其是有關於一種可以提升對位準確度的軟性電路板。This creation is about a flexible circuit board (FPC) and its application touch device, especially for a flexible circuit board that can improve the alignment accuracy.

請參考圖9所示,是一現有觸控面板之平面示意圖,該觸控面板包含一操作區101及環繞在操作區101外圍的一走線區102,其中,操作區101內部形成多數個感應電極,在該觸控面板一側的佈線區102內具有一接合區103,在接合區103內部設有多數個信號接點104及兩個面板對位靶標105,兩面板對位靶標105分別位在接合區103的相對兩側,各面板對位靶標105的形狀是L形。再請參考圖10,為用於連接該觸控面板的一軟性電路板(FPC),包含有一接合區201,接合區201內具有多數個金手指接點202及兩個電路板對位靶標203,兩個對位靶標203同樣分佈在接合區201的相對兩側。Please refer to FIG. 9 , which is a schematic plan view of a conventional touch panel. The touch panel includes an operation area 101 and a routing area 102 surrounding the operation area 101 . The electrode has a bonding area 103 in the wiring area 102 on one side of the touch panel. A plurality of signal contacts 104 and two panel alignment targets 105 are disposed inside the bonding area 103, and the two panel alignment targets 105 are respectively located. On the opposite sides of the land 103, the shape of each of the panel alignment targets 105 is L-shaped. Referring to FIG. 10, a flexible circuit board (FPC) for connecting the touch panel includes a bonding area 201. The bonding area 201 has a plurality of gold finger contacts 202 and two circuit board alignment targets 203. The two alignment targets 203 are also distributed on opposite sides of the junction area 201.

請參考圖11所示,當軟性電路板與該觸控面板對位連接時,多數個金手指接點202與信號接點104分別對應接觸,達成電性連接目的。在對位連接的過程中,可通過觀察面板對位靶標105及電路板對位靶標203的相對位置而判斷金手指接點202與信號接點104是否正確對應接觸,當面板對位靶標105及電路板對位靶標203的位置對應重疊時,即確定金手指接點202與信號接點104有對應接觸。當軟性電路板與該觸控面板對位連接時,先將兩側的面板對位靶標105、電路板對位靶標203對準,再進行熱壓合。但是軟性電路板在高溫高壓的作用下會產生延展現象而有微量形變,導致觸控面板上的信號接點104與軟性電 路板上的金手指接點203之間具有對位偏差。因為是利用面板對位靶標105、電路板對位靶標203作為對齊的參考基準,而面板對位靶標105、電路板對位靶標203的位置是位在最外側,所以偏差量會以遠離面板對位靶標105及電路板對位靶標203的方向(如箭號A1、A2所指示)逐漸累增,在接合區201的中段處將會是累積偏差最大的地方。Referring to FIG. 11 , when the flexible circuit board is aligned with the touch panel, a plurality of gold finger contacts 202 and the signal contacts 104 are respectively in contact with each other to achieve electrical connection. In the process of the alignment connection, the relative position of the target target 105 and the alignment target 203 of the circuit board can be observed to determine whether the golden finger contact 202 and the signal contact 104 are in proper contact with each other, and when the panel is aligned with the target 105 and When the positions of the board alignment targets 203 overlap, it is determined that the gold finger contacts 202 have corresponding contacts with the signal contacts 104. When the flexible circuit board is aligned with the touch panel, the panel alignment target 105 on both sides and the alignment target 203 of the circuit board are aligned first, and then thermocompression bonding is performed. However, under the action of high temperature and high pressure, the flexible circuit board will have an extension phenomenon and a slight deformation, resulting in the signal contact 104 and the soft electricity on the touch panel. There is a registration deviation between the gold finger contacts 203 on the board. Because the panel alignment target 105 and the board alignment target 203 are used as the reference reference for alignment, and the position of the panel alignment target 105 and the board alignment target 203 is located at the outermost side, the deviation amount is away from the panel pair. The direction of the target 105 and the board alignment target 203 (as indicated by arrows A1 and A2) gradually increases, and the middle portion of the junction 201 will be the place where the cumulative deviation is the greatest.

當觸控面板的尺寸加大、靈敏度要求提高或採用特定的感應電極形狀(例如採用單層無交錯式的感應電極排列),可能導致該觸控面板及軟性電路板的接合區變寬,以加大接合區的面積而容納更多的信號接點及金手指接點,所增加的數量可高達十倍以上。請參考圖12所示的軟性電路板,軟性電路板的接合區201寬度加大、面積增加,可看出在接合區201的內部設置極多的金手指接點202。如同前段所述,在壓合過程中,對位偏差量會以遠離電路板對位靶標203的方向(如箭號A1、A2所指示)逐漸累增,在接合區201的中段處將會是累積偏差最大的地方,圖12的軟性電路板因為接合區201大、金手指接點202多,所以累積偏差的問題將會變得更加嚴重。When the size of the touch panel is increased, the sensitivity requirement is increased, or a specific shape of the sensing electrode is used (for example, a single-layer non-interlaced sensing electrode arrangement), the bonding area of the touch panel and the flexible circuit board may be widened to Increasing the area of the junction area to accommodate more signal contacts and gold finger contacts can be increased by more than ten times. Referring to the flexible circuit board shown in FIG. 12, the width of the land 201 of the flexible circuit board is increased and the area is increased. It can be seen that a large number of gold finger contacts 202 are disposed inside the land 201. As described in the previous paragraph, during the nip process, the amount of alignment deviation will gradually increase in the direction away from the board target 203 (as indicated by arrows A1 and A2), and will be at the middle of the lands 201. Where the cumulative deviation is the largest, the flexible circuit board of Fig. 12 has a problem that the accumulated deviation is more serious because the joint area 201 is large and the golden finger joint 202 is large.

請參考圖13,顯示信號接點104與金手指接點202產生對位偏差的示意圖,即使最外側的信號接點104與金手指接點202正確對位,但隨著偏差位移的累積,在接合區中段處累積偏差最為嚴重,觸控面板上的信號接點104與軟性電路板上的金手指接點202幾乎錯位而缺乏電性連接或重疊面積過小,該觸控面板與軟性電路板之間恐無法正常傳遞訊號。Referring to FIG. 13, a schematic diagram showing the alignment deviation between the signal contact 104 and the golden finger contact 202 is shown. Even if the outermost signal contact 104 and the golden finger contact 202 are correctly aligned, as the deviation displacement is accumulated, The cumulative deviation at the middle of the junction area is the most serious. The signal contact 104 on the touch panel is almost misaligned with the golden finger contact 202 on the flexible circuit board, and the electrical connection or the overlapping area is too small. The touch panel and the flexible circuit board are I am afraid that the signal will not be transmitted properly.

本創作是提供一種軟性電路板,以減少金手指接點與一觸控面板對應壓合時之累積偏差量。The present invention provides a flexible circuit board to reduce the cumulative deviation of the gold finger contact and the touch panel corresponding to the pressing.

本創作之軟性電路板包含:一電路板接合區,設置於該軟性電路板的一接合邊緣; 多數個金手指接點,沿一第一方向平行排列並間隔地設置於該電路板接合區;及至少二個電路板對位靶標,沿該接合邊緣設置於該電路板接合區,並且分別穿插設置於相鄰的兩個該些金手指接點之間。The flexible circuit board of the present invention comprises: a circuit board bonding area disposed on a joint edge of the flexible circuit board; a plurality of gold finger contacts are arranged in parallel along a first direction and spaced apart from the board bonding area; and at least two circuit board alignment targets are disposed along the bonding edge of the board bonding area and interspersed respectively It is disposed between two adjacent gold finger joints.

由於電路板對位靶標的位置是位在接合區的內部,而不是在接合區的外側邊緣,當軟性電路板與一觸控面板相對壓合時,利用該電路板對位靶標與觸控面板上的面板對位靶標互相對齊,因此對位的偏差量從該電路板對位靶標的位置向兩側方向累積,對於位在最外側的金手指接點,其累積偏差量仍在可接受的範圍以內,各個金手指接點與觸控面板之間可以保有良好電性連接關係。Since the position of the alignment target of the circuit board is located inside the bonding area instead of the outer edge of the bonding area, when the flexible circuit board is pressed against a touch panel, the target and the touch panel are aligned by the circuit board. The upper panel alignment targets are aligned with each other, so the deviation of the alignment is accumulated from the position of the alignment target of the board to both sides. For the gold finger joint located at the outermost side, the cumulative deviation is still acceptable. Within the range, a good electrical connection relationship can be maintained between each gold finger contact and the touch panel.

10‧‧‧軟性電路板10‧‧‧Soft circuit board

11‧‧‧電路板接合區11‧‧‧Circuit board junction

12‧‧‧金手指接點12‧‧‧Gold Finger Contact

13‧‧‧電路板對位靶標13‧‧‧Board alignment target

131‧‧‧參考邊緣131‧‧‧ reference edge

132‧‧‧縱向線段132‧‧‧Longitudinal line segments

133‧‧‧橫向線段133‧‧‧Horizontal line segments

14‧‧‧接合邊緣14‧‧‧ joint edge

15‧‧‧區段Section 15‧‧‧

16‧‧‧缺口16‧‧‧ gap

20‧‧‧觸控面板20‧‧‧Touch panel

21‧‧‧面板接合區21‧‧‧ Panel junction area

22‧‧‧信號接點22‧‧‧Signal contacts

23‧‧‧面板對位靶標23‧‧‧ Panel alignment target

231‧‧‧開口231‧‧‧ openings

232‧‧‧縱向線段232‧‧‧Longitudinal line segments

101‧‧‧操作區101‧‧‧Operating area

102‧‧‧走線區102‧‧‧Drop area

103‧‧‧接合區103‧‧‧ junction area

104‧‧‧信號接點104‧‧‧Signal contacts

105‧‧‧面板對位靶標105‧‧‧ Panel alignment target

201‧‧‧接合區201‧‧‧ junction area

202‧‧‧金手指接點202‧‧‧Gold Finger Contact

203‧‧‧電路板對位靶標203‧‧‧Board alignment target

圖1A:本創作軟性電路板的第一實施例局部平面示意圖。FIG. 1A is a partial plan view showing a first embodiment of the present flexible circuit board.

圖1B:圖1A的局部放大圖。FIG. 1B is a partial enlarged view of FIG. 1A.

圖2:本創作軟性電路板的第二實施例局部平面示意圖。Figure 2 is a partial plan view showing a second embodiment of the present flexible circuit board.

圖3:本創作軟性電路板與觸控面板之壓合動作示意圖。Figure 3: Schematic diagram of the pressing action of the flexible circuit board and the touch panel.

圖4:本創作電路板對位靶標、面板對位靶標的對齊動作示意圖。Figure 4: Schematic diagram of the alignment action of the target board and the panel alignment target of the circuit board.

圖5A、5B:本創作電路板對位靶標的其它實施例平面圖。Figures 5A, 5B are plan views of other embodiments of the present application board alignment target.

圖6A、6B:本創作面板對位靶標的其它實施例平面圖。Figures 6A, 6B are plan views of other embodiments of the authoring panel alignment target.

圖7:圖5A的電路板對位靶標與圖6A的面板對位靶標的對齊示意圖。Figure 7 is a schematic illustration of the alignment of the board alignment target of Figure 5A with the panel alignment target of Figure 6A.

圖8:圖5B的電路板對位靶標與圖6B的面板對位靶標的對齊示意圖。Figure 8 is a schematic illustration of the alignment of the board alignment target of Figure 5B with the panel alignment target of Figure 6B.

圖9:現有觸控面板之平面示意圖。Figure 9: Schematic diagram of a conventional touch panel.

圖10:與觸控面板電性連接之軟性電路板之平面示意圖。FIG. 10 is a schematic plan view of a flexible circuit board electrically connected to a touch panel.

圖11:現有觸控面板與軟性電路板對應電性連接後之局部示意圖。FIG. 11 is a partial schematic view showing the electrical connection between the existing touch panel and the flexible circuit board.

圖12:現有另一軟性電路板之平面示意圖。Figure 12: Schematic diagram of another flexible circuit board.

圖13:觸控面板與軟性電路板上之間產生對位偏差之示意圖。Figure 13: Schematic diagram of the alignment deviation between the touch panel and the flexible circuit board.

參考圖1A、圖1B所示,其中圖1B是取自於圖1A的局部放大圖,本創作的軟性電路板10包含有一電路板接合區11、多數個金手指接點12及至少二個電路板對位靶標13,本實施例是以兩個電路板對位靶標13來舉例說明。其中,電路板接合區11設置於軟性電路板10的一接合邊緣14,並且金手指接點12沿一第一方向(如X軸方向)平行排列且間隔地設置於電路板接合區11,兩個電路板對位靶標13沿接合邊緣14設置於電路板接合區11,並且分別穿插設置於相鄰的兩個金手指接點12之間。其中金手指接點12一端會通過軟性電路板10的內部線路(圖未示)電性連接至一控制中心(圖未示),電路板對位靶標13僅起對位標識作用,不與控制中心電性連接。Referring to FIG. 1A and FIG. 1B, wherein FIG. 1B is a partial enlarged view of FIG. 1A, the flexible circuit board 10 of the present invention comprises a circuit board bonding area 11, a plurality of gold finger contacts 12 and at least two circuits. The board alignment target 13, this embodiment is exemplified by two circuit board alignment targets 13. The circuit board bonding area 11 is disposed on a bonding edge 14 of the flexible circuit board 10, and the gold finger contacts 12 are arranged in parallel along a first direction (such as the X-axis direction) and are spaced apart from the circuit board bonding area 11, two The board alignment targets 13 are disposed along the bonding edge 14 at the board bonding area 11 and are interposed between the adjacent two gold finger contacts 12, respectively. One end of the gold finger contact 12 is electrically connected to a control center (not shown) through an internal circuit (not shown) of the flexible circuit board 10. The alignment target 13 of the circuit board only functions as a registration mark, and is not controlled. The center is electrically connected.

如圖1B的局部放大圖所示,電路板對位靶標13的位置不是位於電路板接合區11內整體平行排列設置的金手指接點12的相對兩外側,而是向內側移動而穿插在金手指接點12之間,換言之,電路板對位靶標13的兩側皆與金手指接點12相鄰。電路板對位靶標13可以是與金手指接點12的材質相同,以金屬接點構成。As shown in a partially enlarged view of FIG. 1B, the position of the board alignment target 13 is not located on the opposite outer sides of the gold finger joint 12 which are arranged in parallel in the board joint region 11, but is moved inward and interspersed in gold. Between the finger contacts 12, in other words, both sides of the board alignment target 13 are adjacent to the gold finger contacts 12. The board alignment target 13 may be of the same material as the gold finger joint 12 and is formed of metal contacts.

在圖1所示的實施例中,若是以多數個金手指接點12平行延伸排列的總長度L為基準,本實施例的兩個電路板靶標13的較佳位置可以分別選擇設在四分之一總長度(1/4L)與四分之三總長度(3/4L)的位置。In the embodiment shown in FIG. 1, if the total length L of the plurality of gold finger contacts 12 is arranged in parallel, the preferred positions of the two board targets 13 of the present embodiment can be respectively set at four points. One of the total length (1/4L) and three-quarters of the total length (3/4L).

本創作將電路板對位靶標13的位置由外向內移動後,在軟性電路板10與一觸控面板相對壓合時,縱使軟性電路板10因熱壓產生微量延展形變,其偏差量也是從電路板對位靶標13的位置逐漸向兩側方向累積,以圖1A的實施例的其中一個電路板對位靶標13作為基準,位在接合區11最外側的金手指 接點12相距電路板對位靶標13的距離最遠,該距離值大約是金手指接點12沿第一方向排列之總長度四分之一(1/4L),因此可以理解最外側的金手指接點12在本實施例中具有最大的累積偏差量。但是相較於如圖12先前技術將電路板對位靶標203形成在接合區201的最外側,位在接合區201中間的金手指接點202會具有最大的累積偏差量,該金手指接點202相距該電路板對位靶標203的距離大約為二分之一總長度(1/2L),此距離值(1/2L)明顯大於本創作的距離值(1/4L),因此先前技術的金手指接點202所產生最大的累積偏差量會遠大於本創作的最大的累積偏差量。換言之,本創作中可降低金手指接點12的累積偏差量,提高軟性電路板10與觸控面板之間的對位準確率,維持金手指接點12與觸控面板之間的良好電性連接關係。In this creation, when the position of the alignment target 13 of the circuit board is moved from the outside to the inside, when the flexible circuit board 10 is pressed against the touch panel, even if the flexible circuit board 10 is slightly deformed by the hot pressing, the deviation amount is also The position of the board alignment target 13 gradually accumulates in both directions, with one of the board alignment targets 13 of the embodiment of FIG. 1A as a reference, and the gold finger located at the outermost side of the land 11 The contact 12 is farthest from the target 13 of the circuit board, and the distance value is about a quarter (1/4L) of the total length of the golden finger joint 12 arranged in the first direction, so that the outermost gold can be understood. The finger joint 12 has the largest cumulative deviation amount in this embodiment. However, compared to the prior art of FIG. 12, the board alignment target 203 is formed at the outermost side of the land 201, and the gold finger joint 202 located in the middle of the land 201 has the largest accumulated deviation amount, the gold finger joint The distance between the 202 and the target 203 of the board is about one-half of the total length (1/2 L), and the distance value (1/2 L) is significantly larger than the distance value of the creation (1/4 L), so the prior art The maximum cumulative deviation produced by the gold finger joint 202 will be much larger than the maximum cumulative deviation of the creation. In other words, in this creation, the cumulative deviation of the golden finger joint 12 can be reduced, the alignment accuracy between the flexible circuit board 10 and the touch panel can be improved, and the good electrical property between the golden finger contact 12 and the touch panel can be maintained. Connection relationship.

又請參考圖2所示,為軟性電路板10的另一實施例。本實施例的軟性電路板10的電路板接合區11進一步通過至少一缺口16而劃分為至少兩個並排的區段15,也就是如圖2所示的沿第一方向(X軸方向)排列的左右兩個區段15。對此,前述的兩個電路板對位靶標13則是分別設置在不同的兩個區段15,較佳是設置在各區段15的中間位置。Referring also to FIG. 2, another embodiment of the flexible circuit board 10 is shown. The board bonding area 11 of the flexible circuit board 10 of the present embodiment is further divided into at least two side by side sections 15 by at least one notch 16, that is, arranged in the first direction (X-axis direction) as shown in FIG. The left and right sections are 15. In this regard, the aforementioned two board alignment targets 13 are respectively disposed in two different sections 15, preferably disposed at intermediate positions of the sections 15.

更具體來講,缺口16是從軟性電路板10的接合邊緣14朝一垂直於第一方向的第二方向(Y軸方向)開設,以平行於金手指接點12,其中開設深度M以單一個金手指接點12長度的1至3倍為較佳。若考慮軟性電路板10的電路板接合區11長度因素,也可以設置多個缺口16以形成多數個並排的區段15,而各區段15中具有至少一個電路板對位靶標13。此實施例藉由缺口16的設置令軟性電路板10劃分為多個區段15後,每一個區段15的長度相對於軟性電路板10的電路板接合區11的總長度相對較小,因此在進行壓合作業時,每一個區段15的延展形變量也會相對變小,從而降低金手指接點12與觸控面板壓合時的累積偏差量。More specifically, the notch 16 is opened from the joint edge 14 of the flexible circuit board 10 toward a second direction (Y-axis direction) perpendicular to the first direction to be parallel to the gold finger joint 12, wherein the depth M is opened by a single one. It is preferred that the length of the gold finger joint 12 is 1 to 3 times. If a length factor of the board land 11 of the flexible circuit board 10 is considered, a plurality of notches 16 may be provided to form a plurality of side-by-side sections 15 having at least one board alignment target 13 in each section 15. In this embodiment, after the flexible circuit board 10 is divided into a plurality of segments 15 by the arrangement of the notches 16, the length of each of the segments 15 is relatively small with respect to the total length of the board land 11 of the flexible circuit board 10, thus When the press cooperative operation is performed, the extension shape variable of each segment 15 is also relatively small, thereby reducing the cumulative deviation amount when the golden finger joint 12 is pressed against the touch panel.

請參考圖3,當觸控面板20通過一導電膠(圖未示)與軟性電路板10貼合時,軟性電路板10的電路板接合區11可對應連接在觸控面板20上的一面板接合區21。面板接合區21包含多數個沿第一方向(X軸方向)設置的信號接點22及至少二個面板對位靶標23,其中信號接點22分別對應連接金手指接點12,而面板對位靶標23的位置則對齊電路板對位靶標13。配合圖4所示,電路板對位靶標13在本實施例中是一矩形標記。本實施例的電路板對位靶標13在對齊於接合邊緣14的一端是定義為一參考邊緣131,電路板對位靶標13的寬度大於單一個金手指接點12的寬度,例如是具有三個金手指接點12的寬度,使電路板對位靶標13與其鄰近的金手指接點12有明顯差異,以方便查看和對位。對應的面板對位靶標23可以是一矩形標記,在面板對位靶標23一端的內部形成一方形的開口231,開口231在垂直於第一方向的第二方向(Y軸方向)上具有一代表對位誤差範圍的長度D。Referring to FIG. 3 , when the touch panel 20 is attached to the flexible circuit board 10 through a conductive adhesive (not shown), the circuit board bonding area 11 of the flexible circuit board 10 can be correspondingly connected to a panel on the touch panel 20 . Junction area 21. The panel junction area 21 includes a plurality of signal contacts 22 disposed in the first direction (X-axis direction) and at least two panel alignment targets 23, wherein the signal contacts 22 respectively correspond to the gold finger contacts 12, and the panel alignment The position of the target 23 is aligned with the board alignment target 13. As shown in Fig. 4, the board alignment target 13 is a rectangular mark in this embodiment. The end of the circuit board alignment target 13 of the present embodiment aligned with the bonding edge 14 is defined as a reference edge 131. The width of the board alignment target 13 is greater than the width of a single gold finger contact 12, for example, three. The width of the gold finger joint 12 makes the board alignment target 13 significantly different from its adjacent gold finger contact 12 for easy viewing and alignment. The corresponding panel alignment target 23 may be a rectangular mark, and a square opening 231 is formed inside one end of the panel alignment target 23, and the opening 231 has a representative in a second direction (Y-axis direction) perpendicular to the first direction. The length D of the alignment error range.

電路板對位靶標13的寬度W1與面板對位靶標23的寬度W2相等(W1=W2),但面板對位靶標23的長度L2略大於電路板對位靶標13的長度L1(L2>L1)。當軟性電路板10貼合於觸控面板20時,將電路板對位靶標13與面板對位靶標23對齊,因為兩者的寬度相等W1=W2,若兩者在Y軸方向的邊緣對齊即可確定在X軸方向已正確對位;而Y軸方向的對位,可藉由電路板對位靶標13的參考邊緣131的位置而判斷,只要參考邊緣131是落在開口231的範圍之內,代表在Y軸方向也是正確對位。The width W1 of the board alignment target 13 is equal to the width W2 of the panel alignment target 23 (W1=W2), but the length L2 of the panel alignment target 23 is slightly larger than the length L1 of the board alignment target 13 (L2>L1). . When the flexible circuit board 10 is attached to the touch panel 20, the board alignment target 13 is aligned with the panel alignment target 23, because the widths of the two are equal to W1=W2, if the two are aligned at the edge of the Y-axis direction, It can be determined that the alignment is correctly aligned in the X-axis direction; and the alignment of the Y-axis direction can be judged by the position of the reference edge 131 of the board alignment target 13 as long as the reference edge 131 falls within the range of the opening 231 , representing the correct alignment in the Y-axis direction.

請參考圖5A、5B所示,為電路板對位靶標13的其它可行實施例,電路板對位靶標13由多數條平行排列的縱向線段132及至少一橫向線段133構成,在此以三條縱向線段132、一條橫向線段133為例說明,各縱向線段132的寬度可相當於單一個金手指接點12的寬度,橫向線段133與各條縱向線段132垂直相連,使電路板對位靶標13整體而言構成一柵狀標記。橫向線段133的位置不 限,可以是如圖5A所示連接每個縱向線段132的一端,或是如圖5B所示連接每個縱向線段132的中段處。將電路板對位靶標13設計為柵狀標記,可使軟性電路板10在與觸控面板20壓合的過程中,相鄰縱向線段132之間的間隙可允許異方性導電膠(ACF)填入,令電路板對位靶標13與其鄰近的金手指接點12具有均勻一致的受力。而橫向線段133連接各縱向線段132之後,可使得電路板對位靶標13成形為與周邊金手指接點12明顯不同的圖案,能提高電路板對位靶標13的識別度,有利於與金手指接點12區隔。Referring to FIGS. 5A and 5B, for other possible embodiments of the board alignment target 13, the board alignment target 13 is composed of a plurality of parallel longitudinal segments 132 and at least one transverse segment 133, in three longitudinal directions. The line segment 132 and a transverse line segment 133 are taken as an example. The width of each longitudinal line segment 132 may be equivalent to the width of a single gold finger joint 12, and the horizontal line segment 133 is perpendicularly connected to each longitudinal line segment 132 to make the circuit board alignment target 13 as a whole. In this case, a grid-like mark is formed. The position of the horizontal line segment 133 is not Alternatively, one end of each longitudinal line segment 132 may be connected as shown in FIG. 5A or at the middle portion of each longitudinal line segment 132 as shown in FIG. 5B. The circuit board alignment target 13 is designed as a grid mark, so that the gap between the adjacent longitudinal line segments 132 can allow the anisotropic conductive adhesive (ACF) during the pressing of the flexible circuit board 10 with the touch panel 20. Filling in, the board alignment target 13 has a uniform force with its adjacent gold finger joint 12. After the horizontal line segment 133 is connected to each of the longitudinal line segments 132, the circuit board alignment target 13 can be formed into a pattern different from the surrounding gold finger contact 12, which can improve the recognition degree of the circuit board alignment target 13 and is beneficial to the golden finger. The junction 12 is separated.

再參考圖6A、6B所示,在觸控面板20方面,面板對位靶標23可以是由多數條沿第一方向(X軸方向)平行排列的縱向線段232及兩條沿第二方向(Y軸方向)平行排列的橫向線段233構成,在此以三條縱向線段232配合二條橫向線段233舉例說明。各縱向線段232的寬度相當於單一個信號接點22的寬度,兩橫向線段233與各條縱向線段232垂直相連而圍成一開口231,其中一橫向線段233連接各縱向線段232的一端,另一橫向線段233連接各縱向線段232的中段位置,兩橫向線段233相距前述代表對位誤差範圍之長度D的距離。縱向線段232的長度可以等長,也可以不等長,例如圖6A的其中一縱向線段232較短而未通過開口231,圖6B的縱向線段232則通過開口231。整體而言,面板對位靶標23也是一柵狀標記,同樣有利於在壓合過程中達到受力均勻的作用。Referring to FIGS. 6A and 6B , in terms of the touch panel 20 , the panel alignment target 23 may be a longitudinal line segment 232 and two along a second direction (Y in a plurality of strips arranged in a first direction (X-axis direction). The axial direction is formed by parallel transverse line segments 233, here exemplified by three longitudinal line segments 232 with two transverse line segments 233. The width of each longitudinal segment 232 is equivalent to the width of a single signal contact 22, and the two transverse segments 233 are perpendicularly connected to the longitudinal segments 232 to define an opening 231. One transverse segment 233 is connected to one end of each longitudinal segment 232. A transverse line segment 233 connects the mid-segment positions of the longitudinal line segments 232, and the two transverse line segments 233 are spaced apart from the aforementioned length D representing the length of the alignment error range. The longitudinal segments 232 may be of equal length or may be of unequal length. For example, one of the longitudinal segments 232 of FIG. 6A is shorter and does not pass through the opening 231, and the longitudinal segment 232 of FIG. 6B passes through the opening 231. Overall, the panel alignment target 23 is also a grid-like mark, which is also advantageous for achieving a uniform force during the pressing process.

前述所介紹的不同實施例的電路板對位靶標13及面板對位靶標23皆可以互相搭配應用,例如圖7所示的對位示意圖,是將圖5A的電路板對位靶標13與圖6A的面板對位靶標23結合應用;圖8所示的對位示意圖,是將圖5B的電路板對位靶標13與圖6B的面板對位靶標23結合應用。The circuit board alignment target 13 and the panel alignment target 23 of the different embodiments described above can be used in combination with each other. For example, the alignment diagram shown in FIG. 7 is the alignment target 13 of the circuit board of FIG. 5A and FIG. 6A. The panel alignment target 23 is used in combination; the alignment diagram shown in FIG. 8 is to combine the board alignment target 13 of FIG. 5B with the panel alignment target 23 of FIG. 6B.

綜上所述,本創作將電路板對位靶標由原本的邊緣往內移動,令電路板對位靶標位在接合區的相對內側而穿插於金手指接點之間,並且在觸控面板方面,面板對位靶標也進行相對的設計,令面板對位靶標在接合區的相 對內側而穿插於信號接點之間。藉此減少軟性電路板與觸控面板兩者對應壓合時,金手指接點與信號接點之間的累積偏差量,提高對位的準確性,確保軟性電路板與觸控面板具有良好的電性連接關係。In summary, this creation moves the board alignment target from the original edge inward, so that the board alignment target is interposed between the gold finger contacts on the opposite inner side of the joint area, and in terms of the touch panel. The panel alignment target is also designed to make the phase of the panel alignment target in the junction area. Interspersed between the signal contacts for the inner side. Therefore, the cumulative deviation between the gold finger contact and the signal contact is reduced when the flexible circuit board and the touch panel are pressed together, the alignment accuracy is improved, and the flexible circuit board and the touch panel are ensured to have good performance. Electrical connection.

10‧‧‧軟性電路板10‧‧‧Soft circuit board

11‧‧‧電路板接合區11‧‧‧Circuit board junction

12‧‧‧金手指接點12‧‧‧Gold Finger Contact

13‧‧‧電路板對位靶標13‧‧‧Board alignment target

14‧‧‧接合邊緣14‧‧‧ joint edge

20‧‧‧觸控面板20‧‧‧Touch panel

21‧‧‧面板接合區21‧‧‧ Panel junction area

22‧‧‧信號接點22‧‧‧Signal contacts

23‧‧‧面板對位靶標23‧‧‧ Panel alignment target

Claims (15)

一種軟性電路板,包含: 一電路板接合區,設置於該軟性電路板的一接合邊緣; 多數個金手指接點,沿一第一方向平行排列並間隔地設置於該電路板接合區;及 至少二個電路板對位靶標,沿該接合邊緣設置於該電路板接合區,並且分別穿插設置於相鄰的兩個該些金手指接點之間。A flexible circuit board comprising: a circuit board bonding area disposed on a bonding edge of the flexible circuit board; a plurality of gold finger contacts arranged in parallel along a first direction and spaced apart from the board bonding area; and At least two circuit board alignment targets are disposed along the bonding edge of the circuit board bonding area, and are respectively interposed between two adjacent gold finger contacts. 如請求項1所述的軟性電路板,該些金手指接點平行排列延伸達一總長度,該至少二個電路板對位靶標分別設在該總長度的四分之一與四分之三處。The flexible circuit board of claim 1, wherein the gold finger contacts are arranged in parallel to extend a total length, and the at least two circuit board alignment targets are respectively set at one quarter and three quarters of the total length. At the office. 如請求項1所述的軟性電路板,其中該電路板接合區進一步通過至少一缺口而劃分為至少二個並排的區段,並且各該區段中具有至少一個該電路板對位靶標。The flexible circuit board of claim 1, wherein the board bonding area is further divided into at least two side-by-side sections by at least one notch, and each of the sections has at least one of the board alignment targets. 如請求項3所述的軟性電路板,其中該缺口是從該接合邊緣朝一垂直於該第一方向的第二方向開設,該缺口的開設深度為單一個該些金手指接點長度的1至3倍,並且該至少二個電路板對位靶標分別設在各該區段的中間位置。The flexible circuit board of claim 3, wherein the notch is opened from the bonding edge toward a second direction perpendicular to the first direction, the opening depth of the notch being a single one of the lengths of the gold finger contacts Three times, and the at least two circuit board alignment targets are respectively disposed at intermediate positions of the respective sections. 如請求項1所述的軟性電路板,其中各該電路板對位靶標是一矩形標記。The flexible circuit board of claim 1, wherein each of the circuit board alignment targets is a rectangular mark. 如請求項1所述的軟性電路板,其中各該電路板對位靶標是一柵狀標記。The flexible circuit board of claim 1, wherein each of the circuit board alignment targets is a grid mark. 如請求項6所述的軟性電路板,其中各該電路板對位靶標包含有複數條沿該第一方向平行排列的縱向線段及至少一橫向線段,並且該橫向線段垂直相連各該縱向線段。The flexible circuit board of claim 6, wherein each of the circuit board alignment targets comprises a plurality of longitudinal line segments and at least one transverse line segment arranged in parallel along the first direction, and the horizontal line segments are vertically connected to the longitudinal line segments. 如請求項7所述的軟性電路板,其中各該電路板對位靶標包含有三條縱向線段及一條橫向線段,該橫向線段連接各該縱向線段的一端,且各該縱向線段的寬度與單一個該些金手指接點的寬度相等。The flexible circuit board of claim 7, wherein each of the circuit board alignment targets comprises three longitudinal line segments and one transverse line segment, the transverse line segments connecting one end of each of the longitudinal line segments, and each of the longitudinal line segments has a width and a single one. The gold finger joints have the same width. 如請求項7所述的軟性電路板,各該電路板對位靶標包含有三條縱向線段及一條橫向線段,該橫向線段連接各該縱向線段的中段處,且各該縱向線段的寬度與單一個該些金手指接點的寬度相等。The flexible circuit board of claim 7, wherein each of the circuit board alignment targets includes three longitudinal line segments and a transverse line segment, wherein the horizontal line segment is connected to the middle portion of each of the longitudinal line segments, and the width of each of the longitudinal line segments is a single one. The gold finger joints have the same width. 一種觸控裝置,包含: 一如請求項1至9項中任一項所述的軟性電路板;及 一觸控面板,具有一面板接合區,並且包含設置於該面板接合區的多數個沿該第一方向平行排列且間隔設置的信號接點及至少二個面板對位靶標,其中該觸控面板通過一導電膠與該軟性電路板貼合,並且該些信號接點分別對應連接該些金手指接點,該至少二個面板對位靶標分別對齊該至少二個電路板對位靶標。A touch device comprising: the flexible circuit board according to any one of claims 1 to 9; and a touch panel having a panel joint region and including a plurality of edges disposed on the panel joint region The first direction is a parallel arrangement of the signal contacts and the at least two panel alignment targets, wherein the touch panel is adhered to the flexible circuit board by a conductive adhesive, and the signal contacts are respectively connected to the plurality of signal contacts. The gold finger contacts, the at least two panel alignment targets are respectively aligned with the at least two circuit board alignment targets. 如請求項10所述之觸控裝置,其中該面板對位靶標是一矩形標記且具有一開口,該面板對位靶標的寬度與該電路板對位靶標的寬度相等,該開口在一垂直於該第一方向的第二方向上具有一代表對位誤差範圍的長度。The touch device of claim 10, wherein the panel alignment target is a rectangular mark and has an opening, the width of the panel alignment target being equal to the width of the board alignment target, the opening being perpendicular to The second direction of the first direction has a length representing a range of alignment errors. 如請求項10所述之觸控裝置,該面板對位靶標是一柵狀標記且具有一開口,該面板對位靶標的寬度與該電路板對位靶標的寬度相等,該開口在一垂直於該第一方向的第二方向上具有一代表對位誤差範圍的長度。The touch device of claim 10, wherein the panel alignment target is a grid mark and has an opening, the width of the panel alignment target being equal to the width of the alignment target of the circuit board, the opening being perpendicular to The second direction of the first direction has a length representing a range of alignment errors. 如請求項11或12所述之觸控裝置,其中該電路板對位靶標在對齊於該接合邊緣的一端是定義為一參考邊緣,並且該參考邊緣在該軟性電路板貼合於該觸控面板時是位於該開口的範圍內。The touch device of claim 11 or 12, wherein the alignment target of the circuit board is defined as a reference edge at an end aligned with the joint edge, and the reference edge is attached to the touch on the flexible circuit board. The panel is located within the range of the opening. 如請求項12所述之觸控裝置,該面板對位靶標包含多數條沿該第一方向平行排列的縱向線段及兩條沿該第二方向平行排列且相交於該些縱向線段的橫向線段,其中該面板對位靶標的該兩條橫向線段相距該代表對位誤差範圍之長度的距離,並且其中一條該面板對位靶標的該橫向線段連接於該面板對位靶標的該些縱向線段的一端。The touch device of claim 12, wherein the panel alignment target comprises a plurality of longitudinal line segments arranged in parallel along the first direction and two transverse line segments arranged in parallel along the second direction and intersecting the longitudinal line segments, Wherein the two lateral line segments of the panel alignment target are separated from the length representing the length of the alignment error range, and wherein one of the lateral segments of the panel alignment target is connected to one end of the longitudinal segments of the panel alignment target . 如請求項14所述之觸控裝置,該面板對位靶標的各該縱向線段的寬度與單一個該信號接點的寬度相等。The touch device of claim 14, wherein the width of each of the longitudinal segments of the panel alignment target is equal to the width of a single one of the signal contacts.
TW104214125U 2015-07-02 2015-09-01 A flexible printed circuit board (FPC) and a touch device using the same TWM514181U (en)

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CN105516412B (en) * 2015-12-29 2018-03-27 广东欧珀移动通信有限公司 Flexible PCB and mobile terminal with double golden finger
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