TWM512292U - Lighting device - Google Patents
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- TWM512292U TWM512292U TW104209118U TW104209118U TWM512292U TW M512292 U TWM512292 U TW M512292U TW 104209118 U TW104209118 U TW 104209118U TW 104209118 U TW104209118 U TW 104209118U TW M512292 U TWM512292 U TW M512292U
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Description
本創作係有關一種照明裝置,特別係關於一種發光二極體照明裝置。The present invention relates to a lighting device, and more particularly to a lighting diode lighting device.
隨著科技的進步,對於生活品質的要求也越來越高,因此,對於水族燈的要求不只是營造出不同的景觀效果,更希望可透過燈光控制水生植物的生長。With the advancement of technology, the requirements for quality of life are getting higher and higher. Therefore, the requirements for aquarium lamps are not only to create different landscape effects, but also to control the growth of aquatic plants through lighting.
然而,一般水族燈僅能發射單一波長的光線。而這單一波長的光線可能適合某一水中生物的生長,但會影響其他生物生長的機會。此外,一般水族燈所搭配的光學元件,多為依賴機構設計或是膠合方式固定於本體,使用者若有不同使用需求,例如:需要不同光形的照明,抑或者水族燈之光學元件損壞時,因光學元件不可更換而需要購買具有不同光形的水族燈,造成不必要的浪費。However, a typical aquarium lamp can only emit light of a single wavelength. This single-wavelength light may be suitable for the growth of a living organism, but it will affect the chances of other organisms growing. In addition, the optical components of the general aquarium lamps are mostly fixed to the main body by means of mechanism design or gluing. If the user has different use requirements, for example, when different illuminations are required, or when the optical components of the aquarium lamp are damaged. Because the optical components are not replaceable, it is necessary to purchase an aquarium lamp with different light shapes, resulting in unnecessary waste.
本創作之主要目的係在於,可同時提供多波段的光線,且可根據不同的使用者需求,抑或者照明裝置之光學元件損壞時,使用者可自行更換光學元件,達到良好的光照功效。The main purpose of this creation is to provide multi-band light at the same time, and according to different user requirements, or when the optical components of the lighting device are damaged, the user can replace the optical component by himself to achieve good illumination effect.
為達上述目的,本創作係提供一種照明裝置,包含殼體、發 光模組以及光學元件。其中,殼體包含載座與穿孔,發光模組配置於載座,光學元件可更換地設置於穿孔。發光模組包含發光二極體組件與基板,基板包含發光區域,發光二極體組件配置於發光區域。發光二極體組件包含複數個白光發光二極體、複數個藍光發光二極體、複數個紅光發光二極體與複數個紫光發光二極體,藍光發光二極體的波長範圍為440nm~480nm,紅光發光二極體的波長範圍為620nm~690nm,紫光發光二極體的波長範圍為370nm~420nm。光學元件包含入光區域,發光區域相對入光區域,使發光二極體組件所發出之光線穿透光學元件。In order to achieve the above purpose, the present invention provides a lighting device comprising a casing and a hair Optical modules and optical components. The housing includes a carrier and a through hole, and the light emitting module is disposed on the carrier, and the optical component is replaceably disposed on the through hole. The light emitting module includes a light emitting diode assembly and a substrate, the substrate includes a light emitting region, and the light emitting diode assembly is disposed in the light emitting region. The light emitting diode assembly comprises a plurality of white light emitting diodes, a plurality of blue light emitting diodes, a plurality of red light emitting diodes and a plurality of violet light emitting diodes, and the blue light emitting diode has a wavelength range of 440 nm. At 480 nm, the red light emitting diode has a wavelength range of 620 nm to 690 nm, and the violet light emitting diode has a wavelength range of 370 nm to 420 nm. The optical component includes a light incident region, and the light emitting region is opposite to the light incident region, so that light emitted by the light emitting diode assembly penetrates the optical component.
於本創作之一實施例中,殼體更包含本體與蓋體,蓋體包含卡扣部與穿孔,本體包含卡合部,蓋體與本體藉由卡扣部與卡合部相互扣合而結合。In an embodiment of the present invention, the housing further includes a body and a cover, the cover includes a buckle portion and a through hole, and the body includes a locking portion, and the cover body and the body are engaged with each other by the buckle portion and the engaging portion. Combine.
於本創作之一實施例中,蓋體包含側面,側面凸設一組防滑紋。In an embodiment of the present invention, the cover body has a side surface, and a pair of anti-slip lines are protruded from the side surface.
於本創作之一實施例中,白光發光二極體、藍光發光二極體、紅光發光二極體與紫光發光二極體以環狀排列的方式配置於發光區域。In one embodiment of the present invention, the white light emitting diode, the blue light emitting diode, the red light emitting diode, and the violet light emitting diode are arranged in a ring-shaped arrangement in the light emitting region.
於本創作之一實施例中,發光二極體組件分成第一發光二極體陣列、第二發光二極體陣列與第三發光二極體陣列,第一發光二極體陣列包含白光發光二極體與部分藍光發光二極體,第二發光二極體陣列包含紅光發光二極體與紫光發光二極體,第三發光二極體陣列包含另一部分藍光發光二極體。In one embodiment of the present invention, the light emitting diode assembly is divided into a first light emitting diode array, a second light emitting diode array and a third light emitting diode array, and the first light emitting diode array comprises white light emitting light The polar body and part of the blue light emitting diode, the second light emitting diode array comprises a red light emitting diode and a violet light emitting diode, and the third light emitting diode array comprises another part of the blue light emitting diode.
於本創作之一實施例中,照明裝置更包含控制單元,用以控制第一發光二極體陣列、第二發光二極體陣列與第三發光二極體陣列的發 光狀態。In an embodiment of the present invention, the illumination device further includes a control unit for controlling the emission of the first LED array, the second LED array, and the third LED array. Light state.
於本創作之一實施例中,基板包含散熱區,用以連接第三發光二極體陣列。In an embodiment of the present invention, the substrate includes a heat dissipation region for connecting the third LED array.
於本創作之一實施例中,照明裝置更包含儲存單元,用以儲存第一發光二極體陣列、第二發光二極體陣列與第三發光二極體陣列的發光狀態。In an embodiment of the present invention, the illumination device further includes a storage unit for storing the illumination states of the first LED array, the second LED array, and the third LED array.
於本創作之一實施例中,殼體更包含底面,底面具有控制介面。In an embodiment of the present invention, the housing further includes a bottom surface having a control interface.
於本創作之一實施例中,控制介面包含開關觸控區、視覺觸控區、快速成長觸控區、緩慢成長觸控區、藍光觸控區、白光觸控區、紫光觸控區與記憶觸控區。In one embodiment of the present invention, the control interface includes a switch touch area, a visual touch area, a fast growing touch area, a slowly growing touch area, a blue touch area, a white light touch area, a violet touch area, and a memory. Touch area.
於本創作之一實施例中,光學元件係選自於透鏡、反光杯與擴散板所構成之群組。In one embodiment of the present invention, the optical component is selected from the group consisting of a lens, a reflector, and a diffuser.
於本創作之一實施例中,光學元件的材料係選自於聚碳酸酯(Polycarbonate,PC)、聚酸甲酯(Polymethylmethacrylate,PMMA)、聚醚酰亞胺(Polyetherimide,PEI)與環烯烴共聚物(Cyclo olefin coplymer,COC)所構成之群組。In one embodiment of the present invention, the material of the optical element is selected from the group consisting of polycarbonate (Polycarbonate, PC), polymethylmethacrylate (PMMA), polyetherimide (PEI), and cyclic olefin copolymerization. Group of Cyclo olefin coplymers (COCs).
於本創作之一實施例中,殼體更包含端緣部,光學元件包含固定部,端緣部承載固定部,用以將光學元件固設於穿孔。In an embodiment of the present invention, the housing further includes an end edge portion, and the optical component includes a fixing portion, and the end edge portion carries a fixing portion for fixing the optical component to the through hole.
於本創作之一實施例中,照明裝置更包含散熱模組,以將發光模組所產生的熱量導出。In an embodiment of the present invention, the illumination device further includes a heat dissipation module to derive heat generated by the illumination module.
於本創作之一實施例中,散熱模組係選自於風扇與散熱鰭片 所構成之群組。In one embodiment of the present invention, the heat dissipation module is selected from the group consisting of a fan and a heat sink fin The group formed.
於本創作之一實施例中,殼體包含多個散熱孔。In one embodiment of the present invention, the housing includes a plurality of louvers.
10‧‧‧照明裝置10‧‧‧Lighting device
20‧‧‧殼體20‧‧‧shell
21‧‧‧防滑紋21‧‧‧Slip lines
22‧‧‧載座22‧‧‧Hosting
23‧‧‧卡扣部23‧‧‧Snaps
24‧‧‧穿孔24‧‧‧Perforation
25‧‧‧側面25‧‧‧ side
26‧‧‧本體26‧‧‧Ontology
27‧‧‧卡合部27‧‧‧Clock Department
28‧‧‧蓋體28‧‧‧ Cover
29‧‧‧端緣部29‧‧‧End edge
30‧‧‧發光模組30‧‧‧Lighting module
32‧‧‧發光二極體組件32‧‧‧Lighting diode components
33‧‧‧白光發光二極體33‧‧‧White light emitting diode
34‧‧‧基板34‧‧‧Substrate
35‧‧‧藍光發光二極體35‧‧‧Blue Light Emitting Diode
36‧‧‧發光區域36‧‧‧Lighting area
37‧‧‧紅光發光二極體37‧‧‧Red light emitting diode
39‧‧‧紫光發光二極體39‧‧‧ violet light-emitting diode
40‧‧‧光學元件40‧‧‧Optical components
42‧‧‧入光區域42‧‧‧lighting area
44‧‧‧固定部44‧‧‧ Fixed Department
51‧‧‧第一發光二極體陣列51‧‧‧First LED array
52‧‧‧第二發光二極體陣列52‧‧‧Second light-emitting diode array
53‧‧‧第三發光二極體陣列53‧‧‧3rd LED array
62‧‧‧控制單元62‧‧‧Control unit
63‧‧‧電路板63‧‧‧ boards
64‧‧‧儲存單元64‧‧‧storage unit
66‧‧‧控制介面66‧‧‧Control interface
72‧‧‧底面72‧‧‧ bottom
81‧‧‧開關觸控區81‧‧‧Switch touch area
82‧‧‧視覺觸控區82‧‧‧Visual touch area
83‧‧‧快速成長觸控區83‧‧‧Rapid growth touch area
84‧‧‧緩慢成長觸控區84‧‧‧ Slowly growing touch area
85‧‧‧藍光觸控區85‧‧‧Blu-ray touch area
86‧‧‧白光觸控區86‧‧‧White light touch area
87‧‧‧紫光觸控區87‧‧‧ violet touch area
88‧‧‧記憶觸控區88‧‧‧Memory touch area
90‧‧‧散熱模組90‧‧‧ Thermal Module
91‧‧‧散熱孔91‧‧‧ vents
98‧‧‧風扇98‧‧‧fan
99‧‧‧散熱鰭片99‧‧‧Heat fins
H、F‧‧‧區域H, F‧‧‧ area
第1圖係為本創作第一實施例之照明裝置之立體結構示意圖。Fig. 1 is a schematic perspective view showing the illuminating device of the first embodiment of the present invention.
第2圖係為第1圖之AA剖面圖。Fig. 2 is a cross-sectional view taken along line AA of Fig. 1.
第3圖係為第1圖之發光模組的一實施例部分俯視放大圖。Fig. 3 is a partially enlarged plan view showing an embodiment of the light-emitting module of Fig. 1.
第4圖係為第1圖之發光模組的另一實施例部分俯視放大圖。Fig. 4 is a partially enlarged plan view showing another embodiment of the light-emitting module of Fig. 1.
第5圖係為第2圖之F區域放大示意圖。Fig. 5 is an enlarged schematic view of the F area of Fig. 2.
第6圖係為第2圖之H區域放大示意圖。Fig. 6 is an enlarged schematic view of the H region of Fig. 2.
第7圖係為第3圖之發光二極體組件的第一發光二極體陣列、第二發光二極體陣列與第三發光二極體陣列的等效電路示意圖。FIG. 7 is an equivalent circuit diagram of the first light emitting diode array, the second light emitting diode array, and the third light emitting diode array of the light emitting diode assembly of FIG.
第8圖係為第1圖之仰視圖。Figure 8 is a bottom view of Figure 1.
請參照「第1圖」、「第2圖」與「第3圖」,係分別為本創作第一實施例之照明裝置之立體結構示意圖、「第1圖」之AA剖面圖與「第1圖」之發光模組的一實施例部分俯視放大圖。照明裝置10包含殼體20、發光模組30以及光學元件40。其中,殼體20包含載座22與穿孔24,發光模組30配置於載座22上,光學元件40可更換地設置於穿孔24。發光模組30包含發光二極體組件32與基板34,基板34包含發光區域36,發光二極體組件32配置於發光區域36。發光二極體組件32包含複數個 白光發光二極體33、複數個藍光發光二極體35、複數個紅光發光二極體37與複數個紫光發光二極體39,藍光發光二極體35的波長範圍為440nm~480nm,紅光發光二極體37的波長範圍為620nm~690nm,紫光發光二極體39的波長範圍為370nm~420nm。光學元件40包含入光區域42,發光區域36相對入光區域42,使發光二極體組件32所發出之光線穿透光學元件40。其中,白光發光二極體33、藍光發光二極體35、紅光發光二極體37與紫光發光二極體39以環狀排列的方式配置於發光區域36。Please refer to "1", "2" and "3", which are schematic views of the three-dimensional structure of the illuminating device of the first embodiment of the present invention, and the AA cross-sectional view of "Fig. 1" and "1st" A portion of an embodiment of a lighting module of the drawings is a top plan view. The illumination device 10 includes a housing 20, a light emitting module 30, and an optical element 40. The housing 20 includes a carrier 22 and a through hole 24 . The light emitting module 30 is disposed on the carrier 22 , and the optical component 40 is replaceably disposed on the through hole 24 . The light-emitting module 30 includes a light-emitting diode assembly 32 and a substrate 34. The substrate 34 includes a light-emitting region 36, and the light-emitting diode assembly 32 is disposed in the light-emitting region 36. The light emitting diode assembly 32 includes a plurality of a white light emitting diode 33, a plurality of blue light emitting diodes 35, a plurality of red light emitting diodes 37 and a plurality of violet light emitting diodes 39, and the blue light emitting diode 35 has a wavelength range of 440 nm to 480 nm, red The wavelength range of the light-emitting diode 37 is 620 nm to 690 nm, and the wavelength range of the violet light-emitting diode 39 is 370 nm to 420 nm. The optical element 40 includes a light incident region 42 that opposes the light incident region 42 such that light emitted by the light emitting diode assembly 32 penetrates the optical element 40. The white light-emitting diode 33, the blue light-emitting diode 35, the red light-emitting diode 37, and the violet light-emitting diode 39 are arranged in a ring-shaped arrangement in the light-emitting region 36.
在本實施例中,白光發光二極體33的數量可為六個,藍光發光二極體35的數量可為二十個,紅光發光二極體37的數量可為二個,紫光發光二極體39的數量可為八個,但本實施例並非用以限縮本創作,可依據使用者需求進行調整。舉例而言,請參照「第4圖」,係為「第1圖」之發光模組的另一實施例部分俯視放大圖。白光發光二極體33的數量可為六個,藍光發光二極體35的數量可為二十個,紅光發光二極體37的數量可為四個,紫光發光二極體39的數量可為六個。In this embodiment, the number of white light emitting diodes 33 may be six, the number of blue light emitting diodes 35 may be twenty, and the number of red light emitting diodes 37 may be two, and the violet light emitting light is two. The number of the poles 39 can be eight, but this embodiment is not intended to limit the creation, and can be adjusted according to user requirements. For example, please refer to FIG. 4, which is a partial enlarged view of another embodiment of the light-emitting module of "FIG. 1". The number of the white light emitting diodes 33 may be six, the number of the blue light emitting diodes 35 may be twenty, the number of the red light emitting diodes 37 may be four, and the number of the violet light emitting diodes 39 may be For six.
請參照「第1圖」、「第2圖」與「第5圖」,「第5圖」係為「第2圖」之F區域放大示意圖。殼體20更包含本體26與蓋體28,蓋體28包含卡扣部23與穿孔24,本體26包含卡合部27,蓋體28與本體26藉由卡扣部23與卡合部27相互扣合而結合。因此,使用者可藉由分離本體26與蓋體28的方式更換符合其使用需求的光學元件40。此外,蓋體28包含側面25,側面25凸設一組防滑紋21,以利使用者分離第一殼體20與第二殼體30,更換光學元件40,以符合其照明需求。再者,請參照「第2圖」與「第6圖」,「第6圖」係為「第2圖」之H區域放大示意圖。殼體20 的蓋體28更可包含端緣部29,光學元件40包含固定部44,端緣部29承載固定部44,由於照明裝置10係用以往下方照射的裝置,因此藉由端緣部29與固定部44的設計,將光學元件40固設於穿孔24,但本實施例並非用以限縮本創作。Please refer to "1st", "2nd" and "5th", and "5th" is an enlarged view of the F area of "2nd". The housing 20 further includes a body 26 and a cover body 28. The cover body 28 includes a latching portion 23 and a through hole 24. The body 26 includes a latching portion 27. The cover body 28 and the body 26 are mutually coupled by the latching portion 23 and the engaging portion 27. Combine and combine. Therefore, the user can replace the optical element 40 that meets its use requirements by separating the body 26 from the cover 28. In addition, the cover body 28 includes a side surface 25, and a pair of anti-slip lines 21 are protruded from the side surface 25 to facilitate separation of the first housing 20 and the second housing 30 by the user, and the optical element 40 is replaced to meet the lighting requirements. In addition, please refer to "2nd drawing" and "6th drawing", and "6th drawing" is an enlarged view of the H area of "2nd drawing". Housing 20 The cover body 28 may further include an end edge portion 29, the optical element 40 includes a fixing portion 44, and the end edge portion 29 carries the fixing portion 44. Since the illumination device 10 is a device that is irradiated in the past, the edge portion 29 is fixed by the edge portion 29 The design of the portion 44 secures the optical element 40 to the perforations 24, but this embodiment is not intended to limit the creation.
光學元件40係選自於透鏡、反光杯與擴散板所構成之群組。光學元件40用以接收發光二極體組件32所發出之光線,並透過折射或反射方式將發光二極體組件32所發出之光線自照明裝置照射至使用者預計照明的範圍。若光學元件40為透鏡,其可為聚光型透鏡、散光型透鏡、防眩光透鏡以及特殊造型之透鏡。光學元件40的材料係選自於聚碳酸酯(Polycarbonate,PC)、聚酸甲酯(Polymethylmethacrylate,PMMA)、聚醚酰亞胺(Polyetherimide,PEI)與環烯烴共聚物(Cyclo olefin coplymer,COC)所構成之群組。在本實施例中,光學元件40可為聚光型透鏡,其材料為聚碳酸酯,但本實施例並非用以限縮本創作。The optical element 40 is selected from the group consisting of a lens, a reflector, and a diffuser. The optical component 40 is configured to receive the light emitted by the LED assembly 32 and illuminate or illuminate the light emitted by the LED assembly 32 from the illumination device to a range of illumination expected by the user. If the optical element 40 is a lens, it may be a concentrating lens, an astigmatic lens, an anti-glare lens, and a specially shaped lens. The material of the optical element 40 is selected from the group consisting of polycarbonate (Polycarbonate, PC), polymethylmethacrylate (PMMA), polyetherimide (PEI) and Cycloolefin coplymer (COC). The group formed. In the present embodiment, the optical element 40 may be a concentrating lens whose material is polycarbonate, but this embodiment is not intended to limit the creation.
請參照「第3圖」與「第7圖」,「第7圖」係為「第3圖」之發光二極體組件的第一發光二極體陣列、第二發光二極體陣列與第三發光二極體陣列的等效電路示意圖。發光二極體組件32分成第一發光二極體陣列51、第二發光二極體陣列52與第三發光二極體陣列53,第一發光二極體陣列51包含白光發光二極體33與部分藍光發光二極體35,第二發光二極體陣列52包含紅光發光二極體37與紫光發光二極體39,第三發光二極體陣列53包含另一部分藍光發光二極體35。Please refer to "Figure 3" and "Figure 7". "Figure 7" is the first LED array, the second LED array and the second LED array of the "Figure 3" An equivalent circuit diagram of a three-emitting diode array. The light emitting diode assembly 32 is divided into a first light emitting diode array 51, a second light emitting diode array 52 and a third light emitting diode array 53, and the first light emitting diode array 51 includes a white light emitting diode 33 and A portion of the blue light emitting diode 35, the second light emitting diode array 52 includes a red light emitting diode 37 and a violet light emitting diode 39, and the third light emitting diode array 53 includes another portion of the blue light emitting diode 35.
在本實施例中,第一發光二極體陣列51包含六個白光發光二極體33與四個藍光發光二極體35,第二發光二極體陣列52包含二個紅光發 光二極體37與八個紫光發光二極體39,第三發光二極體陣列53包含十六個藍光發光二極體35。其中,第一發光二極體陣列51所包含的白光發光二極體33與四個藍光發光二極體35二極體35係以串聯與並聯的方式連接,第二發光二極體陣列52所包含的二個紅光發光二極體37與八個紫光發光二極體39係以串聯與並聯的方式連接,第三發光二極體陣列53所包含的十六個藍光發光二極體35係以串聯與並聯的方式連接,但本實施例並非用以限縮本創作。In this embodiment, the first LED array 51 includes six white light emitting diodes 33 and four blue light emitting diodes 35, and the second light emitting diode array 52 includes two red light emitting elements. The photodiode 37 and the eight violet light emitting diodes 39, the third light emitting diode array 53 includes sixteen blue light emitting diodes 35. The white light emitting diode 33 and the four blue light emitting diodes 35 are connected in series and in parallel, and the second light emitting diode array 52 is connected to the first light emitting diode array 51. The two red light emitting diodes 37 and the eight violet light emitting diodes 39 are connected in series and in parallel, and the sixteen blue light emitting diodes 35 included in the third light emitting diode array 53 are connected. Connected in series and in parallel, but this embodiment is not intended to limit the creation.
此外,基板34更可包含散熱區(未繪示),用以連接第三發光二極體陣列53。由於第三發光二極體陣列53發光的同時產生熱量特別多,因此特別設計上述散熱機制,避免第三發光二極體陣列53的溫度過高而縮短其使用壽命。其中,散熱區的材料可為但不限於銅。In addition, the substrate 34 further includes a heat dissipation region (not shown) for connecting the third LED array 53. Since the third light-emitting diode array 53 generates a large amount of heat while emitting light, the heat dissipation mechanism is specifically designed to prevent the temperature of the third light-emitting diode array 53 from being excessively high and shortening the service life thereof. The material of the heat dissipation zone may be, but not limited to, copper.
請參照「第2圖」,照明裝置10更可包含控制單元62、電路板63與儲存單元64,控制單元62與儲存單元64配置於電路板63上,基板34連接電路板63,控制單元62用以控制第一發光二極體陣列51、第二發光二極體陣列52與第三發光二極體陣列53的發光狀態,儲存單元64用以儲存第一發光二極體陣列51、第二發光二極體陣列52與第三發光二極體陣列53的發光狀態。Referring to FIG. 2, the illumination device 10 further includes a control unit 62, a circuit board 63 and a storage unit 64. The control unit 62 and the storage unit 64 are disposed on the circuit board 63. The substrate 34 is connected to the circuit board 63. The control unit 62 The storage unit 64 is configured to store the first LED array 51 and the second LED array 51, the second LED array 52, and the third LED array 53. The light emitting state of the light emitting diode array 52 and the third light emitting diode array 53.
請參照「第2圖」與「第8圖」,「第8圖」係為「第1圖」之仰視圖。殼體20更可包含底面72,底面72具有控制介面66,控制介面66連接電路板63,用以驅動控制單元62與儲存單元64。因此,使用者可藉由控制介面66控制或儲存第一發光二極體陣列51、第二發光二極體陣列52與第三發光二極體陣列53的發光狀態。Please refer to "Figure 2" and "Figure 8". "Figure 8" is the bottom view of "Figure 1". The housing 20 further includes a bottom surface 72 having a control interface 66 that connects the circuit board 63 for driving the control unit 62 and the storage unit 64. Therefore, the user can control or store the illumination states of the first LED array 51, the second LED array 52, and the third LED array 53 by the control interface 66.
舉例而言,控制介面66可包含開關觸控區81、視覺觸控區82、快速成長觸控區83、緩慢成長觸控區84、藍光觸控區85、白光觸控區86、紫光觸控區87與記憶觸控區88。其中,當使用者觸碰開關觸控區81時,可開啟或關閉第一發光二極體陣列51、第二發光二極體陣列52與第三發光二極體陣列53;當使用者觸碰視覺觸控區82時,可將第一發光二極體陣列51、第二發光二極體陣列52與第三發光二極體陣列53的發光狀態調整成內建於儲存單元64的視覺模式;當使用者觸碰快速成長觸控區83時,可將第一發光二極體陣列51、第二發光二極體陣列52與第三發光二極體陣列53的發光狀態調整成內建於儲存單元64中有利於生物生長的快速成長模式;當使用者觸碰緩慢成長觸控區84時,可將第一發光二極體陣列51、第二發光二極體陣列52與第三發光二極體陣列53的發光狀態調整成內建於儲存單元64中抑制生物生長的緩慢成長模式;當使用者觸碰藍光觸控區85時,可將第三發光二極體陣列53的發光強度調高;當使用者觸碰白光觸控區86時,可將第一發光二極體陣列51的發光強度調高;當使用者觸碰紫光觸控區87時,可將第二發光二極體陣列52的發光強度調高;當使用者觸碰記憶觸控區88且超過一預定時間時,可儲存此時第一發光二極體陣列51、第二發光二極體陣列52與第三發光二極體陣列53的發光狀態,但本實施例並非用以限縮本創作。For example, the control interface 66 can include a switch touch area 81, a visual touch area 82, a fast growing touch area 83, a slow growing touch area 84, a blue touch area 85, a white light touch area 86, and a violet touch. Area 87 and memory touch area 88. When the user touches the switch touch area 81, the first LED array 51, the second LED array 52 and the third LED array 53 can be turned on or off; when the user touches In the visual touch area 82, the illumination states of the first LED array 51, the second LED array 52, and the third LED array 53 can be adjusted to a visual mode built into the storage unit 64; When the user touches the fast-growing touch area 83, the light-emitting states of the first LED array 51, the second LED array 52, and the third LED array 53 can be adjusted to be built-in for storage. a rapid growth mode in the unit 64 that facilitates biological growth; when the user touches the slowly growing touch area 84, the first light emitting diode array 51, the second light emitting diode array 52, and the third light emitting diode may be The illuminating state of the body array 53 is adjusted to a slow growth mode built in the storage unit 64 to suppress biological growth; when the user touches the blue touch area 85, the illuminating intensity of the third illuminating diode array 53 can be increased. When the user touches the white touch area 86, the first The illuminating intensity of the illuminating diode array 51 is increased; when the user touches the illuminating touch area 87, the illuminating intensity of the second illuminating diode array 52 can be increased; when the user touches the memory touch area 88 The illuminating state of the first illuminating diode array 51, the second illuminating diode array 52, and the third illuminating diode array 53 can be stored at a time when the predetermined time is exceeded, but the embodiment is not used for limiting the illuminating state. This creation.
由於發光二極體組件32發光的同時也會產生熱量,因此照明裝置10更包含散熱模組90,以將發光二極體組件32所產生的熱量導出。其中,散熱模組90係選自於風扇與散熱鰭片所構成之群組。本實施例中,散熱模組90包含風扇98與散熱鰭片99,但本實施例並非用以限縮本創作。舉 例而言,殼體20亦可包含多個散熱孔91,藉由散熱孔91與散熱模組90的設計,發光二極體組件32所產生的熱量導出,避免照明裝置10因其產生的熱量過多而受損,進而縮短照明裝置10的使用壽命。Since the light-emitting diode assembly 32 emits light while generating heat, the illumination device 10 further includes a heat dissipation module 90 to derive heat generated by the light-emitting diode assembly 32. The heat dissipation module 90 is selected from the group consisting of a fan and a heat dissipation fin. In this embodiment, the heat dissipation module 90 includes the fan 98 and the heat dissipation fins 99, but this embodiment is not intended to limit the creation. Lift For example, the housing 20 can also include a plurality of heat dissipation holes 91. By the design of the heat dissipation holes 91 and the heat dissipation module 90, the heat generated by the LED assembly 32 is led out, thereby avoiding the heat generated by the illumination device 10. Excessive damage, thereby shortening the service life of the lighting device 10.
綜上所述,本創作之照明裝置可提供多波段的光線,且可根據不同的使用者需求,抑或者照明裝置之光學元件損壞時,使用者可自行更換光學元件,達到良好的光照功效,進而使本創作之產生能更進步、更實用、更符合消費者使用之所需,確已符合創作專利申請之要件,爰依法提出專利申請。In summary, the lighting device of the present invention can provide multi-band light, and the user can replace the optical component to achieve good illumination effect according to different user requirements or when the optical component of the lighting device is damaged. In turn, the creation of this creation can be more progressive, more practical, and more in line with the needs of consumers. It has indeed met the requirements for the creation of a patent application, and has filed a patent application according to law.
惟以上所述者,僅為本創作之較佳實施例,當不能以此限定本創作實施之範圍;故,凡依本創作申請專利範圍及創作說明書內容所作之簡單的等效變化與修飾,皆應仍屬本創作專利涵蓋之範圍內。However, the above is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited by this; therefore, the simple equivalent changes and modifications made by the scope of the patent application and the content of the creation specification are All should remain within the scope of this creation patent.
10‧‧‧照明裝置10‧‧‧Lighting device
20‧‧‧殼體20‧‧‧shell
21‧‧‧防滑紋21‧‧‧Slip lines
22‧‧‧載座22‧‧‧Hosting
24‧‧‧穿孔24‧‧‧Perforation
25‧‧‧側面25‧‧‧ side
26‧‧‧本體26‧‧‧Ontology
28‧‧‧蓋體28‧‧‧ Cover
30‧‧‧發光模組30‧‧‧Lighting module
40‧‧‧光學元件40‧‧‧Optical components
42‧‧‧入光區域42‧‧‧lighting area
62‧‧‧控制單元62‧‧‧Control unit
63‧‧‧電路板63‧‧‧ boards
64‧‧‧儲存單元64‧‧‧storage unit
72‧‧‧底面72‧‧‧ bottom
90‧‧‧散熱模組90‧‧‧ Thermal Module
91‧‧‧散熱孔91‧‧‧ vents
98‧‧‧風扇98‧‧‧fan
99‧‧‧散熱鰭片99‧‧‧Heat fins
H、F‧‧‧區域H, F‧‧‧ area
Claims (16)
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TW104209118U TWM512292U (en) | 2015-06-08 | 2015-06-08 | Lighting device |
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TW104209118U TWM512292U (en) | 2015-06-08 | 2015-06-08 | Lighting device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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EP3300107A1 (en) | 2016-09-22 | 2018-03-28 | Excellence Opto. Inc. | Light emitting diode array optical cup structure with a focal position |
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Publication number | Priority date | Publication date | Assignee | Title |
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EP3300107A1 (en) | 2016-09-22 | 2018-03-28 | Excellence Opto. Inc. | Light emitting diode array optical cup structure with a focal position |
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