TWM512227U - Electrical connector and terminals thereof - Google Patents
Electrical connector and terminals thereof Download PDFInfo
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- TWM512227U TWM512227U TW104209002U TW104209002U TWM512227U TW M512227 U TWM512227 U TW M512227U TW 104209002 U TW104209002 U TW 104209002U TW 104209002 U TW104209002 U TW 104209002U TW M512227 U TWM512227 U TW M512227U
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Description
本創作涉及一種電連接器及其導電端子,尤指一種安裝於電路板上之電連接器及其導電端子。The present invention relates to an electrical connector and a conductive terminal thereof, and more particularly to an electrical connector mounted on a circuit board and a conductive terminal thereof.
隨著電子技術之快速發展,電連接器被廣泛應用於電子產品中,以與外部設備交換資訊、資料等。現有之電連接器一般包括絕緣本體及收容於前述絕緣本體內之端子。前述端子之焊接腳自絕緣本體伸出,以焊接在電路板上。惟,習知電源連接器以夾板形式與電路板焊接時,錫膏往往會被端子之焊接腳往後推,從而堆積在後方,進而造成黏錫區域不均勻、焊接強度與焊接性能較差。With the rapid development of electronic technology, electrical connectors are widely used in electronic products to exchange information and materials with external devices. The existing electrical connector generally includes an insulative housing and a terminal received in the insulative housing. The soldering legs of the aforementioned terminals extend from the insulating body to be soldered to the circuit board. However, when the conventional power connector is soldered to the circuit board in the form of a splint, the solder paste is often pushed back by the soldering legs of the terminal, thereby accumulating at the rear, thereby causing uneven soldering area, poor soldering strength and soldering performance.
有鑒於此,確有必要對現有電源連接器之端子焊接腳作進一步改進,以解決上述技術問題。In view of this, it is indeed necessary to further improve the terminal soldering legs of the existing power connector to solve the above technical problems.
本創作之目的在於提供一種導電端子,該導電端子之焊腳在與電路板焊接固定時,錫膏不會被推移到後方,且黏錫區域均勻分佈在焊點上,焊接強度與焊接性能較好。The purpose of the present invention is to provide a conductive terminal. When the soldering leg of the conductive terminal is soldered and fixed to the circuit board, the solder paste is not pushed to the rear, and the soldering tin area is evenly distributed on the solder joint, and the soldering strength and the soldering performance are compared. it is good.
為實現上述目的,本創作關於一種導電端子,用以與電路板 焊接固定,前述導電端子包括接觸部、焊腳及連接接觸部與焊腳之連接部,前述焊腳包括自前述連接部一端水平延伸之固定部、自固定部末端彎折翹起設置之翹起部及連接固定部與翹起部之焊接區,其中,前述焊接區呈彎折狀設置,且前述焊接區設置有供收容錫膏並使錫膏與焊接區均勻焊接之收容部。In order to achieve the above object, the present invention relates to a conductive terminal for use with a circuit board The conductive terminal includes a contact portion, a solder fillet, and a connecting portion connecting the contact portion and the solder fillet. The solder fillet includes a fixing portion horizontally extending from one end of the connecting portion, and the tilting from the end of the fixing portion And a welding zone connecting the fixing portion and the lifting portion, wherein the welding zone is provided in a bent shape, and the welding zone is provided with a receiving portion for receiving the solder paste and uniformly soldering the solder paste to the welding zone.
作為本創作之進一步改進,前述收容部係開設於前述焊接區之開孔,且前述開孔貫穿前述焊接區設置。As a further improvement of the present invention, the accommodating portion is opened in the opening of the welding zone, and the opening is provided through the welding zone.
作為本創作之進一步改進,前述收容部係自前述焊接區之兩側邊緣分別凹陷形成之缺口。As a further improvement of the present invention, the accommodating portion is a notch formed by recessing from both side edges of the welding zone.
作為本創作之進一步改進,前述收容部係自前述焊接區和翹起部之兩側邊緣分別凹陷形成之凹槽,以使得前述焊接區之寬度與前述翹起部之寬度相等。As a further improvement of the present invention, the accommodating portion is formed by recessing grooves formed on both side edges of the welding portion and the cocking portion, so that the width of the lands is equal to the width of the cocking portion.
作為本創作之進一步改進,前述收容部係自前述焊接區和翹起部之同側邊緣凹陷形成之開槽,以使得前述焊接區之寬度與前述翹起部之寬度相等。As a further improvement of the present invention, the accommodating portion is formed by recessing the same side edge of the welding portion and the cocking portion so that the width of the welding portion is equal to the width of the cocking portion.
本創作之目的還在於提供一種電連接器,該電連接器在將端子焊腳與電路板焊接固定時,錫膏不會被推移到後方,且黏錫區域均勻分佈在焊點上,焊接強度與焊接性能較好。The purpose of the present invention is also to provide an electrical connector, the solder paste is not pushed to the rear when the terminal soldering foot is soldered to the circuit board, and the soldering area is evenly distributed on the solder joint, and the soldering strength is Good welding performance.
為實現上述目的,本創作關於一種電連接器,安裝於電路板上用於與對接連接器對接,其包括:絕緣本體,其上形成有與對接連接器對接之對接部及自對接 部向後延伸之安裝部,複數收容槽自前述對接部延伸至前述安裝部並沿對接方向貫穿前述對接部和安裝部;以及導電端子,對應收容於前述收容槽內,前述導電端子包括與對接連接器電性連接之接觸部、與電路板焊接固定之焊腳以及連接前述接觸部與前述焊腳之連接部,前述焊腳包括自前述連接部一端水平延伸之固定部、自固定部末端彎折翹起設置之翹起部及連接固定部與翹起部之焊接區;其中,前述焊接區呈彎折狀設置,且前述焊接區設置有供收容錫膏並使錫膏與焊接區均勻焊接之收容部。To achieve the above object, the present invention relates to an electrical connector mounted on a circuit board for docking with a mating connector, comprising: an insulative housing having a mating portion and a self-docking interface with the mating connector a mounting portion extending rearwardly, a plurality of receiving slots extending from the mating portion to the mounting portion and extending through the mating portion and the mounting portion in a mating direction; and a conductive terminal correspondingly received in the receiving slot, the conductive terminal including the butted connection a contact portion electrically connected to the board, a solder joint fixed to the circuit board, and a connection portion connecting the contact portion and the solder fillet, wherein the solder fillet includes a fixing portion horizontally extending from one end of the connecting portion, and the end portion of the fixing portion is bent a lifting portion of the lifting and a welding portion connecting the fixing portion and the lifting portion; wherein the welding portion is provided in a bent shape, and the welding portion is provided with a solder paste for uniformly soldering the solder paste and the welding portion Containment department.
作為本創作之進一步改進,前述收容部係開設於前述焊接區之開孔,且前述開孔貫穿前述焊接區設置。As a further improvement of the present invention, the accommodating portion is opened in the opening of the welding zone, and the opening is provided through the welding zone.
作為本創作之進一步改進,前述收容部係自前述焊接區之至少一側邊緣凹陷形成之缺口。As a further improvement of the present invention, the accommodating portion is a notch formed by recessing at least one side edge of the welding zone.
作為本創作之進一步改進,前述收容部係自前述焊接區和翹起部之至少一側邊緣凹陷形成之開槽,以使得前述焊接區之寬度與翹起部之寬度相等。As a further improvement of the present invention, the accommodating portion is formed by recessing at least one side edge of the welding zone and the cocking portion such that the width of the lands is equal to the width of the cocking portion.
作為本創作之進一步改進,前述安裝部之後端設有朝向前述收容槽突伸之彈臂,前述連接部之靠近焊腳一側突設有凸起,前述彈臂沿對接反方向傾斜延伸以與前述凸起相抵頂而限制前述導電端子於前述收容槽內發生位移。As a further improvement of the present invention, the rear end of the mounting portion is provided with an elastic arm protruding toward the receiving groove, and a protrusion is protruded from a side of the connecting portion near the soldering leg, and the elastic arm extends obliquely in a reverse direction of the butting to the foregoing The protrusions abut against the top to limit displacement of the conductive terminals in the receiving groove.
相較於現有技術,本創作之電連接器及其導電端子,通過在 導電端子之焊腳上設置彎折狀的焊接區,同時在前述焊接區處設置供收容錫膏並使錫膏與焊接區均勻焊接之收容部,從而,前述導電端子之焊腳在與電路板焊接固定時,錫膏不會被推移到後方,且黏錫區域均勻分佈在焊點上,焊接強度與焊接性能較好。Compared with the prior art, the electrical connector of the present invention and its conductive terminal pass through a soldering portion is formed on the soldering leg of the conductive terminal, and a receiving portion for accommodating the solder paste and uniformly soldering the solder paste to the soldering region is disposed at the soldering portion, so that the soldering leg of the conductive terminal is on the circuit board When soldering is fixed, the solder paste will not be pushed to the rear, and the tin-bonded area is evenly distributed on the solder joints, and the soldering strength and soldering performance are better.
100‧‧‧電連接器100‧‧‧Electrical connector
10‧‧‧絕緣本體10‧‧‧Insulated body
11‧‧‧對接部11‧‧‧Docking Department
111‧‧‧對接面111‧‧‧ docking surface
112‧‧‧頂壁112‧‧‧ top wall
113‧‧‧底壁113‧‧‧ bottom wall
114‧‧‧肋條114‧‧‧ Ribs
12‧‧‧安裝部12‧‧‧Installation Department
121‧‧‧收容空間121‧‧‧ accommodating space
122‧‧‧延長臂122‧‧‧Extension arm
123‧‧‧槽道123‧‧‧ channel
124‧‧‧頂壁124‧‧‧ top wall
125‧‧‧底壁125‧‧‧ bottom wall
13‧‧‧收容槽13‧‧‧storage trough
131‧‧‧上收容槽131‧‧‧上上槽
132‧‧‧下收容槽132‧‧‧Lower storage trough
14‧‧‧對接空間14‧‧‧ docking space
15‧‧‧間隔片15‧‧‧ Spacer
16‧‧‧彈臂16‧‧‧Bounce arm
17‧‧‧間隔壁17‧‧‧ partition wall
20‧‧‧導電端子20‧‧‧Electrical terminals
201‧‧‧第一端子201‧‧‧First terminal
202‧‧‧第二端子202‧‧‧second terminal
21‧‧‧接觸部21‧‧‧Contacts
22‧‧‧連接部22‧‧‧Connecting Department
23‧‧‧焊腳23‧‧‧ solder feet
231‧‧‧固定部231‧‧‧ Fixed Department
232‧‧‧焊接區232‧‧‧Weld area
233‧‧‧翹起部233‧‧‧ cocked
234‧‧‧開孔234‧‧‧Opening
235‧‧‧缺口235‧‧ ‧ gap
236‧‧‧凹槽236‧‧‧ Groove
237‧‧‧開槽237‧‧‧ slotting
24‧‧‧凸起24‧‧‧ bumps
241‧‧‧抵接面241‧‧‧ Abutment
242‧‧‧導引面242‧‧‧ Guide surface
第一圖係本創作電連接器之立體圖。The first figure is a perspective view of the present electrical connector.
第二圖係第一圖所示電連接器之分解圖。The second figure is an exploded view of the electrical connector shown in the first figure.
第三圖係第二圖所示絕緣本體之立體圖。The third figure is a perspective view of the insulative body shown in the second figure.
第四圖係第三圖所示絕緣本體之另一視角立體圖。The fourth figure is another perspective view of the insulating body shown in the third figure.
第五圖係第二圖所示導電端子之立體圖。The fifth figure is a perspective view of the conductive terminal shown in the second figure.
第六圖係第五圖所示導電端子之第一實施方式立體圖。Fig. 6 is a perspective view showing a first embodiment of the conductive terminal shown in Fig. 5.
第七圖係第五圖所示導電端子之第二實施方式立體圖。Fig. 7 is a perspective view showing a second embodiment of the conductive terminal shown in Fig. 5.
第八圖係第五圖所示導電端子之第三實施方式立體圖。Figure 8 is a perspective view showing a third embodiment of the conductive terminal shown in the fifth figure.
第九圖係第五圖所示導電端子之第四實施方式立體圖。Figure 9 is a perspective view showing a fourth embodiment of the conductive terminal shown in the fifth figure.
請參閱第一圖與第二圖所示,本創作揭示了一種電連接器100,該電連接器100可安裝於電路板(未圖示)上用於與對接連接器(未圖示)對接配合。前述電連接器100包括絕緣本體10及收容於前述絕緣本體10內之複數導電端子20。Referring to the first and second figures, the present application discloses an electrical connector 100 mountable on a circuit board (not shown) for docking with a docking connector (not shown). Cooperate. The electrical connector 100 includes an insulative housing 10 and a plurality of conductive terminals 20 received in the insulative housing 10 .
請參閱第三圖與第四圖所示,前述絕緣本體10上形成有與對 接連接器對接之對接部11及自對接部11向後延伸之安裝部12,複數收容槽13自前述對接部11延伸至前述安裝部12並沿對接方向貫穿前述對接部11和安裝部12。Referring to the third and fourth figures, the insulative housing 10 is formed with a pair. The docking portion 11 to which the connector is butted and the mounting portion 12 extending rearward from the mating portion 11 extend from the mating portion 11 to the mounting portion 12 and penetrate the mating portion 11 and the mounting portion 12 in the mating direction.
前述對接部11包括與對接連接器對接之對接面111、及連接前述對接面111和前述安裝部12之頂壁112和底壁113。前述頂壁112與底壁113上均設置有複數肋條114,以增大前述對接部11之散熱面積。前述肋條114自前述對接面111延伸至前述安裝部12,且前述肋條114之厚度沿其延伸方向逐漸遞增,從而前述導電端子20於前述收容槽13內產生之熱量可藉由前述肋條114儘快散發出去。The abutting portion 11 includes an abutting surface 111 that abuts the mating connector, and a top wall 112 and a bottom wall 113 that connect the abutting surface 111 and the mounting portion 12. A plurality of ribs 114 are disposed on the top wall 112 and the bottom wall 113 to increase the heat dissipation area of the abutting portion 11. The ribs 114 extend from the abutting surface 111 to the mounting portion 12, and the thickness of the ribs 114 gradually increases along the extending direction thereof, so that the heat generated by the conductive terminals 20 in the receiving groove 13 can be dissipated as quickly as possible by the ribs 114. Go out.
前述對接部11內開設有供對接連接器插入之對接空間14,前述對接空間14前後貫穿前述對接部11並與前述收容槽13相連通,以便於前述導電端子20在前述對接空間14內與對接連接器電性連接。前述對接部11內之相鄰兩個收容槽13之間設置有間隔片15,前述間隔片15分別自前述頂壁112和底壁113突伸入前述對接空間14,以防止相鄰兩片導電端子20發生干擾。The docking portion 11 is provided with a docking space 14 for inserting the mating connector. The mating space 14 extends through the mating portion 11 and communicates with the receiving slot 13 to facilitate the docking of the conductive terminal 20 in the docking space 14. The connector is electrically connected. A spacer 15 is disposed between the adjacent two receiving slots 13 in the abutting portion 11. The spacers 15 protrude from the top wall 112 and the bottom wall 113 into the mating space 14 to prevent adjacent two sheets from conducting. The terminal 20 is disturbed.
前述安裝部12自前述對接部11向後延伸形成,且前述安裝部12之厚度大於等於前述對接部11與肋條114之厚度之和。前述安裝部12上開設有收容空間121,前述收容空間121與前述收容槽13相連通以供收容前述導電端子20。前述安裝部12還包括分設在前述收容空間121兩側之延長臂122,前述延長臂122與前述收容空間121相配合以使得前述安裝部12大致呈U型結構。前述延長臂122上開設有與前述收容空間121相連通之槽道123, 且前述槽道123係自前述延長臂122之後端中間位置處沿對接方向向前凹陷形成。The mounting portion 12 is formed to extend rearward from the mating portion 11, and the thickness of the mounting portion 12 is greater than or equal to the sum of the thicknesses of the mating portion 11 and the ribs 114. A receiving space 121 is defined in the mounting portion 12 , and the receiving space 121 communicates with the receiving slot 13 to receive the conductive terminal 20 . The mounting portion 12 further includes an extension arm 122 that is disposed on both sides of the accommodating space 121. The extension arm 122 cooperates with the accommodating space 121 such that the mounting portion 12 has a substantially U-shaped configuration. The extending arm 122 defines a channel 123 communicating with the receiving space 121. And the aforementioned channel 123 is formed to be recessed forward in the butting direction from the intermediate position of the rear end of the extension arm 122.
前述安裝部12之後端設有朝向前述收容槽13突伸之彈臂16,前述彈臂16沿對接反方向傾斜延伸並彈性懸伸於前述收容槽13內。前述安裝部12內設置有間隔壁17,前述間隔壁17於絕緣本體10厚度方向上將前述收容槽13分隔成上收容槽131和下收容槽132,前述上收容槽131和下收容槽132內均設置有前述彈臂16。前述上收容槽131內之彈臂16自前述安裝部12之頂壁124內側朝向前述上收容槽131突伸,前述下收容槽132內之彈臂16自前述安裝部12之底壁125內側朝向前述下收容槽132突伸,且前述上收容槽131內之彈臂16與前述下收容槽132內之彈臂16對稱設置於前述間隔壁17之兩側。前述槽道123與前述間隔壁17位於同一水平面上,以便於將電路板穿插在前述槽道123和收容空間121內,進而便於導電端子20與電路板焊接固定。The rear end of the mounting portion 12 is provided with an elastic arm 16 protruding toward the receiving groove 13. The elastic arm 16 extends obliquely in the opposite direction of the butting and elastically extends in the receiving groove 13. A partition wall 17 is disposed in the mounting portion 12, and the partition wall 17 partitions the receiving groove 13 into an upper receiving groove 131 and a lower receiving groove 132 in the thickness direction of the insulating body 10, and the upper receiving groove 131 and the lower receiving groove 132 The aforementioned elastic arms 16 are provided. The elastic arm 16 in the upper receiving groove 131 protrudes from the inner side of the top wall 124 of the mounting portion 12 toward the upper receiving groove 131, and the elastic arm 16 in the lower receiving groove 132 faces from the inner side of the bottom wall 125 of the mounting portion 12 The lower receiving groove 132 protrudes, and the elastic arm 16 in the upper receiving groove 131 and the elastic arm 16 in the lower receiving groove 132 are symmetrically disposed on both sides of the partition wall 17 . The channel 123 is located on the same level as the partition wall 17 to facilitate the insertion of the circuit board into the channel 123 and the receiving space 121, thereby facilitating soldering and fixing of the conductive terminal 20 to the circuit board.
請參閱第二圖與第五圖並結合第三圖與第四圖所示,前述導電端子20對應收容於前述收容槽13內並用以與電路板焊接固定。前述導電端子20包括與對接連接器電性連接之接觸部21、與電路板焊接固定之焊腳23以及連接前述接觸部21與前述焊腳23之連接部22。前述接觸部21自前述收容槽13突伸入前述對接空間14,以在前述對接空間14內與對接連接器電性連接。前述連接部22和焊腳23突伸超出前述收容槽13並收容於前述收容空間121內。Referring to the second and fifth figures, in conjunction with the third and fourth figures, the conductive terminals 20 are correspondingly received in the receiving slots 13 for soldering and fixing to the circuit board. The conductive terminal 20 includes a contact portion 21 electrically connected to the mating connector, a solder leg 23 soldered to the circuit board, and a connecting portion 22 connecting the contact portion 21 and the solder fillet 23. The contact portion 21 protrudes from the receiving groove 13 into the docking space 14 to be electrically connected to the mating connector in the docking space 14 . The connecting portion 22 and the solder fillet 23 protrude beyond the receiving groove 13 and are received in the receiving space 121.
前述連接部22之靠近焊腳23一側突設有凸起24,且前述凸起 24沿前述連接部22之厚度方向突設,以與前述彈臂16相抵頂而限制前述導電端子20於前述收容槽13內發生位移。前述凸起24與前述彈臂16相接觸抵持可使得導電端子20僅能自對接部11朝向安裝部12組裝,且在前述導電端子20受到脫離前述絕緣本體10方向的外力時,前述凸起24將卡止於前述彈臂16。前述凸起24包括與前述彈臂16相抵接之抵接面241及在組裝時起導引作用之導引面242,前述抵接面241靠近接觸部21一側並垂直於連接部22設置,前述導引面242靠近焊腳23一側設置並朝向焊腳23傾斜延伸,以使得前述凸起24大致呈梯形狀。a protrusion 24 is protruded from a side of the connecting portion 22 near the solder tail 23, and the protrusion is The protrusion 24 protrudes in the thickness direction of the connecting portion 22 to restrain the displacement of the conductive terminal 20 in the receiving groove 13 by abutting against the elastic arm 16 . The protrusion 24 is in contact with the elastic arm 16 so that the conductive terminal 20 can be assembled only from the mating portion 11 toward the mounting portion 12, and when the conductive terminal 20 is subjected to an external force in a direction away from the insulating body 10, the protrusion is 24 will be locked to the aforementioned elastic arm 16. The protrusion 24 includes an abutting surface 241 that abuts the elastic arm 16 and a guiding surface 242 that guides during assembly. The abutting surface 241 is disposed on a side close to the contact portion 21 and perpendicular to the connecting portion 22, The guiding surface 242 is disposed adjacent to the side of the soldering foot 23 and extends obliquely toward the solder tail 23 such that the aforementioned protrusion 24 has a substantially trapezoidal shape.
前述焊腳23包括自前述連接部22一端水平延伸之固定部231、自固定部231末端彎折翹起設置之翹起部233及連接固定部231與翹起部233之焊接區232。前述焊接區232呈彎折狀設置,且前述焊接區232設置有供收容錫膏並使錫膏與焊接區232均勻焊接之收容部。前述收容部包括有四種實施方式,以下將對這四種實施方式作詳細說明。The solder fillet 23 includes a fixing portion 231 extending horizontally from one end of the connecting portion 22, a lifting portion 233 bent from the end of the fixing portion 231, and a soldering portion 232 connecting the fixing portion 231 and the lifting portion 233. The soldering area 232 is provided in a bent shape, and the soldering area 232 is provided with an accommodating portion for accommodating the solder paste and uniformly soldering the solder paste to the soldering region 232. The foregoing housing portion includes four embodiments, and the four embodiments will be described in detail below.
請參閱第六圖所示,為前述收容部之第一種實施方式立體圖。於本實施方式中,前述收容部係開設於前述焊接區232之開孔234,且前述開孔234貫穿前述焊接區232設置,從而前述導電端子20之焊腳23在與電路板焊接固定時,錫膏就可穿過前述開孔234而均勻分佈在焊點上,進而使得焊接強度與焊接性能較好。Please refer to the sixth figure, which is a perspective view of the first embodiment of the housing portion. In the embodiment, the receiving portion is formed in the opening 234 of the soldering region 232, and the opening 234 is disposed through the soldering region 232, so that the soldering leg 23 of the conductive terminal 20 is soldered and fixed to the circuit board. The solder paste can be evenly distributed on the solder joint through the aforementioned opening 234, so that the soldering strength and the soldering performance are better.
請參閱第七圖所示,為前述收容部之第二種實施方式立體圖。於本實施方式中,前述收容部係自前述焊接區232之至少一側邊緣凹陷形成之缺口235。具體而言,前述收容部係自前述焊接區232之兩側邊緣分 別凹陷形成之缺口235,從而前述導電端子20之焊腳23在與電路板焊接固定時,錫膏就可穿過前述缺口235而均勻分佈在焊點上,進而使得焊接強度與焊接性能較好。Please refer to the seventh figure, which is a perspective view of a second embodiment of the accommodating portion. In the present embodiment, the accommodating portion is a notch 235 formed by recessing at least one side edge of the lands 232. Specifically, the accommodating portion is separated from the two sides of the welding zone 232 The notch 235 is formed by the recess, so that the solder paste 23 of the conductive terminal 20 can be uniformly distributed on the solder joint through the gap 235 when soldered and fixed to the circuit board, thereby better welding strength and soldering performance. .
請參閱第八圖所示,為前述收容部之第三種實施方式立體圖。於本實施方式中,前述收容部係自前述焊接區232和翹起部233之兩側邊緣分別凹陷形成之凹槽236,以使得前述焊接區232之寬度與前述翹起部233之寬度相等,從而前述導電端子20之焊腳23在與電路板焊接固定時,錫膏就可穿過前述凹槽236而均勻分佈在焊點上,進而使得焊接強度與焊接性能較好。Referring to the eighth embodiment, it is a perspective view of a third embodiment of the housing portion. In the embodiment, the accommodating portion is recessed 236 formed from the two sides of the welding zone 232 and the cocking portion 233, so that the width of the lands 232 is equal to the width of the cocking portion 233. Therefore, when the soldering legs 23 of the conductive terminals 20 are soldered and fixed to the circuit board, the solder paste can be evenly distributed on the solder joints through the grooves 236, thereby further improving the soldering strength and the soldering performance.
請參閱第九圖所示,為前述收容部之第四種實施方式立體圖。於本實施方式中,前述收容部係自前述焊接區232和翹起部233之同側邊緣凹陷形成之開槽237,以使得前述焊接區232之寬度與前述翹起部233之寬度相等,從而前述導電端子20之焊腳23在與電路板焊接固定時,錫膏就可穿過前述開槽237而均勻分佈在焊點上,進而使得焊接強度與焊接性能較好。Please refer to the ninth figure, which is a perspective view of a fourth embodiment of the housing portion. In the present embodiment, the accommodating portion is formed by a groove 237 recessed from the same side edge of the lands 232 and the cocking portion 233 such that the width of the lands 232 is equal to the width of the cocking portion 233, thereby When the soldering legs 23 of the conductive terminals 20 are soldered and fixed to the circuit board, the solder paste can be evenly distributed on the solder joints through the slots 237, so that the soldering strength and the soldering performance are better.
當然,前述收容部之實施方式不限於上述四種,只要能夠實現錫膏穿過收容部而均勻分佈在焊點上以使得焊接強度與焊接性能均較好即可。另外,前述收容部不僅適用於單支端子之焊腳,也適用於以二合一形式排列之焊腳或以四合一形式排列之焊腳,且每個焊腳上收容部之設計形式可以相同也可以不同,可以為上述四種實施方式中的任意一種。Of course, the embodiment of the accommodating portion is not limited to the above four types, as long as the solder paste can be uniformly distributed on the solder joint through the accommodating portion so that the soldering strength and the soldering performance are both good. In addition, the accommodating portion is applicable not only to the soldering legs of the single terminal but also to the soldering legs arranged in a two-in-one form or the soldering legs arranged in a four-in-one form, and the design of the receiving portion on each of the soldering legs can be The same may be different, and may be any of the above four embodiments.
請參第二圖並結合第四圖所示,前述導電端子20包括收容於 前述上收容槽131內之第一端子201和收容於前述下收容槽132內之第二端子202,前述第一端子201之接觸部21與前述第二端子202之接觸部21相對且對稱設置。前述第一端子201之連接部22上之凸起24與第二端子202之連接部22上之凸起24對稱且相背離延伸,以分別與上收容槽131和下收容槽132內之彈臂16接觸抵持。前述第一端子201之焊腳23與前述第二端子202之焊腳23相對且對稱設置,以分別與電路板焊接固定。Referring to the second figure and the fourth figure, the foregoing conductive terminal 20 includes the The first terminal 201 in the upper receiving groove 131 and the second terminal 202 received in the lower receiving groove 132, the contact portion 21 of the first terminal 201 and the contact portion 21 of the second terminal 202 are opposite to each other and symmetrically disposed. The protrusions 24 on the connecting portion 22 of the first terminal 201 are symmetric with the protrusions 24 on the connecting portion 22 of the second terminal 202 and extend away from each other to respectively form the elastic arms in the upper receiving groove 131 and the lower receiving groove 132. 16 contact resistance. The solder tails 23 of the first terminal 201 are opposite to and soldered to the solder tails 23 of the second terminals 202 to be soldered and fixed to the circuit board, respectively.
在組裝本創作之電連接器100時,先將導電端子20自對接部11朝向安裝部12方向插入收容槽13內,直至凸起24到達彈臂16的後方並與彈臂16接觸抵持,然後再將焊腳23與電路板焊接固定,這樣即可完成本創作電連接器100之組裝,簡單、易操作。When the electrical connector 100 of the present invention is assembled, the conductive terminal 20 is first inserted into the receiving slot 13 from the mating portion 11 toward the mounting portion 12 until the protrusion 24 reaches the rear of the elastic arm 16 and is in contact with the elastic arm 16 . Then, the soldering legs 23 are soldered and fixed to the circuit board, so that the assembly of the present electrical connector 100 can be completed, which is simple and easy to operate.
相較于現有技術,本創作之電連接器100通過在導電端子20之焊腳23上設置彎折狀的焊接區232,同時在前述焊接區232處設置供收容錫膏並使錫膏與焊接區232均勻焊接之收容部,從而,前述導電端子20之焊腳23在與電路板焊接固定時,錫膏不會被推移到後方,且黏錫區域均勻分佈在焊點上,焊接強度與焊接性能較好。Compared with the prior art, the electrical connector 100 of the present invention is provided with a bent welding zone 232 on the soldering leg 23 of the conductive terminal 20, and at the same time, the soldering zone 232 is provided for accommodating the solder paste and soldering and soldering. The 232 is uniformly welded to the accommodating portion, so that the solder paste 23 of the conductive terminal 20 is not soldered to the rear when soldering and fixing to the circuit board, and the soldering region is evenly distributed on the solder joint, and the soldering strength and soldering are performed. Good performance.
特別需要指出,對於本領域之普通技藝人員來說,在本創作之教導下所作之針對本創作之等效變化,仍應包含在本創作申請專利範圍所主張之範圍中。It is to be understood that the equivalent changes to the present invention made by the teachings of the present invention should be included in the scope of the present invention.
100‧‧‧電連接器100‧‧‧Electrical connector
10‧‧‧絕緣本體10‧‧‧Insulated body
11‧‧‧對接部11‧‧‧Docking Department
111‧‧‧對接面111‧‧‧ docking surface
112‧‧‧頂壁112‧‧‧ top wall
114‧‧‧肋條114‧‧‧ Ribs
12‧‧‧安裝部12‧‧‧Installation Department
122‧‧‧延長臂122‧‧‧Extension arm
123‧‧‧槽道123‧‧‧ channel
124‧‧‧頂壁124‧‧‧ top wall
14‧‧‧對接空間14‧‧‧ docking space
15‧‧‧間隔片15‧‧‧ Spacer
20‧‧‧導電端子20‧‧‧Electrical terminals
21‧‧‧接觸部21‧‧‧Contacts
23‧‧‧焊腳23‧‧‧ solder feet
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW104209002U TWM512227U (en) | 2015-06-05 | 2015-06-05 | Electrical connector and terminals thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW104209002U TWM512227U (en) | 2015-06-05 | 2015-06-05 | Electrical connector and terminals thereof |
Publications (1)
Publication Number | Publication Date |
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TWM512227U true TWM512227U (en) | 2015-11-11 |
Family
ID=55219421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW104209002U TWM512227U (en) | 2015-06-05 | 2015-06-05 | Electrical connector and terminals thereof |
Country Status (1)
Country | Link |
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TW (1) | TWM512227U (en) |
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2015
- 2015-06-05 TW TW104209002U patent/TWM512227U/en not_active IP Right Cessation
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