TWM511501U - Smart plating rack - Google Patents

Description

Intelligent plating hanger

A smart plating rack (Smart Plating Rack), in particular, a current regulator is provided on each of the plating racks, and the input DC fixed power source directly outputs a steady current to the plated parts according to the plating requirement, so that Each of the plated parts can achieve a stable optimal current value of the smart rack.

According to the plating process, the surface of the plated part (for example, the circuit board) is mainly subjected to surface treatment such as copper plating or silver plating, and the rack is suspended from the conductive plate (Rack) to suspend the circuit board to the processing slot. Perform electroplating operations.

1 and 2, a schematic diagram of a plating system 80 and a hanger 90 is used, which includes a plating tank 81, a rectifier 82, an anode rod 83, a plating anode 831, a cathode rod 84 and a hanger 90, and a plating tank 81. The electroplating solution is filled therein for electroplating the circuit board (P). The positive and negative poles of the rectifier 82 are electrically connected to the anode rod 83 and the cathode rod 84, respectively, and the plating anode 831 is connected to the anode rod 83, and the hanger 90 is connected to the anode rod 83. The cathode rod 84, the plating anode 831 and the hanger 90 are both disposed in the plating tank 81. After the rectifier 82 is powered, the metal ions deposited by the plating anode 831 are deposited and plated on the circuit board (P) under the action of current. This board (P) is equivalent to a cathode.

Since the DC power supply of the circuit board (P) is introduced by the conductive clip 91 of the hanger 90, and the conventional plating system 80 has only one rectifier 82, at the same time, the same plating tank 81 is provided with a plurality of hangers 90 (as shown in FIG. 1). Show 3 groups), but due to the resistance of each hanger 90, poor contact and other factors, it is difficult to obtain the average distribution current; in addition, when the total set current of the actual operation is constant, the single rectifier 82 simultaneously copes with multiple outputs. Terminals A, B, and C, each of the output terminals A, B, and C affect each other, so that the currents of the output terminals A, B, and C are different for each group of plated parts, resulting in coating thickness of each group. Variations occur and cannot be consistent, affecting plating quality.

Therefore, the problem of controlling a plurality of hangers by a rectifier for the conventional plating system is a problem to be solved by the creation.

The reason is that the main purpose of this creation is to provide an intelligent electroplating hanger, which is provided with a current regulator independently on each electroplating hanger, and the input DC fixed power supply directly outputs a steady current according to the demand of electroplating. To the plated parts, each plated part can obtain a stable optimum current value to ensure the quality of the plating.

Another purpose of the creation is to provide an intelligent plating hanger, which can further record the average current and other data used in the electroplating process, and feed the data back to the control center management system through wireless transmission mode, strengthen the electroplating quality control and facilitate the process. The effect of adjustment, etc. is enhanced.

Another purpose of this creation is to provide an intelligent electroplating rack that can control the steady current output of each rack in addition to the wireless transmission mode, and can also directly adjust and obtain current through the panel through the manual input interface. The convenience of the data.

In order to achieve the above objectives, the technical means adopted by the present invention comprises: a conductive frame mounted on an electrode plate of an electroplating system, and a DC fixed power source is obtained therefrom; a control body is connected to the conductive frame The control body includes: a processor; a memory coupled to the processor; a current regulator coupled to the processor and electrically connected to the conductive frame, the current regulator according to the processor Controlling to output a stable current; a current detecting unit coupled to the processor and the output of the current regulator; a current display coupled to the current detecting unit, the display surface of which is exposed in the control body a surface for displaying an output current value; a manual input interface is disposed on the surface of the control body and coupled to the processor; a first wireless transmission unit coupled to the processor for obtaining the electroplating process Data The wireless transmission mode is fed back to a management system; and a rack (Rack) is connected to the control body, and the upper end has a conductive plate connected to the current output end for obtaining a stable output current after passing the current regulator, and sending To the plated parts on the hanger.

According to the foregoing feature, the rack can be formed by a hanger, and the hanger includes a cross bar and a plurality of conductive clips electrically connected under the conductive plate.

In addition, in another possible embodiment, the rack (Rack) may be formed by a bracket, and the bracket includes a frame electrically connected under the conductive plate, and any pair of sides of the frame are provided with a plurality of frames. Conductive clips.

According to the foregoing features, a management center is further disposed at a periphery of the electroplating apparatus, and includes a central control unit and a storage unit, and a second wireless transmission unit is coupled to the central control unit, and The first wireless transmission unit has a mutual transmission function. In a possible embodiment, the central control unit and the storage unit can be a computer.

According to the foregoing feature, a remote controller is further provided for transmitting a signal to the control body, and the current value of the current output terminal to the hanger is controlled by the current regulator.

According to the foregoing feature, the manual input interface of the control body comprises a button or a rotary button, and the current value of the current output terminal to the hanger can be set through the manual input interface.

With the help of the above-mentioned technical means, each electroplating rack has a current regulator independently, which replaces the traditional one-to-many current control method with "one-to-one" to solve the problem of irregular current usage. Point, so that each plated piece can obtain a stable optimal current value to ensure the quality of plating. Further, the average current and other data used in the electroplating process can be recorded, and the data can be fed back to the control center management system through wireless transmission to enhance plating. Improved quality control and ease of process adjustment.

10‧‧‧ Conductive frame

20‧‧‧Control body

21‧‧‧ Processor

22‧‧‧ memory

23‧‧‧ Current Regulator

231‧‧‧current output

24‧‧‧current detection unit

25‧‧‧ Current display

26‧‧‧Manual input interface

27‧‧‧First wireless transmission unit

30‧‧‧ hanging

31‧‧‧ Conductive plate

32A‧‧‧ hanger

32B‧‧‧ bracket

33‧‧‧crossbar

34‧‧‧conductive clip

35‧‧‧ frame

40‧‧‧Smart plating hanger

50‧‧‧Control Center Management System

51‧‧‧Central Control Unit

52‧‧‧ storage unit

53‧‧‧Second wireless transmission unit

54‧‧‧ computer

60‧‧‧Remote control

70‧‧‧ plating system

71‧‧‧Electrode plate

72‧‧‧DC fixed power supply

Figure 1 is a front elevational view of a conventional plating rack.

Figure 2 is a side cross-sectional view of a conventional plating rack.

Figure 3 is a perspective view of one possible embodiment of the present invention.

Figure 4 is a cross-sectional view taken along line 4-4 of Figure 3.

Figure 5 is a perspective view of another possible embodiment of the present invention.

Figure 6 is a block diagram of the circuit structure of the present creation.

Figure 7 is a flow chart of the current control of the present creation.

Certain terms are used in this specification and subsequent patent claims to refer to particular elements. It should be understood by those skilled in the art that a hardware manufacturer may refer to a component by a different noun. In the present specification and subsequent patent claims, the difference in name is not used as the means for distinguishing the elements, but the difference in function of the elements is used as the criterion for distinguishing. The term "including" as used in the specification and subsequent claims is an open term and should be interpreted as "including but not limited to". In addition, the term "coupling" is used herein to include any direct and indirect electrical connection means. Therefore, if a first circuit is coupled to a second circuit, it means that the first circuit can be directly electrically connected. The second circuit is electrically connected to the second circuit indirectly via other devices or connection means.

First, referring to FIG. 3 to FIG. 7, a preferred embodiment of the present intelligent electroplating rack 40 includes: a conductive frame 10 mounted on an electrode plate 71 of a plating system 70, and is Obtaining a DC fixed power source 72; a control body 20 is connected to the conductive frame 10, The control unit 20 includes: a processor 21; a memory 22 coupled to the processor 21; a current regulator 23 coupled to the processor 21, and electrically connected to the conductive frame 10, the current regulator 23 adjusts the output current according to the control of the processor 21. Since the electroplating power supply has two working modes of a regulated current limiting and a steady current limiting voltage, in the embodiment, the DC fixed power supply 72 can be transmitted through a voltage regulating or shunting method according to requirements, for example, The variable resistance or the like directly controls the output current, and the set value is displayed on the surface of the control body 20 through a current detecting unit 24 and a current display 25.

As shown in FIG. 6, the current detecting unit 24 is coupled to the output end of the processor 21 and the current regulator 23. The current display 25 is coupled to the current detecting unit 24, and its display surface is displayed. Exposed on the surface of the control body 20 for displaying the output current value. In this embodiment, the current detecting unit 24 and the current display 25 can be formed by an ammeter 28, and the current commercially available ammeter has current measurement. And current display function.

As shown in FIG. 3, a manual input interface 26 is disposed on the surface of the control body 20 and coupled to the processor 21; a first wireless transmission unit 27 is coupled to the processor 21 for the electroplating process. The obtained data is fed back to a control center management system 50 by wireless transmission. The manual input interface 26 of the control body 20 is formed by a button or a rotary button. The current input terminal 231 can be used to set the current value of the current output terminal 231 to the hanger 30. As for the control center management system 50, it is provided around the plating system 70, and will be described later.

A rack 30 is connected to the control body 20, and a conductive plate 31 is connected to the current output end 231 at the upper end for obtaining a stable output current after passing through the current regulator 23, and is sent to the rack 30. Plated parts (P). As shown in FIG. 3 and FIG. 4 , in the embodiment, the hanger 30 can be formed by a hanger 32A. The hanger 32A includes a cross bar 33 and a plurality of conductive clips electrically connected to the conductive plate 31 . 34; but is not limited to this. Referring to FIG. 5, the hanger 30 can also be formed by a bracket 32B. The bracket 32B includes an electrical connection under the conductive plate 31. A frame 35 is attached, and a plurality of conductive clips 34 are disposed on either side of the frame 35. Therefore, in this embodiment, the hanger 30 can be implemented regardless of the type.

The control center management system 50 includes a central control unit 51 and a storage unit 52. The second wireless transmission unit 53 is coupled to the central control unit 51 and has a first wireless transmission unit 27. Transfer each other. In this embodiment, the central control unit 51 and the storage unit 52 can be configured by a computer 54. The control center management system 50 is a device of the electroplating system 70, which is not a major patent feature of the present invention; however, the data obtained by the electroplating process can be obtained by the creative smart device 40 through the first wireless transmission unit 27, For example, the average current value used for the plated part (P) during the electroplating process is fed back to the control center management system 50 by wireless transmission, which enhances the electroplating quality control and facilitates process adjustment and the like. Moreover, the first and second wireless transmission units are configured to be any of WiFi, BlueTooth, RFID, and the like.

In this embodiment, a remote controller 60 is further included for transmitting a signal to the control body 20, and the current regulator 23 controls the current value of the current output terminal 231 to the hanger 30.

The current control system of this creation is shown in the flow chart shown in Figure 7, and the steps after the start include:

Step S1: The smart plating hanger 40 is mounted with the plating member (P) into the electrode plate 71 of the plating system 70.

Step S2: The DC fixed power source 72 is supplied to the smart plating hanger 40 through the electrode plate 71.

Step S3: The current regulator 23 adjusts and controls the stable output current value according to the plating (P) specification, which can be set by the manual input interface 26 or the remote controller 60 to set the current value. In a possible embodiment, but not limited to, the current regulator 23 can transmit an analog signal of the DC fixed power source 72 to the A/D converter through an A/D converter and a D/A converter. Converting to a digital signal, causing processor 21 to know the current by digital signal The value of the memory 22 can temporarily memorize the relationship between the plating plate (P) specification and the current value. When the plating component (P) specification is determined, the processor 21 can determine the required current value, and thus the current current value. Below the range, the desired current value can be controlled, and the digital signal of the desired current value is converted to an analog signal by the D/A converter, and the analog signal is sent to the current output terminal 231. However, there are many ways to adjust and control the current.

Step S4: Recording data related to the plating process, for example, the memory 22 can record the plating time, the average current value, and the like.

Step S5: The data is fed back to the control center management system 50 by wireless transmission, that is, the control center management system 50 receives the data fed back by the smart plating rack 40 by the second wireless transmission unit 53, and stores it by the storage unit 52. The output current value of each of the smart plating tongs 40 can be controlled by the manual input interface 26 or the remote controller 60.

Step S6: After the electroplating is completed, the record data of the smart plating hanger 40 is cleared. For example, the memory 22 can clear all the materials of the previous plating component (P), so that the smart plating hanger 40 can be returned to the electroplating again. At the beginning of system 70, a new plated part is placed. Finally ended.

With the technical features of the above-mentioned technology, each electroplating fixture has a current regulator independently, which replaces the traditional one-to-many current control method with one-to-one, through record, feedback, and wireless. Or manual control, etc., so that each plated part can obtain a stable optimal current value to ensure the improvement of plating quality.

In summary, the technical means revealed in this creation are indeed new types of patents such as "novelty", "progressiveness" and "available for industrial use", and pray for the patents to be promoted by the bureau. German sense. However, the above-mentioned drawings and descriptions are only for the purpose of this creation. For the best example, the modifications or equivalent changes made by those who are familiar with this skill in the spirit of the case should still include the scope of the patent application in this case.

10‧‧‧ Conductive frame

20‧‧‧Control body

25‧‧‧ Current display

26‧‧‧Manual input interface

30‧‧‧ hanging

31‧‧‧ Conductive plate

32A‧‧‧ hanger

33‧‧‧crossbar

34‧‧‧conductive clip

40‧‧‧Smart plating hanger

50‧‧‧Control Center Management System

60‧‧‧Remote control

70‧‧‧ plating system

71‧‧‧Electrode plate

72‧‧‧DC fixed power supply

Claims (9)

An intelligent electroplating rack comprises: a conductive frame mounted on an electrode plate of a plating system, and a DC fixed power source is obtained therefrom; a control body is connected to the conductive frame, the control body comprises: a processor coupled to the processor; a current regulator coupled to the processor and electrically coupled to the conductive frame, the current regulator outputting a stable current according to the control of the processor a current detecting unit coupled to the processor and the output of the current regulator; a current display coupled to the current detecting unit, the display surface of which is exposed on the surface of the control body for displaying output a current input interface is disposed on the surface of the control body and coupled to the processor; a first wireless transmission unit coupled to the processor for transmitting data obtained by the electroplating process through wireless transmission Feedback to a control center management system; and a rack connected to the control body, the upper end of which has a conductive plate connected to the current output terminal for obtaining stability after passing the current regulator Output current, and sent to the plating on the rack. The smart plating hanger of claim 1, wherein the hanger is composed of a hanger, and the hanger comprises a crossbar and a plurality of conductive clips electrically connected under the conductive plate. The smart plating rack of claim 1, wherein the rack is formed by a bracket, the bracket includes a frame electrically connected under the conductive plate, and any one side of the frame is disposed There are a plurality of conductive clips. The intelligent electroplating rack of claim 1, wherein the control center management system is disposed around the electroplating apparatus, and includes a central control unit and a storage unit, and a second wireless transmission unit coupled The central control unit is connected to and has a mutual transmission function with the first wireless transmission unit. The smart plating rack of claim 4, wherein the central control unit and the storage unit are formed by a computer. The smart plating rack of claim 1, further comprising a remote controller for transmitting a signal to the control body, and controlling the current value of the current output to the rack through the current regulator. The smart plating device of claim 1, wherein the input interface of the control body comprises a button or a button, and the current value of the current output terminal to the device can be set through the manual input interface. The smart plating device of claim 4, wherein the first and second wireless transmission units comprise any of WiFi, BlueTooth, and RFID. The smart plating device of claim 1, wherein the current detecting unit and the current display are formed by an ammeter.