TWM509448U - USB Type-C connector module - Google Patents

Description

USB Type-C connector module (1)

This creation relates to connectors, and more particularly to connector modules.

With the development of the semiconductor industry, various electronic devices have been introduced, especially electronic devices such as personal computers, tablet computers, and smart phones. Moreover, due to their convenience and powerful functionality, they have rapidly spread to the general public.

In recent years, with the popularization of the universal serial bus (USB) connector, almost all types of electronic devices are equipped with a USB port, whereby the user can easily transfer data through the USB interface. . At present, the most widely used USB interface is USB 2.0 specification supporting 480Mbps high-speed transmission rate (Hi-Speed), USB 3.0 specification supporting 5Gbps ultra-high speed (Super-Speed), and mainly for portability. Micro USB specifications used in electronic devices (such as smart phones).

However, with the rapid development of electronic devices, the aforementioned USB2.0, USB3.0 and Micro USB transmission rates have been unable to meet the needs of some users. Therefore, a new generation of USB 3.1 specifications has been developed in the market recently, and among them, the USB 3.1 Type-C specification capable of supporting a transmission rate of 10 Gbps is most attracting attention of users.

Due to the complexity of the USB Type-C and up to 24 Terminal, so if you want to set the USB Type-C connector on the electronic device, you need to set one or more additional chips on the motherboard, for example, through the configuration channel terminal (Configuration Channel, CC) of the USB Type-C connector. A chip for judging the output signal, a wafer for switching the USB Type-C upper and lower signals, and a wafer for amplifying the output/input signal.

However, the above-mentioned chip will occupy a valuable configuration space on the motherboard, causing the problem that the space on the motherboard is insufficient. Therefore, in the modern era where electronic devices are miniaturized, how can the USB Type-C interface be supported while the space on the motherboard is not wasted due to the setting of the chips, and the motherboard is Difficulties in wiring are the directions that researchers in this field are concentrating on.

The main purpose of this creation is to provide a USB Type-C connector module, which is provided with a USB Type-C connector and a chip having a configuration channel function in the same connector module, so as to facilitate the setting and circuit of the external motherboard. simplify.

In order to achieve the above object, the USB Type-C connector of the present invention comprises at least a circuit board, and a USB Type-C connector electrically connected to the circuit board, a configuration channel chip and a plurality of lead terminals. The two configuration channel terminals of the USB Type-C connector are electrically connected to the configuration channel chip to receive configuration channel control. A plurality of power terminals of the USB Type-C connector are connected to a power control of an external motherboard through the plurality of conductive terminals A chip to receive output power. The plurality of data terminals of the USB Type-C connector are connected to a chip set of the external main board through the plurality of lead terminals for data transfer.

The technical effect that the present invention can achieve with respect to the prior art is that a wafer related to the function of the USB Type-C interface, such as a configuration channel wafer, is disposed in a single connector module together with a USB Type-C connector. In this way, when the manufacturer needs to add a USB Type-C interface to the external motherboard, the connector module of the creation can be directly configured, thereby quickly setting the USB Type-C connector on the external motherboard. And related wafers.

Moreover, the present invention sets a chip related to the function of the USB Type-C interface in the connector module, so that no corresponding wafer is required to be disposed on the external motherboard. In this way, the circuit on the external motherboard can be effectively simplified, thereby helping to reduce the circuit design difficulty of the external motherboard, and the manufacturing cost of the external motherboard can be greatly reduced.

1‧‧‧USB Type-C Connector Module

10‧‧‧ boards

11‧‧‧USB Type-C connector

12‧‧‧Configure channel chip

13‧‧‧Connecting terminal

14‧‧‧Outer casing

2, 2'‧‧‧ chipset

22‧‧‧Power Control Wafer

23‧‧‧System Power

24‧‧‧USB Control Wafer

3, 3', 3"‧‧‧ USB Type-C connector module

30‧‧‧ boards

31‧‧‧USB Type-C Connector

32‧‧‧First chip

321‧‧‧Configure channel chip

33‧‧‧second chip

331‧‧‧ Signal conditioning chip

332‧‧‧Signal switching chip

333‧‧‧Signal adjustment/switching chip

34‧‧‧Connecting terminal

35‧‧‧Outer casing

1 is an exploded perspective view of a connector module of a first embodiment of the present invention.

2 is a perspective assembled view of the connector module of the first embodiment of the present invention.

Figure 3 is a connection circuit diagram of the first embodiment of the present invention.

4 is a perspective assembled view of a connector module of a second embodiment of the present invention.

Figure 5 is a connection circuit diagram of a second embodiment of the present invention.

Figure 6 is a connection circuit diagram of a third embodiment of the present invention.

Figure 7 is a connection circuit diagram of a fourth embodiment of the present invention.

For a more detailed understanding of the features and technical aspects of the present invention, reference should be made to the description and the accompanying drawings.

Please refer to FIG. 1 and FIG. 2 , which are respectively a perspective exploded view of a connector module and a three-dimensional combination diagram of a connector module according to a first embodiment of the present invention. The present application discloses a USB Type-C connector module 1, including a USB Type-C connector 11, and at least one chip associated with the functionality of the USB Type-C interface, as described in detail below.

As shown in FIG. 1 and FIG. 2, in the first embodiment of the present invention, the USB Type-C connector module 1 mainly includes a circuit board 10, the USB Type-C connector 11, and a configuration channel chip. 12. A plurality of conductive terminals 13 and an outer casing 14. The USB Type-C connector 11 , the configuration channel wafer 12 , and the plurality of conductive terminals 13 are electrically connected to the circuit board 10 . The outer casing 14 is used to cover the circuit board 10, the USB Type-C connector 11, the arrangement channel wafer 12, and the plurality of conductive terminals 13.

The USB Type-C connector 11 is electrically connected to one side of the circuit board 10 and is exposed outside the outer casing 14. In this embodiment, the USB Type-C connector 11 is mainly a USB Type-C connector female, and the USB The Type-C connector module 1 can be connected to an external USB Type-C connector male (not shown) through the USB Type-C connector 11. In other embodiments, the USB Type-C connector 11 can also be a USB Type-C connector male, and the USB Type-C connector module 1 can be connected to the outside through the UBS Type-C connector 11. A USB Type-C connector female (not shown), through which the data and power are transmitted through the USB Type-C interface, but is not limited.

The configuration channel wafer 12 is electrically connected to the USB Type-C connector 11 through the circuit board 10 (specifically, at least one terminal electrically connected to the USB Type-C connector 11 (for example, CC1 shown in FIG. 3) And the CC2 two terminals)), thereby providing the USB Type-C connector module 1 with the operation of the Configuration Channel (CC) of the USB Type-C interface (described later).

The plurality of conductive terminals are electrically connected to the other side of the circuit board 10 away from the USB Type-C connector 11 , and the USB Type-C connector 11 and the configuration channel are electrically connected through the circuit board 10 . Wafer 12. More specifically, one end of the plurality of conductive terminals 13 is electrically connected to the circuit board 10, and the other ends respectively extend downward and protrude outside the outer casing 14. In this embodiment, the USB Type-C connector module 1 is electrically connected to the main board of an electronic device (not shown) through the other end of the plurality of conductive terminals 13 , so that the electronic device can pass the USB Type. -C connector module 1 uses USB Type-C interface for data and power transmission.

Please refer to FIG. 3 at the same time, which is a connection circuit diagram of the first embodiment of the present invention. As shown in FIG. 3, in the first embodiment of the present invention, the USB Type-C connector module 1 is mainly connected to the motherboard through the plurality of conductive terminals 13 and a chipset on the motherboard. (Platform Controller Hub, PCH) 2, a power control chip 22, and a system power supply 23 are electrically connected.

The USB Type-C connector 11 mainly has a plurality of terminals (for example, 24 ports), and at least two configuration channel (CC) terminals are included. As shown in FIG. 3, in the embodiment, the two configuration channel terminals (CC1, CC2) of the USB Type-C connector are electrically connected to the configuration channel wafer 12 through the circuit board 10, thereby configuring the channel wafer. 12 The second configuration channel terminal can determine whether the USB Type-C connector outputs a USB Type-C signal or outputs a USB 2.0 signal.

Specifically, a portion of the configuration channel wafer 12 is electrically connected to the two configuration channel terminals through the circuit board 10, and another portion is electrically connected to the chip group 2 on the main board through the plurality of connection terminals 13.

As described above, when the USB Type-C connector 11 is triggered by an external connector (not shown), the configuration channel chip 12 transmits a feedback signal of the two configuration channel terminals to the chip group 2, The chipset 2 can determine whether the external connector supports the USB Type-C interface by using the feedback signal. Moreover, the chip set 2 can issue a control command to the configuration channel wafer 12 when determining that the external connector supports the USB Type-C interface. The configuration channel chip 12 can control the USB Type-C connector 11 to output a USB Type-C signal according to the control command.

On the contrary, the chipset 2 can determine that the external connector does not support the USB Type-C interface (for example, the external connector is disposed on a transmission line, and the other end of the transmission line is configured with a USB2 that only supports the USB2.0 interface. The .0 connector) issues another control command to the configuration channel wafer 12, whereby the configuration channel wafer 12 controls the USB Type-C connector 11 to output a USB 2.0 signal in accordance with the other control command. However, the above description is only one specific example of the present creation, but is not limited thereto.

It is worth mentioning that if the external connector can support the USB Type-C interface, and one of the two configuration channel terminals is determined to be triggered by the external connector, the configuration channel wafer 12 can be based on the chip set 2 The control outputs a connection voltage (Vconn) to another of the configuration channel terminals of the USB Type-C connector 11.

Specifically, the configuration channel wafer 12 is electrically connected to the power control chip 22 and the chip group 2 on the main board through a first guiding terminal and a second guiding terminal of the plurality of guiding terminals 13 respectively. In this embodiment, the configuration channel wafer 12 is an active IC, and the power control chip 22 provides the power (Vcc) required for the configuration of the channel wafer 12 through the first conductive terminal. And the configuration channel wafer 12 is connected to the chip group 2 through the second conductive terminal, and receives the control of the chip group 2, and is received by the first conductive terminal when the USB Type-C connector 11 is needed. Power control crystal The connection voltage supplied from the slice 22 is output to the USB Type-C connector 11. The function of the connection voltage belongs to the common knowledge of the USB Type-C interface, and will not be described here.

The plurality of power terminals of the USB Type-C connector 11 further include a plurality of power terminals. In this embodiment, the plurality of power terminals are electrically connected to the plurality of lead terminals 13 through the circuit board 10, and the power control chip 22 on the main board is electrically connected through the plurality of lead terminals 13. In the present creation, the power control chip 22 is also electrically connected to the system power supply 23 on the main board and receives the power output of the system power supply 23. Thereby, the USB Type-C connector 11 can receive the required operating voltage (VBUS) from the power control chip 22 for external output.

More specifically, the system power supply 23 of the motherboard is typically a 12V power supply. The power control chip 22 receives the power output from the system power supply 23, and performs voltage drop according to the demand of the USB Type-C connector 11, and then outputs it to the outside. For example, in the present embodiment, the connection voltage (Vconn) is 5V, and the operating voltage (VBUS) is 5V.

The plurality of terminals of the USB Type-C connector 11 further include a plurality of data terminals. In this embodiment, the plurality of data terminals are electrically connected to the plurality of conductive terminals 13 through the circuit board 10, and the plurality of conductive terminals 13 are directly electrically connected to the chip set 2 on the main board. Thereby, the motherboard can perform data transmission with the external by the USB Type-C connector 11.

As shown in FIG. 3, in this embodiment, the USB Type-C connector 11 mainly transmits the positive data signal (D+) and the negative data signal (D-) corresponding to the USB2.0 interface through the plurality of data terminals and the chip group 2.

The USB Type-C connector 11 can also transmit two sets of high-speed transmission positive signals (SSTx+), high-speed transmission negative signals (SSTx-), and high-speed receiving positive signals corresponding to the USB 3.1 interface through the plurality of data terminals and the chip group 2. Signal (SSRx+) and high speed receiving negative signal (SSRx-). It is to be noted that the chip set 2 in this embodiment is exemplified by a chip set capable of directly supporting at least 6 sets of USB 3.1 signals, so that no chip for signal switching needs to be additionally disposed on the main board (generally For the PCI-E signal to a single USB3.1 signal conversion chip), two sets of USB3.1 interface signals can be directly provided to the USB Type-C connector module 1 to support the USB Type-C connection at the same time. Two sets of USB3.1 signals required by the upper and lower layers of the device 11 (such as Tx1, Rx1 (ie, the first set of USB3.1 signals) and Tx2, Rx2 (the second set of USB3.1 signals) shown in FIG. 3) .

In addition, the USB Type-C connector 11 can also transmit a differential signal (Lane0) corresponding to the channel 0 of the display port (DisplayPort) interface, a differential signal of the channel 1 (Lane1), and the chip group 2 through the plurality of data terminals. Channel 2's differential signal (Lane2), channel 3's differential signal (Lane3), and the auxiliary channel's differential signal (AUX). In this way, the USB Type-C connector 11 can integrate the USB2.0 signal, the USB 3.1 signal and the DisplayPort signal provided by the chipset 2 to form a USB Type-C signal, and then the USB Type-C connection. The module 1 can transmit data to and from the outside through the USB Type-C interface.

In this embodiment, the USB Type-C connector 11 and the configuration channel chip 12 are commonly disposed in the USB Type-C connector module 1 to save valuable configuration space on the motherboard, and the motherboard is The line configuration can be greatly simplified, which in turn significantly reduces manufacturing costs.

Please refer to FIG. 4 , which is a perspective assembled view of the connector module of the second embodiment of the present invention. The second embodiment of the present invention discloses another USB Type-C connector module 3, including a circuit board 30, a USB Type-C connector 31, a first chip 32, a second chip 33, and a plurality of The terminal 34 is connected to the outer casing 35.

The circuit board 30, the USB Type-C connector 31, the first chip 32, the plurality of conductive terminals 34, and the outer casing 35 of the embodiment are the same as the circuit board 10 in the first embodiment. The USB Type-C connector 11, the configuration channel wafer 12, the plurality of conductive terminals 13 and the outer casing 14 are the same and will not be described again.

The USB Type-C connector module 3 of the present embodiment differs from the USB Type-C connector module 1 described above in that it further includes the second wafer 33 electrically connected to the circuit board 30. The second chip 33 is electrically connected to the USB Type-C connector 31 through the circuit board 30, and the plurality of conductive terminals 34 are electrically connected to the USB Type-C connector 31 through the circuit board 30. A wafer 32 and the second wafer 33.

Referring to FIG. 5, a connection circuit diagram of a second embodiment of the present invention is shown. In this embodiment, the first wafer 32 is a configuration channel wafer 321 . And electrically connected to the two configuration channel terminals (CC1, CC2) of the USB Type-C connector 31. In this embodiment, the configuration of the configuration channel chip 321 and the two configuration channel terminals and the plurality of power terminals of the USB Type-C connector 31 are the same as those described in the first embodiment, and details are not described herein.

In this embodiment, the plurality of data terminals in the USB Type-C connector 31 includes a plurality of first data terminals, and the plurality of first data terminals are electrically connected to the second wafer 33 through the circuit board 30, and the second chip 33 is connected to the chip set 2 on the main board of the external electronic device through the plurality of lead terminals 34. The plurality of first data terminals include a plurality of upper layer terminals and a plurality of lower layer terminals. Therefore, as shown in FIG. 5, the plurality of first data terminals in the USB Type-C connector 31 are mainly connected through two data transmission paths. The second chip 33 receives the upper USB Type-C signal output from the chip set 2 and the lower USB Type-C signal.

In addition, the plurality of data terminals of the USB Type-C connector 31 further includes a plurality of second data terminals. The plurality of second data terminals are electrically connected to the plurality of lead terminals 34 through the circuit board 30, and are directly connected to the chip group 2 through the plurality of lead terminals 34, thereby transmitting corresponding to the USB2.0 interface with the chip group 2 Positive data signal (D+) and negative data signal (D-).

Specifically, in the embodiment, the second wafer 33 is a signal conditioning wafer 331. The plurality of first data terminals of the USB Type-C connector 31 are electrically connected to the signal conditioning chip 331 through the two data transmission paths, and the signal conditioning chip 331 is electrically connected through the plurality of conductive terminals 34. Connecting the chip set 2, and transmitting two sets of high-speed transmission positive signals (SSTx+), high-speed transmission negative signals (SSTx-), high-speed receiving positive signals (SSRx+), and high-speed receiving negatives corresponding to the USB 3.1 interface with the chip set 2 Signal (SSRx-), and the differential signal (Lane0) of channel 0 corresponding to the DisplayPort interface, the differential signal of lane 1 (Lane1), the differential signal of channel 2 (Lane2), the differential signal of channel 3 (Lane3), and the auxiliary channel Differential signal (AUX).

According to the above, the USB Type-C connector module 3 can amplify the DisplayPort signal and the USB 3.1 signal outputted by the signal conditioning chip 331 to the chip group 2 to solve the problem that the distance is too long. Signal attenuation problem. Similarly, the USB Type-C connector module 3 can amplify the received signal via the signal conditioning chip 331 and output it to the chip set 2. In this embodiment, since the USB 2.0 signal outputted by the chip set 2 has no problem of signal attenuation, the signal conditioning chip 331 is not required to be processed.

It should be noted that the signal conditioning chip 331 is also electrically connected to the configuration channel wafer 321 through the circuit board 30. Thereby, the control of the arrangement channel wafer 321 is accepted (the arrangement channel wafer 321 is controlled by the wafer group 2), and when necessary, the operation of the signal adjustment wafer 331 is controlled by the arrangement channel wafer 321 to The signal output from the chip set 2/the USB Type-C connector 31 is amplified.

In this embodiment, the USB Type-C connector 31, the configuration channel chip 321 and the signal conditioning chip 331 are collectively disposed on the USB. In the Type-C connector module 3, the valuable configuration space on the motherboard is saved, and the circuit configuration of the motherboard can be greatly simplified.

Referring to Figure 6, a connection circuit diagram of a third embodiment of the present invention is shown. A third embodiment of the present invention discloses a USB Type-C connector module 3' having the same circuit board 30 as the USB Type-C connector module 3 of the second embodiment, and the USB The Type-C connector 31, the first wafer 32, the second wafer 33, the plurality of conductive terminals 34, and the outer casing 35 are not described herein. The main difference between the USB Type-C connector module 3' and the USB Type-C connector module 3 disclosed in FIG. 5 is that the second chip 33 in the USB Type-C connector module 3' is A signal switches wafer 332.

More specifically, the USB Type-C connector module 3' is mainly used to connect a motherboard (not shown) of another electronic device, and a chip set 2' on the motherboard, the power control chip 22, The system power supply 23 and a USB control chip 24 are electrically connected. In this embodiment, the chipset 2' can only support a single set of USB 3.1 signals through the PCI-E interface, so the USB control chip 24 needs to be converted and simulated as a multi-turn. The USB 3.1 signal is further switched by the signal switching chip 332 to support the two sets of USB 3.1 signals required by the upper and lower layers of the USB Type-C connector 31.

As shown in FIG. 6, in the embodiment, the plurality of second data terminals of the USB Type-C connector 31 are the same as the embodiment shown in FIG. The circuit board 30 is electrically connected to the plurality of lead terminals 34, and is directly connected to the chip group 2' through the plurality of lead terminals 34, thereby transmitting a positive data signal corresponding to the USB2.0 interface with the chip group 2'. (D+) and negative data signal (D-).

The plurality of first data terminals of the USB Type-C connector 31 are electrically connected to the signal switching chip 332 through the two data transmission paths, respectively, and a part of the signal of the signal switching chip 332 passes through the plurality of guiding terminals. 34 electrically connecting the USB control chip 24 on the main board, thereby transmitting two sets of high-speed transmission positive signals corresponding to the USB 3.1 interface with the chip set 2' through the signal switching chip 332 and the USB control chip 24. (SSTx+), high-speed transmission negative signal (SSTx-), high-speed reception positive signal (SSRx+) and high-speed reception negative signal (SSRx-), that is, Tx1, Rx1 (the first group of USB3.1 signals) shown in Figure 6 and Tx2, Rx2 (second group USB3.1 signal).

In addition, the other pins of the signal switching chip 332 are directly electrically connected to the chip group 2 ′ through the plurality of guiding terminals 34 , and the differential signal (Lane 0 ) corresponding to the channel 0 of the DisplayPort interface is transmitted with the chip group 2 ′, Channel 1 differential signal (Lane1), channel 2 differential signal (Lane2), channel 3 differential signal (Lane3) and auxiliary channel differential signal (AUX).

It is worth mentioning that one of the pins of the signal switching chip 332 is also electrically connected to the configuration channel wafer 321 through the circuit board 30. Thereby, the control of the configuration channel wafer 321 is accepted (the configuration channel wafer 321 is subject to The control of the chip set 2', and if necessary, the operation of the signal switching chip 332 by the configuration channel wafer 321 to output the first set of USB 3.1 signals (Tx1, Rx1) to the USB control chip 24. And the second group of USB3.1 signals (Tx2, Rx2) are switched (corresponding to the upper layer signal and the lower layer signal of the USB Type-C connector 31 respectively).

More specifically, the chip set 2' receives the feedback signals of the two configuration channel terminals (CC1, CC2) from the configuration channel wafer 321, and thereby determines that the USB Type-C connector 31 is triggered by the upper layer twelve. The root terminal is also the twelve terminals of the lower layer. And the chip set 2 ′ sends a control signal to the configuration channel wafer 321 to control the operation of the signal switching chip 332 according to the determination result, so that the signal switching chip 332 switches one of the two sets of USB 3.1 signals (via One of the two data transmission paths is output to the USB Type-C connector 31.

In this embodiment, the USB Type-C connector 31, the configuration channel chip 321 and the signal switching chip 332 are collectively disposed in the USB Type-C connector module 3', thereby saving valuable on the motherboard. The configuration space and the circuit configuration of the motherboard can be greatly simplified.

Continuing to refer to FIG. 7, a connection circuit diagram of a fourth embodiment of the present invention is shown. FIG. 7 discloses another USB Type-C connector module 3", which differs from the USB Type-C connector module 3 and 3' described above in the USB Type-C connector module 3" The second chip 33 is a signal adjustment/switching chip having a signal adjustment function and a signal switching function. 333.

In this embodiment, the plurality of second data terminals of the USB Type-C connector 31 are the same as the embodiment shown in FIG. 5 and FIG. 6, and the plurality of conductive terminals 34 are electrically connected through the circuit board 30, and The chip group 2' is directly connected through the plurality of lead terminals 34, thereby transmitting a positive data signal (D+) and a negative data signal (D-) corresponding to the USB2.0 interface with the chip group 2'.

The plurality of first data terminals of the USB Type-C connector 31 are electrically connected to the signal conditioning/switching chip 333 through the circuit board 30, respectively. More specifically, the plurality of first data terminals includes a plurality of upper layer terminals and a plurality of lower layer terminals, and the signal conditioning/switching wafer 333 is connected through the two data transmission paths respectively.

A portion of the signal of the signal conditioning/switching chip 333 is directly connected to the chip group 2' on the main board through the plurality of guiding terminals 34, and transmits a differential signal corresponding to the channel 0 of the DisplayPort interface with the chip group 2' (Lane0) ), channel 1 differential signal (Lane1), channel 2 differential signal (Lane2), channel 3 differential signal (Lane3) and auxiliary channel differential signal (AUX).

In addition, the other pins of the signal conditioning/switching chip 333 are also connected to the USB control chip 24 on the main board through the plurality of guiding terminals 34, thereby adjusting/switching the chip 333 and the USB control chip 24 through the signal. And the chipset 2' transmits two sets of high-speed transmission positive signals (SSTx+), high-speed transmission negative signals (SSTx-), high-speed receiving positive signals corresponding to the USB 3.1 interface. (SSRx+) and high-speed reception negative signal (SSRx-), that is, Tx1, Rx1 (first group USB 3.1 signal) and Tx2, Rx2 (second group USB 3.1 signal) shown in FIG.

It is worth mentioning that one of the pins of the signal conditioning/switching chip 333 is also electrically connected to the configuration channel wafer 321 through the circuit board 30. Thereby, the control of the arrangement channel wafer 321 is accepted (the configuration channel wafer 321 is controlled by the wafer group 2'), and the signal adjustment/switching wafer 333 is controlled by the configuration channel wafer 321 when needed. Switching between the first set of USB 3.1 signals (Tx1, Rx1) outputted by the USB control chip 24 and the second set of USB 3.1 signals (Tx2, Rx2), and the chipset 2'/the USB Type-C The signal output from the connector 31 is amplified. In other words, the signal conditioning/switching chip 333 in this embodiment is integrated with the signal conditioning chip 331 and the signal switching chip 332 in the foregoing embodiment, and is used to support a single group only through the PCI-E interface. The chipset 2' of the USB 3.1 signal.

In this embodiment, the USB Type-C connector 31, the configuration channel chip 321 and the signal conditioning/switching chip 333 having the signal adjustment function and the signal switching function are collectively disposed on the USB Type-C connector module. In the 3", the valuable configuration space on the motherboard is saved, and the circuit configuration of the motherboard can be greatly simplified.

The above is only a specific description of a preferred embodiment of the present invention, and is not intended to limit the scope of the patents of the present invention, and any other equivalent transformations are within the scope of the patent application described below.

1‧‧‧USB Type-C Connector Module

10‧‧‧ boards

11‧‧‧USB Type-C connector

12‧‧‧Configure channel chip

13‧‧‧Connecting terminal

14‧‧‧Outer casing

Claims (11)

[Item 1] A USB Type-C connector module is disposed on an external motherboard, including:
a circuit board;
a USB Type-C connector electrically connected to one side of the circuit board and having at least two configuration channel terminals, a plurality of power supply terminals, and a plurality of data terminals;
a channel chip is electrically connected to the circuit board; and a plurality of conductive terminals are electrically connected to the other side of the circuit board away from the USB Type-C connector, and the USB is electrically connected through the circuit board a Type-C connector and the configuration channel wafer;
The two configuration channel terminals of the USB Type-C connector are electrically connected to the configuration channel chip through the circuit board, and the plurality of power terminals are electrically connected to a power control chip of the external motherboard through the plurality of connection terminals. The plurality of data terminals are electrically connected to a chip set of the external main board through the plurality of lead terminals, and the configuration channel chip is electrically connected to the chip set through the plurality of lead terminals, and the feedback signals of the two configuration channel terminals are transmitted to the The chipset is used to make a judgment on the USB Type-C interface. [Item 2] The USB Type-C connector module of claim 1, wherein the configuration channel chip is further connected to the power control chip through the plurality of conductive terminals, and the power control chip receives a connection voltage (Vconn) and outputs the same Two of the configuration channel terminals. [Item 3] The USB Type-C connector module according to claim 2, wherein the USB Type-C connector transmits the positive data signal (D+) and the negative data corresponding to the USB2.0 interface through the plurality of data terminals and the chipset. Signal (D-). [Item 4] The USB Type-C connector module of claim 3, wherein the USB Type-C connector transmits two sets of high-speed transmission positive signals (SSTx+) corresponding to the USB 3.1 interface through the plurality of data terminals and the chipset. High-speed transmission of negative signals (SSTx-), high-speed reception of positive signals (SSRx+) and high-speed reception of negative signals (SSRx-). [Item 5] The USB Type-C connector module according to claim 4, wherein the USB Type-C connector transmits a differential signal (Lane0) corresponding to the channel 0 of the DisplayPort interface and the channel 1 through the plurality of data terminals and the chipset. Differential signal (Lane1), channel 2 differential signal (Lane2), channel 3 differential signal (Lane3) and auxiliary channel differential signal (AUX). [Item 6] A USB Type-C connector module is disposed on an external motherboard, including:
a circuit board;
a USB Type-C connector electrically connected to one side of the circuit board and having at least two configuration channel terminals, a plurality of power supply terminals, a plurality of first data terminals, and a plurality of second data terminals;
a first chip electrically connected to the circuit board, and electrically connected to the USB Type-C connector through the circuit board, wherein the first chip is a configuration channel wafer;
a second chip electrically connected to the circuit board and electrically connected to the USB Type-C connector through the circuit board; and a plurality of conductive terminals electrically connected to the circuit board away from the USB Type-C connection The other side of the device, and electrically connecting the USB Type-C connector, the first wafer and the second wafer through the circuit board;
The two configuration channel terminals of the USB Type-C connector are electrically connected to the first chip, and the plurality of power terminals are electrically connected to a power control chip of the external motherboard through the plurality of connection terminals, the plurality of first data The terminals are electrically connected to the second chip through two data transmission paths, and the plurality of second data terminals are electrically connected to a chip set of the external main board through the plurality of reference terminals, and the second wafer passes the plurality of leads The terminal is electrically connected to the chip set;
The first chip is electrically connected to the chip set through the plurality of conductive terminals, and the feedback signals of the two configuration channel terminals are transmitted to the chip set for determining the USB Type-C interface. [Item 7] The USB Type-C connector module of claim 6, wherein the first chip is further connected to the power control chip through the plurality of conductive terminals, and the power control chip receives a connection voltage (Vconn) and outputs the same Two of the configuration channel terminals. [Item 8] The USB Type-C connector module of claim 7, wherein the first chip is electrically connected to the second chip through the circuit board to control the operation of the second chip according to the judgment of the chip group. [Item 9] The USB Type-C connector module of claim 8, wherein the second chip is a signal conditioning chip connected to the chip set through the plurality of conductive terminals, and the plurality of first data terminals adjust the wafer by the signal The chipset transmits two sets of high-speed transmission positive signals (SSTx+), high-speed transmission negative signals (SSTx-), high-speed reception positive signals (SSRx+), and high-speed reception negative signals (SSRx-) corresponding to the USB 3.1 interface, and corresponding to The channel 0 differential signal (Lane0) of the DisplayPort interface, the channel 1 differential signal (Lane1), the channel 2 differential signal (Lane2), the channel 3 differential signal (Lane3), and the auxiliary channel differential signal (AUX), the complex number The second data terminal directly transmits the positive data signal (D+) and the negative data signal (D-) corresponding to the USB2.0 interface through the plurality of conductive terminals and the chip set. [Item 10] The USB Type-C connector module of claim 8, wherein the second chip is a signal switching chip of a USB control chip connected to the motherboard through a plurality of guiding terminals, wherein the plurality of first chips The data terminal switches the chip and the USB control chip through the signal, and transmits two sets of high-speed transmission positive signals (SSTx+), high-speed transmission negative signals (SSTx-), and high-speed reception positive signals (SSRx+) corresponding to the USB 3.1 interface. And receiving a negative signal (SSRx-) at a high speed, and the other pins of the second chip are connected to the chip set through the plurality of lead terminals, and directly transmitting a differential signal corresponding to the channel 0 of the DisplayPort interface with the chip set (Lane0) ), channel 1 differential signal (Lane1), channel 2 differential signal (Lane2), channel 3 differential signal (Lane3) and auxiliary channel differential signal (AUX), the plurality of second data terminals pass through the plurality of reference terminals A positive data signal (D+) and a negative data signal (D-) corresponding to the USB 2.0 interface are directly transmitted with the chipset. [Item 11] The USB Type-C connector module of claim 10, wherein the second chip is a signal conditioning/switching chip having both signal conditioning capability and signal switching capability.