TWM509434U - Optical transceiver module - Google Patents

Description

Photoelectric conversion module

This creation is about solar cells, especially a photoelectric conversion module with a honeycomb-like compartment structure.

Due to the limited resources on the earth, human beings are now facing the dilemma of continuous consumption of resources and the exhaustion of energy. Nuclear power plants have problems in that nuclear waste is not easy to handle. It shows that the development of new generation energy is urgently needed. Question. Among the many new energy technologies in development, solar energy is currently the most reliable new energy source, and it has received considerable attention from all walks of life. Solar energy converters are relatively simple in structure and do not have any regenerative pollution during the conversion process, so they are called "clean energy."

At present, the main structure of a solar power generation device on the market includes a plurality of photoelectric conversion wafers, a transparent glass plate covering the photoelectric conversion wafer, and a bottom plate disposed under the photoelectric conversion wafer. The transparent glass plate protects the solar cell from external damage to prolong the service life of the solar cell. In addition, the high light transmittance of the glass allows the sunlight to smoothly penetrate the glass to reach the photoelectric conversion wafer, so that the photoelectric conversion wafer can generate electricity normally. The laminated plate-like structure of the solar power generation device is weak in strength and is easily damaged if it is improperly transported or installed.

In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

The present invention provides a photoelectric conversion module having a honeycomb-like compartment structure.

The present invention provides a photoelectric conversion module comprising a light transmissive sheet, a back sheet and a plurality of photoelectric conversion wafers. The back plate and the light-transmissive sheet are stacked, and the inside of the back plate forms a plurality of honeycomb-shaped compartments. Each of the photoelectric conversion wafers is interposed between the light-transmissive sheet and the back sheet, and the photoelectric conversion wafers are arranged in a matrix and spaced apart from each other.

Preferably, adjacent two columns of photoelectric conversion wafers are arranged in a spaced relationship. The back sheet and each of the photoelectric conversion wafers are bonded by an adhesive layer. The light transmissive sheet is bonded to each of the photoelectric conversion wafers by an adhesive layer. The honeycomb compartments are attached to each other.

Preferably, each of the honeycomb compartments may extend along a plane direction of the backboard, and the honeycomb compartments may be arranged to form a reflective surface, and the reflective surface has a sawtooth shape.

Preferably, each of the honeycomb compartments may also extend along the forward direction of the backplane, and the adjacent two columns of photoelectric conversion wafers may be arranged at intervals, and a reflector may be disposed between the backplane and each of the photoelectric conversion wafers. The reflector is bonded to each of the photoelectric conversion wafers by an adhesive layer.

The photoelectric conversion module of the present invention has a honeycomb substrate with a back plate having a better structural strength.

Referring to FIG. 1 to FIG. 3, a first embodiment of the present invention provides a photoelectric conversion module including a light transmissive sheet 100, a back sheet 200, a plurality of photoelectric conversion wafers 300, and a pair of adhesive layers 410/420.

The light transmissive sheet 100 may be a transparent sheet made of glass or transparent plastic. In the present embodiment, the light-transmitting sheet 100 is preferably made of glass, which has better light transmittance and better structural strength than the transparent plastic.

The back sheet 200 and the light-transmissive sheet 100 are stacked. In the present example, the back sheet 200 may be made of metal or plastic, and the present invention is not limited thereto. The interior of the backing plate 200 forms a plurality of honeycomb-like compartments 201 that are connected to each other, and each of the honeycomb-shaped compartments 201 has a hollow hexagonal columnar shape. In this embodiment, each of the honeycomb compartments 201 extends in the plane direction of the backboard 200, and the honeycomb compartments 201 are stacked in an array and attached to each other to make the backboard 200 have better structural strength. The honeycomb compartments 201 are arranged on one side of the backboard 200 to form a reflective surface 202, and the reflective surface 202 has a sawtooth shape.

Each of the photoelectric conversion wafers 300 is interposed between the light-transmissive sheet 100 and the back sheet 200. The photoelectric conversion wafers 300 are arranged in a matrix, and the adjacent photoelectric conversion wafers 300 are arranged at intervals. The photoelectric conversion wafers 300 can be electrically connected to each other or electrically connected to each other. This creation is not limited thereto.

In this embodiment, an adhesive layer 410 is disposed on the transparent sheet 100 and located between the transparent sheet 100 and the photoelectric conversion wafers 300; another adhesive layer 420 is disposed on the reflective surface 201 of the back sheet 200. The light-transmitting sheet 100 and the back sheet 200 can thereby be bonded to the respective photoelectric conversion wafers 300, respectively. In this embodiment, the adhesive layer 410/420 is preferably made of a light transmissive resin, and the adhesive layers 410/420 are preferably infiltrated into the spaces between the adjacent photoelectric conversion wafers 300 and bonded to each other, and the adhesive layer is bonded. In addition to the bonding effect, the 410/420 is capable of covering and encapsulating the photoelectric conversion wafers 300 to protect the photoelectric conversion wafer 300.

Referring to FIG. 3, in the embodiment, when the photoelectric conversion module of the present invention is used, the transparent sheet 100 faces the light source, and the light passes through the transparent sheet 100 to reach one side of each photoelectric conversion wafer 300. A portion of the incident light rays do not reach the respective photoelectric conversion wafers 300, and pass through the adhesive layers 410/420 between the photoelectric conversion wafers 300 to reach the reflective surface 202 of the backing plate 200, and are then reflected to the other surface of each of the photoelectric conversion wafers 300. The light is reflected and diffused by the reflective surface 202 having a sawtooth cross section, thereby increasing the contact area between the light and the photoelectric conversion wafer 300, thereby improving the photoelectric conversion efficiency of the photoelectric conversion module.

Referring to FIG. 4 and FIG. 5, a second embodiment of the present invention provides a photoelectric conversion module including a transparent sheet 100, a back sheet 200, a plurality of photoelectric conversion wafers 300, and a pair of adhesive layers 410/420 and a reflective layer. Board 500.

In the present embodiment, the light-transmissive sheet 100 is the same as the first embodiment described above, and the same points are not described in the embodiment.

The back sheet 200 and the light-transmissive sheet 100 are stacked. In the present example, the back sheet 200 may be made of metal or plastic, and the present invention is not limited thereto. The interior of the backing plate 200 forms a plurality of honeycomb-like compartments 201 that are connected to each other, and each of the honeycomb-shaped compartments 201 has a hollow hexagonal columnar shape. In this embodiment, each of the honeycomb compartments 201 extends along the forward direction of the backboard, and the honeycomb compartments 201 are stacked in an array and attached to each other.

Each of the photoelectric conversion wafers 300 is interposed between the light-transmissive sheet 100 and the back sheet 200. The photoelectric conversion wafers 300 are arranged in a matrix, and the adjacent photoelectric conversion wafers 300 are arranged at intervals. The photoelectric conversion wafers 300 can be electrically connected to each other or electrically connected to each other. This creation is not limited thereto. The reflector 500 is stacked on one side of the backplane 200 between the backplane 200 and the photoelectric conversion wafers 300.

In this embodiment, an adhesive layer 410 is disposed on the transparent sheet 100 and located between the transparent sheet 100 and the photoelectric conversion wafers 300; another adhesive layer 420 is disposed on the reflective sheet 500, and the transparent sheet 100 is disposed. And the light reflecting plate 500 can thereby be bonded to each of the photoelectric conversion wafers 300, respectively. In this embodiment, the adhesive layer 410/420 is preferably made of a light transmissive resin, and the adhesive layers 410/420 are preferably infiltrated into the spaces between the adjacent photoelectric conversion wafers 300 and bonded to each other, and the adhesive layer is bonded. In addition to the bonding effect, the 410/420 is capable of covering and encapsulating the photoelectric conversion wafers 300 to protect the photoelectric conversion wafer 300.

Referring to FIG. 5 , in the embodiment, when the photoelectric conversion module of the present invention is used, the transparent sheet 100 faces the light source, and the light passes through the transparent sheet 100 to reach one side of each photoelectric conversion wafer 300 . Part of the incident light rays do not reach the respective photoelectric conversion wafers 300, which pass through the adhesive layers 410/420 between the photoelectric conversion wafers 300 to reach the light reflecting plate 500, and are then reflected to the other surface of each of the photoelectric conversion wafers 300.

The photoelectric conversion module of the present invention has a honeycomb substrate 201 with a honeycomb-like compartment 201, so that the back plate 200 has better structural strength, thereby strengthening the overall structural strength of the photoelectric conversion module. Furthermore, the honeycomb-like compartment 201 can be used to thread the wires connecting the photoelectric conversion wafers 300.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the patents of the present invention. Other equivalent variations of the patent spirit using the present invention are all within the scope of the patent.

100‧‧‧Transparent film

200‧‧‧ Backplane

201‧‧‧ Honeycomb compartment

202‧‧‧reflective surface

300‧‧‧ photoelectric conversion chip

310‧‧‧Wire

410/420‧‧‧Adhesive layer

500‧‧‧reflector

FIG. 1 is a perspective exploded view of the photoelectric conversion module of the first embodiment of the present invention.

2 is a perspective exploded view of the photoelectric conversion module of the first embodiment of the present invention.

FIG. 3 is a schematic diagram showing the working state of the photoelectric conversion module of the first embodiment of the present invention.

4 is a perspective exploded view of the photoelectric conversion module of the second embodiment of the present invention.

FIG. 5 is a schematic view showing the working state of the photoelectric conversion module of the second embodiment of the present invention.

100‧‧‧Transparent film

200‧‧‧ Backplane

201‧‧‧ Honeycomb compartment

300‧‧‧ photoelectric conversion chip

410/420‧‧‧Adhesive layer

500‧‧‧reflector

Claims (11)

A photoelectric conversion module comprising: a light-transmissive sheet; a backing plate disposed in a stacked manner with the light-transmissive sheet; a plurality of honeycomb-shaped compartments formed inside the back-plate; and a plurality of photoelectric conversion wafers, each of the photoelectric conversion wafers being respectively clipped The photoelectric conversion wafers are arranged in a matrix and spaced apart from each other between the light-transmissive sheet and the back sheet. The photoelectric conversion module of claim 1, wherein the adjacent two columns of the photoelectric conversion wafers are arranged in a space. The photoelectric conversion module of claim 1, wherein the backplane and each of the photoelectric conversion wafers are bonded by an adhesive layer. The photoelectric conversion module of claim 1, wherein the light-transmissive sheet and each of the photoelectric conversion wafers are bonded by an adhesive layer. The photoelectric conversion module of claim 1, wherein the honeycomb-shaped compartments are attached to each other. The photoelectric conversion module of claim 1, wherein each of the honeycomb-shaped compartments extends in a planar direction of the backplane. The photoelectric conversion module of claim 6, wherein the honeycomb-shaped compartments are arranged to form a reflective surface, and the reflective surface has a saw-tooth shape. The photoelectric conversion module of claim 1, wherein each of the honeycomb-shaped compartments extends in a forward direction of the backplane. The photoelectric conversion module of claim 8, wherein the adjacent two columns of the photoelectric conversion wafers are arranged in a space. The photoelectric conversion module of claim 9, wherein a reflector is disposed between the backplane and each of the photoelectric conversion wafers. The photoelectric conversion module of claim 10, wherein the reflector is bonded to each of the photoelectric conversion wafers by an adhesive layer.