TWM505912U - Medical diagnosis device and medical system thereof - Google Patents

Medical diagnosis device and medical system thereof Download PDF

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Publication number
TWM505912U
TWM505912U TW104201750U TW104201750U TWM505912U TW M505912 U TWM505912 U TW M505912U TW 104201750 U TW104201750 U TW 104201750U TW 104201750 U TW104201750 U TW 104201750U TW M505912 U TWM505912 U TW M505912U
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Taiwan
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module
lesion
needle assembly
hardness
diagnostic device
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TW104201750U
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Chinese (zh)
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Hsien-Chang Shih
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Hsien-Chang Shih
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Description

醫療診斷裝置及其醫療系統Medical diagnostic device and its medical system

本創作係關於一種醫療診斷裝置及其醫療系統,特別是一種可方便地對病灶進行數據分析及診斷治療的醫療診斷裝置及其醫療系統。The present invention relates to a medical diagnostic device and a medical system thereof, and more particularly to a medical diagnostic device and a medical system thereof that can conveniently perform data analysis and diagnosis and treatment on a lesion.

隨著時代的發展,各式的文明病也日益增多。也因為現代人飲食習慣的改變,造成癌症已經成為了現代人的一大死因。因此能夠及早發現並進行治療是很重要的課題。現今癌症的治療可以分為外科手術切除、放射線、化療、超音波治療以及微波治療等方式,然而外科手術切除、放射線、化療等傳統的治療方式對於病患的身體負擔都很大,並且超音波治療以及微波治療等新興的治療需要使用昂貴的設備及成本,對一般病患來說會是極大的負擔。而且此種醫療儀器的操作繁瑣,對醫療人員來說也無法隨心所欲地使用。With the development of the times, various types of civilized diseases are also increasing. Because of the changes in modern people's eating habits, cancer has become a major cause of death for modern people. Therefore, early detection and treatment is an important issue. Today's cancer treatment can be divided into surgical resection, radiation, chemotherapy, ultrasonic therapy and microwave therapy. However, traditional treatment methods such as surgical resection, radiation, chemotherapy, etc. have a great burden on the patient, and the ultrasound is supersonic. Emerging treatments such as treatment and microwave therapy require expensive equipment and costs, which can be a great burden for the general patient. Moreover, the operation of such medical instruments is cumbersome and cannot be used by medical personnel as desired.

因此,有必要創作一種醫療診斷裝置及其醫療系統,以解決先前技術的缺失。Therefore, it is necessary to create a medical diagnostic device and its medical system to solve the lack of prior art.

本創作之主要目的係在提供一種醫療診斷裝置,其具有可方便地對病灶進行數據分析及診斷治療的效果。The main purpose of the present invention is to provide a medical diagnostic device having the effect of facilitating data analysis and diagnosis and treatment of lesions.

本創作之另一主要目的係在提供一種具有上述醫療診斷裝置之醫療系統。Another primary object of the present invention is to provide a medical system having the medical diagnostic apparatus described above.

為達成上述之目的,本創作之醫療診斷裝置可連接至外部診斷裝置。醫療診斷裝置包括連線模組、針狀組裝模組及微處理模組。連線模組用以傳送或接收連線訊號。針狀組裝模組用以偵測病灶以產生偵測訊號或治療病灶。微處理模組係電性連接連線模組,並與針狀組裝模組互相組裝連接,微處理模組用以接收針狀組裝模組所偵測得到之偵測訊號,並經由連線模組以傳輸至外部診斷裝置,或藉由針狀組裝模組以治療病灶。To achieve the above objectives, the medical diagnostic device of the present invention can be connected to an external diagnostic device. The medical diagnostic device includes a wiring module, a needle assembly module, and a micro processing module. The connection module is used to transmit or receive connection signals. The needle assembly module is used to detect a lesion to generate a detection signal or to treat a lesion. The micro-processing module is electrically connected to the connection module, and is assembled with the needle-shaped assembly module. The micro-processing module is configured to receive the detection signal detected by the needle-shaped assembly module, and is connected to the connection mode. The group is delivered to an external diagnostic device or by a needle assembly module to treat the lesion.

本創作之醫療系統包括外部診斷裝置及醫療診斷裝置。外部診斷裝置具有可搭配醫療診斷裝置的程式軟體。醫療診斷裝置包括連線模組、針狀組裝模組及微處理模組。連線模組用以傳送或接收連線訊號。針狀組裝模組用以偵測病灶以產生偵測訊號或治療病灶。微處理模組係電性連接連線模組,並與針狀組裝模組互相組裝連接,微處理模組用以接收針狀組裝模組所偵測得到之偵測訊號,並經由連線模組以傳輸至外部診斷裝置,或使外部診斷裝置藉由針狀組裝模組以治療該病灶。The medical system of the present invention includes an external diagnostic device and a medical diagnostic device. The external diagnostic device has a program software that can be used with a medical diagnostic device. The medical diagnostic device includes a wiring module, a needle assembly module, and a micro processing module. The connection module is used to transmit or receive connection signals. The needle assembly module is used to detect a lesion to generate a detection signal or to treat a lesion. The micro-processing module is electrically connected to the connection module, and is assembled with the needle-shaped assembly module. The micro-processing module is configured to receive the detection signal detected by the needle-shaped assembly module, and is connected to the connection mode. The group is transmitted to an external diagnostic device, or the external diagnostic device is treated by a needle assembly module to treat the lesion.

為能讓 貴審查委員能更瞭解本新型之技術內容,特舉較佳具體實施例說明如下。In order to enable the reviewing committee to better understand the technical content of the present invention, the preferred embodiments are described below.

以下請先參考圖1係本創作之醫療系統之架構示意圖。Please refer to Figure 1 for a schematic diagram of the architecture of the medical system.

本創作之醫療系統1包括醫療診斷裝置10及外部診斷裝置20。外部診斷裝置20可以為一醫療用之電腦系統,但本創作並不限於此。外部診斷裝置20具有可搭配醫療診斷裝置10的程式軟體。醫療診斷裝置10包括連線模組11、針狀組裝模組12及微處理模組13。連線模組11具有連線通訊功能,用以利用有線或是無線的方式傳送或接收一連線訊號到外部診斷裝置20,本創作並不限制連線模組11的傳輸方式。針狀組裝模組12具有一針型之外觀,本創作並不限定針狀組裝模組12具有的針狀體的粗細長短,但針狀組裝模組12之規格可以用以利用微創方式來偵測一病灶的不同特徵,以產生一偵測訊號。此外針狀組裝模組12也可以利用微創方式做為治療病灶之用。於本創作之一實施例中,病灶可以為癌症腫瘤,但本創作的醫療診斷裝置10並不限於僅能用於治療腫瘤。針狀組裝模組12的各式實施例在之後會有詳細的說明,故在此先不贅述。The medical system 1 of the present invention includes a medical diagnostic device 10 and an external diagnostic device 20. The external diagnostic device 20 can be a medical computer system, but the creation is not limited thereto. The external diagnostic device 20 has a program software that can be used with the medical diagnostic device 10. The medical diagnostic device 10 includes a wiring module 11 , a needle assembly module 12 , and a micro processing module 13 . The connection module 11 has a connection communication function for transmitting or receiving a connection signal to the external diagnostic device 20 by wire or wirelessly. This creation does not limit the transmission mode of the connection module 11. The needle assembly module 12 has a needle-shaped appearance. The present invention does not limit the thick and thin needle-shaped body of the needle assembly module 12, but the specifications of the needle assembly module 12 can be used to utilize a minimally invasive manner. A different feature of a lesion is detected to generate a detection signal. In addition, the needle assembly module 12 can also be used as a treatment for lesions in a minimally invasive manner. In one embodiment of the present invention, the lesion may be a cancerous tumor, but the medical diagnostic apparatus 10 of the present invention is not limited to being used only for treating a tumor. The various embodiments of the acicular assembly module 12 will be described in detail later, and thus will not be described herein.

微處理模組13係電性連接該連線模組11,並選擇性地與不同的針狀組裝模組12互相組裝連接。微處理模組13與針狀組裝模組12之間可以互相卡合、扣合、樞接等方式互相組裝,並利用特殊或制式的接頭來互相電性連接,但本創作並不限制接頭的類別。微處理模組13用以接收該針狀組裝模組12所偵測得到之該偵測訊號,並經由該連線模組11以傳輸至該外部診斷裝置20。藉由上述的作用方式,醫療診斷裝置10可以將測量結果傳輸到外部診斷裝置20,讓外部診斷裝置20內的程式軟體進行計算模擬,以利用外部診斷裝置20的程式軟體來執行診斷輔助。另外外部診斷裝置20也可以藉由微處理模組13控制針狀組裝模組12對病灶進行治療,並且外部診斷裝置20也可隨時調整治療方式。或者直接由醫師直接手動控制針狀組裝模組12對病灶進行治療,本創作並不限於此。The micro-processing module 13 is electrically connected to the connection module 11 and selectively assembled with the different needle-shaped assembly modules 12. The micro-processing module 13 and the needle-shaped assembly module 12 can be mutually assembled by snapping, snapping, pivoting, etc., and electrically connected to each other by using special or standard connectors, but the creation does not limit the joints. category. The detection module 13 receives the detection signal detected by the needle assembly module 12 and transmits the detection signal to the external diagnostic device 20 via the connection module 11 . According to the above-described operation mode, the medical diagnostic apparatus 10 can transmit the measurement result to the external diagnostic device 20, and cause the program software in the external diagnostic device 20 to perform computational simulation to execute the diagnostic assistance using the program software of the external diagnostic device 20. In addition, the external diagnostic device 20 can also control the needle-shaped assembly module 12 to treat the lesion by the micro-processing module 13, and the external diagnostic device 20 can also adjust the treatment mode at any time. Alternatively, the needle assembly module 12 can be directly controlled by the physician directly to treat the lesion, and the creation is not limited thereto.

接著請參考圖2係本創作之醫療診斷裝置之第一實施例之架構示意圖。Next, please refer to FIG. 2, which is a schematic structural diagram of a first embodiment of the medical diagnostic apparatus of the present invention.

由於腫瘤的溫度會高於一般的正常組織,且惡性腫瘤的溫度高於良性腫瘤的溫度,因此於本創作之第一實施例中,醫療診斷裝置10a之針狀組裝模組12a可包括溫度感測模組31及溫度處理器32。溫度感測模組31具有複數之溫度感測點311,用以針對該病灶以得到複數之溫度值。溫度感測點311可以為熱電偶(Thermocouple)製成之感測元件,但本創作並不限於此。由於熱電偶之原理已經被本創作所屬技術領域中具通常知識者所熟悉,故在此不再贅述。溫度處理器32係電性連接至複數之溫度感測點311,用以處理該複數之溫度值以得到溫度偵測訊號。藉此微處理模組13可以將得到的溫度偵測訊號回傳到外部診斷裝置20,外部診斷裝置20即可以準確地得知腫瘤的位置及規模。Since the temperature of the tumor is higher than that of the normal normal tissue, and the temperature of the malignant tumor is higher than the temperature of the benign tumor, in the first embodiment of the present invention, the needle assembly module 12a of the medical diagnostic apparatus 10a may include a temperature sense. The module 31 and the temperature processor 32 are tested. The temperature sensing module 31 has a plurality of temperature sensing points 311 for obtaining a plurality of temperature values for the lesion. The temperature sensing point 311 may be a sensing element made of a thermocouple, but the creation is not limited thereto. Since the principle of the thermocouple has been familiar to those of ordinary skill in the art to which this creation belongs, it will not be repeated here. The temperature processor 32 is electrically connected to the plurality of temperature sensing points 311 for processing the temperature values of the plurality to obtain a temperature detecting signal. The micro-processing module 13 can transmit the obtained temperature detection signal to the external diagnostic device 20, and the external diagnostic device 20 can accurately know the location and scale of the tumor.

接著請參考圖3係本創作之醫療診斷裝置之第二實施例之架構示意圖。Next, please refer to FIG. 3, which is a schematic structural diagram of a second embodiment of the medical diagnostic apparatus of the present invention.

除了溫度之外,腫瘤的硬度會與其他的組織結構不同。雖然依照腫瘤的種類、腫瘤實質與間質的比例及有無變性或壞死等因素,會導致腫瘤比其他的組織較硬或較軟,但可以藉由硬度的不同分辨出腫瘤與其他組織結構的交界。所以於本創作之第二實施例中,醫療診斷裝置10b之針狀組裝模組12b可包括硬度感測模組41、馬達42及硬度處理器43。硬度感測模組41的末端具有一壓電薄膜411,壓電薄膜411係直接接觸於病灶。馬達42係連接於該硬度感測模組41,用以由微處理模組13自動控制來驅動該硬度感測模組41,使該硬度感測模組41前後移動,來藉由該壓電薄膜411接觸病灶以偵測該病灶的硬度值。此外,馬達42也可以由醫師來手動操作,以目視方式來直接調整馬達42,本創作並不限於此。由於壓電薄膜411之原理已經被本創作所屬技術領域中具通常知識者所熟悉,故在此不再贅述。硬度處理器43係電性連接硬度感測模組41用以根據該硬度值以得到該硬度偵測訊號。藉此微處理模組13可以將得到的硬度偵測訊號回傳到外部診斷裝置20,外部診斷裝置20即可以準確地利用不同硬度的差別得知腫瘤的位置及規模。In addition to temperature, the hardness of the tumor will be different from other tissue structures. Although depending on the type of tumor, the ratio of tumor parenchyma to interstitial, and the presence or absence of denaturation or necrosis, the tumor may be harder or softer than other tissues, but the junction of the tumor and other tissue structures may be distinguished by the difference in hardness. . Therefore, in the second embodiment of the present invention, the needle assembly module 12b of the medical diagnostic device 10b may include a hardness sensing module 41, a motor 42 and a hardness processor 43. The end of the hardness sensing module 41 has a piezoelectric film 411 which is in direct contact with the lesion. The motor 42 is connected to the hardness sensing module 41 for automatically controlling the micro-processing module 13 to drive the hardness sensing module 41 to move the hardness sensing module 41 back and forth. The film 411 is in contact with the lesion to detect the hardness value of the lesion. Further, the motor 42 can also be manually operated by a physician to directly adjust the motor 42 in a visual manner, and the present creation is not limited thereto. Since the principle of the piezoelectric film 411 has been familiar to those of ordinary skill in the art to which the present invention pertains, it will not be described herein. The hardness processor 43 is electrically connected to the hardness sensing module 41 for obtaining the hardness detecting signal according to the hardness value. The micro-processing module 13 can transmit the obtained hardness detecting signal to the external diagnostic device 20, and the external diagnostic device 20 can accurately use the difference in hardness to know the location and scale of the tumor.

最後請參考圖4係本創作之醫療診斷裝置之第三實施例之架構示意圖。Finally, please refer to FIG. 4, which is a schematic structural diagram of a third embodiment of the medical diagnostic apparatus of the present invention.

於本創作之第三實施例中,醫療診斷裝置10c之針狀組裝模組12c可包括雷射探頭51、雷射調整器52及內視鏡53。雷射探頭51用以產生一雷射。雷射調整器52係連接於該雷射探頭51,用以調整該雷射之強度。當雷射的強度高時,可以用來燒灼腫瘤。因此由外部診斷裝置20或是由微處理模組13直接控制雷射調整器52,來對腫瘤進行熱燒灼切除。此外,也可由醫師手動操作雷射調整器52,本創作並不限制雷射調整器52的操作方式。另一方面,當雷射的強度低時,可以用來當作內視鏡53的照明光源。內視鏡53用以直接提供影像偵測訊號,再經由連線模組11傳輸到外部診斷裝置20。藉此外部診斷裝置20可以經由微處理模組13以控制雷射調整器52,來調整雷射探頭51以對腫瘤進行燒灼治療,且在燒灼的過程中,也可以利用內視鏡53來得到影像偵測訊號以進行調整,精確地去除病灶,避免傷害到其他的正常組織。In the third embodiment of the present invention, the needle assembly module 12c of the medical diagnostic apparatus 10c may include a laser probe 51, a laser adjuster 52, and an endoscope 53. The laser probe 51 is used to generate a laser. A laser adjuster 52 is coupled to the laser probe 51 for adjusting the intensity of the laser. When the intensity of the laser is high, it can be used to burn the tumor. Therefore, the laser adjuster 52 is directly controlled by the external diagnostic device 20 or by the micro-processing module 13 to perform thermal cauterization and resection of the tumor. In addition, the laser adjuster 52 can also be manually operated by a physician, and this creation does not limit the manner in which the laser adjuster 52 operates. On the other hand, when the intensity of the laser is low, it can be used as an illumination source of the endoscope 53. The endoscope 53 is used to directly provide the image detection signal, and then transmitted to the external diagnostic device 20 via the connection module 11. Thereby, the external diagnostic device 20 can adjust the laser probe 51 via the micro-processing module 13 to adjust the laser probe 51 to perform cauterization treatment on the tumor, and in the process of cauterization, the endoscope 53 can also be used to obtain The image detection signal is adjusted to accurately remove the lesion and avoid damage to other normal tissues.

上述各個模組除可配置為硬體裝置、軟體程式、韌體或其組合外,亦可藉電路迴路或其他適當型式配置;並且,各個模組除可以單獨之型式配置外,亦可以結合之型式配置。此外,本實施方式僅例示本創作之較佳實施例,為避免贅述,並未詳加記載所有可能的變化組合。然而,本領域之通常知識者應可理解,上述各模組或元件未必皆為必要。且為實施本創作,亦可能包含其他較細節之習知模組或元件。各模組或元件皆可能視需求加以省略或修改,且任兩模組間未必不存在其他模組或元件。In addition to being configurable as a hardware device, a software program, a firmware, or a combination thereof, each of the above modules may also be configured by a circuit loop or other suitable type; and, in addition to being individually configurable, each module may also be combined. Type configuration. In addition, the present embodiment is merely illustrative of the preferred embodiment of the present invention, and all possible combinations of variations are not described in detail in order to avoid redundancy. However, those of ordinary skill in the art will appreciate that the various modules or components described above are not necessarily required. In order to implement this creation, other well-known modules or components of more detail may also be included. Each module or component may be omitted or modified as needed, and no other modules or components may exist between any two modules.

藉由本案的醫療診斷裝置10以及其醫療系統1,即可方便地對病灶進行數據分析及診斷治療,提高醫療的便利性。With the medical diagnostic apparatus 10 of the present invention and the medical system 1 thereof, data analysis, diagnosis and treatment of the lesion can be conveniently performed, and the convenience of medical treatment can be improved.

需注意的是,上述實施方式僅例示本新型之較佳實施例,為避免贅述,並未詳加記載所有可能的變化組合。然而,本領域之通常知識者應可理解,上述各模組或元件未必皆為必要。且為實施本新型,亦可能包含其他較細節之習知模組或元件。各模組或元件皆可能視需求加以省略或修改,且任兩模組間未必不存在其他模組或元件。只要不脫離本新型基本架構者,皆應為本專利所主張之權利範圍,而應以專利申請範圍為準。It should be noted that the above-described embodiments are merely illustrative of the preferred embodiments of the present invention, and all possible combinations of variations are not described in detail to avoid redundancy. However, those of ordinary skill in the art will appreciate that the various modules or components described above are not necessarily required. In order to implement the present invention, other well-known modules or components of more detail may also be included. Each module or component may be omitted or modified as needed, and no other modules or components may exist between any two modules. As long as they do not deviate from the basic structure of this new model, they should be the scope of rights claimed in this patent, and the scope of patent application shall prevail.

1‧‧‧醫療系統
10、10a、10b、10c‧‧‧醫療診斷裝置
11‧‧‧連線模組
12、12a、12b、12c‧‧‧針狀組裝模組
13‧‧‧微處理模組
31‧‧‧溫度感測模組
311‧‧‧複數之溫度感測點
32‧‧‧溫度處理器
41‧‧‧硬度感測模組
411‧‧‧壓電薄膜
42‧‧‧馬達
43‧‧‧硬度處理器
51‧‧‧雷射探頭
52‧‧‧雷射調整器
53‧‧‧內視鏡
20‧‧‧外部診斷裝置
1‧‧ medical system
10, 10a, 10b, 10c‧‧‧ medical diagnostic equipment
11‧‧‧Connection module
12, 12a, 12b, 12c‧‧‧ needle assembly module
13‧‧‧Micro Processing Module
31‧‧‧Temperature Sensing Module
311‧‧‧Multiple temperature sensing points
32‧‧‧ Temperature Processor
41‧‧‧ Hardness Sensing Module
411‧‧‧Piezoelectric film
42‧‧‧Motor
43‧‧‧ hardness processor
51‧‧‧Laser probe
52‧‧‧Laser adjuster
53‧‧‧Endoscope
20‧‧‧External diagnostic device

圖1係本創作之醫療系統之架構示意圖。 圖2係本創作之醫療診斷裝置之第一實施例之架構示意圖。 圖3係本創作之醫療診斷裝置之第二實施例之架構示意圖。 圖4係本創作之醫療診斷裝置之第三實施例之架構示意圖。Figure 1 is a schematic diagram of the architecture of the medical system of the present invention. 2 is a schematic structural view of a first embodiment of the medical diagnostic apparatus of the present invention. 3 is a schematic structural view of a second embodiment of the medical diagnostic apparatus of the present invention. 4 is a schematic structural view of a third embodiment of the medical diagnostic apparatus of the present invention.

1‧‧‧醫療系統1‧‧ medical system

10‧‧‧醫療診斷裝置10‧‧‧Medical diagnostic equipment

11‧‧‧連線模組11‧‧‧Connection module

12‧‧‧針狀組裝模組12‧‧‧ Needle assembly module

13‧‧‧微處理模組13‧‧‧Micro Processing Module

Claims (12)

一種醫療診斷裝置,可連接至一外部診斷裝置,該醫療診斷裝置包括: 一連線模組,用以傳送或接收一連線訊號; 一針狀組裝模組,用以偵測一病灶以產生一偵測訊號或治療該病灶;以及 一微處理模組,係電性連接該連線模組,並與該針狀組裝模組互相組裝連接,該微處理模組用以接收該針狀組裝模組所偵測得到之該偵測訊號,並經由該連線模組以傳輸至該外部診斷裝置,或藉由該針狀組裝模組以治療該病灶。A medical diagnostic device can be connected to an external diagnostic device, the medical diagnostic device comprising: a wired module for transmitting or receiving a connected signal; and a needle assembly module for detecting a lesion to generate a detection signal or a treatment for the lesion; and a micro-processing module electrically connected to the connection module and assembled with the needle assembly module, the micro-processing module for receiving the needle assembly The detection signal detected by the module is transmitted to the external diagnostic device via the connection module, or the needle assembly module is used to treat the lesion. 如申請專利範圍第1項所述之醫療診斷裝置,其中該針狀組裝模組包括: 一溫度感測模組,具有複數之溫度感測點,用以針對該病灶以得到複數之溫度值;以及 一溫度處理器,係電性連接該溫度感測模組,用以處理該複數之溫度值以得到一溫度偵測訊號。The medical diagnostic device of claim 1, wherein the needle assembly module comprises: a temperature sensing module having a plurality of temperature sensing points for obtaining a plurality of temperature values for the lesion; And a temperature processor electrically connected to the temperature sensing module for processing the plurality of temperature values to obtain a temperature detecting signal. 如申請專利範圍第1項所述之醫療診斷裝置,其中該針狀組裝模組包括: 一硬度感測模組,具有一壓電薄膜,該壓電薄膜係直接接觸於該病灶; 一馬達,係連接於該硬度感測模組,用以驅動該硬度感測模組,使該硬度感測模組得以藉由該壓電薄膜偵測該病灶之硬度值;以及 一硬度處理器,係電性連接該硬度感測模組,用以根據該硬度值以得到一硬度偵測訊號。The medical diagnostic device of claim 1, wherein the needle assembly module comprises: a hardness sensing module having a piezoelectric film directly contacting the lesion; a motor, Is connected to the hardness sensing module for driving the hardness sensing module, so that the hardness sensing module can detect the hardness value of the lesion by the piezoelectric film; and a hardness processor The hardness sensing module is connected to obtain a hardness detecting signal according to the hardness value. 如申請專利範圍第1項所述之醫療診斷裝置,其中該針狀組裝模組包括: 一雷射探頭,用以產生一雷射;以及 一雷射調整器,係連接於該雷射探頭,用以調整該雷射之強度,以治療該病灶。The medical diagnostic device of claim 1, wherein the needle assembly module comprises: a laser probe for generating a laser; and a laser adjuster coupled to the laser probe, Used to adjust the intensity of the laser to treat the lesion. 如申請專利範圍第4項所述之醫療診斷裝置,其中該針狀組裝模組更包括一內視鏡,用以針對該病灶以得到一影像偵測訊號。The medical diagnostic device of claim 4, wherein the needle assembly module further comprises an endoscope for obtaining an image detection signal for the lesion. 如申請專利範圍第1項所述之醫療診斷裝置,其中該連線模組係經由一有線或一無線方式以傳送或接收該連線訊號。The medical diagnostic device of claim 1, wherein the connection module transmits or receives the connection signal via a wired or wireless method. 一種醫療系統,包括: 一外部診斷裝置;以及 一醫療診斷裝置,包括: 一連線模組,用以傳送或接收一連線訊號; 一針狀組裝模組,用以偵測一病灶以產生一偵測訊號或治療該病灶;以及 一微處理模組,係電性連接該連線模組,並與該針狀組裝模組互相組裝連接,該微處理模組用以接收該針狀組裝模組所偵測得到之該偵測訊號,並經由該連線模組以傳輸至該外部診斷裝置,或使該外部診斷裝置藉由該針狀組裝模組以治療該病灶。A medical system comprising: an external diagnostic device; and a medical diagnostic device comprising: a wired module for transmitting or receiving a connected signal; and a needle assembly module for detecting a lesion to generate a detection signal or a treatment for the lesion; and a micro-processing module electrically connected to the connection module and assembled with the needle assembly module, the micro-processing module for receiving the needle assembly The detection signal detected by the module is transmitted to the external diagnostic device via the connection module, or the external diagnostic device is used to treat the lesion by the needle assembly module. 如申請專利範圍第7項所述之醫療系統,其中該針狀組裝模組包括: 一溫度感測模組,具有複數之溫度感測點,用以針對該病灶以得到複數之溫度值;以及 一溫度處理器,係電性連接該溫度感測模組,用以處理該複數之溫度值以得到一溫度偵測訊號。The medical system of claim 7, wherein the needle assembly module comprises: a temperature sensing module having a plurality of temperature sensing points for obtaining a plurality of temperature values for the lesion; A temperature processor is electrically connected to the temperature sensing module for processing the plurality of temperature values to obtain a temperature detecting signal. 如申請專利範圍第7項所述之醫療系統,其中該針狀組裝模組包括: 一硬度感測模組,具有一壓電薄膜,該壓電薄膜係直接接觸於該病灶; 一馬達,係連接於該硬度感測模組,用以驅動該硬度感測模組,使該硬度感測模組得以藉由該壓電薄膜偵測該病灶之硬度值;以及 一硬度處理器,係電性連接該硬度感測模組,用以根據該硬度值以得到一硬度偵測訊號。The medical system of claim 7, wherein the needle assembly module comprises: a hardness sensing module having a piezoelectric film directly contacting the lesion; a motor Connected to the hardness sensing module for driving the hardness sensing module, so that the hardness sensing module can detect the hardness value of the lesion by the piezoelectric film; and a hardness processor, the electrical system The hardness sensing module is connected to obtain a hardness detecting signal according to the hardness value. 如申請專利範圍第7項所述之醫療系統,其中該針狀組裝模組包括: 一雷射探頭,用以產生一雷射;以及 一雷射調整器,係連接於該雷射探頭,用以調整該雷射之強度,以治療該病灶。The medical system of claim 7, wherein the needle assembly module comprises: a laser probe for generating a laser; and a laser adjuster coupled to the laser probe The intensity of the laser is adjusted to treat the lesion. 如申請專利範圍第10項所述之醫療系統,其中該針狀組裝模組更包括一內視鏡,用以針對該病灶以得到一影像偵測訊號。The medical system of claim 10, wherein the needle assembly module further comprises an endoscope for obtaining an image detection signal for the lesion. 如申請專利範圍第7項所述之醫療系統,其中該連線模組係經由一有線或一無線方式以傳送或接收該連線訊號。The medical system of claim 7, wherein the connection module transmits or receives the connection signal via a wired or wireless method.
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