TWM501678U - Circuit board of electrical connector - Google Patents

Description

Circuit board of electrical connector

The present invention relates to a circuit board of an electrical connector, and more particularly to a circuit board of an electrical connector capable of shortening high frequency wiring to reduce the amount of attenuation and avoiding warpage when the high frequency wire is soldered to the circuit board. .

An electrical connector is a conductor device for transmitting electronic data. It is widely used in various transmission lines. The connection formed by the electrical connector may be temporarily and conveniently plugged in at any time, or may be a permanent node between transmission devices. . The electrical connectors mainly include PCB Connector, Rectangular I/O, Circular I/O, CPU Socket, RF Coax. , Fiber Optic, High Voltage Connector, etc. At present, the main domestic production of PCB board connectors (PCB Connector) and angle I / O (Rectangular I / O). The common electrical connector is mainly provided with a circuit board in the electrical connector for plugging into the electrical connector slot, thereby electrically contacting the circuit board with the conductive pins in the electrical connector slot to enable the electronic Electronic data is transmitted between devices.

Referring to FIG. 1, as shown, the circuit board of the conventional electrical connector has a substrate 9, a plurality of high frequency traces 94, and a plurality of low frequency traces 95. The substrate 9 has an electrical contact region 91, a low frequency region 93 and a high frequency wire bonding region 92 in the longitudinal direction. The electrical contact region 91 is located on the upper edge of the substrate 9, and the high frequency wire bonding region 92 is located on the substrate 9. The lower side edge, the low frequency area 93 is located in the middle area of the substrate 9; the high frequency wiring 94 has a high frequency electrical contact end 941 and a high frequency wire bonding end 942, respectively, and the high frequency trace 94 is disposed on the substrate 9 and passes through the low frequency area. On the side of 93, the high frequency electrical contact end 941 is located in the electrical contact zone 91, and the high frequency wire bonding end 942 is located in the high frequency wire bonding zone 92; the low frequency routing 95 has a low frequency electrical contact end 951 and a low frequency electrical connection end 952, respectively. The low frequency trace 95 is disposed on the substrate 9, the low frequency electrical contact 951 is located in the electrical contact region 91, and the low frequency electrical connection 952 is located in the low frequency region 93. As described above, since the low frequency region 93 of the circuit board of the conventional electrical connector is located in the intermediate portion of the substrate 9, the path of the high frequency trace 94 is elongated, increasing the amount of attenuation. Therefore, how to create a circuit board of an electrical connector so that it can shorten the high-frequency wiring to reduce the amount of attenuation, and avoid the warpage caused when the high-frequency wire is soldered to the circuit board, which will be actively disclosed by the present invention. Where.

In view of the shortcomings of the above-mentioned prior art, the creator feels that he has not perfected it, exhausted his mind and researched and overcome it, and developed a circuit board of an electrical connector, in order to shorten the high-frequency trace to reduce the attenuation. And can avoid the purpose of warping when the high-frequency wire is soldered to the circuit board.

In order to achieve the above and other objects, a first aspect of the present invention provides a circuit board for an electrical connector, comprising: a substrate having an electrical contact region, a high frequency wire bonding region, and a longitudinal direction; At least one opening and a low frequency region, the electrical contact region is located at an edge of the substrate, the electrical contact region is electrically connected to the low frequency region; and the plurality of high frequency traces respectively have a high frequency electrical contact end and a high frequency wire bonding The high frequency wiring is disposed on the substrate, and the high frequency electrical contact ends are located in the electrical contact region, and the high frequency wire bonding ends are located in the high frequency wire bonding region.

The circuit board of the first aspect of the electrical connector further includes a plurality of low frequency traces respectively having a low frequency electrical contact end and a low frequency electrical connection end, wherein the low frequency traces are disposed on the substrate and pass through the opening On the side, the low frequency electrical contact ends are located in the electrical contact region, and the low frequency electrical connection ends are located in the low frequency region.

In the circuit board of the first aspect of the electrical connector, the number of the openings is two and laterally arranged, and the low frequency traces pass between the openings, which form the second aspect of the present invention.

In the circuit board of the first aspect of the electrical connector, the high frequency electrical contact ends are laterally spaced from the low frequency electrical contact ends, and the high frequency wire soldering ends are laterally spaced.

The circuit board of the first aspect of the electrical connector further includes a plurality of high frequency wires respectively having a signal line and an insulating skin, the insulating skins respectively covering the signal lines and the ends of the signal lines The ends are respectively exposed at the ends of the insulating skins, and the ends of the signal wires are respectively flatly welded to the high-frequency wire welding ends, and the end portions of the insulating skins are located in the openings.

The third aspect of the present invention provides a circuit board of an electrical connector, comprising: a substrate having a horizontal substrate and a vertical substrate connected to each other in a T shape, and a gap is formed on each of the two sides of the substrate, The horizontal substrate has an electrical contact region and a high-frequency wire bonding region in a longitudinal direction, the electrical contact region is located at an edge of the lateral substrate, the longitudinal substrate has a low frequency region, and the high-frequency wire bonding region is located in the electrical contact region Between the low frequency regions, the electrical contact region is electrically connected to the low frequency region; and the plurality of high frequency traces respectively have a high frequency electrical contact end and a high frequency wire soldering end, and the high frequency traces are disposed on the horizontal substrate The high frequency electrical contact ends are located in the electrical contact region, and the high frequency wire soldering ends are located in the high frequency wire bonding region.

The circuit board of the electrical connector of the third aspect further includes a plurality of low frequency traces respectively having a low frequency electrical contact end and a low frequency electrical connection end, wherein the low frequency traces are disposed on the substrate and pass through the gaps Between the low frequency electrical contacts, the low frequency electrical contacts are located in the low frequency region.

In the circuit board of the electrical connector of the third aspect, the high-frequency electrical contact ends are laterally spaced from the low-frequency electrical contact ends, and the high-frequency wire soldering ends are laterally spaced.

The circuit board of the electrical connector of the third aspect further includes a plurality of high frequency wires respectively having a signal line and an insulating skin, the insulating skins respectively covering the signal lines and the ends of the signal lines The ends are exposed at the ends of the insulating skins, and the ends of the signal wires are respectively flatly welded to the high-frequency wire soldering ends, and the end portions of the insulating skins are located in the notches.

Thereby, the circuit board of the present electrical connector can shorten the high frequency wiring to reduce the amount of attenuation, and can avoid warpage when the high frequency wire is soldered to the circuit board.

In order to clarify the purpose, technical features and advantages of the present invention, the author can understand and implement the present invention, and the technical features and implementation manners of the present invention are explained in the following description in conjunction with the drawings. The description of the preferred embodiments is further illustrated, but the following description of the embodiments is not intended to limit the present invention, and the drawings in the following description are intended to be illustrative of the features of the present invention.

Referring to FIG. 2, as shown in the figure, the first aspect of the present invention provides a circuit board of an electrical connector including a substrate 1 and a plurality of high frequency traces 15. The substrate 1 may be an electric wood board, a fiberglass board or a plastic board and may have a multi-layer structure and have at least one interlayer. The plurality of low frequency traces 16 may be embedded in the interlayer, and the substrate 1 is sequentially arranged in the longitudinal direction of the surface 10 thereof (see FIG. 2). The upper side edge 191 to the lower side edge 192 of the substrate 1 have an electrical contact region 11, a high frequency wire bonding region 12, an opening 13 and a low frequency region 14, and the electrical contact region 11 is located on the upper side of the surface 10 of the substrate 1. The edge 191 is electrically connected to an external electrical connector slot (not shown). The high frequency wire bonding zone 12 is located on the surface 10 of the substrate 1 and may be located at the upper side edge of the opening 13 or may be located at the electrical contact region 11 and the opening 13. Between the upper side edges, the opening 13 may be biased to the left side (or the right side, or the middle) of the substrate 1, and the low frequency region 14 is located on the surface 10 of the substrate 1 and between the lower side edge of the opening 13 and the lower side edge 192 of the substrate 1, electrically The contact region 11 is electrically connected to the low frequency region 14 via the right side (or the left side, or both sides) of the opening 13 and the low frequency wiring 16 in the interlayer of the substrate 1; the high frequency traces 15 respectively have a high frequency electrical contact end 151 and a high The frequency line soldering end 152, the high frequency trace 15 is disposed on the surface 10 of the substrate 1, high frequency electricity The contact end 151 is located in the electrical contact region 11 to electrically contact the external electrical connector slot, and the high frequency wire bonding end 152 is located in the high frequency wire bonding region 12. Thereby, since the high-frequency wire bonding region 12 is located between the electrical contact region 11 and the low-frequency region 14, the path of the high-frequency wiring 15 can be shortened, thereby reducing the amount of attenuation.

Referring to FIG. 3, as shown in the figure, the circuit board of the electrical connector of the first aspect may further include a plurality of high frequency wires 2 respectively having a signal line 21 and an insulating skin 22, and the insulating skin 22 respectively The ends of the signal lines 21 and the signal lines 21 are exposed at the ends of the insulating strips 22, and the ends of the signal lines 21 are respectively soldered to the high-frequency wire soldering ends 152, and the lower edges of the ends of the insulating strips 22 are respectively covered. Placed in the opening 13.

Please refer to FIG. 4 and refer to FIG. 2 and FIG. 3 at the same time. As shown in the figure, since the opening 13 is located below the high-frequency wire bonding region 12, the signal line 21 of the high-frequency wire 2 can be flat-welded and soldered to the high-frequency wire. The high frequency wire bonding end 152 in the region 12, and the lower edge of the insulating skin 22 of the high frequency wire 2 can be accommodated in the opening 13, thereby preventing the high frequency wire 2 from being warped when soldered to the circuit board.

Referring to FIG. 2 again, as shown in the figure, the circuit board of the electrical connector of the first aspect further includes a plurality of low frequency traces 16 respectively having a low frequency electrical contact end 161 and a low frequency electrical connection end 162. The low frequency electrical contact end 161 and the low frequency electrical connection end 162 are located on the surface 10 of the substrate 1. The low frequency trace 16 can be disposed on the interlayer of the substrate 1 and can pass through the side of the opening 13 (on the right side of the opening 13 as shown in FIG. 2). The electrical contact end 161 is located in the electrical contact region 11 to electrically contact the external electrical connector slot, and the low frequency electrical connection terminal 162 is located in the low frequency region 14.

Referring to FIG. 5, as shown in the figure, the second aspect of the present invention provides a circuit board of another electrical connector, which is different from the circuit board of the first aspect of the electrical connector in that the opening 13 The number of 'can be two and horizontally arranged, and the low frequency trace 16 can pass between the two openings 13'. Alternatively, the number of openings 13' may be increased as needed, and the low frequency traces 16 may also pass outside the opening 13'. Thereby, when the number of openings 13' is plural, the low frequency traces 16 can be selected to pass between the two openings 13' or evenly outside the opening 13' to enhance the diversity of the configuration of the low frequency traces 16. Similarly, since the high-frequency wire bonding region 12 is located between the electrical contact region 11 and the low-frequency region 14, the path of the high-frequency wiring 15 can be shortened, thereby reducing the amount of attenuation.

Please refer to FIG. 6. As shown in the figure, the circuit board of the electrical connector of the second aspect may further include a plurality of high frequency wires 2 respectively having a signal line 21 and an insulating skin 22, and the insulating skin 22 respectively The ends of the signal lines 21 and the signal lines 21 are exposed at the ends of the insulating strips 22, and the ends of the signal lines 21 are respectively soldered to the high-frequency wire soldering ends 152, and the lower edges of the ends of the insulating strips 22 are respectively covered. Placed in the two openings 13'.

Referring to FIG. 7 and referring to FIG. 5 and FIG. 6 simultaneously, as shown in the figure, since the two openings 13' are located below the high-frequency wire bonding region 12, the signal line 21 of the high-frequency line 2 can be flatly soldered to the high frequency. The high-frequency wire soldering end 152 in the wire bonding zone 12, and the lower edge of the insulating skin 22 of the high-frequency wire 2 can be accommodated in the two openings 13', thereby preventing the high-frequency wire 2 from being warped when soldered to the circuit board. .

Referring to FIG. 2 and FIG. 5 again, and referring to FIG. 3 and FIG. 6 simultaneously, as shown in the figure, in the circuit board of the first aspect and the second aspect of the electrical connector, the high frequency electrical contact end 151 and the low frequency The electrical contact ends 161 are laterally spaced to facilitate electrical contact with an external electrical connector slot, and the high frequency wire bonding ends 152 are laterally spaced to facilitate soldering the signal lines 21 of the high frequency line 2.

Referring to FIG. 8, as shown in the figure, the third aspect of the present invention provides a circuit board of another electrical connector, which comprises a substrate 1 and a plurality of high frequency traces 15. The substrate 1 can be a bakelite board, a fiberglass board or a plastic board and can have a multi-layer structure and have at least one interlayer. The plurality of low-frequency traces 16 can be embedded in the interlayer, and the substrate 1 has a horizontal substrate 17 and a T-shaped interconnected with each other. The longitudinal substrate 18 has a notch 181 on both sides of the substrate 1. The horizontal substrate 17 has an electrical contact area 11 and a high frequency in the longitudinal direction (the upper side edge 171 to the lower side edge 172 of the horizontal substrate 17 as shown in FIG. 8). The wire bonding zone 12, the electrical contact zone 11 is located at the upper edge 171 of the surface 10 of the lateral substrate 17 to electrically contact an external electrical connector socket (not shown), and the high frequency wire bonding zone 12 is located on the surface 10 of the lateral substrate 17. The second substrate 172 may be located between the lower side edge 172 of the horizontal substrate 17 or the lower side edge 172 of the horizontal substrate 17. The two notches 181 are respectively located on the lower left side and the lower right side of the substrate 1. The vertical substrate 18 has a The low frequency region 14 is located between the surface 10 of the longitudinal substrate 18 and between the high frequency wire bonding region 12 and the lower edge of the longitudinal substrate 18, and the high frequency wire bonding region 12 is located between the electrical contact region 11 and the low frequency region 14. , the electrical contact area 11 is via the two gaps 181 The low frequency wiring 16 in the interlayer of the substrate 1 and the substrate 1 are electrically connected to the low frequency region 14; the high frequency wiring 15 has a high frequency electrical contact end 151 and a high frequency wire bonding end 152, respectively, and the high frequency trace 15 is disposed on the lateral substrate. The surface 10 of the 17 is placed at the electrical contact region 11 to electrically contact the external electrical connector slot, and the high frequency wire bonding end 152 is located in the high frequency wire bonding region 12. Thereby, since the high-frequency wire bonding region 12 is located between the electrical contact region 11 and the low-frequency region 14, the path of the high-frequency wiring 15 can be shortened, thereby reducing the amount of attenuation.

Referring to FIG. 9, as shown in the figure, the circuit board of the electrical connector of the third aspect may further include a plurality of high frequency wires 2 respectively having a signal line 21 and an insulating skin 22, and the insulating skin 22 respectively The ends of the signal lines 21 and the signal lines 21 are exposed at the ends of the insulating strips 22, and the ends of the signal lines 21 are respectively soldered to the high-frequency wire soldering ends 152, and the lower edges of the ends of the insulating strips 22 are respectively covered. Placed in the two gaps 181.

Referring to FIG. 10 and referring to FIG. 8 and FIG. 9 simultaneously, as shown in the figure, since the two notches 181 are located below the high-frequency wire bonding region 12, the signal line 21 of the high-frequency line 2 can be flatly soldered to the high-frequency line. The high-frequency wire soldering end 152 in the soldering zone 12, and the lower edge of the insulating skin 22 of the high-frequency wire 2 can be accommodated in the two notches 181, thereby preventing the high-frequency wire 2 from being warped when soldered to the circuit board. In addition, due to the design of the two notches 181, the rear end of the high-frequency wire 2 can also be accommodated in the two notches 181 to reduce the thickness of the high-frequency wires 2 after soldering to the circuit board.

Referring to FIG. 8 again, as shown in the figure, the circuit board of the electrical connector of the third aspect further includes a plurality of low frequency traces 16 respectively having a low frequency electrical contact end 161 and a low frequency electrical connection end 162. The low frequency electrical contact end 161 and the low frequency electrical connection end 162 are respectively located on the surface 10 of the lateral substrate 17 and the surface 10 of the longitudinal substrate 18. The low frequency trace 16 can be disposed on the interlayer of the substrate 1 and can pass between the two notches 181, low frequency electrical contact. The terminal 161 is located in the electrical contact region 11 to electrically contact the external electrical connector slot, and the low frequency electrical connection terminal 162 is located in the low frequency region 14.

Referring to FIG. 8 again, and referring to FIG. 9 at the same time, as shown in the figure, in the circuit board of the electrical connector of the third aspect, the high frequency electrical contact end 151 and the low frequency electrical contact end 161 are laterally spaced to facilitate electrical connection. In contact with the external electrical connector slots, the high frequency wire soldering ends 152 are laterally spaced to facilitate soldering the signal lines 21 of the high frequency line 2.

Referring to FIG. 11 and FIG. 12, as shown in the figure, the circuit boards of all the above electrical connectors can be disposed between an upper casing 3 and a lower casing 4, and the upper casing 3 and the lower casing 4 are connected. The material may be a zinc alloy, and the high-frequency wire 2 electrically connected to the circuit board is exposed outside the upper casing 3 and the lower casing 4; in addition, a U may be disposed between the upper casing 3 and the lower casing 4 The clip fastener 5 and the U-shaped clip 5 can be provided with a pull handle 6. Thereby, all the circuit boards of the electrical connector of the present invention can be applied to an electrical connector.

In summary, in the circuit board of the first aspect of the present invention, since the high-frequency wire bonding region 12 is located between the electrical contact region 11 and the low-frequency region 14, the path of the high-frequency wiring 15 can be shortened. In addition, since the opening 13 is located below the high-frequency wire bonding region 12, the signal line 21 of the high-frequency wire 2 can be flatly soldered to the high-frequency wire bonding end 152 in the high-frequency wire bonding region 12, The lower edge of the insulating film 22 of the high-frequency line 2 can be accommodated in the opening 13, thereby preventing the high-frequency wire 2 from being warped when soldered to the circuit board. In the circuit board of the second aspect of the electrical connector, since the number of the openings 13' is plural, the low frequency traces 16 can be selected to pass between the two openings 13' or evenly outside the opening 13' to raise the low frequency. The diversity of the route 16 configuration. In the circuit board of the third aspect of the electrical connector, since the high-frequency wire bonding region 12 is located between the electrical contact region 11 and the low-frequency region 14, the path of the high-frequency wiring 15 can be shortened, thereby reducing the attenuation. In addition, since the two notches 181 are located below the high-frequency wire bonding region 12, the signal wires 21 of the high-frequency wires 2 can be flatly soldered to the high-frequency wire bonding ends 152 in the high-frequency wire bonding region 12, and the high-frequency wires The lower edge of the insulating skin 22 of the second can be accommodated in the two notches 181, thereby preventing the high frequency wire 2 from being warped when soldered to the circuit board; further, due to the design of the two notches 181, the rear of the high frequency line 2 The end can also be accommodated in the two notches 181 to reduce the thickness of the high-frequency wire 2 after soldering to the circuit board.

The present invention has been disclosed in the above preferred embodiments, and it should be understood by those skilled in the art that the present invention is only intended to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of patent application.

1‧‧‧Substrate
10‧‧‧ surface
11‧‧‧Electrical contact area
12‧‧‧High frequency wire bonding zone
13‧‧‧ openings
13'‧‧‧ openings
14‧‧‧Low frequency zone
15‧‧‧High frequency wiring
151‧‧‧High frequency electrical contact
152‧‧‧High frequency wire welding end
16‧‧‧Low frequency wiring
161‧‧‧Low-frequency electrical contact
162‧‧‧Low-frequency electrical connection
17‧‧‧Horizontal substrate
171‧‧‧ upper edge
172‧‧‧ lower side edge
18‧‧‧Longitudinal substrate
181‧‧ ‧ gap
191‧‧‧ upper side edge
192‧‧‧ lower side edge
2‧‧‧High frequency line
21‧‧‧ Signal Line
22‧‧‧Insulation
3‧‧‧Upper casing
4‧‧‧ Lower case
5‧‧‧Card fasteners
6‧‧‧ Pull
9‧‧‧Substrate
91‧‧‧Electrical contact area
92‧‧‧High frequency wire bonding zone
93‧‧‧Low frequency zone
94‧‧‧High frequency wiring
941‧‧‧High frequency electrical contact
942‧‧‧High-frequency wire welding end
95‧‧‧Low frequency wiring
951‧‧‧Low-frequency electrical contact
952‧‧‧Low-frequency electrical connection

[Fig. 1] is a schematic view of a circuit board of a conventional electrical connector. 2 is a schematic view showing a circuit board of the first embodiment of the present invention. FIG. 3 is a schematic view showing the high-frequency line electrically connected to the circuit board of the first embodiment of the present invention. Fig. 4 is a cross-sectional view showing the implementation of the high frequency line of the circuit board of the first embodiment of the present invention. Fig. 5 is a schematic view showing the circuit board of the second embodiment of the present invention. 6 is a schematic view showing the high-frequency line electrically connecting the circuit board of the second embodiment of the present invention. Fig. 7 is a cross-sectional view showing the implementation of the high frequency line of the circuit board of the second embodiment of the present invention. Fig. 8 is a schematic view showing a circuit board of the third embodiment of the present invention. 9 is a schematic view showing the high-frequency line electrically connecting the circuit board of the third embodiment of the present invention. Fig. 10 is a cross-sectional view showing the implementation of the high-frequency line of the circuit board of the third embodiment of the present invention. Fig. 11 is an exploded perspective view showing the application of the present embodiment to an electrical connector. Fig. 12 is a schematic view showing the combination of the present embodiment applied to an electrical connector.

1‧‧‧Substrate

10‧‧‧ surface

11‧‧‧Electrical contact area

12‧‧‧High frequency wire bonding zone

13‧‧‧ openings

14‧‧‧Low frequency zone

15‧‧‧High frequency wiring

151‧‧‧High frequency electrical contact

152‧‧‧High frequency wire welding end

16‧‧‧Low frequency wiring

161‧‧‧Low-frequency electrical contact

162‧‧‧Low-frequency electrical connection

191‧‧‧ upper side edge

192‧‧‧ lower side edge

Claims (9)

A circuit board for an electrical connector, comprising: a substrate having an electrical contact region, a high frequency wire bonding region, at least one opening, and a low frequency region in a longitudinal direction, the electrical contact region being located at an edge of the substrate The electric contact area is electrically connected to the low frequency region; and the plurality of high frequency traces respectively have a high frequency electrical contact end and a high frequency line soldering end, and the high frequency traces are disposed on the substrate, the high frequency The electrical contact end is located in the electrical contact zone, and the high frequency wire soldering end is located in the high frequency wire bonding zone. The circuit board of the electrical connector of claim 1, further comprising a plurality of low frequency traces respectively having a low frequency electrical contact end and a low frequency electrical connection end, wherein the low frequency traces are disposed on the substrate and pass through A side of the opening, the low frequency electrical contact ends are located in the electrical contact region, and the low frequency electrical connection ends are located in the low frequency region. The circuit board of the electrical connector of claim 2, wherein the number of the openings is two and laterally arranged, and the low frequency traces pass between the openings. The circuit board of the electrical connector of claim 2, wherein the high frequency electrical contact ends are laterally spaced from the low frequency electrical contact ends, and the high frequency wire soldering ends are laterally spaced. The circuit board of the electrical connector of claim 1, further comprising a plurality of high frequency wires each having a signal line and an insulating skin, the insulating skins respectively covering the signal lines and the signals The ends of the wires are respectively exposed at the ends of the insulating skins, and the ends of the signal wires are respectively flatly welded to the high-frequency wire soldering ends, and the end portions of the insulating skins are located in the openings. A circuit board for an electrical connector, comprising: a substrate having a transverse substrate and a longitudinal substrate connected to each other in a T shape, and each of the two sides of the substrate has a notch, the lateral substrate having an electrical contact in a longitudinal direction And a high frequency wire bonding zone, the electrical contact zone is located at an edge of the lateral substrate, the vertical substrate has a low frequency zone, and the high frequency wire bonding zone is located between the electrical contact zone and the low frequency zone, the electrical contact zone Electrically connecting the low frequency region; and a plurality of high frequency traces respectively having a high frequency electrical contact end and a high frequency wire soldering end, wherein the high frequency traces are disposed on the lateral substrate, and the high frequency electrical contact ends are located In the electrical contact zone, the high frequency wire soldering ends are located in the high frequency wire bonding zone. The circuit board of the electrical connector of claim 6, further comprising a plurality of low frequency traces respectively having a low frequency electrical contact end and a low frequency electrical connection end, wherein the low frequency traces are disposed on the substrate and pass through Between the gaps, the low frequency electrical contacts are located in the electrical contact region, and the low frequency electrical connections are located in the low frequency region. The circuit board of the electrical connector of claim 7, wherein the high frequency electrical contact ends are laterally spaced from the low frequency electrical contact ends, and the high frequency wire soldering ends are laterally spaced. The circuit board of the electrical connector of claim 6, further comprising a plurality of high frequency wires each having a signal line and an insulating skin, the insulating skins respectively covering the signal lines and the signals The ends of the wires are respectively exposed at the ends of the insulating skins, and the ends of the signal wires are respectively flatly welded to the high-frequency wire soldering ends, and the end portions of the insulating skins are located in the notches.