TWM494309U - Conversion card for probe test card - Google Patents

Description

Conversion card for testing probe cards

The present invention relates to a conversion card, and more particularly to a conversion card for testing a probe card.

For a long time, in the wafer industry's wafer acceptance test, it is first verified whether the probe card is available. Because the DC probe card is responsible for the last test, the IC is before being cut ( WS: Wafer Sort), the important role of the functional test is normal, when the IC test can work normally, the IC will be packaged (FT: Final Test; IC has been packaged) and then the subsequent classification (BIN) test, It can be seen that when the error rate of the DC probe card is high, it will directly affect the speed and quality of the subsequent shipment, but the DC probe card becomes more and more powerful with the IC function, and the number of pins is more and more, even up to several. The number of feet of Wangen is tens of millions. If the DC probe card is judged to have a high error rate, it must be cleaned or even changed. These actions are very costly and time-consuming, fab and testing. In order to catch up with the goods, the factory often checks the correct way by directly changing the card. The cost of these replaced DC probe cards is directly absorbed by the fab and the test factory. Therefore, the DC probe card is used. Inventory rate, often reached Tens of millions to hundreds of millions of currency rating, resulting in a substantial increase in costs.

Since the semiconductor industry has long used this DC test method to test the DC probe card, the improvement method has reached the bottleneck. Therefore, the creator is constantly improving and innovating based on the product. Nian is based on years of experience in the design and development of semiconductor and electronic related test industry products, as well as actively researching and developing, and "using the communication method to analyze and improve the error of the DC probe card", through countless times of actual Tests, experiments, and the emergence of this new type.

The purpose of the present invention is to provide an AC signal transmitted by the first transmission unit, and connect the AC signal to the DC probe card through the DC/AC conversion circuit and the second transmission unit, and use the AC circuit and the transmission line principle to cooperate with the AC. The signal instrument uses the AC method to perform error analysis test on the DC probe card and improve the conversion card used to test the probe card.

For the above purposes, the present invention includes a board body, at least one first transmission unit, at least one second transmission unit, and a DC/AC conversion circuit, wherein the first transmission unit is disposed on the board, the first The transmission unit is electrically connected to the test instrument to transmit an AC signal; the second transmission unit is disposed on the board body, and the second transmission unit is electrically connected to the probe card interface; the DC/AC conversion circuit is disposed on the In the board body, the DC/AC conversion circuit is electrically connected to the first transmission unit and the second transmission unit.

The AC signal is transmitted by the first transmission unit, and the AC signal is connected to the DC probe card through the DC/AC conversion circuit, the second transmission unit, and the probe card interface, and the AC circuit and the transmission line principle are used to cooperate with the logic analyzer. AC signal test instruments such as oscilloscope, time domain reflectometer, frequency domain network analyzer, error generator, eye diagram analyzer, etc., can use the AC method to perform error analysis test and improvement on DC probe card to avoid misjudging the probe card. The error rate is reduced to reduce the card exchange rate and the cleaning rate, and the inventory rate of the DC probe card is reduced.

The following is only a detailed description of the specific embodiments, and the detailed description of the drawings will enable the reviewing committee to have a better understanding and understanding of the functions and features of the present invention.

10‧‧‧Transformation card for testing probe cards

11‧‧‧ board

12‧‧‧First transmission unit

121‧‧‧Connecting line

13‧‧‧Second transmission unit

14‧‧‧DC/AC conversion circuit

15‧‧‧Perforation

20‧‧‧ probe card interface

30‧‧‧DC probe card

31‧‧‧Test equipment

40‧‧‧Logic Analyzer

41‧‧‧Digital signal generator

50‧‧‧ oscilloscope

60‧‧‧Time Domain Reflectometer

70‧‧‧ Frequency Domain Network Analyzer

80‧‧‧Error Generator

90‧‧‧Eye Analyzer

91‧‧‧Integrated model of error generator and eye diagram analyzer

Figure 1 is a top view of the present invention.

Figure 2 is a partial enlarged view of the top view of the present invention.

Figure 3 is a perspective exploded view of the novel test embodiment.

Figure 4 is a cross-sectional view of the novel test embodiment.

Figure 5 is a schematic block diagram of the novel.

Fig. 6 is a diagram showing a test embodiment of the novel logic analyzer and digital signal generator.

Figure 7 is a test result diagram of Figure 6.

Figure 8 is a diagram showing a test embodiment of the novel logic analyzer, oscilloscope, and digital signal generator.

Figure 9 is a test result diagram of Figure 8.

Figure 10 is a diagram showing a test embodiment of the novel time domain reflectometer.

Figure 11 is a test result diagram of Figure 10.

Figure 12 is a diagram showing a test embodiment of the novel hybrid frequency domain network analyzer.

Figure 13 is a test result diagram of Figure 12.

Figure 14 is a diagram showing a test embodiment of the novel eye diagram analyzer and error generator.

Figure 15 is a test result diagram of Figure 14.

Fig. 16 is a diagram showing a test embodiment of the integrated model of the eye diagram analyzer and the error generator.

Figure 17 is a flow chart of the test procedure of the present invention.

Referring to FIG. 1 to FIG. 16 , the conversion card 10 structure of the present invention for testing a probe card includes a plate body 11 , a plurality of first transmission units 12 , and a second transmission list. Element 13 and a DC/AC conversion circuit 14, wherein:

In one embodiment, the plate body 11 has a perforation 15 for reducing weight, saving material, and thereby reducing manufacturing costs.

The first transmission unit 12 is disposed on the board body 11. The first transmission unit 12 is electrically connected to a predetermined test instrument to transmit an AC signal. In this embodiment, the first transmission unit 12 is connected to the test instrument 121. The first transmission unit 12 is electrically connected to the plurality of first transmission units 12 at the same time, so that the test instrument can borrow The DC probe card 30 is partitioned and tested by a connection line 121 connected to the first transmission unit 12 at different positions, or the test instrument can be connected to the first transmission unit 12 at different positions by a plurality of connection lines 121 while simultaneously testing the DC. Probe card 30.

In one embodiment, the first transmission unit 12 is an electrical connection hole arranged in a region.

The second transmission unit 13 is disposed on the board body 11 , and the second transmission unit 13 is electrically connected to the POGO tower 20 .

In one embodiment, the first transmission unit 12 is an electrical connection hole. The number of probes on the upper side of the probe card interface 20 of the present embodiment is passed through the second transmission unit 13.

The DC/AC conversion circuit 14 is disposed on the board body 11, and the DC/AC conversion circuit 14 is electrically connected to the first transmission unit 12 and the second transmission unit 13.

In one embodiment, the board body 11, the first transmission unit 12, the second transmission unit 13, and the DC/AC conversion circuit 14 are integrally formed as a printed circuit board (PCB); or the board body 11. The first transmission unit 12, the second transmission unit 13, and the DC/AC conversion circuit 14 are integrated.

The AC signal is transmitted by the first transmission unit 12, and the AC signal is connected to the DC card 30 via the DC/AC conversion circuit 14, the second transmission unit 13, and the probe card interface 20, and the AC circuit is used. The principle of the transmission line is to cooperate with the AC signal test instrument such as the logic analyzer 40, the oscilloscope 50, the time domain reflectometer 60, the frequency domain network analyzer 70, the error generator 80, the eye diagram analyzer 90, etc. The probe card 30 performs error analysis test and improvement to avoid misjudging the error rate of the probe card, reducing the card replacement rate and the cleaning rate, and reducing the inventory rate of the DC probe card.

Referring to FIG. 3 and FIG. 4 , the mode of the present invention is generally disposed on the probe card interface 20 , and the probe card interface 20 is disposed on the DC probe card 30 , and the DC probe card 30 is provided. It is provided on the test device 31.

Referring to FIG. 6 to FIG. 17 , in the test embodiment of the present invention, the first transmission unit 12 of the board body 11 can be electrically connected to the logic analyzer 40, the oscilloscope 50, and the time domain reflection by the connecting line 121. The AC signal test instrument such as the instrument 60, the frequency domain network analyzer 70, the error generator 80, the eye diagram analyzer 90, the error generator and the eye diagram analyzer integrated model 91, and the digital signal generator 41 cooperate The logic analyzer 40 is electrically connected to the DC probe card 30 in conjunction with the logic analyzer 40 and the oscilloscope 50 to perform error analysis testing and improvement on the DC probe card 30 according to the predetermined test procedure. The test and improvement results can be displayed by the above-described AC signal test instruments.

In addition, it is of course also possible to perform error analysis testing and improvement on the DC probe card 30 according to the actual need to select the above-mentioned part of the AC signal testing instrument.

Since the original DC mode can only test the voltage and current values of a certain level, and it is the voltage current or the current voltage, this will cause the problem to be ignored when some problematic signals are not at this level. Therefore, the DC probe card 30 may be misjudged. If the AC is used, the timing may be periodic. If the logic analyzer 40 is adjusted to different levels, the DC standard position can be captured. The key error signal under the command, and then determine which pin is generated by the error, and then improve the pin position, and the logic analyzer 40 can simultaneously identify more than 2000 feet at a time, so when the DC probe card 30 When the position of the foot exceeds 10,000, through the partition test, all the feet can be measured in the fastest time. The existing probe card analyzer has an average of 2 seconds per foot. If the 10,000 is required, it will take 20,000 seconds. The table can indicate the difference:

There are 4~5 layers of different carriers from the probe of the probe card to the carrier to form the whole test system. However, each carrier has different circuit characteristics and impedance matching problems. Therefore, at each foot Bits have different impedance characteristics (even in the same process). If the time domain reflectometer 60 is used to analyze the problematic pin, the output is a very high frequency step wave, rise time. Within 7~12ps (pico second), if the reverse push distance is the resolution of nm (naro meter), the existing IC design and application are in GHz grade (such as DDR3, HDMI, PCI-e....etc. Etc.), plus the product must be light and short, but also powerful, IC is getting smaller and smaller, more and more functions, the relative IC internal circuit is more complicated, and its transmission line effect is more obvious, that is, different frequencies will Because of some small process defects, different inductive or parasitic electricity Capacitive inductors (collectively referred to as induction circuits) cause the original characteristics to be affected by the sensing circuit, which is completely unmeasurable in the DC world. The novel uses the step wave of the time domain reflectometer 60 to analyze not only Where these sensing circuits occur, and can convert the characteristics of the local sensing circuit, and then improve the part, because the resolution is to the nm level, it can understand which layer of the carrier caused the error, not the full error On the probe card.

When the digital signal flows inside the IC, how to properly output or input the desired digital signal at the appropriate time depends on whether the IC can achieve the desired function on the real product. As mentioned above, the existing function Applications are in the GHz class, so the accuracy of the clock and the precise control of the signal input and output are very important. Because of the GHz level, the clock is often disturbed by the jitter and the noise caused by the system and the high frequency. Therefore, it is necessary to use the Bit Error Rate Tester 80 and the eye-diagram analyzer 90 to understand the quality of the signal transmission, and analyze the jitter (such as TJ (total jitter), PJ ( Periodic jitter), DCD (Duty-cycle jitter), etc.) or noise (such as RN (random noise), DN (deterministic noise), DDN (data dependent noise), etc.).

As mentioned above, the existing applications are in the GHz class, also known as the radio frequency (RF) level. Therefore, we must use the RF network analyzer to analyze the frequency domain behavior of the carrier system under the RF, such as input loss (Insertion). Loss), return loss (Transition Loss) and transmission loss (Transitions Loss), etc., so that the behavior of each layer carrier in the time domain and the frequency domain can be understood by different means. And methods to improve.

It can be seen from the above that the novel interface of the entire test DC probe card is integrated by the arrangement of the board, the first transmission unit, the second transmission unit and the DC/AC conversion circuit. Together, using the principle of AC circuit and transmission line, all the key parameters and the causes of the error can be measured at one time, which not only reduces the high inventory rate of the probe card, but also eliminates more functional tests for subsequent functional tests. The error, speed up the time to market, overcome the bottleneck of the DC test probe card, and not only for the DC probe card, but also for each test layer, such as the load board, the carrier card and the probe card. The POGO tower, the probe head and the needle can be used to measure the characteristics and errors, so that the real problem layer can be solved instead of clearing the needle and changing the card.

The above embodiments of the present invention are provided for convenience of explanation only. When the meaning of the case cannot be limited, the various transformation designs according to the scope of the listed patent application should be included in the patent scope of the present application.

10‧‧‧Transformation card for testing probe cards

11‧‧‧ board

12‧‧‧First transmission unit

13‧‧‧Second transmission unit

14‧‧‧DC/AC conversion circuit

15‧‧‧Perforation

Claims (6)

A conversion card for testing a probe card includes: a plate body; at least one first transmission unit disposed on the plate body, the first transmission unit being electrically connected to the test instrument to transmit an AC signal; At least one second transmission unit is disposed on the board body, the second transmission unit is electrically connected to the probe card interface; a DC/AC conversion circuit is disposed on the board body, and the DC/AC conversion circuit is electrically Connected to the first transmission unit and the second transmission unit. The conversion card for testing a probe card according to claim 1, wherein the plate body has a perforation. The conversion card for testing a probe card according to claim 1, wherein the first transmission unit is a plurality of electrical connection holes arranged in a region. The conversion card for testing a probe card according to claim 1, wherein the second transmission unit is an electrical connection hole. The conversion card for testing a probe card according to claim 1, wherein the board, the first transmission unit, the second transmission unit, and the DC/AC conversion circuit are integrally formed as a printing PCB (Printed circuit board). The conversion card for testing a probe card according to claim 1, wherein the board, the first transmission unit, the second transmission unit, and the DC/AC conversion circuit are integrally combined.