TWM493753U - Module IC package structure with electrical shield function - Google Patents

Description

Module integrated circuit package structure with electrical shielding function

This creation is about a module IC package structure, especially a module integrated circuit package structure with electrical shielding function.

In recent years, the rapid growth of technology has led to a variety of products that are oriented towards the application of technology, and are constantly evolving. In addition, due to the increasing functionality of the products, most of the current products are modularized to integrate the design. However, the integration of a variety of modules with different functions in the product has greatly increased the functionality of the product. However, under the demand of miniaturization and exquisite appearance of the product, how to design a small and versatile product. Products are the goal that all walks of life are trying to study.

In semiconductor manufacturing, it is constantly evolving process technology to produce smaller wafers or components with higher and higher-order technologies, so that the module manufacturers of the application can relatively design smaller functional modules. In turn, the terminal products can be used more effectively and matched. According to the current conventional technology, most of the application modules are still based on printed circuit board (PCB), epoxy (FR-4) substrate or BT (Bismaleimide Triazine) substrate. The main carrier board, and all the wafers, components and other parts are adhered to the surface of the carrier by means of surface mount technology (SMT). Therefore, the carrier board is purely used for forming a circuit connection as a carrier, and the structure therein is only used as a layered structure of the line layout.

Furthermore, with the development of radio frequency communication technology, it means that the wireless communication components must be more rigorous and optimized in circuit design. Most wireless communication products require weight Lightweight, small size, high quality, low price, low power consumption and high reliability, these features promote the technical development and market growth of RF/microwave integrated circuits. The electromagnetic shielding function and quality requirements of wireless modules in wireless communication products are relatively important to ensure that signals do not interfere with each other and affect communication quality.

Conventional wireless modules or other circuit modules that require electromagnetic shielding must be provided with an electromagnetic shielding structure according to the required application, such as an electromagnetic shielding metal cover design. The size of the electromagnetic shielding structure must be matched with different modules so that the signal source in the line can be isolated and isolated. However, such a conventional electromagnetic shielding metal cover must be designed and manufactured for different modules or devices, so that the conventional electromagnetic shielding metal cover requires a lot of man-hours, labor and cost.

In addition, another disadvantage of the above-mentioned conventional electromagnetic shielding metal cover is that the size, shape and block of the electronic circuit or device requiring electromagnetic shielding are different, and it is required for each module of different size, shape and block. The production of manual molds, stamping processing and step-by-step component packaging make the production of electromagnetic shielding metal covers difficult and cannot be applied to production lines for rapid production, but the economic benefits and industrial utilization of the conventional electromagnetic shielding metal cover production. reduce.

The present embodiment provides a module integrated circuit package structure that can have an electrical shielding function.

The present invention provides a module integrated circuit package structure having an electrical shielding function, comprising: a substrate unit, an electronic unit, a conductive unit, a package unit, and a shielding unit. The substrate unit has at least one circuit substrate, wherein the circuit substrate has at least one ground pad. The electronic unit has a plurality of electronic components disposed and electrically connected to the circuit substrate. The conductive unit has at least one conductive element disposed on the circuit substrate, wherein the first end portion of the conductive element is electrically connected to the ground pad. The package unit has an encapsulant disposed on the circuit substrate and covering a portion of the plurality of electronic components and the conductive component, wherein the second end portion of the conductive component is exposed. The shielding unit has a metal shield coated on the outer surface of the encapsulant a layer in which both the metal shield layer and the second end portion of the conductive element are in electrical contact with each other.

The present invention provides a module integrated circuit package structure having an electrical shielding function, which comprises a substrate unit, an electronic unit, a package unit and a shielding unit. The substrate unit has at least one circuit substrate, wherein the at least one circuit substrate has at least one ground pad. The electronic unit has a plurality of electronic components disposed and electrically connected to the at least one circuit substrate. The package unit has an encapsulant disposed on the at least one circuit substrate and covering the plurality of electronic components. The shielding unit has a metal shielding layer covering the outer surface of the encapsulant, and at least one of the electronic components is exposed by the packaging unit to be electrically connected to the at least one ground pad and the metal shielding layer. between.

The present invention provides a modular integrated circuit package structure having an electrical shielding function, including a circuit substrate, a plurality of electronic components, an electronic component, an encapsulant, and a metal shielding layer. The circuit substrate has at least one ground pad. A plurality of electronic components are disposed on the circuit substrate and electrically connected to the circuit substrate. An electronic component is disposed on the circuit substrate and electrically connected to the at least one ground pad. The encapsulant is disposed on the circuit substrate and covers the plurality of electronic components and the electronic component. A metal shielding layer is disposed on the outer surface of the encapsulant, wherein the electronic component is exposed by the encapsulant to be electrically connected between the at least one ground pad and the metal shielding layer.

In summary, the module integrated circuit package structure provided by the present embodiment is transparent to at least one electrically conductive component disposed on the circuit substrate to shield a metal formed by any forming method. The layer is electrically connected to at least one grounding pad electrically connected and disposed on the circuit substrate, so that the metal shielding layer can naturally generate an electrical shielding function for protecting a plurality of electronic components.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and explanation, and are not intended to limit the creation.

Z‧‧‧Modular IC package structure

1‧‧‧Substrate unit

10‧‧‧ circuit board

100‧‧‧Ground pad

2‧‧‧Electronic unit

20‧‧‧Electronic components

3‧‧‧Conducting unit

30‧‧‧Conductive components

30A‧‧‧First end

30B‧‧‧second end

300’‧‧‧cut face

300‧‧‧ side

4‧‧‧Package unit

40‧‧‧Package colloid

400‧‧‧ openings

401‧‧‧ surface

5‧‧‧Shielding unit

50‧‧‧Metal shield

1 is a flow chart of a first embodiment of a method for fabricating a module integrated circuit package structure having an electrical shielding function; FIG. 1A is a perspective view showing a manufacturing process of steps S100 to S104 of FIG. 1; 1B-1B is a schematic cross-sectional view of the process of step S106 of FIG. 1; FIG. 1D is a schematic cross-sectional view of the process of step S108 of FIG. 1; FIG. 1F is a schematic cross-sectional view of the 1F-1F of FIG. 1E; FIG. 1G is a schematic perspective view of the manufacturing process of the step S110 of FIG. 1; FIG. 1H is a schematic view of the 1H-1H cross-section of FIG. 1G; A flow chart of a second embodiment of a method for fabricating a module integrated circuit package structure; and FIG. 2B is a second embodiment of a method for fabricating a module integrated circuit package structure having an electrical shielding function Schematic diagram of the process profile.

[First Embodiment]

1 is a flow chart of the manufacturing method of the first embodiment, and FIG. 1A, FIG. 1C, FIG. 1E and FIG. 1G are schematic views showing the manufacturing process of the first embodiment. 1B, FIG. 1D, FIG. 1F and FIG. 1H are schematic cross-sectional views showing the manufacturing process of the first embodiment, and FIG. 1G is a schematic perspective view of the finished product of the first embodiment, and FIG. 1H is a schematic cross-sectional view of the finished product of the first embodiment. As shown in the above figure, the first embodiment of the present invention provides a method for fabricating a module integrated circuit package structure Z having an electrical shielding function, which includes at least the following steps (from step S100 to step S110):

Step S100: First, in conjunction with FIG. 1, FIG. 1A and FIG. 1B, at least one circuit substrate 10 is provided, wherein the circuit substrate 10 has two ground pads 100. For example, the designer can pre-form a circuit (not shown) having a predetermined pattern and two ground pads 100 on the upper surface of the circuit substrate 10. Of course, the above two ground pads 100 The definition is not intended to limit the creation, and at least one or more than two ground pads 100 may be applied to the creation.

Step S102: Next, as shown in FIG. 1, FIG. 1A and FIG. 1B, a plurality of electronic components 20 are disposed and electrically connected to the circuit substrate 10. For example, the plurality of electronic components 20 may be a resistor, a capacitor, an inductor, a functional wafer having a predetermined function, a semiconductor wafer having a predetermined function, and the like. However, the above description of the plurality of electronic components 20 is for illustrative purposes only and is not intended to limit the present invention. Any type or type of electronic component 20 can be applied to the present invention.

Step S104: Then, as shown in FIG. 1 , FIG. 1A and FIG. 1B , two conductive elements 30 are disposed on the circuit substrate 10 , wherein the first end portion 30A of each of the conductive elements 30 is electrically connected to each of the ground electrodes. Pad 100. For example, since the ground pad 100 is disposed on the upper surface of the circuit substrate 10, the bottom surface of the first end portion 30A of the conductive member 30 may be in electrical contact with the ground pad 100. Additionally, each of the electrically conductive elements 30 can be a conductive metal or any electronic component having electrically conductive properties. Of course, the definition of the above two conductive elements 30 is not intended to limit the present invention, and at least one or more than two conductive elements 30 can be applied to the present invention.

Step S106: Then, as shown in FIG. 1, FIG. 1C and FIG. 1D, an encapsulant 40 is formed on the circuit substrate 10 to cover the plurality of electronic components 20 and each of the conductive components 30.

Step S108: Next, as shown in FIG. 1, FIG. 1E and FIG. 1F, along the AA cutting line of FIG. 1D, the encapsulant 40 and the circuit substrate 10 are cut so that each of the conductive elements 30 is cut to form a The exposed cutting face 300' is on the second end portion 30B of each of the conductive members 30. For example, the encapsulant 40 has two openings 400, the second end portion 30B of each of the conductive elements 30 is exposed by each of the openings 400, and the cut surface 300' of the second end portion 30B of each of the conductive elements 30 is One of the surfaces 401 of the encapsulant 40 is flush.

Step S110: Finally, in conjunction with FIG. 1, FIG. 1G and FIG. 1H, a metal shield layer 50 is formed on the outer surface of the encapsulant 40 and each exposed surface is exposed. 300' is such that both the metal shield layer 50 and the second end portion 30B of each of the conductive elements 30 are in electrical contact with each other. For example, the metal shield layer 50 can cover each of the openings 400, and the metal shield layer 50 covers and electrically contacts the cut surface 300' of the second end portion 30B of each of the conductive elements 30. In addition, according to different design requirements, the metal shielding layer 50 can be a conductive spraying layer formed by spray coating, a conductive sputtering layer formed by sputtering, and a printing method. The conductive printed layer formed, a conductive plating layer formed by electroplating, and the like.

Therefore, in conjunction with the above-mentioned FIG. 1G and FIG. 1H, the first embodiment of the present invention provides a module integrated circuit package structure Z having an electrical shielding function, comprising: a substrate unit 1, an electronic unit 2, and a conductive The unit 3, a package unit 4, and a shielding unit 5. The substrate unit 1 has at least one circuit substrate 10, wherein the circuit substrate 10 has at least one ground pad 100 (the first embodiment shows two ground pads 100 as an example). The electronic unit 2 has a plurality of electronic components 20 disposed and electrically connected to the circuit substrate 10. The conductive unit 3 has at least one conductive element 30 disposed on the circuit substrate 10 (the first embodiment shows two conductive elements 30 as an example), wherein the first end portion 30A of the conductive element 30 is electrically connected to the ground pad 100 . The package unit 4 has an encapsulant 40 disposed on the circuit substrate 10 and covering a portion of the plurality of electronic components 20 and the conductive component 30, wherein the second end portion 30B of the conductive component 30 is exposed. The shielding unit 5 has a metal shield layer 50 overlying the outer surface of the encapsulant 40, wherein the metal shield layer 50 and the second end portion 30B of the conductive element 30 are in electrical contact with each other.

For example, the ground pad 100 is disposed on the upper surface of the circuit substrate 10, and the bottom surface of the first end portion 30A of the conductive member 30 and the ground pad 100 are electrically in contact with each other. The encapsulant 40 has at least one opening 400 and the second end portion 30B of the conductive element 30 is exposed by the opening 400. The cut surface 300' of the second end portion 30B of the conductive member 30 is flush with one of the surfaces 401 of the encapsulant 40, the metal shield layer 50 covers the opening 400, and the metal shield layer 50 covers and electrically contacts the conductive member 30. The cut surface 300' of the two end portions 30B. Moreover, according to different design requirements, the metal shielding layer 50 can be a conductive sprayed layer, a conductive sputtered layer, a conductive printed layer, a conductive plating layer, and the like.

[Second embodiment]

Referring to FIG. 2A and FIG. 2B, FIG. 2A is a flowchart of a manufacturing method of the second embodiment, and FIG. 2B is a schematic cross-sectional view of the manufacturing process of the second embodiment, and the third drawing of FIG. 2B (the most The following figure is a schematic cross-sectional view of the finished product of the second embodiment. As can be seen from the above figures, the second embodiment of the present invention provides a method for fabricating a module integrated circuit package structure Z having an electrical shielding function, which includes at least the following steps (from step S200 to step S210):

Step S200: First, as shown in step (A) of FIG. 2A and FIG. 2B, at least one circuit substrate 10 is provided, wherein the circuit substrate 10 has two ground pads 100. For example, the designer can pre-form a circuit having a predetermined pattern and two ground pads 100 on the upper surface of the circuit substrate 10. Of course, the definition of the above two ground pads 100 is not intended to limit the creation, and at least one or more than two ground pads 100 can be applied to the present invention.

Step S202: Next, a plurality of electronic components 20 are disposed and electrically connected to the circuit substrate 10 as shown in step (A) of FIGS. 2A and 2B. For example, the plurality of electronic components 20 may be a resistor, a capacitor, an inductor, a functional wafer having a predetermined function, a semiconductor wafer having a predetermined function, and the like. However, the above description of the plurality of electronic components 20 is for illustrative purposes only and is not intended to limit the present invention. Any type or type of electronic component 20 can be applied to the present invention.

Step S204: Then, as shown in step (A) of FIG. 2A and FIG. 2B, two conductive elements 30 are disposed on the circuit substrate 10, wherein the first end portion 30A of each of the conductive elements 30 is electrically connected to each A ground pad 100. For example, since the ground pad 100 is disposed on the upper surface of the circuit substrate 10, the bottom surface of the first end portion 30A of the conductive member 30 may be in electrical contact with the ground pad 100. In addition, each of the conductive elements 30 can be a conductive metal or any electronic having conductive properties. Components. Of course, the definition of the above two conductive elements 30 is not intended to limit the present invention, and at least one or more than two conductive elements 30 can be applied to the present invention.

Step S206: Then, as shown in step (B) of FIG. 2A and FIG. 2B, an encapsulant 40 is formed on the circuit substrate 10 to cover the plurality of electronic components 20 and each of the conductive components 30.

Step S208: Then, as shown in step (C) of FIG. 2A and FIG. 2B, the encapsulant 40 and the circuit substrate 10 are cut along the AA cutting line of the step (B) in FIG. 2B so that each conductive element The side surface 300 of the second end portion 30B of 30 is exposed. For example, the encapsulant 40 has two openings 400, the second end portion 30B of each of the conductive elements 30 is exposed by each of the openings 400, and the side 300 of the second end portion 30B of each of the conductive elements 30 and the encapsulant One of the surfaces 401 of 40 is flush.

Step S210: Finally, as shown in step (D) of FIG. 2A and FIG. 2B, a metal shield layer 50 is formed on the outer surface of the encapsulant 40 and the side surface 300 of the second end portion 30B of each of the conductive elements 30. The metal shield layer 50 and the second end portion 30B of each of the conductive elements 30 are electrically in contact with each other. For example, the metal shield layer 50 can cover each of the openings 400, and the metal shield layer 50 covers and electrically contacts the side 300 of the second end portion 30B of each of the conductive elements 30. In addition, according to different design requirements, the metal shielding layer 50 can be a conductive spraying layer formed by spray coating, a conductive sputtering layer formed by sputtering, and a printing method. The conductive printed layer formed, a conductive plating layer formed by electroplating, and the like.

Therefore, as shown in the above step (D) of FIG. 2B, the second embodiment of the present invention provides a module integrated circuit package structure Z having an electrical shielding function, comprising: a substrate unit 1, an electronic unit 2, A conductive unit 3, a package unit 4, and a shielding unit 5. The substrate unit 1 has at least one circuit substrate 10, wherein the circuit substrate 10 has at least one ground pad 100 (the second embodiment shows two ground pads 100 as an example). The electronic unit 2 has a plurality of arrangements and is electrically connected to the circuit substrate 10 The upper electronic component 20. The conductive unit 3 has at least one conductive element 30 disposed on the circuit substrate 10 (the second embodiment shows two conductive elements 30 as an example), wherein the first end portion 30A of the conductive element 30 is electrically connected to the ground pad 100 . The package unit 4 has an encapsulant 40 disposed on the circuit substrate 10 and covering a portion of the plurality of electronic components 20 and the conductive component 30, wherein the second end portion 30B of the conductive component 30 is exposed. The shielding unit 5 has a metal shield layer 50 overlying the outer surface of the encapsulant 40, wherein the metal shield layer 50 and the second end portion 30B of the conductive element 30 are in electrical contact with each other.

For example, the ground pad 100 is disposed on the upper surface of the circuit substrate 10, and the bottom surface of the first end portion 30A of the conductive member 30 and the ground pad 100 are electrically in contact with each other. The encapsulant 40 has at least one opening 400 and the second end portion 30B of the conductive element 30 is exposed by the opening 400. The side surface 300 of the second end portion 30B of the conductive member 30 is flush with one surface 401 of the encapsulant 40, the metal shield layer 50 covers the opening 400, and the metal shield layer 50 covers and electrically contacts the second end portion of the conductive member 30. Side 300 of 30B. Moreover, according to different design requirements, the metal shielding layer 50 can be a conductive sprayed layer, a conductive sputtered layer, a conductive printed layer, a conductive plating layer, and the like.

In other words, the greatest difference between the second embodiment of the present creation and the first embodiment is that in the second embodiment, each of the conductive members 30 is designed to be just the size, so that each of the conductive members 30 does not require an additional cutting step. It can be applied to the module integrated circuit package structure Z with electrical shielding function.

[Possible effects of the examples]

In summary, the present invention can electrically connect at least one metal shield layer formed by any forming method to at least one electrical connection and be disposed on the circuit through at least one conductive component electrically connected and disposed on the circuit substrate. The ground pad on the substrate, in turn, allows the metal shield to naturally create an electrical shielding function for protecting multiple electronic components.

The above description is only a preferred and feasible embodiment of the present creation, and thus does not limit the creation. The scope of the patents, so the equivalent technical changes made by the use of this creation manual and the contents of the drawings are included in the scope of this creation.

Z‧‧‧Modular IC package structure

1‧‧‧Substrate unit

10‧‧‧ circuit board

100‧‧‧Ground pad

2‧‧‧Electronic unit

20‧‧‧Electronic components

3‧‧‧Conducting unit

30‧‧‧Conductive components

30A‧‧‧First end

30B‧‧‧second end

300’‧‧‧cut face

4‧‧‧Package unit

40‧‧‧Package colloid

400‧‧‧ openings

401‧‧‧ surface

5‧‧‧Shielding unit

50‧‧‧Metal shield

Claims (9)

A modular integrated circuit package structure having an electrical shielding function, comprising: a substrate unit having at least one circuit substrate, wherein the at least one circuit substrate has at least one ground pad; and an electronic unit having a plurality of An electronic component disposed on the at least one circuit substrate; a conductive unit having at least one conductive component disposed on the at least one circuit substrate, wherein the first end portion of the at least one conductive component is electrically connected The at least one grounding pad; the package unit having a package colloid disposed on the at least one circuit substrate and covering the plurality of electronic components and a portion of the at least one conductive component, wherein the at least one conductive component a second end portion is exposed; and a shielding unit having a metal shielding layer covering the outer surface of the encapsulant, wherein the metal shielding layer and the second end portion of the at least one conductive member are electrically connected to each other contact. The module integrated circuit package structure having an electrical shielding function according to claim 1, wherein the at least one ground pad is disposed on an upper surface of the at least one circuit substrate, and the at least one conductive component is The bottom surface of the one end portion and the at least one ground pad are electrically connected to each other; wherein the encapsulant has at least one opening, and the second end portion of the at least one conductive element is exposed by the at least one opening. The module integrated circuit package structure having an electrical shielding function according to claim 1, wherein a side surface or a cutting surface of the second end portion of the at least one conductive member is flush with one surface of the encapsulant The metal shielding layer covers the at least one opening, and the metal shielding layer covers and electrically contacts a side surface or a cutting surface of the second end portion of the at least one conductive element. The module integrated electric power with electric shielding function as described in claim 1 of the patent application scope The circuit package structure, wherein the metal shielding layer is a conductive spray layer, a conductive sputter layer, a conductive printed layer, or a conductive plating layer. A modular integrated circuit package structure having an electrical shielding function, comprising: a substrate unit having at least one circuit substrate, wherein the at least one circuit substrate has at least one ground pad; and an electronic unit having a plurality of An electronic component disposed on the at least one circuit substrate; a package unit having an encapsulant disposed on the at least one circuit substrate and covering the plurality of electronic components; and a shielding unit having a shielding unit A metal shielding layer is disposed on the outer surface of the encapsulant, and at least one of the electronic components is exposed by the packaging unit to be electrically connected between the at least one ground pad and the metal shielding layer. The module integrated circuit package structure with electrical shielding function according to claim 5, wherein the metal shielding layer is a conductive sprayed layer, a conductive sputter layer, a conductive printed layer, or a conductive plating layer. . The module integrated circuit package structure having an electrical shielding function as described in claim 5, wherein the electronic component is a capacitor or an inductor. A modular integrated circuit package structure having an electrical shielding function, comprising: a circuit substrate having at least one ground pad; a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate An electronic component disposed on the circuit substrate and electrically connected to the at least one ground pad; an encapsulant disposed on the circuit substrate and covering the plurality of electronic components and the electronic component; and a metal The shielding layer is disposed on the outer surface of the encapsulant, wherein the electronic component is exposed by the encapsulant to be electrically connected between the at least one ground pad and the metal shielding layer. The module integrated circuit package structure having an electrical shielding function as described in claim 8 wherein the electronic component is a capacitor or an inductor.