TWM493677U - Optical transceiver - Google Patents

Abstract

An optical transceiver includes a main board, a fiber joint, a circuit board, a transfer board, metal traces, photoelectric elements, a lens set, a connection base, and at least one amplifier. The fiber joint is coupled to the lens set and the connection base with high precision guided posts, and served for setting a plurality of optical fibers thereon. The connection base is coupled to the main board, and the circuit board is electrically connected to the main board by one of connection methods such as welding, wiring or conductive glue. The transfer board is disposed between the fiber joint and the circuit board. Each of the metal traces is arranged on both of two neighboring surfaces of the transfer board. The photoelectric elements are mounted on one of the neighboring surfaces of the transfer board facing the fiber joint, and electrically connect to the metal traces, respectively, and respectively axially aim to the optical fibers. The amplifier electrically connects the circuit board, and electrically connects the photoelectric elements via the metal traces.

Description

Optical transceiver

This creation relates to an optical transceiver, and more particularly to an optical transceiver for performing single and multiple optical conversion.

Nowadays, optoelectronic communication technology can provide fast and a large amount of information transmission, so the application of optoelectronic communication technology is becoming more and more popular. In the application of the optoelectronic communication technology, the optical transceivers are respectively coupled to the in-line equipment (In-Line Equipment) and the optical fiber equipment to assist the online equipment to normally use the optical fiber line. The main function of the optical transceiver is to convert the received optical signal into a telecommunication signal or convert the electrical signal into an optical signal for transmission.

For example, the optical transceiver includes optoelectronic components (such as laser or light emitting diodes and photodetecting diodes) and amplifying components. The photoelectric element and the amplifying element are electrically connected to each other by a wire through a wire bonding or a sealing process. However, when a high-speed electrical signal is transmitted from amplifying element to a photovoltaic element via a lead, it often causes a voltage drop or noise interference, which affects the quality of the electrical signal exchanged between the optoelectronic component and the amplifying component, resulting in The error in turn affects the transmission result.

It can be seen that the above technology obviously still has inconveniences and defects, and Need to be further improved. Therefore, how to effectively solve the above inconveniences and defects is one of the current important research and development topics, and it has become an urgent need for improvement in related fields.

One of the aims of the present invention is to provide an optical transceiver for solving the inconveniences and defects mentioned in the prior art above, and to solve the electrical signal transmission by using two vertical or non-vertical faces of an adapter plate (for example, a gold-plated ceramic plate). Difficulties, reducing high-speed signal routing.

Another object of the present invention is to provide an optical transceiver that utilizes direct light to improve coupling efficiency.

Another object of the present invention is to provide an optical transceiver that utilizes passive coupling technology to improve assembly convenience and efficiency.

According to an embodiment of the present invention, the optical transceiver comprises a circuit board, a fiber connector, a circuit board, an adapter board, a plurality of first metal plating lines, a plurality of light emitting elements and a first amplifier. The circuit board contains a plurality of connection terminals. The fiber optic connector is contacted and supported on the circuit board, and is coupled to the connector by a high-precision connection post for respectively positioning a plurality of optical fibers thereon. The circuit daughter board is located on the circuit board. The adapter plate is fixed to one side of the connector and the circuit board, and is interposed between the fiber connector and the circuit board. The adapter plate includes adjacent first and second faces, the first face facing the fiber optic connector. Each of the first metal plating lines is formed on the first side and the second side of the interposer. The light-emitting elements are respectively coupled to the first metal plating lines on the first surface of the interposer, and respectively axially align a part of the optical fibers of the optical fibers. surface. The first amplifier is located on the circuit sub-board and electrically connects the connection terminals via the circuit sub-board and electrically connects the light-emitting elements via the first metal plating lines.

In one or more embodiments of the present invention, the optical transceiver further includes a plurality of second metal plating lines, a plurality of photodetecting diodes, and a second amplifier. Each of the second metal plating lines is formed on the first side and the second side of the interposer. The photodetecting diodes are electrically coupled to the second metal plating wires respectively in a partial region of the first surface of the interposer, and are respectively axially aligned with the light incident surfaces of the other portions of the optical fibers. The second amplifiers are located on the circuit daughter board, and the light detecting diodes are electrically connected via the second metal plating lines.

In one or more embodiments of the present invention, the light-emitting elements and the photodetecting diodes are arranged on the first side of the interposer by an array.

In one or more embodiments of the present invention, the first metal plating lines are juxtaposed to a portion of the interposer, and the second metal plating lines are juxtaposed to another portion of the interposer.

In one or more embodiments of the present invention, the optical transceiver further includes a plurality of buffer solder wires. The buffer solder wires are arranged on the interposer at intervals and are arranged between the first metal plating lines and the second metal plating lines.

In one or more embodiments of the present invention, the first amplifier is electrically connected to the first metal plating lines by a plurality of first lines, and the second amplifier is electrically connected to the second metal lines by a plurality of second lines. .

In one or more embodiments of the present invention, the circuit board has a plurality of first print traces and a plurality of second print traces. Each first print trace The first amplifier and one of the first metal plating lines are electrically connected by the two first wires. Each of the second printed traces is electrically connected to the second amplifier and one of the second metal plating lines by two second lines.

In one or more embodiments of the present invention, the circuit board has a plurality of first print traces and a plurality of second print traces. Each of the first printed traces is electrically connected to the first amplifier by a first wire and directly electrically coupled to one of the first metal plating wires. Each of the second printed traces is electrically connected to the second amplifier by a second wire and directly electrically coupled to one of the second metal plating lines.

In one or more embodiments of the present invention, the circuit board has a plurality of first print traces and a plurality of second print traces. The first amplifier directly electrically couples the first printed traces by flip chip, and the first metal plating lines are directly electrically coupled to the first printed traces. The second amplifier directly electrically couples the second printed traces by flip chip, and the second metal plating lines are directly electrically coupled to the second printed traces.

In one or more embodiments of the present invention, the optical transceiver further includes a connector. The connector is interposed between the fiber connector and the circuit board, and is connected to the circuit board, the circuit board, and the fiber connector. The adapter plate is fixed to the connector.

In one or more embodiments of the present invention, the connector includes a body, at least one fixing insert, a first slot and a second slot. The fixing insert is formed on the bottom surface of the base body for fixing to the circuit board. The first slot is located on the side of the body adjacent to the fiber optic connector for the adapter plate to be inserted straight into it. The second slot is located on a side of the body away from the fiber connector, and the first slot is opened for the circuit board to be laterally inserted therein.

In one or more embodiments of the present invention, the circuit daughter board includes a The first block and a second block. The second block protrudes from one side of the first block, and the second block is laterally inserted into the second slot of the connector block. The first amplifier and the second amplifier are juxtaposed on the second block.

In one or more embodiments of the present invention, the second block of the circuit daughter board contacts the connector.

In one or more embodiments of the present invention, the optical fiber connector includes a connector body, an optical signal output portion, a fiber storage slot, and a plurality of fiber positioning channels. The optical signal output portion is located at one end of the joint body facing the adapter plate. The fiber storage slot is located at one end of the connector body away from the adapter plate for receiving the optical fibers. The optical fiber positioning channels are arranged on the optical signal output portion for respectively positioning the optical fibers, so that the light incident surfaces of the optical fibers are axially aligned with the light detecting diodes and the light emitting elements.

In one or more embodiments of the present invention, the fiber positioning channels are respectively connected to opposite sides of the optical signal output portion. The opening diameter of the optical fiber positioning channel formed on one side of the optical signal output portion facing the adapter plate is smaller than the opening diameter of the optical fiber positioning channel formed on the side of the optical signal output portion facing away from the adapter plate.

In one or more embodiments of the present invention, the diameter of each of the fiber positioning channels is gradually reduced from the fiber receiving groove toward the optical signal output portion.

In one or more embodiments of the present invention, the fiber optic connector includes a fiber optic spacer. The fiber spacer is mounted on the fiber storage slot. The fiber optic spacer contains multiple islands. The islands are spaced apart on one side of the fiber shims and define a plurality of fiber guiding grooves, respectively. These fiber guiding slots are used These fibers are separately directed to the corresponding fiber positioning channels.

In one or more embodiments of the present invention, each of the two ends of each of the islands has a guiding curved surface. These guiding cambers are used to guide the orientation of these fibers.

In one or more embodiments of the present invention, the optical transceiver further includes a lens group. The lens group includes a lens body, a plurality of first lenses, and a plurality of second lenses. The lens body is fixed between the fiber connector and the connector. The lens body includes two first connecting surfaces and a second connecting surface disposed opposite to each other. The first lens is disposed on the first connecting surface, and the optical fiber positioning channels are axially aligned one by one. The second lens is disposed on the second connecting surface, and the first lens is axially aligned one by one, and the light detecting diodes and the light emitting elements.

In one or more embodiments of the present disclosure, the optical transceiver further includes at least one positioning guide post. The connector has at least one first positioning hole. The lens body has at least one second positioning hole. The joint body has at least one third positioning hole. The first positioning hole, the second positioning hole and the third positioning hole are coaxial with each other, and receive the positioning guide post together, so that the lens group is fixed between the fiber connector and the connector.

In one or more embodiments of the present invention, the second side of the adapter board is located on one side of the adapter board opposite the circuit board.

In one or more embodiments of the present invention, the second side of the adapter plate is located on one side of the adapter board facing the circuit board.

According to another embodiment of the present invention, the optical transceiver comprises a circuit board, a connector, a fiber connector, a circuit board, an adapter board, a plurality of optoelectronic components and a second amplifier. The circuit board contains multiple connections Connect the terminal. The connector is connected to one side of the circuit board. The optical fiber connector is connected to the foregoing surface of the circuit board and one side of the connecting base for respectively positioning a plurality of optical fibers. The circuit board is connected to the aforementioned surface of the circuit board and the other side of the connector to electrically connect the connection terminals. The adapter plate is inserted into the connector and located between the fiber connector and the circuit board, including adjacent first and second faces, wherein the first face faces the fiber connector. The optoelectronic components are respectively coupled to the first side of the interposer and are axially aligned with the fibers, respectively. The amplifiers are respectively located on the circuit daughter board and electrically connected to the circuit daughter board and the optoelectronic components.

In one or more embodiments of the present invention, the optoelectronic components are arranged in an array on the first side of the interposer.

In one or more embodiments of the present invention, the optoelectronic components are a combination of a plurality of laser or light emitting diodes and a plurality of photodetecting diodes. One of the amplifiers only electrically connects the light-emitting diodes, and the other amplifier only electrically connects the light-detecting diodes.

In one or more embodiments of the present invention, the optical transceiver further includes a plurality of metal plating lines. The metal plating lines are arranged on the interposer at intervals, and each of the metal plating lines is formed on the first side and the second side of the interposer. These amplifiers are electrically connected to these optoelectronic components via these metal plating wires, respectively.

In one or more embodiments of the present invention, the optical transceiver further includes a plurality of buffer solder wires. The buffer solder wires are arranged on the interposer at intervals and are arranged between the metal plating lines.

In one or more embodiments of the present invention, the amplifiers are electrically connected to the metal plating lines by a plurality of wires, respectively.

In one or more embodiments of the present creation, the circuit board has a plurality of Printed lines. Each of the printed traces is electrically connected to one of the metal platers and one of the amplifiers by two wires.

In one or more embodiments of the present invention, the circuit board has a plurality of printed traces. Each of the printed traces is electrically connected to one of the amplifiers by a single wire, and is directly electrically coupled to one of the metal plating wires.

In one or more embodiments of the present invention, the circuit board has a plurality of printed traces. The amplifiers are directly electrically coupled to the printed traces by flip chip, and the metal plating lines are directly electrically coupled to the printed traces.

In one or more embodiments of the present invention, the connector includes a body having at least one fixing insert, a first slot, and a second slot. The fixing insert is formed on the bottom surface of the base body for fixing to the circuit board. The first slot is located on the side of the body adjacent to the fiber optic connector for the adapter plate to be inserted straight into it. The second slot is located on a side of the body away from the fiber connector, and the first slot is opened for the circuit board to be laterally inserted therein.

In one or more embodiments of the present invention, the circuit daughter board includes a first block and a second block. The second block protrudes from one side of the first block, and the second block is laterally inserted into the second slot of the connector block. These amplifiers are juxtaposed on the second block.

In one or more embodiments of the present invention, the second block of the circuit daughter board contacts the connector.

In one or more embodiments of the present invention, the fiber optic connector includes a connector body, an optical signal output portion, a fiber receiving slot, and a plurality of fiber positioning channels. The optical signal output portion is located at one of the joint body facing the adapter plate end. The fiber storage slot is located at one end of the connector body away from the adapter plate for receiving the optical fibers. The fiber positioning channels are arranged on the optical signal output portion for respectively positioning the optical fibers such that the light incident surfaces of the optical fibers are axially aligned with the optical components.

In one or more embodiments of the present invention, the fiber positioning channels are respectively connected to opposite sides of the optical signal output portion. The opening diameter of the optical fiber positioning channel formed on one side of the optical signal output portion facing the adapter plate is smaller than the opening diameter of the optical fiber positioning channel formed on the side of the optical signal output portion facing away from the adapter plate.

In one or more embodiments of the present invention, the diameter of each of the fiber positioning channels is gradually reduced from the fiber receiving groove toward the optical signal output portion.

In one or more embodiments of the present invention, the fiber optic connector includes a fiber optic spacer. The fiber optic gasket is mounted on the fiber storage slot, and the fiber gasket includes a plurality of islands. These islands are spaced apart and define a plurality of fiber guiding grooves, respectively. These fiber guiding slots are used to direct the fibers to the corresponding fiber positioning channels.

In one or more embodiments of the present invention, each of the two ends of each of the islands has a guiding curved surface. These guiding cambers are used to guide the orientation of these fibers.

In one or more embodiments of the present invention, the optical transceiver further includes a lens group. The lens group includes a lens body, a plurality of first lenses, and a plurality of second lenses. The lens body is fixed between the fiber connector and the connector. The lens body includes two first connecting surfaces and a second connecting surface disposed opposite to each other. the first The lens is disposed on the first connecting surface, and the optical fiber positioning channels are axially aligned one by one. The second lens is disposed on the second connecting surface, and the first lens and the photoelectric elements are axially aligned one by one.

In one or more embodiments of the present disclosure, the optical transceiver further includes at least one positioning guide post. The connector has at least one first positioning hole. The lens body has at least one second positioning hole. The joint body has at least one third positioning hole. The first positioning hole, the second positioning hole and the third positioning hole are coaxial with each other, and the common receiving post is inserted therein, so that the lens body is fixed between the fiber connector and the connecting seat.

In one or more embodiments of the present invention, the second side of the adapter board is located on one side of the adapter board opposite the circuit board.

In one or more embodiments of the present invention, the second side of the adapter plate is located on one side of the adapter board facing the circuit board.

The above description will be described in detail in the following embodiments, and further explanation of the technical solutions of the present invention will be provided.

100~103‧‧‧ Optical Transceiver

200‧‧‧ circuit board

210‧‧‧Top surface of the circuit board

220‧‧‧Connecting terminal

230‧‧‧Fixed holes

300‧‧‧Connecting Block

310‧‧‧ body

320‧‧‧Fixed plugin

330‧‧‧first slot

340‧‧‧second slot

350‧‧‧First positioning hole

400‧‧‧Fiber Optic Connector

410‧‧‧Connector body

411‧‧‧Snap slot

420‧‧‧ third positioning hole

430‧‧‧Fiber storage slot

440‧‧‧Fiber positioning channel

441, 442‧‧‧ opening caliber

450‧‧‧Optical signal output department

451‧‧‧Chamfering

460‧‧‧Installation slot

470‧‧‧ fiber

480‧‧‧Optical fiber gasket

481‧‧‧Piece

481W‧‧‧Width

482‧‧‧divided island

482L‧‧‧ length

483‧‧‧guide curved surface

484‧‧‧Fiber guide slot

485‧‧‧ mounting ribs

500, 501‧‧‧ circuit board

510‧‧‧ first block

520‧‧‧Second block

530‧‧‧ wafer area

600‧‧‧Adapter plate

610‧‧‧ first side

620, 621‧‧‧ second side

710‧‧‧Laser or light-emitting diode

720‧‧‧Light detection diode

730, 731‧‧‧ first amplifier

740‧‧‧second amplifier

810, 811‧‧‧ first metal plating line

820‧‧‧Second metal plating line

830‧‧‧buffering wire

900‧‧‧ lens group

910‧‧‧ lens body

920‧‧‧First spacer rib

930‧‧‧Second spacer rib

940‧‧‧Second positioning hole

950‧‧‧First junction

960‧‧‧recessed trough

970‧‧‧Second junction

980‧‧‧first lens

980D‧‧‧Diameter of the first lens

990‧‧‧second lens

990D‧‧‧The diameter of the second lens

C‧‧‧ protective cover

C1‧‧‧ buckle

R‧‧‧ positioning guide column

L1‧‧‧ first line

L2‧‧‧ second line

L3‧‧‧ third line

L4‧‧‧ fourth line

P‧‧‧Printing trace

PE‧‧‧Optoelectronic Module

B‧‧‧Electrode contacts

FIG. 1 is a perspective view of an optical transceiver according to a first embodiment of the present invention.

FIG. 2A is an exploded view of the optical transceiver according to the first embodiment of the present invention as viewed from a viewing angle.

FIG. 2B is an exploded view of the optical transceiver according to the first embodiment of the present invention viewed from another perspective.

FIG. 3 is a perspective view of the optical transceiver according to the first embodiment of the present invention after the protective cover is removed.

4A is a partially enlarged view of an adapter plate of the optical transceiver according to the first embodiment of the present invention.

FIG. 4B is a cross-sectional view showing the photovoltaic module of the optical transceiver of the first embodiment of the present invention.

Figure 5 is a perspective view of the connector of Figure 2A.

Figure 6 is a perspective view of the circuit daughter board of Figure 2A.

Figure 7 is a perspective view of the fiber optic connector of Figure 2A as viewed in the direction of the fiber.

Figure 8 is a perspective view of the fiber spacer of Figure 2A.

Figure 9 is a perspective view of the fiber optic spacer of Figure 2A as viewed from the bottom.

Fig. 10 is a perspective view showing the lens group of Fig. 2A viewed in the direction of the optical fiber.

Figure 11 is a perspective view showing the lens group of Figure 2A as viewed in the direction of the adapter plate.

Figure 12 is a cross-sectional view showing a photovoltaic module of an optical transceiver in accordance with a second embodiment of the present invention.

Figure 13 is a cross-sectional view showing a photovoltaic module of an optical transceiver in accordance with a third embodiment of the present invention.

Figure 14 is a cross-sectional view showing a photovoltaic module of an optical transceiver in accordance with a fourth embodiment of the present invention.

In the following, a plurality of embodiments of the present invention will be disclosed in the drawings. For the sake of clarity, a number of practical details will be described in the following description. However, it should be understood that these practical details are not applied to limit the creation. That is to say, in the implementation part of this creation, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

The technical terms of the following descriptions refer to the idioms in the technical field, and some of the terms are explained or defined in the specification, and the explanation of the terms is based on the description or definition of the specification. In addition, the terms "upper", "lower", "to", etc., as used in this specification, may be included as "on" or "directly" in the context of an object or reference. , "下下", and directly or indirectly "in" something or a reference object, the so-called "indirect" means that there is still an intermediate or physical space; when referring to "proximity", "between" and other terms When the implementation is possible, the meaning may include other intermediates or spaces between the two objects or two reference objects, and no other intermediates or spaces. Furthermore, the following is related to an optical transceiver, and the technical or principle known in the art will not be described unless it involves the technical features of the present invention. In addition, the shapes, dimensions, proportions, and the like of the illustrated components are merely illustrative and are intended to be used by those of ordinary skill in the art to understand the present invention and not to limit the scope of the present invention.

As used herein, "about", "about" or "roughly" is generally the error or range of the index value within 20%, preferably Within 10%, it is better than 5 percent. In the text, unless otherwise stated, the numerical values mentioned are regarded as approximations, that is, they have an error or range as expressed by "about", "about" or "approximately".

First embodiment

1 is a perspective view of an optical transceiver 100 in accordance with a first embodiment of the present invention. FIG. 2A is an exploded view of the optical transceiver 100 according to the first embodiment of the present invention as viewed from a perspective. FIG. 2B is an exploded view of the optical transceiver 100 according to the first embodiment of the present invention as viewed from another perspective. FIG. 3 is a perspective view of the optical transceiver 100 according to the first embodiment of the present invention after the protective cover C is removed.

As shown in FIG. 1 to FIG. 3, the optical transceiver 100 includes a circuit board 200, a fiber connector 400, and a photoelectric module PE. The optical fiber connector 400 is connected to the photoelectric module PE, and the optical fiber connector 400 is connected to the photoelectric module PE on the circuit board 200.

Specifically, the optoelectronic module PE includes a connecting base 300, a circuit sub-board 500, an interposer board 600 (for example, double-sided gold-plated ceramic sheets or double-sided copper-plated ceramic sheets, etc.), a plurality of photoelectric components and more Amplifiers. The photovoltaic element is, for example, a light-emitting element (hereinafter, exemplified by a laser or light-emitting diode 710) and a light detecting diode 720. The amplifiers are, for example, a first amplifier 730 and a second amplifier 740. The connector 300 is connected to the top surface 210 of the circuit board 200. The fiber optic connector 400 is coupled to the top surface 210 of the circuit board 200 and one side of the connector block 300 for positioning a plurality of optical fibers 470 thereon, respectively. The circuit board 500 is connected to the top surface 210 of the circuit board 200 and the connector 300 is connected to the fiber One side of the head 400. The adapter plate 600 is fixed to the connector 300 and located between the fiber connector 400 and the circuit daughter board 500. Since the size of the circuit board 200 is larger than the size of the connector 300, the fiber connector 400, the circuit board 500, and the adapter board 600, the connector 300, the fiber connector 400, the circuit board 500, the adapter board 600, and the optoelectronic component (such as Ray) The emitter or light emitting diode 710 and the light detecting diode 720) and the amplifiers (such as the first amplifier 730 and the second amplifier 740) are all carried on the circuit board 200. The optical transceiver 100 of this embodiment can be covered by a sealant and covered by a protective cover C to protect components such as the optical fiber connector 400 and the optoelectronic module PE on the circuit board 200.

As such, when the optical transceiver 100 of the first embodiment is coupled to an electrical connector (not shown) of the external device, the plurality of connection terminals 220 (eg, metal contacts) of the circuit board 200 are electrically connected to the external device. The connection terminals (e.g., metal contacts) of the connector are electrically connected to each other, so that the optical transceiver 100 of the first embodiment can exchange electrical signals with an external device.

4A is a partially enlarged view of the adapter plate 600 of the optical transceiver 100 according to the first embodiment of the present invention. Fig. 4B is a cross-sectional view taken along line A-A of Fig. 4A.

As shown in FIGS. 4A and 4B, the adapter plate 600 includes adjacent first faces 610 and second faces 620. It should be understood that the adjacent first surface 610 and second surface 620 are not limited to the first surface 610 and the second surface 620 are directly connected. However, in other embodiments included in the present invention, the adjacent first side and second side also include other slopes between the first side and the second side of the adapter plate, thereby allowing the first side of the adapter plate Do not adjoin each other with the second side. First One side 610 faces the fiber optic connector 400 (Fig. 3). For example, the adapter plate 600 has a rectangular shape, the second surface 620 and the first surface 610 are substantially perpendicular to each other, and the second surface 620 is located on a side of the adapter plate 600 facing away from the circuit board 200.

The plurality of light-emitting diodes 710 and the plurality of light-detecting diodes 720 are coupled to each other. The laser or LED 710 and the photo-detecting diode 720 are respectively coupled to the interposer 600. One side 610, and one-to-one axially aligned with the entrance face of these fibers 470 (Fig. 2B). For example, the present invention is not limited thereto. The laser or LED 710 and the photodetecting diode 720 are arranged on the first side 610 of the interposer 600 by an array (eg, linear) arrangement. The first amplifier 730 and the second amplifier 740 are respectively disposed on the circuit sub-board 500, and electrically connect the circuit sub-board 500 with the laser or light-emitting diode 710 and the photo-detecting diode 720 (FIG. 2B).

It should be understood that the so-called axial alignment refers to linear light coupling or linear projection onto the light incident surface (end surface) of the optical fiber 470, and does not need to be projected onto the light incident surface (end surface) of the optical fiber 470 via the mirror surface. In other words, the optical axis of each of the photovoltaic elements passes through the extended axial direction of any of the optical fibers 470 described above.

Specifically, as shown in FIG. 4A, the first amplifier 730 is only electrically connected to the laser or light emitting diode 710, and the second amplifier 740 is only electrically connected to the light detecting diode 720. The laser or LED 710 is axially aligned with a portion of the light incident surface (end surface) of the optical fiber 470 for converting the electrical signal into an optical signal and outputting the optical signal. The laser or light-emitting diode 710 is, for example, a laser diode or a light-emitting diode (LED), and may be simply referred to as a light-emitting element, but is not limited thereto. The light detecting diodes 720 are respectively axially opposite The light-emitting surface (end surface) of the remaining portion of the optical fiber 470 is used to receive the optical signal and convert it into a electrical signal. The photodetecting diode 720 is, for example, a photodiode, but is not limited thereto.

The adapter plate 600 includes a plurality of metal plating wires. The metal plating lines are juxtaposed on the interposer 600 at intervals, and each metal plating line is formed on the first surface 610 and the second surface 620 of the interposer 600. The laser or the LED 710 and the photodetecting diode 720 are respectively disposed on the first surface 610 of the interposer 600 and electrically coupled to the first surface 610 of the interposer 600. Part of the area. The corresponding amplifiers are electrically connected to the photovoltaic elements via the metal plating lines to amplify the electrical signals.

The metal plating lines described above are a combination of a plurality of first metal plating lines 810 and a plurality of second metal plating lines 820. The first metal plating lines 810 are spaced apart from each other in a portion of the interposer 600, and each of the first metal plating lines 810 is formed on the first surface 610 and the second surface 620 of the interposer 600. The laser or LEDs 710 are respectively disposed on the first surface 610 of the interposer 600 and coupled to the first metal plating lines 810 on the first surface 610 of the interposer 600. The first amplifier 730 is electrically connected to the laser or LED 710 via the first metal plating lines 810 for amplifying the electrical signals to be sent to the laser or the LED 710. The second metal plating lines 820 are spaced apart from each other in the other portion of the interposer 600, and each of the second metal plating lines 820 is formed on the first surface 610 and the second surface 620 of the interposer 600. The photodetecting diodes 720 are respectively disposed on the first surface 610 of the interposer 600 and coupled to the second metal plating wires 820 on the first surface 610 of the interposer 600. The second amplifier 740 is electrically connected via these second metal plating lines 820 The light detecting diode 720 is used to amplify the electrical signal transmitted from the light detecting diode 720.

Therefore, the arrangement of the metal plating lines (such as the first metal plating line 810 and the second metal plating line 820) of the adapter plate 600 of the above embodiment along the first surface 610 and the second surface 620 can greatly shorten the photoelectricity. The transmission distance between the component (such as the laser or LED 710 and the photodetecting diode 720) to the corresponding amplifier, such that when the first amplifier 730 transmits the amplified output signal to the thunder via the first metal plating line 810 When the light-emitting diode 710 or the light-detecting diode 720 transmits the input signal to the second amplifier 740 via the second metal plating line 820, the output/input signal may be reduced due to voltage drop or noise. The opportunity to interfere with the difficulty of transmission of electrical signals and reduce the number of high-speed signal traces, thereby reducing the quality of cracked electrical signals.

In the first embodiment, as shown in FIG. 4A, the laser or LED 710 and the photodetecting diode 720 are soldered to the first metal plating line 810 and the second metal through solder. The plating line 820 is located in a partial area of the first surface 610 of the interposer 600, such that the laser or LEDs 710 are directly electrically coupled to the first metal plating line 810 on the first side of the interposer 600. The partial regions of the 610 and the photodetecting diodes 720 are directly electrically coupled to the second metal plating wires 820 at a partial region of the first surface 610 of the interposer 600.

In addition, in order to prevent the solder from crossing and electrically connecting the adjacent first metal plating line 810 or the second metal plating line 820, the adapter plate 600 further includes a plurality of buffer solder wire 830. The buffer solder wires 830 are arranged on the interposer 600 at intervals, and are staggered in parallel with the first metal plating lines 810 and the like. Between the second metal plating lines 820.

Thus, when the laser or LED 710 and the photodetecting diode 720 are soldered to the first metal plating line 810 and the second metal plating line 820, respectively, the buffer soldering wires 830 block the solder. The spanning and avoiding the adjacent first metal plating line 810 or the second metal plating line 820 are electrically connected to each other. These buffer solder wires 830 have the same material as these first metal plating lines 810 or second metal plating lines 820. However, the present creation is not limited thereto, and in other embodiments, the buffer weld lines may also be changed to bumps or grooves, respectively.

In the first embodiment, referring to FIG. 3 and FIG. 4B, the first amplifier 730 is electrically connected to the first metal plating lines 810 (FIG. 4A) by a plurality of first bonding wires L1, thereby electrically connecting the thunders. Shot or light emitting diode 710. In particular, the first amplifier 730 is respectively connected to a partial region of the first metal plating line 810 located on the second surface 620 of the interposer 600 by a plurality of first bonding lines L1. The second amplifier 740 is also electrically connected to the second metal plating lines 820 (FIG. 4B) by a plurality of second bonding lines L2, thereby electrically connecting the photodetecting diodes 720. In particular, the second amplifier 740 is respectively connected to a local area of the second metal plate 820 of the second plate 620 of the interposer 600 by a plurality of second wires L2.

However, the present creation is not limited thereto, and other changes will be additionally described in the second to fourth embodiments to be described later.

Fig. 5 is a perspective view showing the connector 300 of Fig. 2A. In the first embodiment, as shown in FIGS. 2A and 5, the connector 300 includes a body 310, a plurality of fixing inserts 320, a first slot 330, and a second. Slot 340. The fixing plugs 320, for example, are located on one side of the circuit board 200 facing the circuit board 200, and are respectively inserted into the fixing holes 230 (FIG. 2A) of the fixed circuit board 200 for fixing the connecting base 300 to the circuit board 200. The first slot 330 is located on one side of the base 310, for example, on the side of the body 310 that is adjacent to the fiber optic connector 400. Therefore, the adapter plate 600 can be inserted straight into the first slot 330, that is, the adapter plate 600 can be inserted into the first slot 330 from the connector 300 toward the circuit board 200. The second slot 340 is located on the other side of the base 310, for example, on the side of the base 310 that is furthest from the fiber optic connector 400. Therefore, the circuit board 500 can be laterally inserted into the second slot 340, that is, the circuit board 500 can be inserted into the second slot 340 from the connector 300 toward the fiber connector 400.

Figure 6 is a perspective view of the circuit daughter board 500 of Figure 2A. In the first embodiment, as shown in FIGS. 2B and 6 , the circuit sub-board 500 is substantially in a “T” shape and includes a first block 510 and a second block 520 . The second block 520 protrudes from one side of the first block 510 such that the second block 520 is laterally inserted into the second slot 340 of the connector 300 (Fig. 5). The second block 520 is disposed on the end farthest from the first block 510 with two wafer regions 530 for the first amplifier 730 and the second amplifier 740 to be juxtaposed on the two wafer regions 530 (FIG. 2B). . In addition, portions of the two wafer regions 530 may also extend toward the first slot 330 such that the second block 520 is as close as possible or contacts the connector 300. In this way, the transmission distance between the photoelectric component (ie, the light-emitting component and the photodetecting diode) to the corresponding amplifier can be greatly shortened, and the output/input signal is reduced in chance of voltage drop or noise interference, thereby reducing the cracking electrical signal quality. chance. Furthermore, due to the second The slot 340 also exposes the top surface 210 of the circuit board 200 (FIG. 2A), so that after the circuit board 500 is inserted into the second slot 340, the top surface 210 of the circuit board 200 can be directly electrically coupled. The connection terminals 220 are electrically connected (Fig. 1).

Figure 7 is a perspective view of the fiber optic connector of Figure 2A as viewed in the direction of the fiber. In the first embodiment, as shown in FIGS. 2A and 7 , the optical fiber connector 400 includes a joint body 410 , a fiber receiving groove 430 , and a plurality of fiber positioning channels 440 . The fiber receiving slot 430 is recessed on the top surface of the connector body 410 for receiving the optical fibers 470 described above. One end of the connector body 410, that is, the connector body 410 faces one end of the adapter plate 600, and has an optical signal output portion 450.

The optical fiber positioning channels 440 are arranged on the optical signal output portion 450 by an array linear arrangement, and the optical fibers 470 are respectively located in the optical fiber positioning channels 440. More specifically, the optical fiber positioning channels 440 are respectively disposed on opposite sides of the optical signal output portion 450. The opening diameters 441 formed by the optical fiber positioning channels 440 on the side of the optical signal output portion 450 facing the interposer 600 are smaller than the optical fibers. The opening 442 of the passage 440 formed by the optical signal output portion 450 facing away from the side of the adapter plate 600 (Fig. 7). In addition, the second side of the joint body 410 further includes a plurality of snap grooves 411 for locking the buckle C1 of the protective cover C therein.

Therefore, as shown in FIG. 2A, the optical fiber positioning channels 440 are axially aligned one by one to the photoelectric elements (ie, the light detecting diode 720 and the laser or light emitting diode 710), and the optical fibers 470 are respectively passed through. These fibers are fixed After the bit channel 440 faces the opening of the adapter plate 600 and is cut, the light-input surface (end surface) of the optical fibers 470 is flushly exposed to the opening of the optical fiber positioning channel 440 on the side of the optical signal output portion 450 facing the adapter plate 600. Therefore, the light incident surfaces (end faces) of the optical fibers 470 are respectively axially aligned with the photovoltaic elements (ie, the light detecting diode 720 and the laser or light emitting diode 710).

It should be understood that when the laser is used to cut through the optical fiber positioning channel 440 to face the opening of the adapter plate 600, a special angle needs to be tilted to cut the optical fibers 470. Therefore, the optical signal output portion 450 is respectively provided with two The chamfer 451 is disposed oppositely to prevent the laser from hitting the optical signal output portion 450 to cause scorching.

In practice, as shown in FIG. 7, the diameter of each of the fiber positioning channels 440 gradually decreases from the fiber receiving groove 430 to the optical signal output portion 450. The opening diameter 442 of the optical fiber positioning channel 440 on the side of the optical signal output portion 450 facing away from the adapter plate 600 is greater than the opening diameter 441 of the optical fiber positioning channel 440 on the side of the optical signal output portion 450 facing the adapter plate 600. These fibers 470 can be quickly inserted into these fiber positioning channels 440 and positioned within the fiber positioning channels 440.

Figure 8 is a perspective view of the fiber optic spacer 480 of Figure 2A. Figure 9 is a perspective view of the fiber optic spacer 480 of Figure 2A as viewed from the bottom. As shown in FIGS. 8 and 9, the fiber optic connector 400 further includes a fiber optic spacer 480. The optical fiber spacer 480 is mounted on the optical fiber receiving groove 430. Specifically, as shown in FIG. 10, the fiber spacer 480 includes a pair of body 481 and two mounting ribs 485 opposite thereto. The mounting rib 485 is located on the bottom surface of the sheet body 481 for insertion The top surface of the joint body 410 is opposite the mounting groove 460 (Fig. 8) to allow the fiber spacer 480 to be secured to the joint body 410.

More specifically, the fiber spacer 480 further includes a plurality of partition islands 482. The partition islands 482 are spacedly arranged on the top surface of the sheet body 481, and define a plurality of fiber guiding grooves 484, respectively. These fibers 470 are thoroughly separated and directed to respective fiber positioning channels 440, respectively. The length 482L of the islands 482 is substantially the same as the width 481W of the top surface of the sheet 481, and the fibers 470 are effectively separated into the corresponding fiber positioning channels 440. Moreover, each of the two ends of each of the islands 482 has a guiding curved surface 483. These guiding cam faces 483 are more helpful in guiding the configuration of these fibers 470 and avoiding the breakage of these fibers 470.

FIG. 10 is a perspective view of the lens group 900 of FIG. 2A viewed in the direction of the optical fiber 470. 11 is a perspective view of the lens group 900 of FIG. 2A viewed in the direction of the adapter plate 600.

Further, as shown in FIGS. 10 and 11, in the first embodiment, the optical transceiver 100 further includes a lens group 900. The lens group 900 includes a lens body 910, a plurality of first lenses 980, and a plurality of second lenses 990. The lens body 910 is fixed between the fiber optic connector 400 and the connector 300. The lens body 910 includes two first connecting faces 950 and a second connecting face 970 that are oppositely disposed. The first lens 980 is disposed on the first interface 950, and the second lens 990 is disposed on the second interface 970. The 980D of these first lenses 980 is smaller than the diameter 990D of these second lenses 990. As shown in FIGS. 2A and 2B, the first lenses 980 are axially aligned one by one to the fiber positioning channels. 440, and the second lens 990 is disposed on the second connecting surface 970, respectively axially aligning the first lens 980, and the photo-electric elements (ie, the light detecting diode 720 and the laser or the light emitting diode) 710). These first lenses 980 or/and these second lenses 990 may be spherical lenses or aspherical lenses, however, the present creation is not limited thereto.

More specifically, the first connecting surface 950 has a recessed groove 960, and the first lenses 980 are arranged at the bottom of the recessed groove 960.

The lens body 910 further includes first and second spacer ribs 920 and 930 having different sizes. The first spacer rib 920 is larger than the second spacer rib 930 and is located on the first connecting surface 950 to abut the optical signal output portion 450 of the optical fiber spacer 480. Therefore, by the action of the first spacer rib 920 and the recessed groove 960, To ensure that the fiber positioning channel 440 of the fiber spacer 480 and the first lens 980 have a desired spacing to maintain the focal length of the first lens 980 relative to the fiber 470. The second spacer rib 930 is located on the second connecting surface 970 and abuts the one side of the connecting frame 300 facing the optical fiber connector 400. Therefore, the second spacer rib 930 functions to ensure the first surface 610 of the adapter plate 600. The optoelectronic component (ie, the laser or LED 710 and the photodetecting diode 720) has a desired spacing from the second lens 990 to maintain the second lens 990 relative to the optoelectronic component. There is a focal length.

Referring back to FIG. 2A, two opposite sides of the base 310 of the connecting base 300 have two first positioning holes 350. Two opposite positioning sides of the lens body 910 of the lens group 900 have two second positioning holes 940. The second side of the joint body 410 of the optical fiber connector 400 has two third positioning holes 420. First positioning on the same side The hole 350, the second positioning hole 940 and the third positioning hole 420 are coaxial with each other, and receive a positioning guide column R (such as a high-precision guide column), so that the lens group 900 is fixed to the fiber connector 400 and the connector 300. between.

As such, when the user performs the assembly of the optical transceiver 100 of this embodiment, the user assembles the connector 300 to the circuit board 200, assembles the adapter board 600 and the circuit board 500 to the connector 300, and In the above manner, the lens assembly 900 and the optical fiber connector 400 are positioned on the connection base 300, and then covered with a glue portion (not shown) over the optical fiber connector 400, the circuit sub-board 500, the connection base 300, the adapter plate 600, and the photoelectric device. The components (such as the laser or LED 710 and the photodetecting diode 720), the first amplifier 730, the second amplifier 740, and the circuit board 200, such that the fiber connector 400, the circuit board 500, the connector 300, The adapter board 600, the laser or light emitting diode 710, the photodetecting diode 720, the first amplifier 730 and the second amplifier 740 are packaged on the circuit board 200 to protect the optical fiber 470 and the circuit on the optical fiber connector 400. The first metal plating line 810 and the second metal plating line 820 on the sub-board 500.

Further, as shown in FIG. 3, when the lens group 900 is combined between the optical fiber connector 400 and the connector 300, a position is defined between the opposite sides of the lens body 910 adjacent to the second positioning hole 940 and the connector 300, respectively. Notch 911. The notch 911 is connected to the second positioning hole 940, and the positioning guide rod R is exposed therein, and the fixing material is inserted through the notch 911 into the first positioning hole 350, the second positioning hole 940 and the third positioning hole 420 on the same side. The positioning guide column R is received by the fixed lens group 900, the optical fiber connector 400, and the connecting base 300.

Second embodiment

Figure 12 is a cross-sectional view showing a photovoltaic module of an optical transceiver in accordance with a second embodiment of the present invention. As shown in Fig. 12, the optical transceiver 101 of the second embodiment is substantially identical to the optical transceiver 100 of Fig. 3 except that the circuit board 200 has a plurality of printed traces P. Each of the printed traces P is electrically connected to the first metal plating line 810 (or the second metal plating line) and the first amplifier 730 (or the second amplifier) by the third bonding line L3 and the fourth bonding line L4, respectively. More specifically, each of the print traces P is printed on the top surface 210 of the circuit board 200 and between the circuit daughter board 500 and the laser or light emitting diode 710. Each of the printed traces P is connected to the first amplifier 730 (or the second amplifier) via the fourth bonding line L4, and the first metal plating line 810 (or the second metal plating line) is connected to the interposer via the third bonding line L3. A partial area of the second side 620 of 600.

Third embodiment

Figure 13 is a cross-sectional view showing a photovoltaic module of an optical transceiver in accordance with a third embodiment of the present invention. As shown in FIG. 13, the optical transceiver 102 of the third embodiment is substantially the same as the optical transceiver 101 of FIG. 12 except that the second surface 621 of the interposer 600 is not located opposite the interposer 600 opposite the circuit board 200. One side is located on one side of the circuit board 200 facing the circuit board 200, and each of the printing traces P of the top surface 210 of the circuit board 200 is directly electrically coupled to the first metal plating line 810 (or the second metal plating line). And the printed trace P is connected to the first metal plating line 810 at the second surface 621 of the interposer 600 Local area.

Fourth embodiment

Figure 14 is a cross-sectional view showing a photovoltaic module of an optical transceiver in accordance with a fourth embodiment of the present invention. As shown in FIG. 14, the optical transceiver 103 of the fourth embodiment is substantially the same as the optical transceiver 102 of FIG. 13, except that the first amplifier 730 or/and the second amplifier 740 are not electrically connected to the printed wiring P. The first amplifier 730 or/and the second amplifier 740 are directly electrically coupled to the printed traces P of the top surface 210 of the circuit board 200 through flip chip, that is, the vertically inverted circuit daughter board 501 is turned downward. The first amplifier 730 or/and the electrode contact B of the second amplifier are directly electrically coupled to the printed trace P of the top surface 210 of the circuit board 200.

Although the present invention has been disclosed in a preferred embodiment as described above, any one skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. The scope defined in the scope of application for patent application shall prevail.

100‧‧‧ Optical Transceiver

200‧‧‧ circuit board

210‧‧‧Top surface of the circuit board

300‧‧‧Connecting Block

400‧‧‧Fiber Optic Connector

470‧‧‧ fiber

480‧‧‧Optical fiber gasket

500‧‧‧Circuit daughter board

600‧‧‧Adapter plate

710‧‧‧Laser or light-emitting diode

720‧‧‧Light detection diode

730‧‧‧First amplifier

740‧‧‧second amplifier

900‧‧‧ lens group

L1‧‧‧ first line

L2‧‧‧ second line

PE‧‧‧Optoelectronic Module

Claims (43)

An optical transceiver comprises: a circuit board; a fiber connector connected to the circuit board for respectively positioning a plurality of optical fibers; a circuit sub board located on the circuit board; and an adapter board fixed to the circuit board One side, and between the fiber connector and the circuit board, the adapter board includes adjacent first and second faces, the first face faces the fiber connector; and the plurality of first metal plating lines Each of the first metal plating lines is formed on the first surface and the second surface of the interposer; the plurality of light emitting elements are electrically coupled to the first metal plating lines respectively on the interposer a partial area of the first surface, and axially respectively aligning a portion of the light incident surfaces of the optical fibers; and a first amplifier disposed on the circuit board, electrically connecting the first metal plating lines Light-emitting element. The optical transceiver of claim 1, further comprising: a plurality of second metal plating lines, each of the second metal plating lines being formed on the first side and the second side of the adapter board; a plurality of photodetecting diodes electrically coupled to the second metal plating lines in a partial region of the first surface of the interposer, and axially aligned with another portion of the optical fibers of the other portion And a second amplifier disposed on the circuit board, and electrically connecting the light detecting diodes via the second metal plating lines. The optical transceiver of claim 2, wherein the light emitting elements and the photodetecting diodes are arranged on the first side of the interposer by an array. The optical transceiver of claim 2, wherein the first metal plating lines are juxtaposed to a portion of the interposer, and the second metal plating lines are juxtaposed to another portion of the interposer. The optical transceiver of claim 2, further comprising: a plurality of buffer solder wires arranged at intervals on the interposer and between the first metal plating lines and the second metal plating lines . The optical transceiver of claim 2, wherein the first amplifier is electrically connected to the first metal plating lines by a plurality of first wires, and the second amplifiers are electrically connected to the plurality of second wires respectively. The second metal plating line. The optical transceiver of claim 2, wherein the circuit board has a plurality of first print traces and a plurality of second print traces, each of the first print traces being electrically connected by two first traces One of the first metal plating lines and the first amplifier, each of the second printed traces is electrically connected to one of the second metal plating lines and the second amplifier by two second lines. The optical transceiver of claim 2, wherein the circuit board has a plurality of a first printed trace and a plurality of second printed traces, each of the first printed traces being electrically connected to the first amplifier by a first wire, and directly electrically coupling one of the first metal plating wires Each of the second printed traces is electrically connected to the second amplifier by a second wire and directly electrically coupled to one of the second metal plating wires. The optical transceiver of claim 2, wherein the circuit board has a plurality of first printed traces and a plurality of second printed traces, and the first amplifier directly couples the first prints by flip chip bonding And the first metal plating lines are directly electrically coupled to the first printed traces, and the second amplifier is directly electrically coupled to the second printed traces by flip chip, and the second metal plating The wires are directly electrically coupled to the second printed traces. The optical transceiver of claim 2, further comprising: a connector between the fiber connector and the circuit board, connecting the circuit board, the circuit board and the fiber connector, wherein the adapter board Fixed to the connector. The optical transceiver of claim 10, wherein the connector comprises: a body; at least one fixing insert formed on a bottom surface of the base for fixing to the circuit board; a first slot located at the The seat body is adjacent to one side of the fiber optic connector for the adapter plate to be inserted straight therein; A second slot is located on a side of the body away from the fiber connector, and the first slot is opened for the circuit board to be laterally inserted therein. The optical transceiver of claim 11, wherein the circuit sub-board comprises a first block and a second block, the second block protruding from one side of the first block, the second block Translating laterally into the second slot of the connector, wherein the first amplifier and the second amplifier are located side by side on the second block. The optical transceiver of claim 12, wherein the second block of the circuit daughter board contacts the connector. The optical transceiver of claim 10, wherein the optical fiber connector comprises: a connector body; an optical signal output portion located at one end of the connector body facing the adapter plate; and a fiber storage slot located at the connector body away from the connector body One end of the adapter plate for receiving the optical fibers; and a plurality of optical fiber positioning channels arranged on the optical signal output portion for respectively positioning the optical fibers, so that the light incident surfaces of the optical fibers are respectively axially and axially Aligning the light detecting diodes with the light emitting elements. The optical transceiver of claim 14, wherein the optical fiber positioning channels respectively pass through two opposite sides of the optical signal output portion, and the optical fiber positioning channels are disposed on a side of the optical signal output portion facing the interposer Forming an opening smaller than the fiber positioning channels on the side of the optical signal output portion facing away from the adapter plate The opening diameter formed. The optical transceiver of claim 15, wherein the diameter of each of the optical fiber positioning channels is gradually reduced from the optical fiber receiving slot toward the optical signal output portion. The optical transceiver of claim 14, wherein the fiber optic connector comprises: a fiber optic spacer mounted on the fiber receiving slot, the fiber optic spacer comprising a plurality of islands, the islands being spaced apart from the fiber One of the shims defines a plurality of fiber guiding grooves for guiding the fibers to the corresponding fiber positioning channels. The optical transceiver of claim 17, wherein each of the two islands has a guiding arc surface for guiding the arrangement direction of the fibers. The optical transceiver of claim 14, further comprising: a lens group, comprising: a lens body fixed between the fiber connector and the connector, the lens body comprising two oppositely disposed first interfaces a second connecting surface; a plurality of first lenses disposed on the first connecting surface, respectively axially aligning the optical fiber positioning channels; and a plurality of second lenses disposed on the second connecting surface And axially aligning the first lenses, and the light detecting diodes and the light emitting elements. The optical transceiver of claim 19, further comprising at least one positioning guide post, wherein the connecting base has at least one first positioning hole, the lens body has at least one second positioning hole, and the connector body has at least a third a positioning hole, wherein the at least one first positioning hole, the at least one second positioning hole and the at least one third positioning hole are coaxial with each other, and receive the at least one positioning post together, so that the lens group is fixed to the Between the fiber optic connector and the connector. The optical transceiver of claim 1, wherein the second side of the adapter board is located on a side of the adapter board opposite the circuit board. The optical transceiver of claim 1, wherein the second side of the adapter board is located on a side of the circuit board opposite the circuit board. An optical transceiver comprising: a circuit board; a connector connected to one side of the circuit board; a fiber connector connecting the side of the circuit board and one side of the connector for respectively positioning a plurality of optical fibers; a circuit board connected to the side of the circuit board and the other side of the connector for electrically connecting the circuit board; an adapter board inserted into the connector and located at the fiber connector and the circuit board Between the adjacent first and second faces, wherein the first face faces the fiber optic connector; a plurality of optoelectronic components respectively coupled to the first surface of the interposer and axially aligning the optical fibers respectively; and a second amplifier disposed on the circuit sub-board and electrically connecting the circuit sub-board and the Photoelectric components. The optical transceiver of claim 23, wherein the optoelectronic components are arranged in an array on the first side of the interposer. The optical transceiver of claim 23, wherein the plurality of light-emitting elements are a combination of a plurality of light-emitting elements and a plurality of light-detecting diodes, wherein one of the two amplifiers is only electrically connected to the light-emitting elements, and the other An amplifier is only electrically connected to the photodetecting diodes. The optical transceiver of claim 23, further comprising: a plurality of metal plating lines arranged at intervals on the transfer board, and each of the metal plating lines is formed on the first side of the transfer board And the second surface, wherein the amplifiers are electrically connected to the photovoltaic elements via the metal plating lines. The optical transceiver of claim 26, further comprising: a plurality of buffer solder wires arranged at intervals on the riser board and disposed between the metal plating lines. The optical transceiver of claim 26, wherein the amplifiers respectively borrow The metal plating lines are electrically connected by a plurality of wires. The optical transceiver of claim 26, wherein the circuit board has a plurality of printed traces, each of the printed traces electrically connecting one of the metal plating lines and one of the amplifiers by a second line . The optical transceiver of claim 26, wherein the circuit board has a plurality of printed traces, each of the printed traces electrically connecting one of the amplifiers by a wire, and directly electrically coupling the metal plating One of the lines. The optical transceiver of claim 26, wherein the circuit board has a plurality of printed traces, and the amplifiers are directly electrically coupled to the print traces by flip chip, and the metal plating lines are directly electrically coupled. Take these print lines. The optical transceiver of claim 23, wherein the connector comprises: a body; at least one fixing insert formed on a bottom surface of the base for fixing to the circuit board; a first slot located at the a seat body is adjacent to one side of the fiber connector for the adapter plate to be inserted straight therein; and a second slot is located at a side of the body away from the fiber connector, and the first slot is opened for The circuit daughter board is inserted laterally therein. The optical transceiver of claim 32, wherein the circuit daughter board comprises a a first block and a second block, the second block protrudes from one side of the first block, and the second block is laterally inserted into the second slot of the connector, wherein the amplifiers are juxtaposed The ground is located on the second block. The optical transceiver of claim 33, wherein the second block of the circuit daughter board contacts the connector. The optical transceiver of claim 21, wherein the optical fiber connector comprises: a connector body; an optical signal output portion located at one end of the connector body facing the adapter plate; and a fiber storage slot located at the connector body away from the connector body One end of the adapter plate for receiving the optical fibers; and a plurality of optical fiber positioning channels arranged on the optical signal output portion for respectively positioning the optical fibers, so that the light incident surfaces of the optical fibers are respectively axially and axially Align the optoelectronic components. The optical transceiver of claim 35, wherein the optical fiber positioning channels respectively pass through two opposite sides of the optical signal output portion, and the optical fiber positioning channels are disposed on a side of the optical signal output portion facing the interposer The opening diameter formed is smaller than the opening diameter of the optical fiber positioning channel formed on the side of the optical signal output portion facing away from the one of the adapter plates. The optical transceiver of claim 36, wherein each of the optical fiber positioning channels has a diameter gradually from the optical fiber receiving slot toward the optical signal output portion. Zoom out. The optical transceiver of claim 35, wherein the fiber optic connector comprises: a fiber optic spacer mounted on the fiber receiving slot, the fiber optic spacer comprising a plurality of islands spaced apart and defined separately A plurality of fiber guiding slots are provided for guiding the fibers to the corresponding fiber positioning channels. The optical transceiver of claim 38, wherein each of the two islands has a guiding arc surface for guiding the arrangement direction of the optical fibers. The optical transceiver of claim 35, further comprising: a lens group, comprising: a lens body fixed between the fiber connector and the connector, the lens body comprising two oppositely disposed first interfaces a second connecting surface; a plurality of first lenses disposed on the first connecting surface, respectively axially aligning the optical fiber positioning channels; and a plurality of second lenses disposed on the second connecting surface The first lenses and the photovoltaic elements are axially aligned one by one. The optical transceiver of claim 40, further comprising at least one positioning guide post, wherein the connecting base has at least one first positioning hole, the lens body has at least one second positioning hole, and the connector body has at least a third Positioning hole, The at least one first positioning hole, the at least one second positioning hole and the at least one third positioning hole are coaxial with each other, and receive the at least one positioning guide column therein, so that the lens body is fixed to the optical fiber connector. Between the connectors. The optical transceiver of claim 23, wherein the second side of the adapter board is located on a side of the adapter board opposite the circuit board. The optical transceiver of claim 23, wherein the second side of the adapter board is located on a side of the circuit board opposite the circuit board.