TWM493667U - Cooling system for an electronic rack - Google Patents

Abstract

The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.

Description

Electronic instrument cabinet cooling system

This creation is about a cooling system, especially with regard to cooling systems for electronic instrument cabinets.

Referring to the first figure, the first figure is a schematic diagram of a heat dissipation path of a conventional electronic instrument cabinet cooling system 100, wherein the arrows in the first figure represent heat flow. The heat generated by heat source 110 (electronic components within the electronic instrument, such as an IC or hard disk) is removed to external environment 112 by forced air circulation 111. The air system acts as a heat transfer medium. For a similar data center location, a large number of computer cabinets and related components are placed, and an active cooling system 113 is further required to reduce the temperature of the circulating air and increase its heat transfer performance. However, it is difficult to effectively bring cold air into the instrument without the need for a fan and additional equipment.

In addition, for an electronic instrument cabinet in which an electronic instrument such as a blade servo is placed, the power can easily exceed 20 KW, and thus a cooling device having a very high air flow rate is required. It will require a larger area and power than the electronic instrument itself. The energy efficiency of the data center is an obvious example. The common method of determining the energy efficiency of a data center is Power Usage Effectiveness (PUE). This ratio is the total energy delivered to the data center divided by the energy used by the instrument. The data center has an average PUE of approximately 2. In other words, a data center with 1 MW electronic instrument must consume another 1 MW to the cooling system of the data center. Furthermore, the conventional electronic instrument The cabinet cooling system not only wastes energy but also generates a lot of noise, and the damage of the fan also reduces the reliability of the entire system.

In view of this, the creation provides an electronic instrument cabinet cooling system that does not have a fan, low noise, and low power consumption.

One of the aims of this creation is to provide an electronic instrument cabinet cooling system that does not have a fan, low noise, and low power consumption.

In order to achieve the above objective, the present invention provides an electronic instrument cabinet cooling system comprising: an electronic instrument cabinet including at least one side wall; at least one electronic instrument case disposed in the electronic instrument cabinet and configured to accommodate at least one mode The at least one electronic device chassis includes a top wall and at least one side wall, the at least one modular electronic device includes a plurality of electronic components and at least one fixed heat dissipation interface disposed above the electronic component; a first detachable heat dissipating interface disposed between the top wall of the at least one electronic instrument chassis and the at least one modular electronic device; and at least one second detachable heat dissipating interface disposed in the electronic instrument cabinet A sidewall is interposed between the sidewall and the at least one sidewall of the at least one electronic instrument chassis.

In the foregoing electronic device cabinet cooling system, the first detachable heat dissipation interface or the at least one second detachable heat dissipation interface is made of a metal material.

In the foregoing electronic device cabinet cooling system, the first detachable heat dissipation interface or the at least one second detachable heat dissipation interface is a heat pipe.

In the foregoing, the electronic instrument cabinet cooling system is created, and the electronic instrument cabinet does not have a fan.

The aforementioned electronic device cabinet cooling system, the first detachable heat sink The surface includes a first contact portion, a second contact portion and a locking portion, and the first detachable heat dissipation interface generates a relative displacement between the first contact portion and the second contact portion by actuating the locking portion .

In the above-described electronic device cabinet cooling system, the at least one second detachable heat dissipation interface includes a first contact portion, a second contact portion and a locking portion, and the at least one second detachable heat dissipation interface is actuated The locking portion causes a relative displacement between the first contact portion and the second contact portion.

In order to achieve the above objective, the present invention provides an electronic instrument cabinet cooling system comprising: an electronic instrument cabinet including at least one side wall; at least one modular electronic device disposed in the electronic instrument cabinet and including a top wall At least one side wall, a plurality of electronic components, and at least one fixed heat dissipation interface disposed between the plurality of electronic components and the top wall; and at least one detachable heat dissipation interface disposed on at least one of the electronic instrument cabinets The sidewall is between the at least one sidewall of the at least one modular electronic device.

In the foregoing electronic device cabinet cooling system, the at least one detachable heat dissipation interface is made of a metal material.

In the foregoing electronic device cabinet cooling system, the at least one detachable heat dissipation interface is a heat pipe.

In the foregoing, the electronic instrument cabinet cooling system is created, and the electronic instrument cabinet does not have a fan.

In the above-mentioned electronic device cabinet cooling system, the at least one detachable heat dissipation interface includes a first contact portion, a second contact portion and a locking portion, and the at least one detachable heat dissipation interface is actuated by actuating the locking portion. The first contact portion and the second contact portion generate a relative displacement.

The creation of the electronic instrument cabinet cooling system effectively dissipates heat from the heat source in the electronic device to the external environment by conduction heat dissipation, thereby achieving the advantages of no fan, low noise and low power consumption. The reader will be better able to understand the other objects, features, and advantages of the present invention after referring to the detailed description of the embodiments below and the accompanying drawings and claims.

100‧‧‧Electronic instrument cabinet cooling system

110‧‧‧heat source

111‧‧‧ Forced air circulation

112‧‧‧ External environment

113‧‧‧Active cooling system

200‧‧‧Electronic instrument cabinet cooling system

210‧‧‧Electronic instrument cabinet

211‧‧‧ Side wall of electronic instrument cabinet

220‧‧‧Electronic instrument chassis

221‧‧‧The top wall of the electronic instrument case

222‧‧‧ Side wall of electronic instrument case

230‧‧‧Modular electronic instruments

231‧‧‧Electronic components

232‧‧‧Fixed thermal interface

240‧‧‧First detachable thermal interface

2401‧‧‧First contact

2402‧‧‧Second contact

2403‧‧‧ Main body

2404‧‧‧Locking Department

250‧‧‧Second removable heat sink

300‧‧‧Electronic instrument cabinet cooling system

310‧‧‧Electronic instrument cabinet

311‧‧‧ Side wall of electronic instrument cabinet

320‧‧‧Modular electronic instruments

321‧‧‧Top wall of modular electronic equipment

322‧‧‧Sidewall of modular electronic equipment

323‧‧‧Electronic components

324‧‧‧Fixed thermal interface

330‧‧‧Removable thermal interface

421‧‧‧ top wall

430‧‧‧Modular electronic instrument

440‧‧‧First detachable thermal interface

4401‧‧‧ first tablet

4402‧‧‧ second tablet

4403‧‧‧First fin

4404‧‧‧second fin

520‧‧‧Electronic instrument chassis

521‧‧‧ 避避

530‧‧‧Modular electronic equipment

540‧‧‧First detachable thermal interface

5401‧‧‧ first tablet

5402‧‧‧ second tablet

5403‧‧‧First fin

5404‧‧‧second fin

621‧‧‧ top wall

630‧‧‧Modular electronic instrument

640‧‧‧First detachable thermal interface

6401‧‧‧ first tablet

6402‧‧‧ second tablet

6403‧‧‧First bevel

6404‧‧‧Second slope 102a

Refer to the following drawings and descriptions to better understand the system and method of this creation. For a detailed and non-limiting example, please refer to the description of the subsequent figures. The constituent elements in the drawings are not necessarily to scale, and the principles of the present invention are depicted in an emphasized manner. In the drawings, the same elements are labeled in the different drawings.

The first figure is a schematic diagram of the heat dissipation path of the conventional electronic instrument cabinet cooling system 100.

The second drawing is a partial schematic view of an electronic instrument cabinet cooling system according to the first embodiment of the present invention.

The third figure is a magnified view of the module type electronic device, the first detachable heat dissipating interface and the top wall of the electronic instrument case according to the first embodiment of the present invention, and the first detachable heat dissipating interface is in a locked state. schematic diagram.

The third figure is a magnified view of the module type electronic device, the first detachable heat dissipating interface and the top wall of the electronic instrument case according to the first embodiment of the present invention, and the first detachable heat dissipating interface is in a loose state. Schematic diagram.

The fourth A is an enlarged view of the modular electronic device, the first detachable heat dissipation interface and the top wall of the electronic instrument case of the second embodiment of the present invention.

The fourth B is an enlarged view of the modular electronic device, the first detachable heat dissipation interface and the top wall of the electronic instrument case of the second embodiment of the present invention, and the first detachable heat dissipation interface is loose. A schematic diagram of the open state.

Figure 5A is an enlarged view of the modular electronic device of the third embodiment of the present invention and the first detachable heat dissipating interface (released state) before being inserted into the electronic device chassis.

The fifth B is an enlarged view of the modular electronic device of the third embodiment of the present invention and the first detachable heat dissipating interface (locked state) after being inserted into the electronic device chassis.

The sixth figure is an enlarged view of the modular electronic device, the first detachable heat dissipation interface and the top wall of the electronic instrument case of the fourth embodiment of the present invention.

The seventh figure is a partial schematic view of an electronic instrument cabinet cooling system according to the fourth embodiment of the present invention.

The description of the specific embodiment of the present creation will be made below. It should be noted that the disclosed embodiments are merely illustrative. The scope of the present invention is not limited to the specific embodiments in which the specific features, structures, or properties are disclosed, but are defined by the scope of the appended claims. In addition, the illustrations referred to in the specification do not specifically describe all the features of the present invention, and the elements depicted may be expressed in a simplified and schematic manner, and the dimensions of various elements in the drawings may be described. It is exaggerated or does not conform to the actual ratio. Whether or not the foregoing is abbreviated, or whether the relevant features are described in detail, the persons described in the table are those skilled in the relevant art, and other specifics related to the features, structures, or properties may be The examples are implemented within the scope of knowledge.

Please refer to the second figure, which is a partial schematic view of the electronic instrument cabinet cooling system according to the first embodiment of the present invention. The electronic instrument cabinet cooling system 200 includes an electronic equipment cabinet 210, a plurality of electronic equipment cabinets 220, a plurality of modular electronic instruments 230, and a first The heat dissipation interface 240 and the plurality of second removable heat dissipation interfaces 250 are removable. It should be noted that since the connection relationship between each electronic instrument case 220 and the electronic instrument cabinet 210 in the electronic instrument cabinet cooling system 200 is the same, the second figure only shows one of the plurality of electronic instrument cases 220. The electronic device cabinet 210 has two side walls 211. The electronic equipment case 220 has a top wall 221 and two side walls 222. The electronic instrument case 220 is disposed in the electronic instrument cabinet 210 and is used for accommodating a plurality of modular electronic devices. Instrument 230. The modular electronic device 230 includes a plurality of electronic components 231 (eg, an IC or a hard disk, etc.) and a fixed heat dissipation interface 232 disposed above the electronic component 231. The first detachable heat dissipating interface 240 is disposed between the top wall 221 of the electronic device chassis 220 and the module type electronic device 230, and the plurality of second detachable heat dissipating interfaces 250 are disposed on the side wall 211 of the electronic instrument cabinet 210 and the electronic device. Between the side walls 222 of the chassis 220. With further reference to the arrows in the second figure, the arrows represent the heat flow of the electronics cabinet cooling system 200, ie, the heat dissipation path of the electronics cabinet cooling system 200. The heat generated by the electronic component 231 (such as an IC or a hard disk, etc.) in the electronic device 230 is transmitted to the top wall 221 of the electronic device chassis 220 by the fixed heat dissipation interface 232 and the first detachable heat dissipation interface 240. The sidewall 222, and then the two sidewalls 211 of the electronic device cabinet 210 are generated by the second detachable heat dissipation interface 250, and the heat generated by the electronic component 231 in the electronic device 230 is generated from the top wall 221 of the electronic device chassis 220 and two The side walls 222 are conducted to the external environment. The electronic instrument cabinet cooling system 200 of the present invention achieves good heat conduction and heat dissipation by means of a heat dissipation interface and a large area contact surface without using a fan and a gas flow. In a specific embodiment of the present invention, the first detachable heat dissipation interface 240 and the second detachable heat dissipation interface 250 may be metal plates or heat pipes. The configurations of the detachable heat dissipation interfaces 240, 250 and the electronic components 231 in the electronic instruments 230 can be different, as in any of the embodiments shown in the third to sixth embodiments.

Because the electronics of the electronic instrument cabinet cooling system may be damaged, The modular electronic or electronic instrument chassis is capable of removing and replacing the requirements that are important for electronic instrument cabinets. Therefore, the structural design of the detachable heat dissipation interface of the present invention allows the modular electronic instrument or electronic instrument case to be easily removed and replaced. Referring to the third A to third B, the third type A and the third B are the modular electronic device 230 of the second figure, the first detachable heat dissipation interface 240, and the top wall 221 of the electronic instrument case 220 are enlarged. And the first detachable heat dissipation interface 240 is in a schematic view of a locked state and a released state, respectively. The first detachable heat dissipation interface 240 includes a first contact portion 2401, a second contact portion 2402, a main body portion 2403, and a locking portion 2404. The first contact portion 2401 and the second contact portion 2402 are wedge-shaped and movable. It is disposed on the main body portion 2403. Referring to FIG. 3A, FIG. 3A is a schematic view showing the first detachable heat dissipation interface 240 in a locked state, and the first detachable heat dissipation interface 240 is locked by locking the locking portion 2404 into the main body portion 2403, so that the second contact is made. The portions 2402 are close to each other, thereby pushing the first contact portion 2401 to move in the Z direction (ie, the direction of the top wall 221 of the electronic instrument case 220), so that the first contact portion 2401 closely contacts the top wall 221 of the electronic instrument case 220. Accordingly, referring to the second figure, the heat generated by the electronic component 231 (such as an IC or a hard disk, etc.) in the module type electronic device 230 can be conducted by the fixed heat dissipation interface 232 and the first detachable heat dissipation interface 240. The top wall 221 and the two side walls 222 of the electronic instrument case 220 are provided. With further reference to the third B diagram, the third B diagram is a schematic diagram of the first detachable heat dissipation interface 240 in the released state, and the first detachable heat dissipation interface 240 is loosened by the locking portion 2404 toward the main body portion 2403, so that the first The two contact portions 2402 are separated from each other, and the force pushing the first contact portion toward the Z direction (ie, the direction of the top wall 221 of the electronic instrument case 220) disappears, and the first contact portion 2401 will no longer contact the top of the electronic instrument case 220. The wall 221, according to which the modular electronic instrument 230 can be easily removed and replaced. Similarly, the structural design of the first detachable heat dissipation interface 240 can also be applied to the second detachable heat dissipation interface 250 disposed between the sidewall 211 of the electronic instrument cabinet 210 and the sidewall 222 of the electronic device chassis 220.

4A and 4B are enlarged views of the module type electronic device 430, a first detachable heat dissipation interface 440, and a top wall 421 of an electronic instrument case 420 of the second embodiment. Further, the fourth and fourth B diagrams respectively show the first detachable heat dissipation interface 440 in a released state and a locked state. The first detachable heat dissipation interface 440 includes a first slab 4401 having a first fin 4403 and a second slab 4402 having a second fin 4404. The first flat plate 4401 is fixedly fixed to the top wall 421 of the electronic device chassis 420, and the second flat plate 4402 is movably placed between the first flat plate 4401 and the modular electronic device 430. The fourth A is a locked state diagram of the third detachable heat dissipation interface 440. The second flat plate 4402 is placed on the modular electronic device 430, and the second fin 4404 is engaged with the first fin 4403 to bring the first flat plate 4401 into contact with the second flat plate 4402, resulting in The first detachable heat dissipation interface 440 is in close contact with the top wall 421 of the electronic device chassis 420 and the module type electronic device 430. FIG. 4B is a release state diagram of the first detachable heat dissipation interface 440. The second flat plate 4402 moves toward the first flat plate 4401, thereby forming a gap between the second flat plate 4402 and the modular electronic device 430. As such, the modular electronic instrument 430 can be easily removed and removed in the released state. Preferably, a thermal filter is provided between the second flat plate 4402 and the modular electronic device 430 or between the first flat plate 4401 and the second flat plate 4402. In addition, other elements of the second embodiment of the present invention and their connection relationships are similar to those described in the first embodiment of the present invention, and thus the related description will not be repeated.

5A and 5B show the modular electronic device 530, the first detachable heat dissipation interface 540 and the electronic instrument case 520 of the third embodiment of the present invention. Figures 5A and 5B show the released state and the locked state of the first detachable heat dissipation interface 540, respectively. The first detachable heat dissipation interface 540 includes a first slab 5401 having a first fin 5403 and a second slab 5404 The second tablet 5402. FIG. 5A shows the released state of the modular electronic instrument 530 before being inserted into the electronic instrument case 520. The first flat plate 5401 is firmly fixed to the top 521 of the electronic device case 520, and the second flat plate 5402 is firmly fixed to the modular electronic device 530. In order to place the second tablet 5402 and the module type electronic device 530 in a locked state, the second tablet 5402 and the module type electronic device 530 are inserted into the electronic instrument case 520 along the X direction. The fifth panel B shows the module type electronic instrument 530 and the second tablet 5402 in a locked state after being inserted into the electronic instrument case 520. The gap between the first fin 5403 and the second fin 5404 is less than a few hundred micrometers, so that the heat generated by the electronic component is conducted from the module type electronic device 530 to the Z direction. The top wall 521 of the electronic instrument case 520. The modular electronic device 530 can achieve a locked state through a locking mechanism and can be extracted and removed by being easily unlocked. Preferably, a heat sink can be filled between the first fin 5403 and the second fin 5404 to enhance heat conduction therebetween. In addition, other elements of the third embodiment of the present invention and their connection relationships are similar to those described in the first embodiment of the present invention, and thus the related description will not be repeated.

The sixth figure is the module type electronic instrument 630, the first detachable heat dissipation interface 640 and the top wall 621 of the electronic instrument case shown in the fourth embodiment of the present invention. The first detachable heat dissipation interface 640 includes a first slab 6401 having a first slope 6403 and a second slab 6402 having a second slope 6404. The first flat plate 6401 is fixedly fixed to the top wall 621 of the electronic device chassis, and the second flat plate 6402 is movably disposed between the first flat plate 6401 and the modular electronic device 630. In the locked state, the second flat plate is placed on the modular electronic device 630, and the second inclined surface 6404 is matched with the first inclined surface 6403 to make the first flat plate 6401 contact the second flat plate 6402. As such, the first detachable heat dissipation interface 640 is in close contact with the top wall 621 of the electronic device chassis and the module type electronic instrument 630. On the other hand, in the released state, the second tablet The 6402 and the modular electronic instrument 630 can be easily removed for removal. Preferably, the second flat panel 6402 can be fixed on the modular electronic device 630. In addition, other elements of the fourth embodiment of the present invention and their connection relationships are similar to those described in the first embodiment of the present invention, and thus the related description will not be repeated.

Please refer to the seventh figure. The seventh figure is a partial schematic diagram of the cooling system of the electronic instrument cabinet according to the fifth embodiment of the present invention. The electronic instrument cabinet cooling system 300 includes an electronic instrument cabinet 310, a plurality of modular electronic devices 320, and a plurality of detachable heat dissipation interfaces 330. It should be noted that the electronic instrument cabinet cooling system 300 is similar to the cooling system 200 of the second figure except that the electronic instrument cabinet cooling system 300 does not include a first detachable heat dissipation interface 240 similar to that of FIG. Moreover, since the connection relationship between each of the modular electronic devices 320 and the electronic instrument cabinet 310 in the electronic instrument cabinet cooling system 300 is the same, the seventh figure shows only one of the plurality of modular electronic devices 320. The electronic instrument cabinet 310 has two side walls 311, and the modular electronic device 320 has a top wall 321 and two side walls 322. The module type electronic device 320 is disposed in the electronic equipment cabinet 310 and includes a plurality of electronic components 323 (such as an IC or a hard disk, etc.) and a plurality of fixed heat dissipation interfaces 324, wherein the fixed heat dissipation interface 324 is disposed on the electronic device. Between the element 323 and the top wall 321 . A plurality of detachable heat dissipation interfaces 330 are disposed between the side walls 311 of the electronics cabinet 310 and the side walls 322 of the module type electronic device 320. The configuration of the detachable heat dissipation interface 330 can be different as in the second to sixth figures of the present writing. With further reference to the arrows in the seventh diagram, the arrows represent the heat flow of the electronics cabinet cooling system 300, ie, the heat dissipation path of the electronics cabinet cooling system 300. The heat generated by the electronic component 323 (such as an IC or a hard disk, etc.) in the module type electronic device 320 is transmitted to the top wall 321 and the two side walls 322 of the module type electronic device 320 through the fixed heat dissipation interface 324, and then The two side walls 311 of the electronic instrument cabinet 310 are separated by a detachable heat dissipation interface The heat generated by the electronic components 323 (eg, IC or hard disk, etc.) is conducted from the top wall 321 and the two sidewalls 322 of the modular electronic device 320 to the external environment. The electronic instrument cabinet cooling system 300 exemplified in the present invention achieves good heat conduction and heat dissipation by the heat dissipation interface and the large-area contact surface without using a fan and a gas flow. In a specific embodiment of the present invention, the detachable heat dissipation interface 330 can be a metal plate or a heat pipe, and the structural design can be designed like the structure of the first detachable heat dissipation interface 240, 440 or 540.

The scope and spirit of the present invention are not limited to the foregoing embodiments. In addition, the drawings shown in the specification are for the purpose Some parts of the diagram may be magnified and others may be abbreviated. Accordingly, the disclosure of the present invention and the drawings are to be regarded as illustrative rather than limiting, and are limited by the scope of the claims.

200‧‧‧Electronic instrument cabinet cooling system

210‧‧‧Electronic instrument cabinet

211‧‧‧ Side wall of electronic instrument cabinet

220‧‧‧Electronic instrument chassis

221‧‧‧The top wall of the electronic instrument case

222‧‧‧ Side wall of electronic instrument case

230‧‧‧Modular electronic instruments

231‧‧‧Electronic components

232‧‧‧Fixed thermal interface

240‧‧‧First detachable thermal interface

250‧‧‧Second removable heat sink

Claims (16)

An electronic instrument cabinet cooling system includes: an electronic instrument cabinet including at least one side wall; at least one electronic instrument case disposed in the electronic instrument cabinet and configured to receive at least one modular electronic device, wherein the at least one An electronic instrument chassis includes a top wall and at least one side wall, the at least one modular electronic device comprising a plurality of electronic components and at least one fixed heat dissipation interface disposed above the electronic components; a first detachable heat dissipation interface, The device is disposed between the top wall of the at least one electronic device chassis and the at least one modular electronic device; and at least one second detachable heat dissipating interface disposed on at least one sidewall of the electronic instrument cabinet and the at least one electronic device The first detachable heat dissipation interface includes a first slab and a second slab, and the two are in contact with each other. The electronic device cabinet cooling system of claim 1, wherein the first detachable heat dissipation interface or the at least one second detachable heat dissipation interface is made of a material having high thermal conductivity. The electronic instrument cabinet cooling system of claim 1, wherein the first detachable heat dissipation interface or the at least one second detachable heat dissipation interface is made of a metal material. The electronic device cabinet cooling system of claim 1, wherein the first detachable heat dissipation interface or the at least one second detachable heat dissipation interface is a heat pipe. The electronic instrument cabinet cooling system of claim 1, wherein the electronic instrument cabinet does not have a fan. The electronic instrument cabinet cooling system of claim 1, wherein the first flat plate comprises a first fin, and the second flat plate comprises a second fin, the second fin meshes with the first fin The first plate is brought into contact with the second plate. The electronic instrument cabinet cooling system of claim 1, wherein the first flat plate is firmly fixed to a top wall of the electronic instrument case. The electronic instrument cabinet cooling system of claim 1, wherein the first flat plate comprises a first inclined surface, and the second flat plate comprises a second inclined surface to form the first flat plate and the second flat plate. contact. An electronic instrument cabinet cooling system includes: an electronic instrument cabinet including at least one side wall; at least one modular electronic device disposed in the electronic instrument cabinet and including a top wall, at least one side wall, and a plurality of electronic components And at least one fixed heat dissipation interface disposed between the plurality of electronic components and the top wall; and at least one detachable heat dissipation interface disposed on at least one sidewall of the electronic instrument cabinet and the at least one module type electronic The at least one side wall of the instrument, wherein the at least one detachable heat dissipating interface comprises a first flat plate and a second flat plate, and the two are in contact with each other. The electronic instrument cabinet cooling system of claim 9, wherein the at least one detachable heat dissipation interface is made of a material having high thermal conductivity. The electronic instrument cabinet cooling system of claim 9, wherein the at least one detachable heat dissipation interface is made of a metal material. The electronic instrument cabinet cooling system of claim 9, wherein the at least one detachable heat dissipation interface is a heat pipe. The electronic instrument cabinet cooling system of claim 9, wherein the electronic instrument cabinet does not have a fan. The electronic instrument cabinet cooling system of claim 9, wherein the first plate comprises a first fin, and the second plate comprises a second fin, the second fin and the first fin The sheets are engaged such that the first plate contacts the second plate. The electronic instrument cabinet cooling system of claim 9, wherein the first flat plate is firmly fixed to a top wall of the electronic instrument case. The electronic instrument cabinet cooling system of claim 9, wherein the first flat plate comprises a first inclined surface, and the second flat plate comprises a second inclined surface to form the first flat plate and the second flat plate. contact.