TWM493164U - Antenna structure with reduced metal shielding effect - Google Patents

Antenna structure with reduced metal shielding effect Download PDF

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Publication number
TWM493164U
TWM493164U TW103216053U TW103216053U TWM493164U TW M493164 U TWM493164 U TW M493164U TW 103216053 U TW103216053 U TW 103216053U TW 103216053 U TW103216053 U TW 103216053U TW M493164 U TWM493164 U TW M493164U
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Taiwan
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conductive layer
loop antenna
antenna
layer
metal shield
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TW103216053U
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Chinese (zh)
Inventor
zhi-shen Zhou
zong-shou Ye
Xiang-Cheng Yang
pei-ren Lin
Shi-Jun Huang
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Unictron Technologies Corp
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Priority to TW103216053U priority Critical patent/TWM493164U/en
Publication of TWM493164U publication Critical patent/TWM493164U/en

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Description

可降低金屬遮蔽效應的天線結構Antenna structure capable of reducing metal shadowing effect

一種可降低金屬遮蔽效應的天線結構,可降低金屬遮蔽物對迴路天線產生的遮蔽效應,達到提升天線輻射效率的目的。An antenna structure capable of reducing metal shadowing effect can reduce the shadowing effect of the metal shielding on the loop antenna, and achieve the purpose of improving the radiation efficiency of the antenna.

隨著無線通訊技術的進步,無線通訊產品已被廣泛的應用在日常生活中,而天線元件則是無線通訊產品最重要的零件之一。天線元件通常會佔用無線通訊產品蠻大的空間,如何縮小天線產品的尺寸來縮減電子裝置的體積是個非常重要的課題。With the advancement of wireless communication technology, wireless communication products have been widely used in daily life, and antenna components are one of the most important parts of wireless communication products. Antenna components usually occupy a large space for wireless communication products. How to reduce the size of antenna products to reduce the size of electronic devices is a very important issue.

為了降低可攜式電子裝置的體積及重量,一般內建型的多頻天線,會選擇以平面倒F天線(Planar Inverted F Antenna、PIFA)或者單極天線的方式來設計,並可將PIFA天線或單極天線設置在可攜式電子裝置的電路板上,藉此以減少可攜式電子裝置內之天線的設置體積。In order to reduce the size and weight of the portable electronic device, the built-in multi-frequency antenna is generally designed to be a Planar Inverted F Antenna (PIFA) or a monopole antenna, and the PIFA antenna can be designed. Or the monopole antenna is disposed on the circuit board of the portable electronic device, thereby reducing the set volume of the antenna in the portable electronic device.

然而在實際應用時,PIFA天線為了要滿足1/4 λ的尺寸需求,而無法進一步縮小天線在電路板上的占用面積,導致無法在電路板上設計PIFA天線,此時,迴路天線便是一個相當優越的解決方案。因為迴路天線只需要使用比較小的電路板面積,就能提供優越的天線輻射效率。然而當迴路天線之周邊有金屬物件存在時,金屬物件會對天線輻射無線電訊號之能力,產生遮蔽效應,顯著影響迴路天線的輻射效率。例如:手機 為了造型或外觀的美感需求,常會用到金屬外殼或金屬環,導致迴路天線的輻射效率受金屬外殼的影響而大幅的下降,此為天線設計者的一大難題。However, in practical applications, in order to meet the size requirement of 1/4 λ, the PIFA antenna cannot further reduce the footprint of the antenna on the circuit board, and the PIFA antenna cannot be designed on the circuit board. In this case, the loop antenna is a A fairly superior solution. Because the loop antenna only needs to use a relatively small board area, it can provide superior antenna radiation efficiency. However, when there are metal objects around the loop antenna, the metal object will have a shadowing effect on the antenna's ability to radiate radio signals, which significantly affects the radiation efficiency of the loop antenna. For example: mobile phone In order to meet the aesthetic needs of the shape or appearance, a metal casing or a metal ring is often used, which causes the radiation efficiency of the loop antenna to be greatly reduced by the influence of the metal casing, which is a big problem for the antenna designer.

本新型主要提供一種可降低金屬遮蔽效應的天線結構,可降低位於迴路天線附近的金屬遮蔽物對迴路天線產生的遮蔽效應,達到提升天線輻射效率的目的。The present invention mainly provides an antenna structure capable of reducing metal shadowing effect, which can reduce the shadowing effect of the metal shielding object located near the loop antenna on the loop antenna, and achieve the purpose of improving the radiation efficiency of the antenna.

本新型是一種可降低金屬遮蔽效應的天線結構,其中迴路天線設置在電路板的淨空區內,淨空區為電路板上沒有設置接地電層或裝置其他電子元件之區域。迴路天線利用訊號饋入線電性連接電子裝置之射頻線路,並透過接地線電性連接接地層與連接單元,且該連接單元電性連接鄰近的金屬遮蔽物,如此的天線結構可產生至少一共振頻率。透過上述的天線構造將可降低金屬遮蔽物對迴路天線產生的遮蔽效應,達到提升天線輻射效率的目的。The invention is an antenna structure capable of reducing metal shadowing effect, wherein the loop antenna is disposed in the clearance area of the circuit board, and the clearance area is an area on the circuit board where no grounding electric layer or other electronic components of the device are disposed. The loop antenna is electrically connected to the RF line of the electronic device by using the signal feed line, and is electrically connected to the ground layer and the connection unit through the ground line, and the connection unit is electrically connected to the adjacent metal shield, and the antenna structure can generate at least one resonance. frequency. Through the above antenna structure, the shielding effect of the metal shielding on the loop antenna can be reduced, and the radiation efficiency of the antenna can be improved.

本新型是一種可降低金屬遮蔽效應的天線結構,其中天線結構設置在具有金屬外殼的電子裝置,而迴路天線則設置在電路板的淨空區內,並透過訊號饋入線電性連接電子裝置之射頻線路。此外迴路天線還透過接地線電性連接接地層與連接單元,其中連接單元電性連接電子裝置的金屬外殼,如此的天線結構可產生至少一共振頻率。透過上述的天線結構可以降低電子裝置的金屬外殼對天線結構產生的遮蔽效應,而達到提升天線輻射效率的目的。The present invention is an antenna structure capable of reducing metal shadowing effect, wherein the antenna structure is disposed in an electronic device having a metal casing, and the loop antenna is disposed in a clearance area of the circuit board, and electrically connected to the RF of the electronic device through the signal feeding line. line. In addition, the loop antenna is electrically connected to the grounding layer and the connecting unit through a grounding wire, wherein the connecting unit is electrically connected to the metal casing of the electronic device, and the antenna structure can generate at least one resonant frequency. Through the above antenna structure, the shielding effect of the metal casing of the electronic device on the antenna structure can be reduced, thereby achieving the purpose of improving the radiation efficiency of the antenna.

為了達到以上目的,本新型提供一種可降低金屬遮蔽效應 的天線裝置,用以傳送或接收射頻訊號,包括:至少一迴路天線,包括:至少一基材;複數個導電層,設置於基材的表面或內部,其中複數個導電層之間形成電容效應,並產生迴路天線的共振頻率;一電路板,承載迴路天線,並包括:一接地層;一淨空區,用以容置迴路天線;複數個接地線,分別連接迴路天線的各個導電層;至少一訊號饋入線,連接迴路天線的至少一導電層;至少一金屬遮蔽物,鄰近迴路天線,其中金屬遮蔽物與迴路天線之間存在一第一間距;及複數個連接單元,電性連接金屬遮蔽物、接地層及接地線。In order to achieve the above object, the present invention provides a metal shadowing effect The antenna device is configured to transmit or receive an RF signal, comprising: at least one loop antenna, comprising: at least one substrate; a plurality of conductive layers disposed on a surface or an interior of the substrate, wherein a capacitance effect is formed between the plurality of conductive layers And generating a resonant frequency of the loop antenna; a circuit board carrying the loop antenna, and comprising: a ground layer; a clearing area for accommodating the loop antenna; and a plurality of grounding lines respectively connected to the respective conductive layers of the loop antenna; a signal feed line connecting at least one conductive layer of the loop antenna; at least one metal shield adjacent to the loop antenna, wherein a first spacing exists between the metal shield and the loop antenna; and a plurality of connecting units electrically connecting the metal shield Object, ground plane and grounding wire.

本新型提供另一種可降低金屬遮蔽效應的天線裝置,用以 傳送或接收射頻訊號,包括:至少一迴路天線,包括:至少一基材;至少一第一導電層,設置於基材的表面或內部;至少一第二導電層,設置於基材的表面或內部,其中第一導電層及第二導電層之間用以產生電容效應,並形成迴路天線的共振頻率;一電路板,承載迴路天線,並包括:一接地層;一淨空區,用以容置迴路天線;複數個接地線,分別連接迴路天線的第一導電層及第二導電層;至少一訊號饋入線,連接迴路天線的第一導電層;至少一金屬遮蔽物,鄰近迴路天線,其中金屬遮蔽物與迴路天線之間存在一第一間距;及複數個連接單元,電性連接金屬遮蔽物、接地層及接地線。The present invention provides another antenna device capable of reducing metal shadowing effect, Transmitting or receiving an RF signal, comprising: at least one loop antenna comprising: at least one substrate; at least one first conductive layer disposed on a surface or an interior of the substrate; at least one second conductive layer disposed on a surface of the substrate or Internally, wherein the first conductive layer and the second conductive layer are used to generate a capacitive effect and form a resonant frequency of the loop antenna; a circuit board carrying the loop antenna and including: a ground layer; a clearance area for receiving a loop antenna; a plurality of ground lines respectively connected to the first conductive layer and the second conductive layer of the loop antenna; at least one signal feed line connected to the first conductive layer of the loop antenna; at least one metal shield adjacent to the loop antenna, wherein There is a first spacing between the metal shield and the loop antenna; and a plurality of connecting units electrically connecting the metal shield, the ground layer and the ground line.

本新型還提供另一種可降低金屬遮蔽效應的天線裝置,用 以傳送或接收複數個頻帶的射頻訊號,包括:至少一迴路天線,包括:至少一基材;至少一第一導電層,設置於基材的表面或內部;至少一第二導 電層,設置於基材的表面或內部;至少一第三導電層,設置於基材的表面或內部,第三導電層設置的平面與第一導電層或第二導電層設置的平面不同,且部分第三導電層分別與部分第一導電層及部分第二導電層重疊,其中第一導電層與第三導電層之間形成電容效應,並產生迴路天線的第一共振頻率,而第二導電層與第三導電層之間形成電容效應,並產生迴路天線的第二共振頻率;一電路板,承載迴路天線,並包括:一接地層;一淨空區,用以容置迴路天線;複數個接地線,分別連接迴路天線的第一導電層、第二導電層及第三導電層;一訊號饋入線,連接迴路天線的第三導電層;至少一金屬遮蔽物,鄰近迴路天線,其中金屬遮蔽物與迴路天線之間存在一第一間距;及複數個連接單元,電性連接金屬遮蔽物、接地層及接地線。The present invention also provides another antenna device capable of reducing metal shadowing effect. Transmitting or receiving radio frequency signals of a plurality of frequency bands, including: at least one loop antenna, comprising: at least one substrate; at least one first conductive layer disposed on a surface or an inner portion of the substrate; at least one second guide An electric layer disposed on a surface or an inner portion of the substrate; at least one third conductive layer disposed on a surface or an inner portion of the substrate, wherein the third conductive layer is disposed at a plane different from a plane formed by the first conductive layer or the second conductive layer, And a portion of the third conductive layer overlaps with a portion of the first conductive layer and a portion of the second conductive layer, wherein a capacitive effect is formed between the first conductive layer and the third conductive layer, and a first resonant frequency of the loop antenna is generated, and the second Forming a capacitance effect between the conductive layer and the third conductive layer, and generating a second resonant frequency of the loop antenna; a circuit board carrying the loop antenna, and comprising: a ground layer; a clearing area for accommodating the loop antenna; a grounding wire, respectively connected to the first conductive layer, the second conductive layer and the third conductive layer of the loop antenna; a signal feeding line connecting the third conductive layer of the loop antenna; at least one metal shielding, adjacent to the loop antenna, wherein the metal There is a first spacing between the shielding and the loop antenna; and a plurality of connecting units electrically connecting the metal shielding, the grounding layer and the grounding wire.

本新型還提供另一種可降低金屬遮蔽效應的天線裝置,用 以傳送或接收複數個頻帶的射頻訊號,包括:至少一迴路天線,包括:至少一基材;至少一第一導電層,設置於基材的表面或內部;至少一第二導電層,設置於基材的表面或內部;至少一第三導電層,設置於基材的表面或內部,第三導電層設置的平面與第一導電層或第二導電層設置的平面不同,且部分第三導電層分別與部分第一導電層及部分第二導電層重疊,其中第一導電層與第三導電層之間形成電容效應,並產生迴路天線的第一共振頻率,而第二導電層與第三導電層之間形成電容效應,並產生迴路天線的第二共振頻率;一電路板,承載迴路天線,並包括:一接地層;一淨空區,用以容置迴路天線;複數個接地線,分別連接迴路天線的第一導電層、第二導電層及第三導電層;一第一訊號饋入線,連接迴路天線的第一導 電層;一第二訊號饋入線,連接迴路天線的第二導電層;至少一金屬遮蔽物,鄰近迴路天線,其中金屬遮蔽物與迴路天線之間存在一第一間距;及複數個連接單元,電性連接金屬遮蔽物、接地層及接地線。The present invention also provides another antenna device capable of reducing metal shadowing effect. Transmitting or receiving a plurality of frequency band RF signals, comprising: at least one loop antenna comprising: at least one substrate; at least one first conductive layer disposed on a surface or an inner portion of the substrate; and at least one second conductive layer disposed on a surface or an inner surface of the substrate; at least one third conductive layer disposed on a surface or an inner portion of the substrate; the third conductive layer is disposed at a plane different from a plane of the first conductive layer or the second conductive layer, and a portion of the third conductive layer The layers overlap with a portion of the first conductive layer and a portion of the second conductive layer, respectively, wherein a capacitive effect is formed between the first conductive layer and the third conductive layer, and a first resonant frequency of the loop antenna is generated, and the second conductive layer and the third conductive layer A capacitive effect is formed between the conductive layers, and a second resonant frequency of the loop antenna is generated; a circuit board carrying the loop antenna includes: a ground layer; a clearing area for accommodating the loop antenna; and a plurality of grounding lines, respectively Connecting the first conductive layer, the second conductive layer and the third conductive layer of the loop antenna; a first signal feed line connecting the first lead of the loop antenna An electrical layer; a second signal feed line connecting the second conductive layer of the loop antenna; at least one metal shield adjacent to the loop antenna, wherein a first spacing exists between the metal shield and the loop antenna; and a plurality of connecting units, Electrically connect the metal shield, ground plane and grounding wire.

本新型天線裝置一實施例中,其中第一間距的長度大於0.3公釐。In an embodiment of the novel antenna device, the length of the first pitch is greater than 0.3 mm.

本新型天線裝置一實施例中,其中相鄰的連接單元之間存在一第二間距,且第二間距的長度大於或等於迴路天線之共振頻率最大波長的1/8。In an embodiment of the novel antenna device, there is a second spacing between adjacent connecting units, and the length of the second spacing is greater than or equal to 1/8 of the maximum wavelength of the resonant frequency of the loop antenna.

本新型天線裝置一實施例中,其中第一導電層及第二導電層分別設置在不同的平面,且部分第一導電層與部分第二導電層重疊以產生電容效應,並形成迴路天線的共振頻率。In an embodiment of the present invention, the first conductive layer and the second conductive layer are respectively disposed on different planes, and a portion of the first conductive layer overlaps with a portion of the second conductive layer to generate a capacitive effect and form a resonance of the loop antenna. frequency.

本新型天線裝置一實施例中,其中第一導電層及第二導電層設置於相同或相近的平面上,且第一導電層與第二導電層之間存在一間隙,第一導電層與第二導電層用以產生電容效應,並形成迴路天線的共振頻率。In an embodiment of the present invention, the first conductive layer and the second conductive layer are disposed on the same or similar planes, and a gap exists between the first conductive layer and the second conductive layer, and the first conductive layer and the first conductive layer The two conductive layers are used to create a capacitive effect and form the resonant frequency of the loop antenna.

本新型天線裝置一實施例中,其中相鄰的連接單元之間存在一第二間距與一第三間距,且第二間距的長度大於或等於迴路天線之第一共振頻率最大波長的1/8及第三間距的長度大於或等於迴路天線之第二共振頻率最大波長的1/8。In an embodiment of the antenna device of the present invention, a second pitch and a third pitch exist between adjacent connecting units, and the length of the second pitch is greater than or equal to 1/8 of the maximum wavelength of the first resonant frequency of the loop antenna. And the length of the third pitch is greater than or equal to 1/8 of the maximum wavelength of the second resonant frequency of the loop antenna.

本新型天線裝置一實施例中,其中電路板的至少一接地線直接透過連接單元連接金屬遮蔽物。In an embodiment of the antenna device of the present invention, at least one grounding wire of the circuit board is directly connected to the metal shield through the connecting unit.

依據本新型所建置之天線結構,即可顯著降低金屬遮蔽物 對天線輻射效率之影響,讓迴路天線發揮最大之功效。有關本新型的特徵、實作與功效,茲配合圖式作最佳實施例詳細說明如下。According to the antenna structure constructed by the novel, the metal shielding can be significantly reduced The effect of the radiation efficiency of the antenna is to maximize the effectiveness of the loop antenna. The features, implementations, and effects of the present invention are described in detail below with reference to the drawings.

10‧‧‧天線裝置10‧‧‧Antenna device

11‧‧‧迴路天線11‧‧‧loop antenna

111‧‧‧基材111‧‧‧Substrate

112‧‧‧重疊區112‧‧‧Overlapping area

1131‧‧‧第一導電層1131‧‧‧First conductive layer

1133‧‧‧第二導電層1133‧‧‧Second conductive layer

114‧‧‧間隙114‧‧‧ gap

13‧‧‧電路板13‧‧‧Circuit board

131‧‧‧淨空區131‧‧‧ clearance area

133‧‧‧接地層133‧‧‧ Grounding layer

135‧‧‧接地線135‧‧‧ Grounding wire

137‧‧‧訊號饋入線137‧‧‧ signal feed line

15‧‧‧金屬遮蔽物15‧‧‧Metal shelter

17‧‧‧連接單元17‧‧‧ Connection unit

20‧‧‧天線裝置20‧‧‧Antenna device

21‧‧‧迴路天線21‧‧‧ loop antenna

211‧‧‧基材211‧‧‧Substrate

212‧‧‧重疊區212‧‧‧Overlapping area

2131‧‧‧第一導電層2131‧‧‧First conductive layer

2133‧‧‧第二導電層2133‧‧‧Second conductive layer

2135‧‧‧第三導電層2135‧‧‧ Third conductive layer

23‧‧‧電路板23‧‧‧ Circuit board

231‧‧‧淨空區231‧‧‧ clearance area

233‧‧‧接地層233‧‧‧ Grounding layer

235‧‧‧接地線235‧‧‧Grounding wire

2371‧‧‧第一訊號饋入線2371‧‧‧First signal feed line

2373‧‧‧第二訊號饋入線2373‧‧‧second signal feed line

27‧‧‧連接單元27‧‧‧ Connection unit

30‧‧‧天線裝置30‧‧‧Antenna device

31‧‧‧迴路天線31‧‧‧loop antenna

311‧‧‧基材311‧‧‧Substrate

312‧‧‧重疊區312‧‧ ‧ overlap zone

3131‧‧‧第一導電層3131‧‧‧First conductive layer

3133‧‧‧第二導電層3133‧‧‧Second conductive layer

3135‧‧‧第三導電層3135‧‧‧ Third conductive layer

33‧‧‧電路板33‧‧‧Circuit board

331‧‧‧淨空區331‧‧‧ clearance area

333‧‧‧接地層333‧‧‧ Grounding layer

335‧‧‧接地線335‧‧‧ Grounding wire

337‧‧‧訊號饋入線337‧‧‧ signal feed line

37‧‧‧連接單元37‧‧‧ Connection unit

第1圖:為本新型可降低金屬遮蔽效應的天線裝置第一實施例的立體示意圖。Fig. 1 is a perspective view showing a first embodiment of an antenna device capable of reducing metal shadowing effect.

第2圖:為本新型可降低金屬遮蔽效應的天線裝置第一實施例的俯視圖。Fig. 2 is a plan view showing a first embodiment of the antenna device which can reduce the metal shadowing effect of the present invention.

第3圖:為本新型可降低金屬遮蔽效應的天線裝置之迴路天線一實施例的立體透視。Fig. 3 is a perspective view showing an embodiment of a loop antenna of an antenna device capable of reducing metal shadowing effect.

第4圖:為本新型可降低金屬遮蔽效應的天線裝置之迴路天線又一實施例的立體透視。Fig. 4 is a perspective view showing still another embodiment of the loop antenna of the antenna device of the present invention which can reduce the metal shadowing effect.

第5圖:為本新型可降低金屬遮蔽效應的天線裝置第二實施例的立體示意圖。Fig. 5 is a perspective view showing a second embodiment of the antenna device which can reduce the metal shielding effect.

第6圖:為本新型可降低金屬遮蔽效應的天線裝置第三實施例的立體示意圖。Fig. 6 is a perspective view showing a third embodiment of the antenna device which can reduce the metal shielding effect.

第7圖:為本新型可降低金屬遮蔽效應的天線裝置第三實施例的俯視圖。Figure 7 is a plan view of a third embodiment of the antenna device of the present invention which can reduce the metal shadowing effect.

第8圖:為本新型可降低金屬遮蔽效應的天線裝置之迴路天線又一實施例的立體透視。Fig. 8 is a perspective view showing still another embodiment of the loop antenna of the antenna device of the present invention which can reduce the metal shadowing effect.

第9圖:為本新型可降低金屬遮蔽效應的天線裝置第四實施例的立體示意圖。Fig. 9 is a perspective view showing a fourth embodiment of the antenna device which can reduce the metal shielding effect.

第10圖:為本新型可降低金屬遮蔽效應的天線裝置第四實施例的俯視圖。Fig. 10 is a plan view showing a fourth embodiment of the antenna device which can reduce the metal shadowing effect of the present invention.

第11圖:為本新型可降低金屬遮蔽效應的天線裝置之迴路天線又一實施例的立體透視。Fig. 11 is a perspective view showing still another embodiment of the loop antenna of the antenna device which can reduce the metal shielding effect.

第1圖及第2圖分別為本新型可降低金屬遮蔽效應的天線裝置一實施例的立體示意圖及俯視圖。如圖所示,本新型所述之天線裝置10可用以傳送及接收射頻訊號,並包括至少一迴路天線11、一電路板13、至少一金屬遮蔽物15及複數個連接單元17,其中電路板13用以承載迴路天線11。1 and 2 are respectively a perspective view and a plan view of an embodiment of an antenna device capable of reducing metal shielding effects. As shown in the figure, the antenna device 10 of the present invention can be used to transmit and receive radio frequency signals, and includes at least one loop antenna 11, a circuit board 13, at least one metal shield 15 and a plurality of connecting units 17, wherein the circuit board 13 is used to carry the loop antenna 11.

電路板13包括至少一淨空區131及一接地層133,其中接地層133由具導電特性的材質所製成,例如金屬,而淨空區131則用以容置迴路天線11。為了利於在圖式上表示,本新型的第1圖主要將接地層133設置在電路板13的表面,但實際上接地層133並不一定要設置在電路板13的表面上。在本新型其它實施例中,接地層133可設置在電路板13的表面或內部,例如電路板13可為多層的結構,並將接地層133設置在電路板13內部的結構內。The circuit board 13 includes at least one clearance area 131 and a ground layer 133. The ground layer 133 is made of a material having a conductive property, such as metal, and the clearance area 131 is for accommodating the loop antenna 11. In order to facilitate the representation in the drawings, the first drawing of the present invention mainly places the ground layer 133 on the surface of the circuit board 13, but actually the ground layer 133 does not have to be provided on the surface of the circuit board 13. In other embodiments of the present invention, the ground layer 133 may be disposed on the surface or inside of the circuit board 13, for example, the circuit board 13 may be a multi-layer structure, and the ground layer 133 may be disposed in the structure inside the circuit board 13.

迴路天線11設置在電路板13的淨空區131內。淨空區131為未設置接地層133的區域,例如以第1圖的構造為例,電路板13的特定區域上不設置接地層133以形成淨空區131。在本新型一實施例中,電路板13之淨空區131的垂直延伸位置上皆不設置接地層133,例如淨空區131的下方或上方亦不設置接地層133或電路。The loop antenna 11 is disposed in the clearance area 131 of the circuit board 13. The clearance area 131 is an area in which the ground layer 133 is not provided. For example, in the configuration of FIG. 1, the ground layer 133 is not provided on a specific area of the circuit board 13 to form the clearance area 131. In an embodiment of the present invention, the ground plane 133 is not disposed in the vertical extension position of the clearance area 131 of the circuit board 13. For example, the ground layer 133 or the circuit is not disposed below or above the clearance area 131.

本新型所述之迴路天線11可產生電容效應,其中迴路天線 11包括至少一基材111及複數個導電層1131/1333,基材111為不具導電特性的材質所製成。複數個導電層1131/1333設置於基材111的表面或內部,其中複數個導電層1131/1333之間可形成電容效應及/或耦合效應,並產生迴路天線11的共振頻率。例如迴路天線11包括第一導電層1131及第二導電層1133,設置於基材111的表面或內部,其中第一導電層1131及第二導電層1133之間可產生電容效應,並形成迴路天線11的共振頻率。The loop antenna 11 of the present invention can generate a capacitive effect, wherein the loop antenna 11 includes at least one substrate 111 and a plurality of conductive layers 1131/1333, and the substrate 111 is made of a material having no conductive property. A plurality of conductive layers 1131/1333 are disposed on the surface or inside of the substrate 111, wherein a capacitance effect and/or a coupling effect are formed between the plurality of conductive layers 1131/1333, and a resonant frequency of the loop antenna 11 is generated. For example, the loop antenna 11 includes a first conductive layer 1131 and a second conductive layer 1133 disposed on the surface or inside of the substrate 111, wherein a capacitive effect is generated between the first conductive layer 1131 and the second conductive layer 1133, and a loop antenna is formed. The resonant frequency of 11.

在本新型一實施例中,請配合參閱第3圖所示,為本新型 迴路天線11一實施例的立體示意圖,迴路天線11包括一基材111、一第一導電層1131及一第二導電層1133,其中第一導電層1131及第二導電層1133分別設置在不同的平面或高度,例如第一導電層1131設置在基材111的上表面,而第二導電層1133則設置在基材111的下表面。部分的第一導電層1131與部分的第二導電層1133重疊,並形成一重疊區112,使得第一導電層1131及第二導電層1133之間可產生電容效應及/或耦合效應,並形成迴路天線11的共振頻率。In an embodiment of the present invention, please refer to FIG. 3 for the present invention. A schematic diagram of an embodiment of the loop antenna 11 includes a substrate 111, a first conductive layer 1131 and a second conductive layer 1133. The first conductive layer 1131 and the second conductive layer 1133 are respectively disposed in different A plane or a height, for example, the first conductive layer 1131 is disposed on the upper surface of the substrate 111, and the second conductive layer 1133 is disposed on the lower surface of the substrate 111. A portion of the first conductive layer 1131 overlaps with a portion of the second conductive layer 1133 and forms an overlap region 112, so that a capacitive effect and/or a coupling effect may be generated between the first conductive layer 1131 and the second conductive layer 1133, and formed. The resonant frequency of the loop antenna 11.

為了說明時的便利性,本新型第3圖所述的實施例中,描 述了將第一導電層1131及第二導電層1133分別設置在基材111之上表面及下表面的構造,然而第一導電層1131及第二導電層1133設置的位置並不侷限於基材111的上表面及下表面,第一導電層1131及第二導電層1133亦可分別設置在基材111的左表面及右表面,或者是分別設置在基材111的前表面及後表面。當然在不同實施例中,第一導電層1131及第二導電層1133亦可設置在基材111的內部。第3圖所述之迴路天線11的主要特徵在於第一導電層1131及第二導電層1133的設置高度或設置的平面不 同,且部分的第一導電層1131與部分的第二導電層1133重疊。For the convenience of explanation, in the embodiment described in FIG. 3 of the present invention, The first conductive layer 1131 and the second conductive layer 1133 are respectively disposed on the upper surface and the lower surface of the substrate 111. However, the positions of the first conductive layer 1131 and the second conductive layer 1133 are not limited to the substrate. The upper surface and the lower surface of the 111, the first conductive layer 1131 and the second conductive layer 1133 may be respectively disposed on the left and right surfaces of the substrate 111, or may be respectively disposed on the front surface and the rear surface of the substrate 111. Of course, in different embodiments, the first conductive layer 1131 and the second conductive layer 1133 may also be disposed inside the substrate 111. The main feature of the loop antenna 11 described in FIG. 3 is that the set height or the set plane of the first conductive layer 1131 and the second conductive layer 1133 are not Similarly, a portion of the first conductive layer 1131 overlaps a portion of the second conductive layer 1133.

在本新型又一實施例中,請配合參閱第4圖所示,為本新 型迴路天線11又一實施例的立體示意圖,迴路天線11包括一基材111、一第一導電層1131及一第二導電層1133,其中第一導電層1131及第二導電層1133設置在基材111的相同或相近的平面或高度上,例如第一導電層1131及第二導電層1133皆設置在基材111的上表面。第一導電層1131及第二導電層1133在基材111上不相互接觸,並於第一導電層1131及第二導電層1133之間存在一間隙114,因此第一導電層1131及第二導電層1133之間可產生電容效應及/或耦合效應,並形成迴路天線11的共振頻率。In still another embodiment of the present invention, please refer to FIG. 4, which is a new A schematic diagram of a further embodiment of the loop antenna 11 includes a substrate 111, a first conductive layer 1131 and a second conductive layer 1133, wherein the first conductive layer 1131 and the second conductive layer 1133 are disposed on the base The same or similar plane or height of the material 111, for example, the first conductive layer 1131 and the second conductive layer 1133 are all disposed on the upper surface of the substrate 111. The first conductive layer 1131 and the second conductive layer 1133 do not contact each other on the substrate 111, and a gap 114 exists between the first conductive layer 1131 and the second conductive layer 1133, so the first conductive layer 1131 and the second conductive layer A capacitive effect and/or a coupling effect can be generated between the layers 1133 and form the resonant frequency of the loop antenna 11.

為了說明時的便利性,本新型第4圖所述之實施例中,描 述了將第一導電層1131及第二導電層1133設置在基材111上表面的構造,然而第一導電層1131及第二導電層1133設置的位置並不侷限於基材111的上表面,第一導電層1131及第二導電層1133分別設置在基材111的左表面、右表面、前表面或後表面。當然在不同實施例中,第一導電層1131及第二導電層1133亦可設置在基材111的內部。第4圖所述之迴路天線11的主要特徵在於第一導電層1131及第二導電層1133設置在基材111的相同或相近的平面或高度上,並於第一導電層1131及第二導電層1133之間存在一間隙114。For the convenience of explanation, in the embodiment described in FIG. 4 of the present invention, The configuration in which the first conductive layer 1131 and the second conductive layer 1133 are disposed on the upper surface of the substrate 111 is described. However, the positions at which the first conductive layer 1131 and the second conductive layer 1133 are disposed are not limited to the upper surface of the substrate 111. The first conductive layer 1131 and the second conductive layer 1133 are respectively disposed on the left surface, the right surface, the front surface, or the rear surface of the substrate 111. Of course, in different embodiments, the first conductive layer 1131 and the second conductive layer 1133 may also be disposed inside the substrate 111. The main feature of the loop antenna 11 described in FIG. 4 is that the first conductive layer 1131 and the second conductive layer 1133 are disposed on the same or similar plane or height of the substrate 111, and are disposed on the first conductive layer 1131 and the second conductive layer. There is a gap 114 between the layers 1133.

電路板13還包括複數個接地線135及至少一訊號饋入線 137,其中接地線135分別連接迴路天線11的各個導電層1131/1133,而訊號饋入線137則連接迴路天線11的至少一導電層1131/1133。以第3圖 及第4圖所述的迴路天線11為例,接地線135分別連接迴路天線11的第一導電層1131及第二導電層1133,而訊號饋入線137則連接迴路天線11的第一導電層1131。The circuit board 13 further includes a plurality of ground lines 135 and at least one signal feed line 137, wherein the grounding wires 135 are respectively connected to the respective conductive layers 1131/1133 of the loop antenna 11, and the signal feeding wires 137 are connected to the at least one conductive layer 1131/1133 of the loop antenna 11. Figure 3 For example, the loop antenna 11 described in FIG. 4 is connected to the first conductive layer 1131 and the second conductive layer 1133 of the loop antenna 11, and the signal feed line 137 is connected to the first conductive layer 1131 of the loop antenna 11. .

在本新型實施例中,天線結構10還包括至少一金屬遮蔽物 15,其中金屬遮蔽物15與電路板13的距離相近,並於金屬遮蔽物15與電路板13之間存在一第一間距d1,例如第一間距d1大於0.3公釐。當然第一間距d1並不一定要大於0.3公釐,本新型亦可應用在第一間距d1小於或等於0.3公釐的構造。由於金屬遮蔽物15與電路板13相鄰,並可能對迴路天線11產生遮蔽效應(Shielding effect),進而影響迴路天線11傳送或接收射頻訊號的效率。In the novel embodiment, the antenna structure 10 further includes at least one metal shield. 15. The distance between the metal shield 15 and the circuit board 13 is similar, and there is a first spacing d1 between the metal shield 15 and the circuit board 13, for example, the first spacing d1 is greater than 0.3 mm. Of course, the first spacing d1 does not have to be greater than 0.3 mm. The present invention can also be applied to a configuration in which the first spacing d1 is less than or equal to 0.3 mm. Since the metal shield 15 is adjacent to the circuit board 13, it may have a shielding effect on the loop antenna 11, thereby affecting the efficiency of the loop antenna 11 transmitting or receiving the RF signal.

在本新型一實施例中,金屬遮蔽物15可以是使用天線結構 10之電子裝置的外殼,例如天線結構10及/或迴路天線11設置在手機或智慧型手機內,而金屬遮蔽物15則是手機及/或智慧型手機的金屬殼體,迴路天線11會被手機及/或智慧型手機的金屬殼體所遮蔽,並造成迴路天線11接收或傳送射頻訊號的效率降低。In an embodiment of the present invention, the metal shield 15 may be an antenna structure. The outer casing of the electronic device 10, such as the antenna structure 10 and/or the loop antenna 11, is disposed in a mobile phone or a smart phone, and the metal shield 15 is a metal case of a mobile phone and/or a smart phone, and the loop antenna 11 is The metal casing of the mobile phone and/or the smart phone is shielded and causes the loop antenna 11 to receive or transmit radio frequency signals with reduced efficiency.

當然手機及智慧型手機僅為說明的實施例,並非本新型所 述之天線結構10的使用限制,本新型所述的天線結構10可應用在任何需要透過天線接收及/或發射射頻訊號的電子裝置。此外金屬遮蔽物15為手機及/或智慧型手機的金屬殼體亦非本新型的限制,金屬遮蔽物15亦可為手機、智慧型手機及/或其它電子裝置內部的構件,換言之金屬遮蔽物15設置在電子裝置的那個位置並非本新型的限制。Of course, mobile phones and smart phones are only illustrative examples, not the present invention. The antenna structure 10 of the present invention can be applied to any electronic device that needs to receive and/or transmit an RF signal through an antenna. In addition, the metal cover 15 is not limited to the metal casing of the mobile phone and/or the smart phone. The metal cover 15 can also be a component of a mobile phone, a smart phone and/or other electronic devices, in other words, a metal shield. The position set in the electronic device 15 is not a limitation of the present invention.

為了避免金屬遮蔽物15對迴路天線11造成遮蔽效應,本 新型所述之天線結構10還包括複數個連接單元17,並透過連接單元17電性連接接地線135、金屬遮蔽物15及接地層133。連接單元17可為具導電特性的材質所製作,例如金屬,以使得金屬遮蔽物15電性連接接地層133和接地線135。In order to avoid the shadowing effect of the metal shield 15 on the loop antenna 11, this The antenna structure 10 of the present invention further includes a plurality of connecting units 17 and is electrically connected to the grounding wire 135, the metal shield 15 and the grounding layer 133 through the connecting unit 17. The connecting unit 17 can be made of a material having conductive properties, such as metal, such that the metal shield 15 is electrically connected to the ground layer 133 and the ground line 135.

以第1圖及第2圖為例,迴路天線11的第一導電層1131 透過接地線135連接接地層133,接地層133則透過連接單元17連接金屬遮蔽物15,而迴路天線11的第二導電層1133則透過接地線135及連接單元17連接金屬遮蔽物15。Taking the first and second figures as an example, the first conductive layer 1131 of the loop antenna 11 The grounding layer 133 is connected to the grounding layer 133. The grounding layer 133 is connected to the metal shield 15 through the connecting unit 17, and the second conductive layer 1133 of the loop antenna 11 is connected to the metal shield 15 through the grounding wire 135 and the connecting unit 17.

以第5圖為例,迴路天線11的第一導電層1131透過接地 線135連接接地層133,接地層133則透過複數個連接單元17連接金屬遮蔽物15,而迴路天線11的第二導電層1133則透過接地線135及連接單元17連接金屬遮蔽物15,例如接地層133可透過兩個連接單元17連接金屬遮蔽物15,當然接地層133及金屬遮蔽物15之連接單元17的數量並不侷限為兩個,亦可為兩個以上。Taking FIG. 5 as an example, the first conductive layer 1131 of the loop antenna 11 is grounded. The line 135 is connected to the ground layer 133. The ground layer 133 is connected to the metal shield 15 through a plurality of connecting units 17, and the second conductive layer 1133 of the loop antenna 11 is connected to the metal shield 15 through the grounding line 135 and the connecting unit 17, for example, The ground layer 133 can be connected to the metal shield 15 through the two connecting units 17. The number of the connecting units 17 of the grounding layer 133 and the metal shielding 15 is not limited to two, and may be two or more.

本新型主要的特徵在於,使得迴路天線11的各個導電層 1131/1133、接地層133、金屬遮蔽物15及/或連接單元17之間相互電性連接,以降低金屬遮蔽物15對迴路天線11所造成的遮蔽效應,至於各個導電層1131/1133、接地層133、金屬遮蔽物15及/或連接單元17之間的電性連接順序則非本新型的重點,亦不為本新型的限制。The main feature of the present invention is that the respective conductive layers of the loop antenna 11 are made 1131/1133, the grounding layer 133, the metal shielding 15 and/or the connecting unit 17 are electrically connected to each other to reduce the shielding effect caused by the metal shielding 15 on the loop antenna 11. As for the respective conductive layers 1131/1133, The electrical connection sequence between the formation 133, the metal shield 15 and/or the connection unit 17 is not the focus of the present invention and is not a limitation of the present invention.

在本新型一實施例中,迴路天線11包括第一導電層1131 及第二導電層1133,且第一導電層1131及第二導電層1133分別透過不同的連接單元17連接接地層133及/或金屬遮蔽物15。兩個連接單元17之 間存在一第二間距d2,其中第二間距d2的長度大於或等於迴路天線11傳送或接收之射頻訊號波長的1/8,例如大於或等於迴路天線11共振頻率之最大波長的1/8。依據本實施例所建置之天線結構10,即可顯著降低金屬遮蔽物15對迴路天線11的輻射效率造成影響,使得迴路天線11可以發揮最大的功效。當然第二間距d2的長度並不一定要大於或等於迴路天線11傳送或接收之射頻訊號波長的1/8,若第二間距d2小於射頻訊號波長的1/8時,同樣可以降低金屬遮蔽物15對迴路天線11產生遮蔽效應,只是效果可能會比較不好一些。In an embodiment of the present invention, the loop antenna 11 includes a first conductive layer 1131. And the second conductive layer 1133, and the first conductive layer 1131 and the second conductive layer 1133 are respectively connected to the ground layer 133 and/or the metal shield 15 through different connection units 17. Two connection units 17 There is a second spacing d2, wherein the length of the second spacing d2 is greater than or equal to 1/8 of the wavelength of the RF signal transmitted or received by the loop antenna 11, for example greater than or equal to 1/8 of the maximum wavelength of the resonant frequency of the loop antenna 11. According to the antenna structure 10 constructed in this embodiment, the influence of the metal shield 15 on the radiation efficiency of the loop antenna 11 can be significantly reduced, so that the loop antenna 11 can exert the maximum effect. Of course, the length of the second spacing d2 is not necessarily greater than or equal to 1/8 of the wavelength of the RF signal transmitted or received by the loop antenna 11. If the second spacing d2 is less than 1/8 of the wavelength of the RF signal, the metal shielding can also be reduced. 15 pairs of loop antennas 11 have a shadowing effect, but the effect may be less good.

本新型所述之天線裝置10還包括一個特徵,電路板13的 至少一個接地線135直接透過連接單元17連接金屬遮蔽物15,且不直接連接接地層133。以第1圖及第5圖為例,位於圖上左側的接地線135直接連接接地層133,並透過接地層133及連接單元17連接金屬遮蔽物15。 位於圖上右側的接地線135則未直接連接接地層133,並直接透過連接單元17連接金屬遮蔽物15,藉此可有效降低金屬遮蔽物15對迴路天線11的輻射效率造成影響。The antenna device 10 of the present invention further includes a feature of the circuit board 13 At least one grounding wire 135 is directly connected to the metal shield 15 through the connecting unit 17, and is not directly connected to the grounding layer 133. Taking the first and fifth figures as an example, the ground line 135 on the left side of the figure is directly connected to the ground layer 133, and the metal shield 15 is connected through the ground layer 133 and the connection unit 17. The grounding wire 135 located on the right side of the figure is not directly connected to the grounding layer 133, and is directly connected to the metal shield 15 through the connecting unit 17, whereby the metal shielding object 15 can effectively reduce the radiation efficiency of the loop antenna 11.

第6圖及第7圖分別為本新型可降低金屬遮蔽效應的天線 裝置又一實施例的立體示意圖及俯視圖。如圖所示,本新型所述之天線裝置20可用以傳送及接收兩種或兩種以上不同頻率的射頻訊號,主要包括一迴路天線21、一電路板23、至少一金屬遮蔽物15及複數個連接單元27,其中電路板23用以承載迴路天線21。Figure 6 and Figure 7 are the antennas that can reduce the metal shadowing effect. A perspective view and a plan view of still another embodiment of the device. As shown in the figure, the antenna device 20 of the present invention can be used to transmit and receive two or more different frequency RF signals, including a loop antenna 21, a circuit board 23, at least one metal shield 15 and a plurality of A connecting unit 27, wherein the circuit board 23 is used to carry the loop antenna 21.

電路板23包括至少一淨空區231及一接地層233,其中淨 空區231為未設置接地層233的區域。接地層233由具導電特性的材質所 製成,例如金屬。為了利於在圖式上表示,本新型的第6圖主要將接地層233設置在電路板23的表面,但實際上接地層233並不一定要設置在電路板23的表面上。在本新型其它實施例中,接地層233可設置在電路板23的表面或內部,例如電路板23可為多層的結構,並將接地層233設置在電路板23內部的結構內。The circuit board 23 includes at least one clearance area 231 and a ground layer 233, wherein The empty area 231 is an area where the ground layer 233 is not provided. The ground layer 233 is made of a material having conductive properties. Made of, for example, metal. In order to facilitate the representation in the drawings, the sixth drawing of the present invention mainly places the ground layer 233 on the surface of the circuit board 23, but actually the ground layer 233 does not have to be provided on the surface of the circuit board 23. In other embodiments of the present invention, the ground layer 233 may be disposed on the surface or inside of the circuit board 23, for example, the circuit board 23 may be a multi-layered structure, and the ground layer 233 may be disposed within the structure inside the circuit board 23.

迴路天線21設置在電路板23的淨空區231內,其中淨空 區231為未設置接地層233的區域。The loop antenna 21 is disposed in the clearance area 231 of the circuit board 23, wherein the clearance is The area 231 is an area where the ground layer 233 is not provided.

本新型所述之迴路天線21具有電容效應,其中迴路天線 21包括至少一基材211及複數個導電層2131/2133/2135,基材211為不具導電特性的材質所製成。複數個導電層2131/2133/2135設置於該基材211的表面或內部,其中複數個導電層2131/2133/2135之間可產生電容效應及/或耦合效應,並形成迴路天線21的共振頻率。The loop antenna 21 of the present invention has a capacitive effect, wherein the loop antenna 21 includes at least one substrate 211 and a plurality of conductive layers 2131/2133/2135, and the substrate 211 is made of a material having no conductive property. A plurality of conductive layers 2131/2133/2135 are disposed on a surface or an inner portion of the substrate 211, wherein a capacitance effect and/or a coupling effect are generated between the plurality of conductive layers 2131/2133/2135, and a resonant frequency of the loop antenna 21 is formed. .

在本新型一實施例中,請配合參閱第8圖所示,為本新型 迴路天線21一實施例的立體示意圖,迴路天線21包括一基材211、一第一導電層2131、一第二導電層2133及一第三導電層2135,其中第一導電層2131及第二導電層2133設置在基材211的表面或內部,例如第一導電層2131及第二導電層2133可設置在基材211上表面。第三導電層2135設置在基材211的表面或內部,例如第三導電層2135可設置在基材211下表面。第三導電層2135設置的平面與第一導電層2131及第二導電層2133設置的平面或高度不同,且部分的第三導電層2135分別與部分的第一導電層2131及部分的第二導電層2133重疊,並形成兩個重疊區212,使得第一導電層2131、第二導電層2133及第三導電層2135之間可產生電 容效應及/或耦合效應,並形成迴路天線21的共振頻率。In an embodiment of the present invention, please refer to FIG. 8 for the present invention. A schematic diagram of an embodiment of the loop antenna 21 includes a substrate 211, a first conductive layer 2131, a second conductive layer 2133, and a third conductive layer 2135, wherein the first conductive layer 2131 and the second conductive layer The layer 2133 is disposed on the surface or inside of the substrate 211. For example, the first conductive layer 2131 and the second conductive layer 2133 may be disposed on the upper surface of the substrate 211. The third conductive layer 2135 is disposed on the surface or inside of the substrate 211, and for example, the third conductive layer 2135 may be disposed on the lower surface of the substrate 211. The plane of the third conductive layer 2135 is different from the plane or height of the first conductive layer 2131 and the second conductive layer 2133, and a portion of the third conductive layer 2135 is respectively connected with a portion of the first conductive layer 2131 and a portion of the second conductive layer. The layers 2133 overlap and form two overlapping regions 212 such that electricity can be generated between the first conductive layer 2131, the second conductive layer 2133, and the third conductive layer 2135. The capacitive effect and/or the coupling effect and form the resonant frequency of the loop antenna 21.

在本新型實施例中,第三導電層2135與第一導電層2131 之間有部分區域重疊並形成電容效應,以產生迴路天線21的第一共振頻率,而第三導電層2135與第二導電層2133之間有部分區域重疊並形成電容效應,以產生迴路天線21的第二共振頻率。因此本新型所述之迴路天線21將可產生兩種或兩種以上的共振頻率,並可接收或發射複數個頻段的射頻訊號。In the new embodiment, the third conductive layer 2135 and the first conductive layer 2131 A partial region overlaps and forms a capacitive effect to generate a first resonant frequency of the loop antenna 21, and a partial region between the third conductive layer 2135 and the second conductive layer 2133 overlaps and forms a capacitive effect to generate the loop antenna 21 The second resonant frequency. Therefore, the loop antenna 21 of the present invention can generate two or more resonant frequencies and can receive or transmit RF signals of a plurality of frequency bands.

為了說明時的便利性,本新型第8圖所述的實施例中,描 述了將第一導電層2131及第二導電層2133設置在基材211之上表面,並將第三導電層2135設置在基材211之下表面的構造,然而第一導電層2131、第二導電層2133及第三導電層2135設置的位置並不侷限於基材211的上表面及下表面,第一導電層2131、第二導電層2133及第三導電層2135亦可分別設置在基材211的左表面及右表面,或者是分別設置在基材211的前表面及後表面。當然在不同實施例中,第一導電層2131、第二導電層2133及第三導電層2135亦可設置在基材211的內部。本新型所述之迴路天線21主要的特徵在於,第一導電層2131及第二導電層2133的設置平面或高度相近,而第三導電層2135的設置平面或高度則與第一導電層2131及第二導電層2133的設置平面或高度不同,且部分的第三導電層2135分別與部分的第一導電層2131及部分的第二導電層2133重疊。For the convenience of explanation, in the embodiment described in FIG. 8 of the present invention, The first conductive layer 2131 and the second conductive layer 2133 are disposed on the upper surface of the substrate 211, and the third conductive layer 2135 is disposed on the lower surface of the substrate 211, but the first conductive layer 2131, the second The positions of the conductive layer 2133 and the third conductive layer 2135 are not limited to the upper surface and the lower surface of the substrate 211, and the first conductive layer 2131, the second conductive layer 2133, and the third conductive layer 2135 may be respectively disposed on the substrate. The left and right surfaces of the 211 are provided on the front and rear surfaces of the substrate 211, respectively. Of course, in different embodiments, the first conductive layer 2131, the second conductive layer 2133, and the third conductive layer 2135 may also be disposed inside the substrate 211. The loop antenna 21 of the present invention is mainly characterized in that the first conductive layer 2131 and the second conductive layer 2133 are disposed in a plane or height, and the third conductive layer 2135 is disposed in a plane or height with the first conductive layer 2131 and The second conductive layer 2133 is disposed at a different plane or height, and a portion of the third conductive layer 2135 overlaps with a portion of the first conductive layer 2131 and a portion of the second conductive layer 2133, respectively.

電路板23還包括複數個接地線235及複數個訊號饋入線 2371/2373,其中接地線235分別連接迴路天線21的各個導電層 2131/2133/2135。以第8圖所述的迴路天線21為例,接地線235分別連接迴路天線21的第一導電層2131、第二導電層2133及第三導電層2135,而訊號饋入線包括第一訊號饋入線2371及第二訊號饋入線2373,其中第一訊號饋入線2371連接第一導電層2131,而第二訊號饋入線2373則連接第二導電層2133。The circuit board 23 further includes a plurality of grounding lines 235 and a plurality of signal feeding lines. 2371/2373, wherein the grounding wire 235 is connected to each conductive layer of the loop antenna 21 2131/2133/2135. Taking the loop antenna 21 described in FIG. 8 as an example, the grounding wire 235 is respectively connected to the first conductive layer 2131, the second conductive layer 2133 and the third conductive layer 2135 of the loop antenna 21, and the signal feeding line includes the first signal feeding line. 2371 and the second signal feeding line 2373, wherein the first signal feeding line 2371 is connected to the first conductive layer 2131, and the second signal feeding line 2373 is connected to the second conductive layer 2133.

在本新型實施例中,天線結構20還包括至少一金屬遮蔽物 15,其中金屬遮蔽物15與電路板23的距離相近,並於金屬遮蔽物15與電路板23之間存在一第一間距d1,例如第一間距d1大於0.3公釐。當然第一間距d1並不一定要大於0.3公釐,本新型亦可應用在第一間距d1小於或等於0.3公釐的構造。金屬遮蔽物15與電路板23相鄰,並可能對迴路天線21產生遮蔽效應(Shielding effect),進而影響迴路天線21傳送或接收射頻訊號的效率。In the novel embodiment, the antenna structure 20 further includes at least one metal shield. 15. The distance between the metal shield 15 and the circuit board 23 is similar, and there is a first spacing d1 between the metal shield 15 and the circuit board 23, for example, the first spacing d1 is greater than 0.3 mm. Of course, the first spacing d1 does not have to be greater than 0.3 mm. The present invention can also be applied to a configuration in which the first spacing d1 is less than or equal to 0.3 mm. The metal shield 15 is adjacent to the circuit board 23 and may have a Shielding effect on the loop antenna 21, thereby affecting the efficiency of the loop antenna 21 to transmit or receive RF signals.

在本新型一實施例中,金屬遮蔽物15可以是使用天線結構 20之電子裝置的外殼,例如金屬遮蔽物15可以是手機及/或智慧型手機的金屬殼體,則設置在手機或智慧型手機的天線結構20及/或迴路天線21,會被手機及/或智慧型手機的金屬殼體所遮蔽,並造成迴路天線21接收或傳送射頻訊號的效率降低。當然手機及智慧型手機僅為說明的實施例,並非本新型所述之天線結構20的限制,本新型所述的內容可應用在任何需要透過天線接收及/或發射射頻訊號的電子裝置。此外金屬遮蔽物15為手機及/或智慧型手機的金屬殼體亦非本新型的限制,金屬遮蔽物15亦可為手機、智慧型手機及/或其它電子裝置內部的構件,換言之金屬遮蔽物15設置在電子裝置的那個位置並非本新型的限制。In an embodiment of the present invention, the metal shield 15 may be an antenna structure. The outer casing of the electronic device 20, such as the metal shield 15, may be a metal casing of a mobile phone and/or a smart phone, and the antenna structure 20 and/or the loop antenna 21 disposed in the mobile phone or the smart phone may be used by the mobile phone and/or Or the metal casing of the smart phone is shielded, and the efficiency of the loop antenna 21 receiving or transmitting the radio frequency signal is reduced. Of course, the mobile phone and the smart phone are only the illustrated embodiments, and are not limited by the antenna structure 20 of the present invention. The content described in the present invention can be applied to any electronic device that needs to receive and/or transmit radio frequency signals through the antenna. In addition, the metal cover 15 is not limited to the metal casing of the mobile phone and/or the smart phone. The metal cover 15 can also be a component of a mobile phone, a smart phone and/or other electronic devices, in other words, a metal shield. The position set in the electronic device 15 is not a limitation of the present invention.

為了避免金屬遮蔽物15對迴路天線21造成遮蔽效應,本新型所述之天線結構20還包括複數個連接單元27,並透過連接單元27電性連接金屬遮蔽物15、接地線235及接地層233。連接單元27可為具導電特性的材質所製作,例如金屬,以使得金屬遮蔽物15電性連接接地層233和接地線235。In order to prevent the metal shield 15 from shielding the loop antenna 21, the antenna structure 20 of the present invention further includes a plurality of connecting units 27, and is electrically connected to the metal shield 15, the grounding line 235, and the grounding layer 233 through the connecting unit 27. . The connecting unit 27 can be made of a material having conductive properties, such as metal, such that the metal shield 15 is electrically connected to the ground layer 233 and the ground line 235.

在本新型實施例中,迴路天線21的第一導電層2131透過接地線235連接接地層233,接地層233則透過連接單元27連接金屬遮蔽物15。迴路天線21的第二導電層2133透過接地線235連接接地層233,接地層233則透過連接單元27連接金屬遮蔽物15。迴路天線21的第三導電層2135透過接地線235及連接單元27連接金屬遮蔽物15。In the present embodiment, the first conductive layer 2131 of the loop antenna 21 is connected to the ground layer 233 through the grounding line 235, and the ground layer 233 is connected to the metal shield 15 through the connecting unit 27. The second conductive layer 2133 of the loop antenna 21 is connected to the ground layer 233 through the ground line 235, and the ground layer 233 is connected to the metal shield 15 through the connection unit 27. The third conductive layer 2135 of the loop antenna 21 is connected to the metal shield 15 through the ground line 235 and the connection unit 27.

在本新型一實施例中,迴路天線21包括第一導電層2131、第二導電層2133及第三導電層2135,且第一導電層2131、第二導電層2133及第三導電層2135分別透過不同的連接單元27連接金屬遮蔽物15及/或接地層233。連接單元27的數量可為三個,其中相鄰或相靠近的連接單元27之間存在一第二間距d2與一第三間距d3,且第二間距d2的長度大於或等於迴路天線21的第一共振頻率之最大波長的1/8,而第三間距d3的長度則大於或等於迴路天線21的第二共振頻率之最大波長的1/8。依據本實施例所建置之天線結構20,即可顯著降低金屬遮蔽物15對迴路天線21的輻射效率造成影響,使得迴路天線21發揮最大的功效。當然第二間距d2的長度並不一定要大於或等於迴路天線21的第一共振頻率之最大波長的1/8;而第三間距d3的長度也不一定要大於或等於迴路天線21的第二共振頻率之最大波長的1/8。若第二間距d2小於第一共振頻率之最大 波長的1/8,或第三間距d3小於第二共振頻率之最大波長的1/8時,同樣可以降低金屬遮蔽物15對迴路天線21產生的遮蔽效應,只是效果可能會比較不好一些。In an embodiment of the present invention, the loop antenna 21 includes a first conductive layer 2131, a second conductive layer 2133, and a third conductive layer 2135, and the first conductive layer 2131, the second conductive layer 2133, and the third conductive layer 2135 are respectively transmitted through Different connection units 27 connect the metal shield 15 and/or the ground layer 233. The number of the connecting units 27 may be three, wherein a second spacing d2 and a third spacing d3 exist between the adjacent or adjacent connecting units 27, and the length of the second spacing d2 is greater than or equal to the number of the loop antennas 21. The length of the third wavelength d3 is greater than or equal to 1/8 of the maximum wavelength of the second resonant frequency of the loop antenna 21. According to the antenna structure 20 constructed in this embodiment, the influence of the metal shield 15 on the radiation efficiency of the loop antenna 21 can be significantly reduced, so that the loop antenna 21 exerts the maximum effect. Of course, the length of the second spacing d2 does not have to be greater than or equal to 1/8 of the maximum wavelength of the first resonant frequency of the loop antenna 21; and the length of the third spacing d3 does not have to be greater than or equal to the second of the loop antenna 21. 1/8 of the maximum wavelength of the resonant frequency. If the second spacing d2 is smaller than the maximum of the first resonant frequency When 1/8 of the wavelength, or the third pitch d3 is less than 1/8 of the maximum wavelength of the second resonance frequency, the shadowing effect of the metal shield 15 on the loop antenna 21 can also be reduced, but the effect may be less favorable.

本新型實施的特徵在於,使得迴路天線21的各個導電層 2131/2133/2135、接地層233、金屬遮蔽物15及/或連接單元27之間相互電性連接,以降低金屬遮蔽物15對迴路天線21所造成的遮蔽效應,至於各個導電層2131/2133/2135、接地層233、金屬遮蔽物15及/或連接單元27之間的電性連接順序則非本新型的重點,亦不為本新型的限制。The present invention is characterized in that the respective conductive layers of the loop antenna 21 are made 2131/2133/2135, the ground layer 233, the metal shield 15 and/or the connecting unit 27 are electrically connected to each other to reduce the shadowing effect of the metal shield 15 on the loop antenna 21, as for the respective conductive layers 2131/2133 The electrical connection sequence between /2135, ground plane 233, metal shield 15 and/or connection unit 27 is not the focus of the present invention and is not a limitation of the present invention.

本新型所述之天線裝置20還包括一個特徵,電路板23的 至少一個接地線235直接透過連接單元27連接金屬遮蔽物15,且不直接連接接地層233。以第6圖為例,位於迴路天線21左右兩側的接地線235直接連接接地層233,例如連接第一導電層2131及第二導電層2133的接地線235,並透過接地層233及連接單元27連接金屬遮蔽物15。位於迴路天線21中央位置的接地線235則未直接連接接地層233,例如連接第三導電層2135的接地線235,而是直接透過連接單元27連接金屬遮蔽物15,藉此可有效降低金屬遮蔽物15對迴路天線21的輻射效率造成影響。The antenna device 20 of the present invention further includes a feature of the circuit board 23 At least one grounding wire 235 is directly connected to the metal shield 15 through the connecting unit 27, and is not directly connected to the grounding layer 233. Taking the figure 6 as an example, the grounding wire 235 located on the left and right sides of the loop antenna 21 is directly connected to the grounding layer 233, for example, the grounding wire 235 connecting the first conductive layer 2131 and the second conductive layer 2133, and is transmitted through the grounding layer 233 and the connecting unit. 27 connects the metal shield 15. The grounding wire 235 located at the center of the loop antenna 21 is not directly connected to the grounding layer 233, for example, the grounding wire 235 of the third conductive layer 2135 is connected, but the metal shielding 15 is directly connected through the connecting unit 27, thereby effectively reducing metal shielding. The object 15 affects the radiation efficiency of the loop antenna 21.

第9圖及第10圖分別為本新型可降低金屬遮蔽效應的天線 裝置又一實施例的立體示意圖及俯視圖。如圖所示,本新型所述之天線裝置30可用以傳送及接收兩種或兩種以上不同頻率的射頻訊號,主要包括一迴路天線31、一電路板33、至少一金屬遮蔽物15及複數個連接單元37,其中電路板33用以承載迴路天線31。Figure 9 and Figure 10 are the antennas that can reduce the metal shadowing effect. A perspective view and a plan view of still another embodiment of the device. As shown in the figure, the antenna device 30 of the present invention can be used to transmit and receive two or more different frequency RF signals, including a loop antenna 31, a circuit board 33, at least one metal shield 15 and a plurality of A connecting unit 37, wherein the circuit board 33 is used to carry the loop antenna 31.

電路板33包括至少一淨空區331及一接地層333,其中淨 空區331為未設置接地層333的區域。接地層333由具導電特性的材質所製成,例如金屬。為了利於在圖式上表示,本新型的第9圖主要將接地層333設置在電路板33的表面,但實際上接地層333並不一定要設置在電路板33的表面上。在本新型其它實施例中,接地層333可設置在電路板33表面或內部,例如電路板33可為多層的結構,並將接地層333設置在電路板33內部的結構內。The circuit board 33 includes at least one clearance area 331 and a ground layer 333, wherein The empty area 331 is an area where the ground layer 333 is not provided. The ground layer 333 is made of a material having a conductive property, such as a metal. In order to facilitate the representation in the drawings, the ninth diagram of the present invention mainly places the ground layer 333 on the surface of the circuit board 33, but actually the ground layer 333 does not have to be provided on the surface of the circuit board 33. In other embodiments of the present invention, the ground layer 333 may be disposed on the surface or inside of the circuit board 33. For example, the circuit board 33 may be a multi-layer structure, and the ground layer 333 may be disposed in the structure inside the circuit board 33.

將迴路天線31設置在電路板33的淨空區331內,其中淨 空區331為未設置接地層333的區域。The loop antenna 31 is disposed in the clearance area 331 of the circuit board 33, wherein The empty area 331 is an area where the ground layer 333 is not provided.

本新型所述之迴路天線31具有電容效應,其中迴路天線 31包括至少一基材311及複數個導電層3131/3133/3135,基材311為不具導電特性的材質所製成。複數個導電層3131/3133/3135設置於該基材311的表面或內部,其中複數個導電層3131/3133/3135之間可產生電容效應及/或耦合效應,並形成迴路天線31的共振頻率。The loop antenna 31 of the present invention has a capacitive effect, wherein the loop antenna 31 includes at least one substrate 311 and a plurality of conductive layers 3131/3133/3135, and the substrate 311 is made of a material having no conductive property. A plurality of conductive layers 3131/3133/3135 are disposed on the surface or inside of the substrate 311, wherein a plurality of conductive layers 3131/3133/3135 can generate a capacitive effect and/or a coupling effect, and form a resonant frequency of the loop antenna 31. .

在本新型一實施例中,請配合參閱第11圖所示,為本新型 迴路天線31一實施例的立體示意圖,迴路天線31包括一基材311、一第一導電層3131、一第二導電層3133及一第三導電層3135,其中第一導電層3131及第二導電層3133設置在基材311的表面或內部,例如第一導電層3131及第二導電層3133可設置在基材311上表面。第三導電層3135設置在基材311的表面或內部,例如第三導電層3135可設置在基材311下表面。第三導電層3135設置的平面與第一導電層3131及第二導電層3133設置的平面或高度不同,且部分的第三導電層3135分別與部分的第一導電層3131及部分的第二導電層3133重疊,並形成兩個重疊區312, 使得第一導電層3131、第二導電層3133及第三導電層3135之間可產生電容效應及/或耦合效應,並形成迴路天線31的共振頻率。In an embodiment of the present invention, please refer to FIG. 11 for the present invention. A schematic diagram of an embodiment of the loop antenna 31 includes a substrate 311, a first conductive layer 3131, a second conductive layer 3133, and a third conductive layer 3135, wherein the first conductive layer 3131 and the second conductive layer The layer 3133 is disposed on the surface or inside of the substrate 311. For example, the first conductive layer 3131 and the second conductive layer 3133 may be disposed on the upper surface of the substrate 311. The third conductive layer 3135 is disposed on the surface or inside of the substrate 311, and for example, the third conductive layer 3135 may be disposed on the lower surface of the substrate 311. The plane of the third conductive layer 3135 is different from the plane or height of the first conductive layer 3131 and the second conductive layer 3133, and a part of the third conductive layer 3135 is respectively connected with a portion of the first conductive layer 3131 and a portion of the second conductive layer. Layers 3133 overlap and form two overlapping regions 312, A capacitive effect and/or a coupling effect may be generated between the first conductive layer 3131, the second conductive layer 3133, and the third conductive layer 3135, and the resonant frequency of the loop antenna 31 is formed.

在本新型實施例中,第三導電層3135與第一導電層3131 之間有部分區域重疊並形成電容效應,以產生迴路天線31的第一共振頻率,而第三導電層3135與第二導電層3133之間有部分區域重疊並形成電容效應,以產生迴路天線31的第二共振頻率。因此本新型所述之迴路天線31將可產生兩種或兩種以上的共振頻率,並可接收或發射複數個頻段的射頻訊號。In the novel embodiment, the third conductive layer 3135 and the first conductive layer 3131 A partial region overlaps and forms a capacitive effect to generate a first resonant frequency of the loop antenna 31, and a partial region between the third conductive layer 3135 and the second conductive layer 3133 overlaps and forms a capacitive effect to generate the loop antenna 31. The second resonant frequency. Therefore, the loop antenna 31 of the present invention can generate two or more resonant frequencies and can receive or transmit RF signals of a plurality of frequency bands.

為了說明時的便利性,本新型第11圖所述的實施例中,描 述了將第一導電層3131及第二導電層3133設置在基材311之上表面,並將第三導電層3135設置在基材311之下表面的構造,然而第一導電層3131、第二導電層3133及第三導電層3135設置的位置並不侷限於基材311的上表面及下表面,第一導電層3131、第二導電層3133及第三導電層3135亦可分別設置在基材311的左表面及右表面,或者是分別設置在基材311的前表面及後表面。當然在不同實施例中,第一導電層3131、第二導電層3133及第三導電層3135亦可設置在基材311的內部。本新型所述之迴路天線31主要的特徵在於,第一導電層3131及第二導電層3133的設置平面或高度相近,而第三導電層3135的設置平面或高度則與第一導電層3131及第二導電層3133的設置平面或高度不同,且部分的第三導電層3135分別與部分的第一導電層3131及部分的第二導電層3133重疊。For the convenience of explanation, in the embodiment described in FIG. 11 of the present invention, A configuration in which the first conductive layer 3131 and the second conductive layer 3133 are disposed on the upper surface of the substrate 311 and the third conductive layer 3135 is disposed on the lower surface of the substrate 311 is described, however, the first conductive layer 3131, the second The positions of the conductive layer 3133 and the third conductive layer 3135 are not limited to the upper surface and the lower surface of the substrate 311, and the first conductive layer 3131, the second conductive layer 3133, and the third conductive layer 3135 may be respectively disposed on the substrate. The left and right surfaces of the 311 are disposed on the front and rear surfaces of the substrate 311, respectively. Of course, in different embodiments, the first conductive layer 3131, the second conductive layer 3133, and the third conductive layer 3135 may also be disposed inside the substrate 311. The loop antenna 31 of the present invention is mainly characterized in that the first conductive layer 3131 and the second conductive layer 3133 are disposed at a similar plane or height, and the third conductive layer 3135 is disposed at a plane or height with the first conductive layer 3131 and The second conductive layer 3133 is disposed at a different plane or height, and a portion of the third conductive layer 3135 overlaps with a portion of the first conductive layer 3131 and a portion of the second conductive layer 3133, respectively.

電路板33還包括複數個接地線335及一訊號饋入線337, 其中接地線335分別連接迴路天線31的各個導電層3131/3133/3135。以第11圖所述的迴路天線31為例,接地線335分別連接迴路天線31的第一導電層3131、第二導電層3133及第三導電層3135,而訊號饋入線337則連接第三導電層3135。The circuit board 33 further includes a plurality of ground lines 335 and a signal feed line 337. The grounding wires 335 are respectively connected to the respective conductive layers 3131/3133/3135 of the loop antenna 31. Taking the loop antenna 31 described in FIG. 11 as an example, the grounding wire 335 is respectively connected to the first conductive layer 3131, the second conductive layer 3133 and the third conductive layer 3135 of the loop antenna 31, and the signal feeding line 337 is connected to the third conductive layer. Layer 3135.

在本新型實施例中,天線結構30還包括至少一金屬遮蔽物 15,其中金屬遮蔽物15與電路板33的距離相近,並於金屬遮蔽物15與電路板33之間存在一第一間距d1,例如第一間距d1大於0.3公釐。當然第一間距d1並不一定要大於0.3公釐,本新型亦可應用在第一間距d1小於或等於0.3公釐的構造。金屬遮蔽物15與電路板33相鄰,並可能對迴路天線31產生遮蔽效應(Shielding effect),進而影響迴路天線31傳送或接收射頻訊號的效率。In the novel embodiment, the antenna structure 30 further includes at least one metal shield. 15. The distance between the metal shield 15 and the circuit board 33 is similar, and there is a first spacing d1 between the metal shield 15 and the circuit board 33, for example, the first spacing d1 is greater than 0.3 mm. Of course, the first spacing d1 does not have to be greater than 0.3 mm. The present invention can also be applied to a configuration in which the first spacing d1 is less than or equal to 0.3 mm. The metal shield 15 is adjacent to the circuit board 33 and may have a Shielding effect on the loop antenna 31, thereby affecting the efficiency with which the loop antenna 31 transmits or receives RF signals.

在本新型一實施例中,金屬遮蔽物15可以是使用天線結構 30之電子裝置的外殼,例如金屬遮蔽物15可以是手機及/或智慧型手機的金屬殼體,則設置在手機或智慧型手機的天線結構30及/或迴路天線31,可能會被手機及/或智慧型手機的金屬殼體所遮蔽,並造成迴路天線31接收或傳送射頻訊號的效率降低。當然手機及智慧型手機僅為說明的實施例,並非本新型所述之天線結構30的限制,本新型所述的內容可應用在任何需要透過天線接收及/或發射射頻訊號的電子裝置。此外金屬遮蔽物15為手機及/或智慧型手機的金屬殼體亦非本新型的限制,金屬遮蔽物15亦可為手機、智慧型手機及/或其它電子裝置內部的構件,換言之金屬遮蔽物15設置在電子裝置的那個位置並非本新型的限制。In an embodiment of the present invention, the metal shield 15 may be an antenna structure. The outer casing of the electronic device of 30, such as the metal shield 15, may be a metal casing of a mobile phone and/or a smart phone, and may be disposed on the antenna structure 30 of the mobile phone or the smart phone and/or the loop antenna 31, possibly by the mobile phone and / or the metal casing of the smart phone is shielded, and the efficiency of the loop antenna 31 receiving or transmitting the radio frequency signal is reduced. Of course, the mobile phone and the smart phone are only the illustrated embodiments, and are not limited by the antenna structure 30 of the present invention. The content described in the present invention can be applied to any electronic device that needs to receive and/or transmit radio frequency signals through the antenna. In addition, the metal cover 15 is not limited to the metal casing of the mobile phone and/or the smart phone. The metal cover 15 can also be a component of a mobile phone, a smart phone and/or other electronic devices, in other words, a metal shield. The position set in the electronic device 15 is not a limitation of the present invention.

為了避免金屬遮蔽物15對迴路天線31造成遮蔽效應,本 新型所述之天線結構30還包括複數個連接單元37,並透過連接單元37電性連接金屬遮蔽物15、接地線335及接地層333。連接單元37可為具導電特性的材質所製作,例如金屬,以使得金屬遮蔽物15電性連接接地層333和接地線335。In order to avoid the shadowing effect of the metal shield 15 on the loop antenna 31, The antenna structure 30 further includes a plurality of connecting units 37, and is electrically connected to the metal shield 15, the grounding wire 335, and the grounding layer 333 through the connecting unit 37. The connecting unit 37 can be made of a material having conductive properties, such as metal, such that the metal shield 15 is electrically connected to the ground layer 333 and the ground line 335.

在本新型實施例中,迴路天線31的第一導電層3131透過 接地線335連接接地層333,接地層333則透過連接單元37連接金屬遮蔽物15。迴路天線31的第二導電層3133透過接地線335連接接地層333,接地層333則透過連接單元37連接金屬遮蔽物15。迴路天線31的第三導電層3135透過接地線335及連接單元37連接金屬遮蔽物15。In the new embodiment, the first conductive layer 3131 of the loop antenna 31 is transparent. The ground line 335 is connected to the ground layer 333, and the ground layer 333 is connected to the metal shield 15 through the connection unit 37. The second conductive layer 3133 of the loop antenna 31 is connected to the ground layer 333 through the ground line 335, and the ground layer 333 is connected to the metal shield 15 through the connection unit 37. The third conductive layer 3135 of the loop antenna 31 is connected to the metal shield 15 through the ground line 335 and the connection unit 37.

在本新型一實施例中,迴路天線31包括第一導電層3131 、第二導電層3133及第三導電層3135,且第一導電層3131、第二導電層3133及第三導電層3135分別透過不同的連接單元37連接金屬遮蔽物15及/或接地層333。連接單元37的數量可為三個,其中相鄰或相靠近的連接單元37之間存在一第二間距d2與一第三間距d3。第二間距d2的長度大於或等於迴路天線31的第一共振頻率之最大波長的1/8,而第三間距d3的長度則大於或等於迴路天線31的第二共振頻率之最大波長的1/8。依據本實施例所建置之天線結構30,即可顯著降低金屬遮蔽物15對迴路天線31的輻射效率造成影響,使得迴路天線31發揮最大的功效。當然第二間距d2並不一定要長度大於或等於迴路天線31的第一共振頻率之最大波長的1/8;而第三間距d3也並不一定要長度大於或等於迴路天線31的第二共振頻率之最大波長的1/8。若第二間距d2小於第一共振頻率之最大波長的1/8或第三間距d3小於第二共振頻率之最大波長的1/8時,同樣可以降 低金屬遮蔽物15對迴路天線31產生的遮蔽效應,只是效果可能會比較不好一些。In an embodiment of the present invention, the loop antenna 31 includes a first conductive layer 3131. The second conductive layer 3133 and the third conductive layer 3135, and the first conductive layer 3131, the second conductive layer 3133, and the third conductive layer 3135 are respectively connected to the metal shield 15 and/or the ground layer 333 through different connection units 37. The number of the connecting units 37 may be three, and a second spacing d2 and a third spacing d3 exist between adjacent or adjacent connecting units 37. The length of the second pitch d2 is greater than or equal to 1/8 of the maximum wavelength of the first resonant frequency of the loop antenna 31, and the length of the third pitch d3 is greater than or equal to 1/ of the maximum wavelength of the second resonant frequency of the loop antenna 31. 8. According to the antenna structure 30 constructed in this embodiment, the influence of the metal shield 15 on the radiation efficiency of the loop antenna 31 can be significantly reduced, so that the loop antenna 31 exerts the maximum effect. Of course, the second spacing d2 does not necessarily have to be greater than or equal to 1/8 of the maximum wavelength of the first resonant frequency of the loop antenna 31; and the third spacing d3 does not necessarily have a length greater than or equal to the second resonance of the loop antenna 31. 1/8 of the maximum wavelength of the frequency. If the second pitch d2 is less than 1/8 of the maximum wavelength of the first resonance frequency or the third pitch d3 is less than 1/8 of the maximum wavelength of the second resonance frequency, the same can be lowered. The shadowing effect of the low metal shield 15 on the loop antenna 31 may only be less effective.

本新型實施的特徵在於,使得迴路天線31的各個導電層 3131/3133/3135、接地層333、金屬遮蔽物15及/或連接單元37之間相互電性連接,以降低金屬遮蔽物15對迴路天線31所造成的遮蔽效應,至於各個導電層3131/3133/3135、接地層333、金屬遮蔽物15及/或連接單元37之間的電性連接順序則非本新型的重點,亦不為本新型的限制。The present invention is characterized in that the respective conductive layers of the loop antenna 31 are made 3131/3133/3135, the grounding layer 333, the metal shield 15 and/or the connecting unit 37 are electrically connected to each other to reduce the shielding effect caused by the metal shielding 15 on the loop antenna 31. As for the respective conductive layers 3131/3133 /3135, the electrical connection sequence between the ground layer 333, the metal shield 15 and/or the connection unit 37 is not the focus of the present invention, nor is it a limitation of the present invention.

為了方便表示,在第1圖、第5圖、第6圖及第9圖中的 金屬遮蔽物15是以設置在電路板13/23/33的下方作為本新型的實施方式,但在實際應用時,金屬遮蔽物15的設置位置並不侷限在電路板13/23/33的下方,金屬遮蔽物15亦可能設置在電路板13/23/33及/或迴路天線11/21/31的上方、左方、右方、前方及/或後方。For convenience of representation, in the first, fifth, sixth, and ninth The metal shield 15 is disposed below the circuit board 13/23/33 as an embodiment of the present invention, but in practical applications, the metal shield 15 is not disposed below the circuit board 13/23/33. The metal shield 15 may also be disposed above, to the left, to the right, to the front, and/or to the rear of the circuit board 13/23/33 and/or the loop antenna 11/21/31.

此外為了說明時的便利性,本新型主要以一個金屬遮蔽物 15作為說明的實施例,但在實際應用時金屬遮蔽物15的數量亦可為複數個,在設置時只要透過連接單元17/27/37使得複數個金屬遮蔽物15電性連接接地層133/233/333及/或接地線135/235/335,便可降低複數個金屬遮蔽物15對迴路天線11/21/31形成遮蔽效應。In addition, for the convenience of explanation, the present invention mainly uses a metal shield. 15 is an illustrative embodiment, but in actual application, the number of metal shields 15 may also be plural. When disposed, a plurality of metal shields 15 are electrically connected to the ground layer 133 by the connection unit 17/27/37. 233/333 and/or grounding wire 135/235/335 can reduce the shadowing effect of the plurality of metal shields 15 on the loop antenna 11/21/31.

本新型所述之天線裝置30還包括一個特徵,電路板33的 至少一個接地線335直接透過連接單元37連接金屬遮蔽物15,且不直接連接接地層333。以第9圖為例,位於迴路天線31左右兩側的接地線335直接連接接地層333,例如連接第一導電層3131及第二導電層3133的接地線335,並透過接地層333及連接單元37連接金屬遮蔽物15。位於迴路 天線31中央位置的接地線335則未直接連接接地層333,例如連接第三導電層3135的接地線335,而是直接透過連接單元37連接金屬遮蔽物15,藉此可有效降低金屬遮蔽物15對迴路天線31的輻射效率造成影響。The antenna device 30 of the present invention further includes a feature of the circuit board 33 At least one grounding wire 335 is directly connected to the metal shield 15 through the connecting unit 37, and is not directly connected to the grounding layer 333. Taking the ninth figure as an example, the grounding wire 335 located on the left and right sides of the loop antenna 31 is directly connected to the grounding layer 333, for example, the grounding wire 335 connecting the first conductive layer 3131 and the second conductive layer 3133, and is transmitted through the grounding layer 333 and the connecting unit. 37 connects the metal shield 15. Located in the loop The grounding wire 335 at the central position of the antenna 31 is not directly connected to the grounding layer 333, for example, the grounding wire 335 of the third conductive layer 3135 is connected, but the metal shielding 15 is directly connected through the connecting unit 37, thereby effectively reducing the metal shielding 15 The radiation efficiency of the loop antenna 31 is affected.

雖然本新型之實施例揭露如上所述,然並非用以限定本新型,任何熟習相關技藝者,在不脫離本新型之精神和範圍內,舉凡依本新型申請範圍所述之形狀、構造、特徵及數量當可做些許之變更,因此本新型之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the embodiments of the present invention are disclosed as described above, it is not intended to limit the present invention, and those skilled in the art can, without departing from the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of the patents may be changed, and the scope of patent protection of the present invention is subject to the scope of the patent application attached to the specification.

本新型中所設置之連接單元是一種可以建立電性連結之裝置,並不受限於其存在之形式,可以是一段金屬導線、導電性材料、金屬彈片或頂針,結構上可以是固定於電路板或金屬遮蔽物或兩者同時,可以依附在電路板外側或埋置於電路板內部,或是結合電路板通孔與金屬構件。The connecting unit provided in the present invention is a device capable of establishing an electrical connection, and is not limited to its existence, and may be a metal wire, a conductive material, a metal dome or a thimble, and may be fixed to the circuit in structure. The board or metal shield or both can be attached to the outside of the board or embedded inside the board, or combined with the board through hole and the metal member.

10‧‧‧天線裝置10‧‧‧Antenna device

11‧‧‧迴路天線11‧‧‧loop antenna

1131‧‧‧第一導電層1131‧‧‧First conductive layer

1133‧‧‧第二導電層1133‧‧‧Second conductive layer

13‧‧‧電路板13‧‧‧Circuit board

131‧‧‧淨空區131‧‧‧ clearance area

133‧‧‧接地層133‧‧‧ Grounding layer

135‧‧‧接地線135‧‧‧ Grounding wire

137‧‧‧訊號饋入線137‧‧‧ signal feed line

15‧‧‧金屬遮蔽物15‧‧‧Metal shelter

17‧‧‧連接單元17‧‧‧ Connection unit

Claims (18)

一種可降低金屬遮蔽效應的天線裝置,用以傳送或接收射頻訊號,包括:至少一迴路天線,包括:至少一基材;複數個導電層,設置於該基材的表面或內部,其中該複數個導電層之間形成電容效應,並產生該迴路天線的共振頻率;一電路板,承載該迴路天線,並包括:一接地層;一淨空區,用以容置該迴路天線;複數個接地線,分別連接該迴路天線的各個導電層;至少一訊號饋入線,連接該迴路天線的至少一導電層;至少一金屬遮蔽物,鄰近該迴路天線,其中該金屬遮蔽物與該迴路天線之間存在一第一間距;及複數個連接單元,電性連接該金屬遮蔽物、該接地層及該接地線。An antenna device for reducing a metal shadowing effect, for transmitting or receiving an RF signal, comprising: at least one loop antenna, comprising: at least one substrate; a plurality of conductive layers disposed on a surface or an interior of the substrate, wherein the plurality a capacitive effect is formed between the conductive layers, and a resonant frequency of the loop antenna is generated; a circuit board carrying the loop antenna includes: a ground layer; a clearing area for accommodating the loop antenna; and a plurality of grounding lines Connecting each conductive layer of the loop antenna; at least one signal feed line connecting at least one conductive layer of the loop antenna; at least one metal shield adjacent to the loop antenna, wherein the metal shield exists between the metal shield and the loop antenna a first spacing; and a plurality of connecting units electrically connecting the metal shield, the ground layer, and the grounding line. 如申請專利範圍第1項所述之天線裝置,其中該第一間距的長度大於0.3公釐。The antenna device of claim 1, wherein the first pitch has a length greater than 0.3 mm. 如申請專利範圍第1項所述之天線裝置,其中相鄰的連接單元之間存在一第二間距,且該第二間距的長度大於或等於該迴路天線之共振頻率最大波長的1/8。The antenna device of claim 1, wherein a second spacing exists between adjacent connecting units, and the length of the second spacing is greater than or equal to 1/8 of a maximum wavelength of a resonant frequency of the loop antenna. 如申請專利範圍第1項所述之天線裝置,其中該電路板的至少一接地線直接透過該連接單元連接該金屬遮蔽物。The antenna device of claim 1, wherein at least one grounding wire of the circuit board directly connects the metal shield through the connecting unit. 一種可降低金屬遮蔽效應的天線裝置,用以傳送或接收射頻訊號,包括:至少一迴路天線,包括:至少一基材;至少一第一導電層,設置於該基材的表面或內部;至少一第二導電層,設置於該基材的表面或內部,其中該第一導電 層及該第二導電層之間用以產生電容效應,並形成該迴路天線的共振頻率;一電路板,承載該迴路天線,並包括:一接地層;一淨空區,用以容置該迴路天線;複數個接地線,分別連接該迴路天線的該第一導電層及該第二導電層;至少一訊號饋入線,連接該迴路天線的該第一導電層;至少一金屬遮蔽物,鄰近該迴路天線,其中該金屬遮蔽物與該迴路天線之間存在一第一間距;及複數個連接單元,電性連接該金屬遮蔽物、該接地層及該接地線。An antenna device for reducing a metal shadowing effect, for transmitting or receiving an RF signal, comprising: at least one loop antenna comprising: at least one substrate; at least one first conductive layer disposed on a surface or an interior of the substrate; a second conductive layer disposed on a surface or an inner portion of the substrate, wherein the first conductive layer The layer and the second conductive layer are used to generate a capacitive effect and form a resonant frequency of the loop antenna; a circuit board carrying the loop antenna and comprising: a ground layer; and a clearance area for accommodating the loop An antenna; a plurality of grounding wires respectively connected to the first conductive layer and the second conductive layer of the loop antenna; at least one signal feeding line connecting the first conductive layer of the loop antenna; at least one metal shield adjacent to the antenna a loop antenna, wherein a first spacing exists between the metal shield and the loop antenna; and a plurality of connecting units electrically connecting the metal shield, the ground layer, and the ground line. 如申請專利範圍第5項所述之天線裝置,其中該第一間距的長度大於0.3公釐。The antenna device of claim 5, wherein the first pitch has a length greater than 0.3 mm. 如申請專利範圍第5項所述之天線裝置,其中相鄰的連接單元之間存在一第二間距,且該第二間距的長度大於或等於該迴路天線之共振頻率最大波長的1/8。The antenna device of claim 5, wherein a second spacing exists between adjacent connecting units, and the length of the second spacing is greater than or equal to 1/8 of a maximum wavelength of a resonant frequency of the loop antenna. 如申請專利範圍第5項所述之天線裝置,其中該第一導電層及該第二導電層分別設置在不同的平面,且部分該第一導電層與部分該第二導電層重疊以產生電容效應,並形成該迴路天線的共振頻率。The antenna device of claim 5, wherein the first conductive layer and the second conductive layer are respectively disposed on different planes, and a portion of the first conductive layer overlaps with a portion of the second conductive layer to generate a capacitor Effect and form the resonant frequency of the loop antenna. 如申請專利範圍第5項所述之天線裝置,其中該第一導電層及該第二導電層設置於相同或相近的平面上,且該第一導電層與該第二導電層之間存在一間隙,該第一導電層與該第二導電層用以產生電容效應,並形成該迴路天線的共振頻率。The antenna device of claim 5, wherein the first conductive layer and the second conductive layer are disposed on the same or similar planes, and a first layer between the first conductive layer and the second conductive layer exists The gap, the first conductive layer and the second conductive layer are used to generate a capacitive effect and form a resonant frequency of the loop antenna. 如申請專利範圍第5項所述之天線裝置,其中該電路板的至少一接地線直接透過該連接單元連接該金屬遮蔽物。The antenna device of claim 5, wherein at least one grounding wire of the circuit board directly connects the metal shield through the connecting unit. 一種可降低金屬遮蔽效應的天線裝置,用以傳送或接收複數個頻帶的射頻訊號,包括:至少一迴路天線,包括: 至少一基材;至少一第一導電層,設置於該基材的表面或內部;至少一第二導電層,設置於該基材的表面或內部;至少一第三導電層,設置於該基材的表面或內部,該第三導電層設置的平面與該第一導電層或該第二導電層設置的平面不同,且部分該第三導電層分別與部分該第一導電層及部分該第二導電層重疊,其中該第一導電層與該第三導電層之間形成電容效應,並產生該迴路天線的第一共振頻率,而該第二導電層與該第三導電層之間形成電容效應,並產生該迴路天線的第二共振頻率;一電路板,承載該迴路天線,並包括:一接地層;一淨空區,用以容置該迴路天線;複數個接地線,分別連接該迴路天線的第一導電層、第二導電層及第三導電層;一第一訊號饋入線,連接該迴路天線的第一導電層;一第二訊號饋入線,連接該迴路天線的第二導電層;至少一金屬遮蔽物,鄰近該迴路天線,其中該金屬遮蔽物與該迴路天線之間存在一第一間距;及複數個連接單元,電性連接該金屬遮蔽物、該接地層及該接地線。An antenna device for reducing a metal shadowing effect, for transmitting or receiving radio frequency signals of a plurality of frequency bands, comprising: at least one loop antenna, comprising: At least one substrate; at least one first conductive layer disposed on a surface or an inner portion of the substrate; at least one second conductive layer disposed on a surface or an inner portion of the substrate; at least one third conductive layer disposed on the base The surface of the material or the interior of the material, the plane of the third conductive layer is different from the plane of the first conductive layer or the second conductive layer, and a portion of the third conductive layer and the portion of the first conductive layer and the portion respectively The two conductive layers overlap, wherein a capacitance effect is formed between the first conductive layer and the third conductive layer, and a first resonant frequency of the loop antenna is generated, and a capacitance is formed between the second conductive layer and the third conductive layer And generating a second resonant frequency of the loop antenna; a circuit board carrying the loop antenna, and comprising: a ground layer; a clearing area for accommodating the loop antenna; and a plurality of grounding lines respectively connected to the loop a first conductive layer, a second conductive layer and a third conductive layer; a first signal feed line connecting the first conductive layer of the loop antenna; a second signal feed line connecting the second conductive layer of the loop antenna At least one metal shield, adjacent to the loop antenna, wherein a first spacing is present between the metal shield and the loop antenna; and a plurality of connection means electrically connected to the metal shield, the ground layer and the ground line. 如申請專利範圍第11項所述之天線裝置,其中該第一間距之長度大於0.3公釐。The antenna device of claim 11, wherein the first pitch has a length greater than 0.3 mm. 如申請專利範圍第11項所述之天線裝置,其中該相鄰的連接單元之間存在一第二間距與一第三間距,且該第二間距的長度大於或等於該迴路天線之第一共振頻率最大波長的1/8,該第三間距的長度大於或等於該迴路天線之第二共振頻率最大波長的1/8。The antenna device of claim 11, wherein the adjacent connecting unit has a second pitch and a third pitch, and the length of the second pitch is greater than or equal to the first resonance of the loop antenna. The length of the third wavelength is greater than or equal to 1/8 of the maximum wavelength of the second resonant frequency of the loop antenna. 如申請專利範圍第11項所述之天線裝置,其中該電路板的至少一接地線直接透過該連接單元連接該金屬遮蔽物。The antenna device of claim 11, wherein at least one grounding wire of the circuit board directly connects the metal shield through the connecting unit. 一種可降低金屬遮蔽效應的天線裝置,用以傳送或接收複數個頻帶的射頻訊號,包括:至少一迴路天線,包括:至少一基材;至少一第一導電層,設置於該基材的表面或內部;至少一第二導電層,設置於該基材的表面或內部;至少一第三導電層,設置於該基材的表面或內部,該第三導電層設置的平面與該第一導電層或該第二導電層設置的平面不同,且部分該第三導電層分別與部分該第一導電層及部分該第二導電層重疊,其中該第一導電層與該第三導電層之間形成電容效應,並產生該迴路天線的第一共振頻率,而該第二導電層與該第三導電層之間形成電容效應,並產生該迴路天線的第二共振頻率;一電路板,承載該迴路天線,並包括:一接地層;一淨空區,用以容置該迴路天線;複數個接地線,分別連接該迴路天線的第一導電層、第二導電層及第三導電層;一訊號饋入線,連接該迴路天線的第三導電層;至少一金屬遮蔽物,鄰近該迴路天線,其中該金屬遮蔽物與該迴路天線之間存在一第一間距;及複數個連接單元,電性連接該金屬遮蔽物、該接地層及該接地線。An antenna device for reducing a metal shadowing effect, for transmitting or receiving a plurality of frequency band RF signals, comprising: at least one loop antenna comprising: at least one substrate; at least one first conductive layer disposed on a surface of the substrate Or at least one second conductive layer disposed on a surface or an inner portion of the substrate; at least one third conductive layer disposed on a surface or an inner portion of the substrate, the third conductive layer disposed on a plane and the first conductive layer The layer or the second conductive layer is disposed in a different plane, and a portion of the third conductive layer overlaps with a portion of the first conductive layer and a portion of the second conductive layer, respectively, wherein between the first conductive layer and the third conductive layer Forming a capacitive effect and generating a first resonant frequency of the loop antenna, and a capacitive effect is formed between the second conductive layer and the third conductive layer, and generating a second resonant frequency of the loop antenna; a circuit board carrying the The loop antenna includes: a grounding layer; a clearing area for accommodating the loop antenna; and a plurality of grounding lines respectively connected to the first conductive layer, the second conductive layer and the third of the loop antenna An electrical layer; a signal feed line connecting the third conductive layer of the loop antenna; at least one metal shield adjacent to the loop antenna, wherein a first spacing exists between the metal shield and the loop antenna; and a plurality of connections The unit electrically connects the metal shield, the ground layer, and the ground line. 如申請專利範圍第15項所述之天線裝置,其中該第一間距之長度大於0.3公釐。The antenna device of claim 15, wherein the first pitch has a length greater than 0.3 mm. 如申請專利範圍第15項所述之天線裝置,其中該相鄰的連接單元之間存在一第二間距與一第三間距,且該第二間距的長度大於或等於該迴路天線之第一共振頻率最大波長的1/8,該第三間距的長度大於或等於該迴路天線之第二共振頻率最大波長的1/8。The antenna device of claim 15, wherein a second spacing and a third spacing exist between the adjacent connecting units, and the length of the second spacing is greater than or equal to the first resonance of the loop antenna. The length of the third wavelength is greater than or equal to 1/8 of the maximum wavelength of the second resonant frequency of the loop antenna. 如申請專利範圍第15項所述之天線裝置,其中該電路板的至少一接地線直接透過該連接單元連接該金屬遮蔽物。The antenna device of claim 15, wherein at least one grounding wire of the circuit board directly connects the metal shield through the connecting unit.
TW103216053U 2014-09-10 2014-09-10 Antenna structure with reduced metal shielding effect TWM493164U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI563725B (en) * 2014-12-05 2016-12-21 Molex Inc Electronic apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI563725B (en) * 2014-12-05 2016-12-21 Molex Inc Electronic apparatus

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