TWM487718U - Conductive patch structure - Google Patents

Conductive patch structure Download PDF

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Publication number
TWM487718U
TWM487718U TW103200837U TW103200837U TWM487718U TW M487718 U TWM487718 U TW M487718U TW 103200837 U TW103200837 U TW 103200837U TW 103200837 U TW103200837 U TW 103200837U TW M487718 U TWM487718 U TW M487718U
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TW
Taiwan
Prior art keywords
layer
conductive
patch structure
conductive patch
hydrogel
Prior art date
Application number
TW103200837U
Other languages
Chinese (zh)
Inventor
Tsu-Tai Lin
Original Assignee
Catz Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Catz Inc filed Critical Catz Inc
Priority to TW103200837U priority Critical patent/TWM487718U/en
Publication of TWM487718U publication Critical patent/TWM487718U/en

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  • Laminated Bodies (AREA)
  • Medicinal Preparation (AREA)

Claims (12)

一種導電貼片結構，其包含：(a)一底層；(b)一水凝膠層，其塗覆於該底層上，該底層用以支撐該水凝膠層；及(c)一導電層，其貼覆於該水凝膠層上，該導電層之外側延伸一側翼，其中使用該導電貼片結構時，以該側翼作為施力點，令該底層與該水凝膠層分離，並將水凝膠層貼合於皮膚時，利用該導電層之側翼作為一導電介質藉以電性導通。A conductive patch structure comprising: (a) a bottom layer; (b) a hydrogel layer applied to the bottom layer, the bottom layer for supporting the hydrogel layer; and (c) a conductive layer And adhering to the hydrogel layer, the outer side of the conductive layer extending a side wing, wherein when the conductive patch structure is used, the side layer is used as a force applying point to separate the bottom layer from the hydrogel layer, and When the hydrogel layer is attached to the skin, the flank of the conductive layer is used as a conductive medium to electrically conduct. 如申請專利範圍第1項所述之導電貼片結構，其中該導電層貼覆於該水凝膠層之周圍，並使部分水膠層裸露於外界。The conductive patch structure of claim 1, wherein the conductive layer is applied around the hydrogel layer and a portion of the water gel layer is exposed to the outside. 如申請專利範圍第1項所述之導電貼片結構，其中該導電層包含銀漿、銀銅漿、石墨、石墨纖維導電板或石墨烯。The conductive patch structure of claim 1, wherein the conductive layer comprises silver paste, silver copper paste, graphite, graphite fiber conductive plate or graphene. 如申請專利範圍第1項所述之導電貼片結構，其中該水凝膠包含：(a)單體；(b)塑化劑；(c)光起始劑；(d)交聯劑；及(e)增稠劑。The conductive patch structure of claim 1, wherein the hydrogel comprises: (a) a monomer; (b) a plasticizer; (c) a photoinitiator; (d) a crosslinking agent; And (e) a thickener. 如申請專利範圍第4項所述之導電貼片結構，其中水凝膠原料重量配比為：壓克力系醯胺單體 15至30份壓克力系磺酸鹽類單體 10至50份甘油 15至45份光起始劑 0.01至0.1份不飽和雙鍵之雙官能基酯類單體 0.01至0.2份。The conductive patch structure according to claim 4, wherein the hydrogel raw material weight ratio is: acrylic to guanamine monomer 15 to 30 parts of acrylic sulfonate monomer 10 to 50 The glycerin is used in an amount of from 0.01 to 0.2 parts by weight of from 15 to 45 parts of the photoinitiator, from 0.01 to 0.1 part by weight of the difunctional ester monomer of the unsaturated double bond. 如申請專利範圍第1項所述之導電貼片結構，其進一步包含一保護膜，其用於隔離外界雜質以保護該水凝膠層。The conductive patch structure of claim 1, further comprising a protective film for isolating external impurities to protect the hydrogel layer. 如申請專利範圍第6項所述之導電貼片結構，其中該保護膜為防水材質所製成。The conductive patch structure according to claim 6, wherein the protective film is made of a waterproof material. 如申請專利範圍第6項所述之導電貼片結構，其中該保護膜包含離型膜。The conductive patch structure of claim 6, wherein the protective film comprises a release film. 如申請專利範圍第1項所述之導電貼片結構，其中該底層為防水材質所製成。The conductive patch structure of claim 1, wherein the bottom layer is made of a waterproof material. 如申請專利範圍第9項所述之導電貼片結構，其中該底層包含矽膠片、離型膜、離型紙。The conductive patch structure of claim 9, wherein the bottom layer comprises a crepe film, a release film, and a release paper. 如申請專利範圍第1項所述之導電貼片結構，其中該水凝膠層進一步包含具治療功效的藥劑層。The conductive patch structure of claim 1, wherein the hydrogel layer further comprises a therapeutically effective agent layer. 如申請專利範圍第11項所述之導電貼片結構，其中該藥劑層為固態、半固態或液態等配方型式。The conductive patch structure of claim 11, wherein the drug layer is in a solid, semi-solid or liquid formulation.
TW103200837U 2014-01-15 2014-01-15 Conductive patch structure TWM487718U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103200837U TWM487718U (en) 2014-01-15 2014-01-15 Conductive patch structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103200837U TWM487718U (en) 2014-01-15 2014-01-15 Conductive patch structure

Publications (1)

Publication Number Publication Date
TWM487718U true TWM487718U (en) 2014-10-11

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107624074A (en) * 2015-03-09 2018-01-23 国家科学研究中心 Method for forming the medical treatment device comprising graphene
US11577960B2 (en) 2015-03-09 2023-02-14 Centre National De La Recherche Scientifique Method of forming a graphene device using polymer material as a support for a graphene film
US12059560B2 (en) 2015-03-09 2024-08-13 Centre National De La Recherche Scientifique Method of forming a device comprising graphene

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107624074A (en) * 2015-03-09 2018-01-23 国家科学研究中心 Method for forming the medical treatment device comprising graphene
US11040191B2 (en) 2015-03-09 2021-06-22 Centre National De La Recherche Scientifique Method of forming a medical device comprising graphene
US11577960B2 (en) 2015-03-09 2023-02-14 Centre National De La Recherche Scientifique Method of forming a graphene device using polymer material as a support for a graphene film
US12054392B2 (en) 2015-03-09 2024-08-06 Centre National De La Recherche Scientifique Method of forming a graphene device using polymer material as a support for a graphene film
US12059560B2 (en) 2015-03-09 2024-08-13 Centre National De La Recherche Scientifique Method of forming a device comprising graphene
US12358797B2 (en) 2015-03-09 2025-07-15 Centre National De La Recherche Scientifique Sensor device formed from conductive graphene film

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