TWM487606U - Heating circuit - Google Patents

Description

Heating circuit

This creation relates to a heating circuit, and more particularly to a heating circuit for circuit board components.

When the display card is used under overclocking and overpressure, liquid nitrogen is used to cool the display card in order to achieve better heat dissipation. However, when liquid nitrogen is used for cooling, the ambient temperature will drop to a critical operating temperature beyond the load of some peripheral components, making the peripheral components inoperable.

In order to solve the above problems, the conventional method uses a hot air blower to heat the peripheral components to operate at a normal temperature. However, the hot air opportunity occupies too much space in the electronic device, and the heating is uneven, thus causing some components to be too hot.

The present invention provides a heating circuit comprising a voltage source module for outputting a voltage; a circuit board heating circuit connecting the voltage source module and receiving the outputted voltage; and an over temperature protection module connected to the voltage source mode group. When the temperature exceeds a preset value, the over temperature protection module outputs a stop signal to the voltage source module to disable the voltage source module.

The heating circuit of the present invention is arranged in the circuit board to arrange the heating circuit around the component to be heated in the manner of printed circuit wiring, so that the component can work under normal temperature, and can also detect the temperature of the heating circuit of the circuit board to avoid The component is overheated. Therefore, the heating circuit of the present invention can uniformly heat the components and avoid occupying more space.

1‧‧‧heating circuit

100‧‧‧Voltage source module

200‧‧‧Board heating circuit

300‧‧‧Logic Control Circuit

400‧‧‧Over temperature protection module

500‧‧‧ components

600‧‧‧Cooling module

301‧‧‧First transistor

302‧‧‧Second transistor

303‧‧‧First resistance

401‧‧‧Thermistor

402‧‧‧second resistance

403‧‧‧ Third transistor

The first figure is a frame diagram of a heating circuit of a preferred embodiment of the present invention.

The second figure is a partial circuit diagram of a heating circuit of a preferred embodiment of the present invention.

The third figure is a circuit diagram of a voltage source module according to a preferred embodiment of the present invention.

The first figure shows a block diagram of a heating circuit 1 according to a preferred embodiment of the present invention. Referring to the first figure, in an embodiment, the heating circuit 1 of the present invention includes a voltage source module 100, a circuit board heating circuit 200, a logic control circuit 300, and an over temperature protection module 400.

The logic control circuit 300 is configured to receive a signal from the cooling module 600. When the cooling module 600 starts to operate, a high level signal is output to the logic control circuit 300. The high level signal is used to notify the logic control circuit 300 of the current working state of the cooling module 600. Of course, the high level signal can also be low level according to needs or design. Signal. After receiving the high level signal, the logic control circuit 300 sends a working signal to the input end of the voltage source module 100. After the input end of the voltage source module 100 receives the working signal, it starts to work, and the output end of the voltage source module 100 outputs a voltage to one end of the circuit board heating circuit 200. The other end of the circuit board heating circuit 200 is grounded. When the voltage output from the output terminal of the voltage source module 100 is received, the circuit board heating circuit 200 begins to de-heat the component 500. In one embodiment, component 500 is an element on a circuit board, such as a memory or the like. The over temperature protection module 400 detects the temperature of the circuit board heating circuit 200. When the temperature of the circuit board heating circuit 200 is higher than a rated value, a stop signal is outputted to the input end of the voltage source module 100, and the voltage source module 100 then stops working and the board heating circuit 200 stops working to avoid overheating of the surrounding components.

The circuit board heating circuit 200 is a printed circuit directly disposed on the circuit board, and may be located in one layer of the multi-layer circuit board, which may be disposed near the component 500 to be heated, and the component 500 may be a plurality of components on the circuit board. The arrangement varies depending on the circuit design, and the board heating circuit 200 can be designed differently depending on the specific distribution of the components 500 to be heated. The circuit board heating circuit 200 can select lines of different magnitudes of resistance depending on the heating demand. The use of such a printed circuit board wiring method to heat the components can save space for the board space, and at the same time, due to the flexibility of the routing method, the heating requirements of the heating elements at different positions can be satisfied.

The second figure illustrates the heating circuit 100 of a preferred embodiment of the present invention. Part of the circuit diagram.

The logic control circuit 300 includes a first transistor 301, a second transistor 302, and a first resistor 303. In the present invention, the first transistor 301 and the second transistor 303 are N-channel field effect transistors, but the creation is not limited thereto, and may be other types of transistors, such as P-channel field effect transistors. The source of the first transistor 301 is grounded, the gate is used to receive the signal of the cooling module 600, and the drain is connected to the gate of the second transistor 302. The source of the second transistor 302 is grounded, and the drain is connected to the input terminal of the voltage source module 100. One end of the first resistor 303 is connected to the drain of the first transistor 301 and the gate of the second transistor 302, and the other end is connected to a power source. When the cooling module 600 starts to work, a high level signal is transmitted to the gate of the first transistor 301, the first transistor 301 is turned on, the second transistor 302 is turned off, and the voltage source module 100 starts to work.

The over temperature protection module 400 includes a thermistor 401, a second resistor 402 and a third transistor 403. In this creation, the thermistor 401 is a negative temperature coefficient thermistor, and the resistance value decreases with the increase of temperature, but the creation is not limited thereto, and other resistance values vary with temperature. The resistance. One of the first ends of the thermistor 401 is connected to a power source. The second resistor 402 is grounded at one end and connected to the second end of one of the thermistors 401 at the other end. In the present example, the third transistor 403 is an N-channel field effect transistor, but the creation is not limited thereto. The source of the third transistor 403 is grounded, the gate is connected to the second end of the thermistor 401, and the drain is connected to the input end of the voltage source module 100. As the temperature of the board heating circuit 200 gradually rises When the resistance of the thermistor 401 is reduced to a rated value, the third transistor 403 is turned on, that is, the voltage source module 100 receives a stop signal, and the voltage is high. The source module 100 then ceases to operate, and the board heating circuit 200 also stops heating. Thus, the over temperature protection module 400 can protect the components to be heated from exceeding the normal operating temperature.

FIG. 3 is a circuit diagram of a voltage source module 100 according to a preferred embodiment of the present invention. The voltage source module 100 is a step-down synchronous converter. When the voltage source module 100 receives the turn-on signal of the logic control circuit 300, the voltage source module 100 starts to work, and the voltage source module 100 receives the temperature protection. When the module 400 stops transmitting signals, the voltage source module 100 stops operating. The voltage source module 100 steps down the voltage to be applied (such as PS_12V shown in the third figure), and then outputs a voltage at the output terminal for the circuit board heating circuit 200 to operate. The magnitude of the voltage outputted from the output of the voltage source module 100 can be changed according to the actual demand of the board heating circuit 200, such as according to the resistance value of the board heating circuit 200, the heating temperature, and the like.

In conclusion, although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this new type is subject to the definition of the scope of the patent application.

1‧‧‧heating circuit

100‧‧‧Voltage source module

200‧‧‧Board heating circuit

300‧‧‧Logic Control Circuit

400‧‧‧Over temperature protection module

500‧‧‧ components

600‧‧‧Cooling module

301‧‧‧First transistor

302‧‧‧Second transistor

303‧‧‧First resistance

401‧‧‧Thermistor

402‧‧‧second resistance

403‧‧‧ Third transistor

Claims (7)

A heating circuit includes: a voltage source module for outputting a voltage; a circuit board heating circuit connected to the voltage source module, and receiving the voltage output by the voltage source module; and an over temperature protection mode The group is connected to the voltage source module, wherein when the temperature exceeds a predetermined value, the over temperature protection module outputs a stop signal to the voltage source module to disable the voltage source module. The heating circuit of claim 1, wherein the circuit board heating circuit is disposed in a printed circuit manner. The heating circuit of claim 1, wherein a logic control circuit is further provided for controlling the voltage source module. The heating circuit of claim 3, further comprising a cooling module, wherein when the cooling module starts to work, a high level signal is output to the logic control circuit, and the logic control circuit is The high level signal outputs a working signal to the voltage source module. The heating circuit of claim 3, wherein the logic control circuit comprises: a first transistor coupled to the cooling module; a second transistor coupled to the first transistor; And a first resistor coupled to the first transistor and the second transistor. The heating circuit of claim 1, wherein the over temperature protection The protection module includes: a thermistor coupled to a power source; a second resistor coupled to the thermistor; and a third transistor coupled to the thermistor and the voltage source module . The heating circuit of claim 6, wherein the thermistor is a negative temperature coefficient thermistor.