TWM485516U - LED frame structure - Google Patents

LED frame structure Download PDF

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Publication number
TWM485516U
TWM485516U TW103207956U TW103207956U TWM485516U TW M485516 U TWM485516 U TW M485516U TW 103207956 U TW103207956 U TW 103207956U TW 103207956 U TW103207956 U TW 103207956U TW M485516 U TWM485516 U TW M485516U
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TW
Taiwan
Prior art keywords
bracket
brackets
insulating layer
connecting strip
emitting diode
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TW103207956U
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Chinese (zh)
Inventor
zhen-you Liang
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Ttop Corp
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Priority to TW103207956U priority Critical patent/TWM485516U/en
Publication of TWM485516U publication Critical patent/TWM485516U/en

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Description

發光二極體支架結構Light-emitting diode support structure

本創作係有關於一種「發光二極體支架結構」,尤指一種材料使用率高,測試效率佳,不容易脫落掉粒,且能避免產生有粉塵、細屑的發光二極體支架結構者。This creation is about a kind of "light-emitting diode support structure", especially a light-emitting diode support structure with high material usage rate, good test efficiency, not easy to fall off particles, and avoiding dust and fine particles. .

按,目前一種習知發光二極體支架結構,多如第五圖所示,其主要是在一金屬基板(40)上沖壓成型有數排之支架組(41),每一排之支架組(41)並由複數個支架(42)構成,又金屬基板(40)是以一至數個連接段(43)與每個支架(42)進行連結,該連接段(43)是沖壓後之餘料,在每一支架(42)外方則注膠包覆有一絕緣層(44)。According to the conventional light-emitting diode support structure, as shown in FIG. 5, the main assembly is a plurality of rows of bracket sets (41) on a metal substrate (40), and each row of bracket sets ( 41) and consisting of a plurality of brackets (42), and the metal substrate (40) is connected to each bracket (42) by one to several connecting sections (43), and the connecting section (43) is a residual material after stamping An insulating layer (44) is coated on the outside of each bracket (42).

然,如上所述之習知結構於實際應用中仍存在有下述之問題點:其每一支架(42)是以一至數個連接段(43)與金屬基板(40)產生連結,當在封裝後,若要在金屬基板(40)上直接對所有支架(42)進行一次性之片測,係會因為各支架(42)均相導通而造成短路,該相對無法執行,而必需在封裝後將每一支架(42)單獨拆下來檢測,使得測試的效率不佳,且拆下之過程係以剪切方式進行,易造成支架(42)腳位拉扯斷線,該將會導致不佳之良率者。However, the conventional structure as described above still has the following problems in practical applications: each bracket (42) is connected to the metal substrate (40) by one to several connecting segments (43), when After the package, if all the brackets (42) are directly tested on the metal substrate (40), the short circuit is caused by the parallel conduction of the brackets (42), which is relatively impossible to perform, and must be packaged. After each bracket (42) is separately removed and tested, the efficiency of the test is not good, and the process of removing is performed in a shearing manner, which easily causes the bracket (42) to be pulled and broken, which will result in poor performance. Yield rate.

又,目前另一種習知發光二極體支架結構,多如第六圖所示,其主要是在一金屬基板(50)上沖壓成型有數排之支架組(51),每一排之支架組(51)並由複數個支架(52)構成,又金屬基板(50)是在每個支架(52)間形成有與支架(52)相斷開的連接板(53),該連接板(53)是沖壓後之餘料,在每一支架(52)外方則注膠包覆有一絕緣層(54),以該絕緣層(54)涵蓋至連接板(53)側端,係令各支架(52)能以連接板(53)略插嵌入絕緣層(54),而產生連結者。Moreover, another conventional light-emitting diode support structure, as shown in the sixth figure, is mainly formed by stamping a plurality of rows of bracket groups (51) on a metal substrate (50), and each row of the bracket group (51) and consisting of a plurality of brackets (52), and a metal substrate (50) is formed between each bracket (52) with a connecting plate (53) disconnected from the bracket (52), the connecting plate (53) ) is the remaining material after stamping, and an insulating layer (54) is coated on the outside of each bracket (52), and the insulating layer (54) covers the side end of the connecting plate (53), and the brackets are arranged. (52) The insulating layer (54) can be slightly inserted into the connecting plate (53) to produce a connector.

然,如上所述之習知結構於實際應用中仍存在有下述之問題點:(一)其利用連接板(53)略插嵌入支架(52)的絕緣層(54),以將各支架(52)連結,雖令各支架(52)能在金屬基板(50)上完成一次性之片測,但因為連接板(53)的設置會大幅降低單位面積中支架(52)的數量,而令該結構有材料使用率不佳之顧慮者;(二)連接板(53)插嵌入支架(52)之絕緣層(54)不足者易造成製程中支架(52)與連接板(53)脫離而掉落(掉粒)之不良者;(三)其利用連接板(53)略插嵌入支架(52)的絕緣層(54),會在支架(52)從金屬基板(50)上折下的過程,以連接板(53)順勢對絕緣層(54)產生刮落,並形成粉塵(60)覆蓋在已封裝好的發光二極體上(如第七圖所示),該將會嚴重影響其製成後之良率者。However, the conventional structure as described above still has the following problems in practical applications: (1) it is slightly inserted into the insulating layer (54) of the bracket (52) by using the connecting plate (53) to mount the brackets. (52) The connection allows the brackets (52) to perform a one-time measurement on the metal substrate (50), but since the connection of the connecting plates (53) greatly reduces the number of brackets (52) per unit area, The structure has the concern that the material usage rate is not good; (2) the insulating layer (54) of the connecting plate (53) inserted into the bracket (52) is insufficient to cause the bracket (52) and the connecting plate (53) to be separated from the process. (3) The insulating layer (54) embedded in the bracket (52) is slightly inserted by the connecting plate (53), and the bracket (52) is folded from the metal substrate (50). The process of scraping off the insulating layer (54) with the connecting plate (53) and forming dust (60) over the packaged LED (as shown in the seventh figure), which will seriously affect The yield after it is made.

是以,如何針對上述二種習知結構所存在之缺點進行研發改良,實為相關業界所需努力研發之目標,本創作人有鑑於此,乃思及創作的意念,遂以多年的經驗加以設計,經多方探討並試作樣品試驗,及多次修正改良,乃推出本創作。Therefore, how to develop and improve the shortcomings of the above two conventional structures is really the goal of the relevant industry to develop and research. The creator has the idea of thinking and creation, and has years of experience. The design, the multi-party discussion and trial sample test, and many corrections and improvements, is the launch of this creation.

習知一種發光二極體支架結構封裝、測試的效率不佳,及支架拆下過程中拉扯嚴重產生不良品,另一種則會在金屬基板與支架分離之過程產生粉塵,材料使用效率不佳也會導致成本增加,此乃欲解決之技術問題點者。It is known that a light-emitting diode support structure is packaged and tested, and the efficiency of the test is poor, and the pull of the support is seriously caused by the pull-off process, and the other is that the dust is generated during the process of separating the metal substrate from the support, and the material use efficiency is also poor. This will lead to an increase in costs, which is the technical problem to be solved.

本創作提供一種發光二極體支架結構,其主要是在一金屬基板上沖壓成型有數排之支架組,每一排之支架組並由複數個支架構成,又金屬基板是在每個支架間形成有與支架相斷開的連接條,該連接條是沖壓後之餘料,連接條在與二相鄰支架的對正處各設有一溝槽,溝槽內則設有貫穿過的至少一異形孔,當每一支架在其外方注膠包覆有一絕緣層時,該溢注的絕緣層膠料係會透過溝槽的製設分別以一絕緣膠條與至少一異形柱填滿在該連接條的溝槽與異形孔中,俾利用絕緣膠條的跨接,讓二相鄰支架能產生連結,藉此,俾以得到一種發光二極體支架結構者。The present invention provides a light-emitting diode support structure, which is mainly formed by stamping and forming a plurality of rows of bracket groups on a metal substrate, the support group of each row is composed of a plurality of brackets, and the metal substrate is formed between each bracket. The connecting strip is disconnected from the bracket, and the connecting strip is the residual material after the stamping, the connecting strip is provided with a groove at the alignment with the two adjacent brackets, and the groove is provided with at least one shaped shape penetrating through a hole, when each of the brackets is coated with an insulating layer on the outer side, the overflow insulating layer is filled with an insulating strip and at least one shaped post through the groove In the groove of the connecting strip and the special-shaped hole, the bridging of the insulating strip can be used to connect the two adjacent brackets, thereby obtaining a light-emitting diode support structure.

(一)本創作提供發光二極體支架結構,其連接條未過度擴張,以插嵌入支架的絕緣層中,讓該結構不虞因為連接條的設置就大幅降低單位面積中支架的數量,其相對沒有材料使用率不佳之問題者。(1) The creation provides a light-emitting diode support structure in which the connecting strip is not over-expanded to be inserted into the insulating layer of the bracket, so that the structure is not reduced because the number of brackets in the unit area is greatly reduced due to the setting of the connecting strip, and the relative There are no problems with poor material usage.

(二)本創作提供發光二極體支架結構,其利用絕緣膠條的跨接,將各支架連結,係令各支架能在金屬基板上完成一次性之片測,讓封裝、測試的效率能再獲得提昇者。(2) The creation provides a light-emitting diode support structure, which uses a jumper of insulating rubber strips to connect the brackets, so that each bracket can complete a one-time film measurement on the metal substrate, so that the efficiency of packaging and testing can be Then get the upgrader.

(三)本創作提供發光二極體支架結構,其連接條未插嵌入絕緣層,所以不會在支架折下時對絕緣層產生刮落,配合絕緣膠條、異形柱填滿於溝槽、異形孔之固結,係能有效杜絕粉塵之發生,讓製成後的成品能維持一定之良率者。(3) The creation provides a light-emitting diode support structure, and the connecting strip is not inserted into the insulating layer, so the insulating layer is not scraped off when the bracket is folded down, and the insulating strip and the special-shaped column are filled in the groove, The consolidation of the special-shaped holes can effectively prevent the occurrence of dust and allow the finished product to maintain a certain yield.

(四)本創作提供發光二極體支架結構,其利用絕緣膠條的跨接,將各支架連結,可避免在製程中發生掉粒之問題者。(4) The creation provides a light-emitting diode support structure, which uses the spanning of the insulating rubber strips to connect the brackets, thereby avoiding the problem of particles falling during the process.

(五)本創作提供發光二極體支架結構,其支架與金屬基板封裝後可以直接剝離,沒有金屬連接段剪切、拉扯支架而至不良之情形者。(5) The creation provides a light-emitting diode support structure, and the bracket and the metal substrate can be directly peeled off after being packaged, and there is no metal connection section to cut or pull the bracket to be in a bad situation.

本創作部份:This creative part:

(10)‧‧‧金屬基板(10)‧‧‧Metal substrates

(20)‧‧‧支架組(20)‧‧‧ bracket group

(21)‧‧‧支架(21) ‧‧‧ bracket

(22)‧‧‧連接條(22)‧‧‧Connecting strips

(23)‧‧‧溝槽(23) ‧‧‧ trench

(24)‧‧‧異形孔(24)‧‧‧ Shaped holes

(30)‧‧‧絕緣層(30)‧‧‧Insulation

(31)‧‧‧絕緣膠條(31)‧‧‧Insulating strips

(32)‧‧‧異形柱(32)‧‧‧Special shaped columns

習知部份:Conventional part:

(40)‧‧‧金屬基板(40)‧‧‧Metal substrates

(41)‧‧‧支架組(41)‧‧‧ bracket group

(42)‧‧‧支架(42) ‧‧‧ bracket

(43)‧‧‧連接段(43) ‧‧‧ Connection section

(44)‧‧‧絕緣層(44)‧‧‧Insulation

(50)‧‧‧金屬基板(50)‧‧‧Metal substrates

(51)‧‧‧支架組(51)‧‧‧ bracket group

(52)‧‧‧支架(52) ‧‧‧ bracket

(53)‧‧‧連接板(53)‧‧‧Connecting plate

(54)‧‧‧絕緣層(54)‧‧‧Insulation

(60)‧‧‧粉塵(60)‧‧‧dust

第一圖:係本創作之立體圖。The first picture: a perspective view of the creation.

第二圖:係本創作之平面圖。The second picture: the plan of the creation.

第三圖:係本創作之剖面圖。The third picture: a sectional view of the creation.

第四圖:係本創作支架從金屬基板上折離之狀態圖。The fourth picture is a state diagram of the creation bracket being folded away from the metal substrate.

第五圖:係一種習知結構之平面圖。Figure 5: A plan view of a conventional structure.

第六圖:係另一種習知結構之平面圖。Figure 6: A plan view of another conventional structure.

第七圖:係另一種習知結構粉塵產生的狀態示意圖。Figure 7: Schematic diagram of the state of dust produced by another conventional structure.

為使 貴審查委員對本創作之目的、特徵及功效能夠有更進一步之瞭解與認識,以下茲請配合【圖式簡單說明】列舉實施例,詳述說明如后:首先,請由第一圖至第三圖所示觀之,其主要是在一金屬基板(10)上沖壓成型有數排之支架組(20),每一排之支架組(20)並由複數個支架(21)構成,又金屬基板(10)是在每個支架(21)間形成有與支架(21)相斷開的連接條(22),該連接條(22)是沖壓後之餘料,連接條(22)在與二相鄰支架(21)的對正處各設有一溝槽(23),溝槽(23)內則設有貫穿過的至少一異形孔(24),當每一支架(21)在其外方注膠包覆有一絕緣層(30)時,該溢注的絕緣層(30)膠料係會透過溝槽(23)的製設分別以一絕緣膠條(31)與至少一異形柱(32)填滿在該連接條(22)的溝槽(23)與異形孔(24)中,俾利用絕緣膠條(31)的跨接,讓二相鄰支架(21)能產生連結者。In order to enable your review committee to have a better understanding and understanding of the purpose, characteristics and efficacy of this creation, please refer to the following figure for a brief description of the example. The detailed description is as follows: First, please go to the first picture to As shown in the third figure, it is mainly formed by stamping a plurality of rows of bracket groups (20) on a metal substrate (10), and each row of bracket groups (20) is composed of a plurality of brackets (21), and The metal substrate (10) is formed with a connecting strip (22) which is disconnected from the bracket (21) between each bracket (21), the connecting strip (22) is a residual material after stamping, and the connecting strip (22) is A groove (23) is disposed in each of the alignments of the two adjacent brackets (21), and at least one shaped hole (24) is formed in the groove (23), and each bracket (21) is in the same When the outer glue is coated with an insulating layer (30), the overflow insulating layer (30) is passed through the groove (23) to form an insulating strip (31) and at least one shaped column. (32) Filling the groove (23) and the special-shaped hole (24) of the connecting strip (22), and using the spanning of the insulating strip (31), the two adjacent brackets (21) can be connected to each other. .

本創作提供一種發光二極體支架結構,其中,異形孔(24)與異形柱(32)是設呈圓形等幾何形狀的配合者。The present invention provides a light-emitting diode support structure in which a shaped hole (24) and a shaped column (32) are matched with a geometric shape such as a circle.

藉上述具體實施例之結構,可得到下述之效益:(一)其連接條(22)未過度擴張,以插嵌入支架(21)的絕緣層(30)中,讓該結構不虞因為連接條(22)的設置就大幅降低單位面積中支架(21)的數量,其相對沒有材料使用率不佳之問題者;(二)其利用絕緣膠條(31)的跨接,將各支架(21)連結,係令各支架(21)能在金屬基板(10)上完成一次性之片測,讓封裝、測試的效率 能再獲得提昇者;(三)其連接條(22)未插嵌入絕緣層(30),所以不會在支架(21)折下時對絕緣層(30)產生刮落(請同時由第四圖所示觀之),配合絕緣膠條(31)、異形柱(32)填滿於溝槽(23)、異形孔(24)之固結,係能有效杜絕粉塵之發生,讓製成後的成品能維持一定之良率者;(四)其利用絕緣膠條(31)的跨接,將各支架(21)連結,可避免在製程中發生掉粒之問題者;(五)其支架(21)與金屬基板(10)封裝後可以直接剝離,沒有金屬連接段剪切、拉扯支架(21)而至不良之情形者。With the structure of the above specific embodiment, the following benefits can be obtained: (1) the connecting strip (22) is not over-expanded to be inserted into the insulating layer (30) of the bracket (21), so that the structure is not damaged because of the connecting strip The setting of (22) greatly reduces the number of brackets (21) per unit area, which is relatively inferior to the problem of poor material usage rate; (2) it uses the span of insulating strips (31) to connect the brackets (21) The connection enables each bracket (21) to perform a one-time measurement on the metal substrate (10), so that the efficiency of packaging and testing (3) The connecting strip (22) is not inserted into the insulating layer (30), so the insulating layer (30) will not be scraped off when the bracket (21) is folded down (please also be the fourth As shown in the figure, the insulating strip (31) and the special-shaped column (32) are filled in the groove (23) and the shaped hole (24) is consolidated, which can effectively prevent the occurrence of dust and make it The finished product can maintain a certain yield; (4) it uses the span of the insulating strip (31) to connect the brackets (21) to avoid the problem of falling particles in the process; (5) the bracket (21) It can be directly peeled off after being packaged with the metal substrate (10), and there is no case where the metal connecting portion is sheared or the bracket (21) is pulled to be defective.

綜上所述,本創作確實已達突破性之結構設計,而具有改良之創作內容,同時又能夠達到產業上之利用性與進步性,且本創作未見於任何刊物,亦具新穎性,當符合專利法相關法條之規定,爰依法提出新型專利申請,懇請 鈞局審查委員授予合法專利權,至為感禱。In summary, this creation has indeed achieved a breakthrough structural design, with improved creative content, while at the same time achieving industrial use and progress, and this creation has not been seen in any publication, but also novel, when In accordance with the provisions of the relevant laws and regulations of the Patent Law, a new type of patent application is filed according to law, and the examination authority of the bureau is required to grant legal patent rights.

唯以上所述者,僅為本創作之一較佳實施例而已,當不能以之限定本創作實施之範圍;即大凡依本創作申請專利範圍所作之均等變化與修飾,皆應仍屬本創作專利涵蓋之範圍內。Only the above-mentioned ones are only preferred embodiments of the present invention, and the scope of the implementation of the creation cannot be limited by them; that is, the equal changes and modifications made by the applicants in accordance with the scope of the patent application for this creation should still belong to the creation. Within the scope of the patent.

(10)‧‧‧金屬基板(10)‧‧‧Metal substrates

(20)‧‧‧支架組(20)‧‧‧ bracket group

(21)‧‧‧支架(21) ‧‧‧ bracket

(22)‧‧‧連接條(22)‧‧‧Connecting strips

(24)‧‧‧異形孔(24)‧‧‧ Shaped holes

(30)‧‧‧絕緣層(30)‧‧‧Insulation

(32)‧‧‧異形柱(32)‧‧‧Special shaped columns

Claims (4)

一種發光二極體支架結構,其主要是在一金屬基板上沖壓成型有數排之支架組,每一排之支架組並由複數個支架構成,其特徵在於:金屬基板是在每個支架間形成有與支架相斷開的連接條,該連接條在與二相鄰支架的對正處各設有一溝槽,當每一支架在其外方注膠包覆有一絕緣層時,該溢注的絕緣層膠料係會透過溝槽的製設以一絕緣膠條填滿在該連接條的溝槽中,俾利用絕緣膠條的跨接,讓二相鄰支架能產生連結者。A light-emitting diode support structure is mainly formed by stamping and forming a plurality of rows of bracket groups on a metal substrate, and each row of the bracket group is composed of a plurality of brackets, wherein the metal substrate is formed between each bracket a connecting strip disconnected from the bracket, the connecting strip is provided with a groove at a position opposite to the two adjacent brackets, and when each bracket is coated with an insulating layer on the outer side thereof, the overflowing The insulating layer is filled in the groove of the connecting strip by an insulating strip through the groove, and the connecting strip of the insulating strip is used to enable the two adjacent brackets to generate a joint. 如請求項1所述之發光二極體支架結構,其中,連接條是沖壓後之餘料者。The light-emitting diode support structure according to claim 1, wherein the connecting strip is a residual material after stamping. 如請求項1所述之發光二極體支架結構,其中,溝槽內設有貫穿過的至少一異形孔,當每一支架在其外方注膠包覆有一絕緣層時,該溢注的絕緣層膠料還會透過溝槽的製設以至少一異形柱填滿在該連接條的異形孔中者。The light-emitting diode support structure according to claim 1, wherein the groove is provided with at least one shaped hole penetrating through, and when each of the brackets is coated with an insulating layer on the outer side thereof, the overflow is The insulating layer compound is also filled through the grooves to fill at least one shaped post in the shaped holes of the connecting strip. 如請求項3所述之發光二極體支架結構,其中,異形孔與異形柱是設呈幾何形狀的配合者。The light-emitting diode support structure according to claim 3, wherein the shaped hole and the shaped column are geometrically matched.
TW103207956U 2014-05-07 2014-05-07 LED frame structure TWM485516U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI819060B (en) * 2018-12-03 2023-10-21 南韓商愛思開海力士有限公司 Semiconductor packages
TWI821361B (en) * 2018-12-04 2023-11-11 南韓商愛思開海力士有限公司 Semiconductor packages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI819060B (en) * 2018-12-03 2023-10-21 南韓商愛思開海力士有限公司 Semiconductor packages
TWI821361B (en) * 2018-12-04 2023-11-11 南韓商愛思開海力士有限公司 Semiconductor packages

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