TWM482848U - LED featuring improved picture granularity and arrangement structure thereof - Google Patents

LED featuring improved picture granularity and arrangement structure thereof Download PDF

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Publication number
TWM482848U
TWM482848U TW103201040U TW103201040U TWM482848U TW M482848 U TWM482848 U TW M482848U TW 103201040 U TW103201040 U TW 103201040U TW 103201040 U TW103201040 U TW 103201040U TW M482848 U TWM482848 U TW M482848U
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TW
Taiwan
Prior art keywords
light
emitting diodes
arrangement structure
fineness
improving
Prior art date
Application number
TW103201040U
Other languages
Chinese (zh)
Inventor
Shih-Chieh Lin
Li-Min Chen
Yung-Chieh Chen
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I Chiun Precision Ind Co Ltd
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Application filed by I Chiun Precision Ind Co Ltd filed Critical I Chiun Precision Ind Co Ltd
Priority to TW103201040U priority Critical patent/TWM482848U/en
Publication of TWM482848U publication Critical patent/TWM482848U/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

可提升畫面細緻度之發光二極體及其排列結構 Light-emitting diode and its arrangement structure capable of improving picture detail

本創作係指一種應用於顯示屏中，可使其排列更加密集以提高畫面細緻度之發光二極體。 This creation refers to a light-emitting diode that is applied to a display screen to make it more densely arranged to improve the fineness of the image.

如第一圖及第二圖，係為一習用發光二極體之示意圖及該些發光二極體之排列結構示意圖。如圖所示，目前應用在於LED顯示屏(LED TV)上之發光二極體，其該發光二極體A之總長度i係為3.5mm，總寬度j係為2.8mm。 The first figure and the second figure are schematic diagrams of a conventional light-emitting diode and an arrangement structure of the light-emitting diodes. As shown in the figure, the current application is a light-emitting diode on an LED display screen, the total length i of the light-emitting diode A is 3.5 mm, and the total width j is 2.8 mm.

當該些發光二極體A欲排列於一電路板B上時，為了將使發光二極體A確實的接著於電路板B上，因此，在電路板B上會依照所欲排列之結構，先預留有複數固定區C，其每一固定區C上皆塗佈有一接著劑(接著劑係為錫膏，為一般習知技藝，圖式中未表示)，使其發光二極體A得以透過接著劑而固定在電路板B之固定區C上，並透過接著劑與電路板B產生電性連結。 When the light-emitting diodes A are to be arranged on a circuit board B, in order to ensure that the light-emitting diodes A are reliably connected to the circuit board B, the circuit board B is arranged according to the desired structure. First, a plurality of fixed areas C are reserved, and each of the fixed areas C is coated with an adhesive (the adhesive is a solder paste, which is a conventional technique, not shown in the drawings), so that the light-emitting diode A is It is fixed to the fixed area C of the circuit board B through the adhesive, and is electrically connected to the circuit board B through the adhesive.

惟，在電路板B上，為避免造成每一發光二極體A之短路，故每一固定區C間皆必須相互間隔，且當發光二極體A利用接著劑固定於每一固定區C上時，由於該些接著劑係呈液態狀，當發光二極體A置放於該些接著劑上時，該些接著劑會往固定區C之四周圍擴散，因此，每一固定區C間之間距不能太過靠近，才不會因為接著劑的擴散，而造成發光二極體A短路之現象。 However, on the circuit board B, in order to avoid short circuit of each of the light-emitting diodes A, each fixed area C must be spaced apart from each other, and when the light-emitting diode A is fixed to each fixed area C by an adhesive. In the above, since the adhesives are in a liquid state, when the light-emitting diodes A are placed on the adhesives, the adhesives will spread around the four of the fixed regions C, and therefore, each fixed region C The distance between the two should not be too close, so that the phenomenon that the light-emitting diode A is short-circuited due to the diffusion of the adhesive is not caused.

除此之外，由於每一發光二極體之A總長度i為3.5mm，總寬度j為2.8mm，再加上每一固定區C之間距， 致使每一發光二極體A固定於電路板B上時，造成每一發光二極體B之中心產生大約8mm之間距k，使每一發光二極體A之間距過遠。 In addition, since the total length i of each of the light-emitting diodes is 3.5 mm, the total width j is 2.8 mm, plus the distance between each fixed area C, When each of the light-emitting diodes A is fixed on the circuit board B, the center of each of the light-emitting diodes B is generated by a distance of about 8 mm, so that the distance between each of the light-emitting diodes A is too far.

因此，當發光二極體A運作產生光線時，所產生之光線角度過大，進而降低了畫面之細緻度，產生人眼在近距離目視LED顯示屏時無法得到一個較佳清晰之畫面。 Therefore, when the light-emitting diode A operates to generate light, the angle of the generated light is too large, thereby reducing the fineness of the picture, and the human eye cannot obtain a better and clear picture when viewing the LED display at a close distance.

本創作之主要目的，在於提供一種可使發光二極體排列的更加密集，進而提高畫面細緻度之發光二極體。 The main purpose of the present invention is to provide a light-emitting diode which can densely align the light-emitting diodes and thereby improve the fineness of the screen.

為達到上述之功效及目的，本創作之技術特徵在於包括有：一塑膠本體，其具有一上端面，該上端面上具有下凹之一功能區，該功能區側壁形成有一反射面，該反射面與功能區之軸心形成有一反射角；以及四個接腳，該些接腳之一部分延伸至該塑膠本體之功能區中形成固晶部，一部分延伸至該塑膠本體外側形成導電部。 In order to achieve the above-mentioned effects and purposes, the technical feature of the present invention includes: a plastic body having an upper end surface having a concave functional area on the side surface, the functional side wall forming a reflecting surface, the reflection The surface and the axis of the functional area form a reflection angle; and four pins, one of the pins extends to form a solid crystal portion in the functional area of the plastic body, and a portion extends to the outside of the plastic body to form a conductive portion.

據以，透過該塑膠本體與四個接腳組構成一發光二極體，使該發光二極體之總長度介於1.9~2.6mm、總寬度介於1.9~2.6mm，使其每一發光二極體排列於一電路板上時，每一發光二極體之中心間距介於2.5mm~5mm間，進而提高畫面之細緻度。 Accordingly, a light emitting diode is formed through the plastic body and the four pin groups, so that the total length of the light emitting diode is between 1.9 and 2.6 mm, and the total width is between 1.9 and 2.6 mm, so that each of the light emitting When the diodes are arranged on a circuit board, the center distance of each of the light-emitting diodes is between 2.5 mm and 5 mm, thereby improving the fineness of the picture.

先前技術元件符號說明 Prior art symbol description

A‧‧‧發光二極體 A‧‧‧Light Emitting Diode

B‧‧‧電路板 B‧‧‧Board

C‧‧‧固定區 C‧‧‧fixed area

i‧‧‧總長度 I‧‧‧ total length

j‧‧‧總寬度 J‧‧‧ total width

k‧‧‧間距 K‧‧‧ spacing

本創作元件符號說明 Symbol of this creative component

10‧‧‧發光二極體 10‧‧‧Lighting diode

20‧‧‧塑膠本體 20‧‧‧Plastic body

21‧‧‧上端面 21‧‧‧ upper end

22‧‧‧功能區 22‧‧‧ functional area

23‧‧‧反射面 23‧‧‧reflecting surface

24‧‧‧軸心 24‧‧‧Axis

30‧‧‧接腳 30‧‧‧ pins

31‧‧‧固晶部 31‧‧‧ Solid Crystal Division

32‧‧‧導電部 32‧‧‧Electrical Department

40‧‧‧電路板 40‧‧‧ boards

41‧‧‧固定區 41‧‧‧fixed area

θ‧‧‧反射角 Θ‧‧‧reflection angle

L‧‧‧總長度 L‧‧‧ total length

W‧‧‧總寬度 W‧‧‧ total width

D‧‧‧間距 D‧‧‧ spacing

第一圖為習知發光二極體之平面示意圖。 The first figure is a schematic plan view of a conventional light-emitting diode.

第二圖為習知發光二極體排列結構之示意圖。 The second figure is a schematic diagram of a conventional arrangement of light emitting diodes.

第三圖為本創作發光二極體之平面示意圖。 The third picture is a schematic plan view of the created light-emitting diode.

第四圖為本創作發光二極體之剖視圖。 The fourth figure is a cross-sectional view of the creative light-emitting diode.

第五圖為本創作發光二極體排列於電路板上之示意圖。 The fifth figure is a schematic view of the light-emitting diodes arranged on the circuit board.

以下將配合圖式及實施例來詳細說明本創作之實施方式，藉此對本創作如何應用技術手段來解決技術問題並達成技術功效的實現過程能充分理解並據以實施。 The embodiments of the present invention will be described in detail below with reference to the drawings and the embodiments, so that the implementation process of how to apply the technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented.

如第三圖及第四圖所示，係為本創作發光二極體之平面及側面示意圖。如圖所示，本創作之發光二極體10係包含有一塑膠本體20以及四個接腳30。其中：塑膠本體20，其具有一上端面21，上端面21上具有下凹之一功能區22，功能區22側壁形成有一反射面23，反射面23與功能區22之軸心24形成有一反射角θ，該反射角θ介於30~60度，在本實施例中之最佳反射角θ為30度。 As shown in the third and fourth figures, it is a schematic view of the plane and side of the created light-emitting diode. As shown in the figure, the light-emitting diode 10 of the present invention comprises a plastic body 20 and four pins 30. The plastic body 20 has an upper end surface 21, and the upper end surface 21 has a concave functional area 22, and a side surface of the functional area 22 is formed with a reflecting surface 23, and the reflecting surface 23 and the axis 24 of the functional area 22 form a reflection. The angle θ is between 30 and 60 degrees, and the optimum reflection angle θ in the present embodiment is 30 degrees.

四個接腳30，該些接腳30之一部分延伸至塑膠本體10之功能區22中形成固晶部31，一部分延伸至塑膠本體10外側形成導電部32。 Four pins 30 extend from one of the pins 30 to the functional region 22 of the plastic body 10 to form a solid portion 31, and a portion extends to the outside of the plastic body 10 to form a conductive portion 32.

據以，透過塑膠本體20與四個接腳30組構成一發光二極體10，使該發光二極體10之總長度L介於1.9~2.6mm間、總寬度W介於1.9~2.6mm，在本實施例中，最佳總長度L為2.0mm、最佳總寬度W為2.0mm。 Accordingly, a light-emitting diode 10 is formed through the plastic body 20 and the four pins 30, so that the total length L of the light-emitting diode 10 is between 1.9 and 2.6 mm, and the total width W is between 1.9 and 2.6 mm. In the present embodiment, the optimum total length L is 2.0 mm, and the optimum total width W is 2.0 mm.

請參閱第五圖所示，係為本創作發光二極體排列於電路板上之示意圖。如圖所示，係將三個發光二極體10固定在於一電路板40上，且每一發光光二極體10係以相鄰結構排列在電路板40上，其電路板40上係依照發光二極體10與排列之位置預先設有三個固定區41，使其每一發光二極體10得以透過一接著劑(錫膏)而固定於電路板40之固定區41上。 Please refer to the fifth figure, which is a schematic diagram of the light-emitting diodes arranged on the circuit board. As shown in the figure, the three light-emitting diodes 10 are fixed on a circuit board 40, and each of the light-emitting diodes 10 is arranged on the circuit board 40 in an adjacent structure, and the circuit board 40 is illuminated according to the light. The position of the diode 10 and the arrangement are previously provided with three fixing regions 41, so that each of the light-emitting diodes 10 is fixed to the fixing portion 41 of the circuit board 40 through an adhesive (solder paste).

由於每一發光二極體10之總長度L介於1.9~2.6mm間、總寬度W介於1.9~2.6mm間，因此電路板10上之固定區11則無須預留太大之空間，如此亦可縮短各固定區41之間距；而當每一發光二極體10固定於電路板40之固定區41上時，由於每一發光二極體10之體積較小(本實施例中，發光二極體之總長度L為2.0mm、總寬度W為2.0mm)，使其固定在電路板40上之每一發光二極體10之中心間距D介於2.5mm~5mm，其最佳間距D為4mm，如此，不但能縮短每一發光二極體10間之間距D，各能使每一發光二極體所釋放出之光線角度不致過大，進而提高了畫面之係制度。 Since the total length L of each of the light-emitting diodes 10 is between 1.9 and 2.6 mm and the total width W is between 1.9 and 2.6 mm, the fixed area 11 on the circuit board 10 does not need to reserve too much space. The distance between the fixed regions 41 can also be shortened. When each of the light-emitting diodes 10 is fixed on the fixed region 41 of the circuit board 40, the volume of each of the light-emitting diodes 10 is small (in this embodiment, the light is emitted). The total length L of the diode is 2.0 mm and the total width W is 2.0 mm), so that the center-to-center distance D of each of the light-emitting diodes 10 fixed on the circuit board 40 is between 2.5 mm and 5 mm, and the optimum pitch is D is 4 mm, so that not only the distance D between each of the light-emitting diodes 10 can be shortened, but also the angle of the light emitted by each of the light-emitting diodes is not excessively large, thereby improving the system of the picture.

與習用之發光二極體相較，本創作之發光二極體具有下列優點： Compared with the conventional light-emitting diodes, the light-emitting diode of the present invention has the following advantages:

1、體積小(總長度L介於1.9~2.6mm間、總寬度W介於1.9~2.6mm間)。 1. Small volume (the total length L is between 1.9 and 2.6 mm, and the total width W is between 1.9 and 2.6 mm).

2、排列間距小(每一發光二極體之中心間距介於2.5~5mm間)。 2. The arrangement pitch is small (the center distance of each light-emitting diode is between 2.5 and 5 mm).

3、發光二極體所釋放出之光線角度不致過大。 3. The angle of light emitted by the light-emitting diode is not too large.

4、可提升畫面細緻度。 4, can improve the detail of the picture.

5、於相同長度之電路板上，可以排列更多數量之發光二極體。 5. A larger number of light-emitting diodes can be arranged on a circuit board of the same length.

雖然本創作以前述之實施例揭露如上，然其並非用以限定本創作，任何熟習相像技藝者，在不脫離本創作之精神和範圍內，當可作些許之更動與潤飾，因此本創作之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the present invention is disclosed above in the foregoing embodiments, it is not intended to limit the present invention, and any skilled person skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of patent protection shall be subject to the definition of the scope of the patent application attached to this specification.

10‧‧‧發光二極體 10‧‧‧Lighting diode

40‧‧‧電路板 40‧‧‧ boards

41‧‧‧固定區 41‧‧‧fixed area

L‧‧‧總長度 L‧‧‧ total length

W‧‧‧總寬度 W‧‧‧ total width

D‧‧‧間距 D‧‧‧ spacing

Claims (10)

一種可提升畫面細緻度之發光二極體之排列結構，其包括有：一塑膠本體，其具有一上端面，該上端面上具有下凹之一功能區，該功能區側壁形成有一反射面，該反射面與功能區之軸心形成有一反射角；以及四個接腳，該些接腳之一部分延伸至該塑膠本體之功能區中形成固晶部，一部分延伸至該塑膠本體外側形成導電部；據以，組構成一發光二極體，使該發光二極體之總長度介於1.9~2.6mm、總寬度介於1.9~2.6mm。 An arrangement structure of a light-emitting diode for improving the fineness of a picture, comprising: a plastic body having an upper end surface, the upper end surface having a concave functional area, the side wall of the functional area forming a reflecting surface The reflective surface and the axis of the functional area form a reflection angle; and four pins, one of the pins extends to form a solid crystal portion in the functional area of the plastic body, and a portion extends to the outer side of the plastic body to form a conductive portion Accordingly, the group constitutes a light-emitting diode such that the total length of the light-emitting diode is between 1.9 and 2.6 mm and the total width is between 1.9 and 2.6 mm. 如申請專利範圍第1項所述之可提升畫面細緻度之發光二極體之排列結構，其中該發光二極體之最佳長度為2.0mm、最佳寬度為2.0mm。 The arrangement structure of the light-emitting diodes for improving the fineness of the picture according to the first aspect of the patent application, wherein the light-emitting diode has an optimum length of 2.0 mm and an optimum width of 2.0 mm. 如申請專利範圍第1項所述之可提升畫面細緻度之發光二極體之排列結構，其中每一發光二極體之中心最佳間距為4mm。 The arrangement structure of the light-emitting diodes for improving the fineness of the screen as described in the first aspect of the patent application, wherein the center of each of the light-emitting diodes has an optimum pitch of 4 mm. 如申請專利範圍第1項所述之可提升畫面細緻度之發光二極體之排列結構，其中該發光二極體之最佳長度為2.0mm、最佳寬度為2.0mm。 The arrangement structure of the light-emitting diodes for improving the fineness of the picture according to the first aspect of the patent application, wherein the light-emitting diode has an optimum length of 2.0 mm and an optimum width of 2.0 mm. 如申請專利範圍第1項所述之可提升畫面細緻度之發光二極體之排列結構，其中該反射面之反射角介於30~60度。 The arrangement structure of the light-emitting diodes for improving the fineness of the screen according to the first aspect of the patent application, wherein the reflection angle of the reflective surface is between 30 and 60 degrees. 如申請專利範圍第5項所述之可提升畫面細緻度之發光二 極體之排列結構，其中該反射面之最佳反射角為30度。 As shown in the fifth paragraph of the patent application, the brightness of the picture can be improved. The arrangement of the polar bodies, wherein the reflective surface has an optimum reflection angle of 30 degrees. 一種可提升畫面細緻度之發光二極體之排列結構，主要係將二個以上之發光二極體排列於一電路板上，其特徵在於：每一發光二極體係以相鄰結構排列，而每一發光二極體之總長度介於1.9~2.6mm、總寬度介於1.9~2.6mm，且每一發光二極體之中心間距介於2.5~5mm間。 An arrangement structure of light-emitting diodes capable of improving the fineness of a picture, mainly comprising arranging two or more light-emitting diodes on a circuit board, wherein each light-emitting diode system is arranged in an adjacent structure, and The total length of each of the light-emitting diodes is between 1.9 and 2.6 mm, the total width is between 1.9 and 2.6 mm, and the center-to-center spacing of each of the light-emitting diodes is between 2.5 and 5 mm. 如申請專利範圍第7項所述之可提升畫面細緻度之發光二極體之排列結構，其中每一發光二極體係包含有一塑膠本體，其具有一上端面，該上端面上具有下凹之一功能區，該功能區側壁形成有一反射面，該反射面與功能區之軸心形成有一反射角；以及四個接腳，該些接腳之一部分延伸至該塑膠本體之功能區中形成固晶部，一部分延伸至該塑膠本體外側形成導電部。 The arrangement structure of the light-emitting diodes for improving the fineness of the picture according to the seventh aspect of the patent application, wherein each of the light-emitting diode systems comprises a plastic body having an upper end surface, the upper end surface having a concave shape a functional area, the side wall of the functional area is formed with a reflecting surface, the reflecting surface forms a reflection angle with the axis of the functional area; and four pins, and one of the pins extends to the functional area of the plastic body to form a solid A portion of the crystal portion extends to the outside of the plastic body to form a conductive portion. 如申請專利範圍第8項所述之可提升畫面細緻度之發光二極體之排列結構，其中該反射面之反射角介於30~60度。 The arrangement structure of the light-emitting diodes capable of improving the fineness of the picture as described in claim 8 of the patent application, wherein the reflection angle of the reflective surface is between 30 and 60 degrees. 如申請專利範圍第9項所述之可提升畫面細緻度之發光二極體之排列結構，其中該反射面之最佳反射角為30度。 The arrangement structure of the light-emitting diodes capable of improving the fineness of the picture as described in claim 9 of the patent application, wherein the reflection angle of the reflective surface is 30 degrees.
TW103201040U 2010-03-26 2010-03-26 LED featuring improved picture granularity and arrangement structure thereof TWM482848U (en)

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