TWM481234U - Sandwich glass structure - Google Patents
Sandwich glass structure Download PDFInfo
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- TWM481234U TWM481234U TW103204772U TW103204772U TWM481234U TW M481234 U TWM481234 U TW M481234U TW 103204772 U TW103204772 U TW 103204772U TW 103204772 U TW103204772 U TW 103204772U TW M481234 U TWM481234 U TW M481234U
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- conductive film
- glass structure
- transparent conductive
- glued
- plastic film
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- 239000011521 glass Substances 0.000 title claims description 74
- 239000012790 adhesive layer Substances 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 22
- 239000002985 plastic film Substances 0.000 claims description 22
- 229920006255 plastic film Polymers 0.000 claims description 22
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000002861 polymer material Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- -1 polyethylene terephthalate Polymers 0.000 claims description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 7
- 238000004891 communication Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 239000005340 laminated glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 1
- 229920000144 PEDOT:PSS Polymers 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000005347 annealed glass Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010525 oxidative degradation reaction Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Joining Of Glass To Other Materials (AREA)
Description
本創作係有關一種玻璃，尤指一種以黏合層將導電膜黏合在二玻璃板間或單一玻璃板上，以提供信號傳遞及電熱轉換之用。 The present invention relates to a glass, in particular to an adhesive layer for bonding a conductive film between two glass plates or a single glass plate to provide signal transmission and electrothermal conversion.
習知的膠合玻璃結構是在兩層或更多層的普通退火玻璃之間設置材料為PVB((Polyvinyl Butyral)聚乙烯醇縮丁醛樹脂)的黏合層，然後加熱至攝氏70度左右，再以滾軸把夾層間的空氣壓出，讓黏合層(PVB)把兩層的玻璃板緊黏在一起。一般的膠合玻璃結構是以如兩層3mm的玻璃板，中間夾上0.38mm的夾層PVB膠，總厚度為6.38毫米。亦可以用更多層、更厚的玻璃板來增加強度。當膠合玻璃結構上的玻璃板被碎裂時，該黏合層仍然會把兩層玻璃板黏著，避免整塊玻璃板碎成可以傷人的碎片。因此已廣用於生活上，如居家用品門窗、桌椅飾品或運輸交通用，如車、船、飛機使用之玻璃。 The conventional glued glass structure is provided with an adhesive layer of PVB (Polyvinyl Butyral polyvinyl butyral resin) between two or more layers of ordinary annealed glass, and then heated to about 70 degrees Celsius, and then heated. The air between the interlayers is pressed out by a roller, and the adhesive layer (PVB) is used to bind the two layers of the glass sheets together. The general glued glass structure is such as a two-layer 3mm glass plate with a 0.38mm sandwich PVB glue sandwiched between them, with a total thickness of 6.38 mm. It is also possible to use more layers and thicker glass sheets to increase the strength. When the glass plate on the glued glass structure is broken, the adhesive layer will still adhere the two glass plates to prevent the whole glass plate from being broken into pieces that can injure people. Therefore, it has been widely used in life, such as home furnishings doors and windows, table and chair accessories or transportation, such as glass used in cars, boats and airplanes.
習用該等膠合玻璃結構為提升應用性，進一步在玻璃板的黏合層間增設金屬材質導線，如汽車前後擋玻璃之除霧線設計或為增益室內或車內之通訊產品收訊提升，利用膠合玻璃結構內設置金屬導線取代天線的功能增益接收效果，不過該等金屬材料有易氧化致使壽命老化的限制，且該等金屬材料氧化後有明顯的透光率下降現象，進一步影響膠合玻璃的透光性或視覺需求。 In order to improve the applicability, the gluing glass structure is used to further increase the metal material wire between the bonding layers of the glass plate, such as the demisting line design of the front and rear glass of the automobile or the receiving of the communication product in the gain room or the vehicle, using the glued glass. The metal wire is arranged in the structure to replace the function gain receiving effect of the antenna, but the metal materials have the limitation of aging, which leads to the aging of the metal, and the metal material has obvious light transmittance decrease after oxidation, further affecting the light transmission of the glued glass. Sexual or visual needs.
近年來有一種新穎的導電膜材料，係於塑料如PET表面結合一導電材料以形成所謂的導電膜(如ITO、CNT、PEDOT：PSS或以上材料之組合)，其光學透過濾可達85%以上，且經長期使用不易氧化劣化，不影響原玻璃板之透光需求。 In recent years, there has been a novel conductive film material which is bonded to a surface of a plastic such as PET to form a so-called conductive film (such as ITO, CNT, PEDOT: PSS or a combination of the above materials), and its optical transmission filter can reach 85%. The above, and long-term use is not easy to oxidative degradation, does not affect the light transmission requirements of the original glass plate.
緣是，本創作人有感上述之結合可增益功能的提升，且依據多年來從事此方面之相關經驗，悉心觀察且研究之，並配合學理之運用，而提出一種設計合理且有效之本創作。 The reason is that the creator feels that the combination of the above-mentioned gains can be improved, and based on years of experience in this field, carefully observe and study, and with the use of academics, propose a design that is reasonable and effective. .
於是，本創作之主要目的，在於解決傳統缺失，避免缺失存在，本創作提供一種膠合玻璃結構，主要是在兩玻璃板間或單一玻璃板上以黏合層黏合一導電膜，該導電膜可取代習用之金屬材料，藉該導電膜與外部的電源連結，可提供訊號傳遞及產生電熱轉換等需求。 Therefore, the main purpose of this creation is to solve the traditional lack and avoid the existence of the missing. This creation provides a glued glass structure, mainly by bonding a conductive film between two glass plates or a single glass plate with an adhesive layer, which can replace the conductive film. The metal material used in the past is connected to an external power source to provide signal transmission and electrothermal conversion.
為達上述之目的，本創作提供一種膠合玻璃結構，包括：至少一玻璃板；一黏合層，係設於該玻璃板的一側；至少一導電膜，其上具有一塑料膠片及一設於該塑料膠片一側的透明導電薄膜層，該透明導電薄膜層以該黏合層黏合於該玻璃板的一側面上。 For the above purposes, the present invention provides a glued glass structure comprising: at least one glass plate; an adhesive layer disposed on one side of the glass plate; at least one conductive film having a plastic film thereon and a a transparent conductive film layer on one side of the plastic film, the transparent conductive film layer being adhered to one side of the glass plate with the adhesive layer.
其中，該黏合層為PVB黏合膠。 Wherein, the adhesive layer is a PVB adhesive.
其中，該導電膜，包含：一塑料膠片及一透明導電薄膜層。 The conductive film comprises: a plastic film and a transparent conductive film layer.
其中，該塑料膠片為聚乙烯對苯二甲酸酯。 Wherein, the plastic film is polyethylene terephthalate.
其中，該塑料膠片厚度低於500um。 Among them, the plastic film thickness is less than 500um.
其中，該塑料膠片厚度為50um。 Among them, the plastic film has a thickness of 50 um.
其中，該透明導電薄膜層為透明導電油墨，其上具有垂直的天線或水平的導熱線。 Wherein, the transparent conductive film layer is a transparent conductive ink having a vertical antenna or a horizontal heat conducting line thereon.
其中，該透明導電油墨為氧化銦錫、含掺奈米碳管透明導電膠或是有機半導體高分子材料，如聚乙撐二氧噻吩。 The transparent conductive ink is indium tin oxide, a carbon nanotube-containing transparent conductive adhesive or an organic semiconductor polymer material, such as polyethylene dioxythiophene.
其中，該塑料膠片另一側面上以該黏合層黏合另一玻璃板，該玻璃板與透明導電薄膜層呈反方向設於塑料膠片上。 The other side of the plastic film is bonded to the other glass plate by the adhesive layer, and the glass plate and the transparent conductive film layer are disposed on the plastic film in the opposite direction.
其中，該導電膜上以該黏合層黏合另一導電膜。 Wherein, the conductive film is bonded to the other conductive film by the adhesive layer.
1‧‧‧上玻璃板 1‧‧‧Upper glass plate
11‧‧‧第一正面 11‧‧‧ first positive
12‧‧‧第一背面 12‧‧‧ first back
2‧‧‧下玻璃板 2‧‧‧Under glass plate
21‧‧‧第二正面 21‧‧‧ second positive
22‧‧‧第二背面 22‧‧‧ second back
3‧‧‧黏合層 3‧‧‧Adhesive layer
4‧‧‧導電膜 4‧‧‧Electrical film
41‧‧‧塑料膠片 41‧‧‧Plastic film
42‧‧‧透明導電薄膜層 42‧‧‧Transparent conductive film layer
421‧‧‧天線 421‧‧‧Antenna
422‧‧‧導熱線 422‧‧‧heat line
第一圖，係本創作之膠合玻璃外觀立體示意圖。 The first picture is a three-dimensional diagram of the appearance of the glued glass of the present invention.
第二圖，係本創作之膠合玻璃剖視示意圖。 The second picture is a schematic cross-sectional view of the glued glass of the present invention.
第三圖，係本創作之導電膜結構正視示意圖。 The third figure is a front view of the structure of the conductive film of the present invention.
第四圖，係本創作之導電膜結構正視及側視示意圖。 The fourth figure is a front view and a side view of the conductive film structure of the present invention.
第五圖，係本創作之另一實施例示意圖。 The fifth figure is a schematic diagram of another embodiment of the present creation.
第六圖，係本創作之再一實施例示意圖。 The sixth figure is a schematic diagram of still another embodiment of the present creation.
茲有關本創作之技術內容及詳細說明，現配合圖式說明如下： The technical content and detailed description of this creation are as follows:
請參閱第一、二圖，係本創作之膠合玻璃外觀立體及剖視示意圖。如圖所示：本創作之膠合玻璃結構，包括：一上玻璃板1、下 玻璃板2、一黏合層3及一導電膜4。 Please refer to the first and second figures, which are the three-dimensional and cross-sectional schematic views of the glued glass. As shown in the figure: the glued glass structure of the creation includes: an upper glass plate 1, a lower The glass plate 2, an adhesive layer 3 and a conductive film 4.
該上玻璃板1，係呈一扇形的上玻璃板1，其上具有第一正面11及第一背面12。 The upper glass plate 1 is a sector-shaped upper glass plate 1 having a first front surface 11 and a first rear surface 12.
該下玻璃板2，係呈一扇形的下玻璃板2，其上具有第二正面21及第二背面22。 The lower glass plate 2 is a fan-shaped lower glass plate 2 having a second front surface 21 and a second rear surface 22 thereon.
該黏合層3，係以塗佈於該該上玻璃板1的該第一背面12及該下玻璃板2的第二正面11上。在本圖式中，該黏合層為PVB黏合膠。 The adhesive layer 3 is applied to the first back surface 12 of the upper glass sheet 1 and the second front surface 11 of the lower glass sheet 2. In this figure, the adhesive layer is a PVB adhesive.
該導電膜4，係呈扇形，以黏合於該上玻璃板11的第一背面12及該下玻璃板2的該第二正面21之間的黏合層3中，以形成膠合玻璃結構，可連接外部電源(圖中未示)提供熱電轉換或連接通訊設備作為天線之用。 The conductive film 4 is fan-shaped to be bonded to the adhesive layer 3 between the first back surface 12 of the upper glass sheet 11 and the second front surface 21 of the lower glass sheet 2 to form a glued glass structure, which can be connected An external power source (not shown) provides thermoelectric conversion or connection of a communication device as an antenna.
請參第三、四圖，係本創作之導電膜結構正視及側視示意圖。如圖所示：本創作之夾黏於膠合玻璃結構中的導電膜4，包含：一塑料膠片41及一透明導電薄膜層42。該塑料膠片41利用如聚乙烯對苯二甲酸酯(Polyethylene Terephthalate，PET)，於塑料膠片41一側製做透明導電薄膜層42，將透明導電油墨利用係透過物理氣相沉積技術(Physical Vapor Deposition，PVD)的三種製程：蒸鍍(Evaporation Deposition)、離子鍍(Ion Plating)、濺鍍(Sputtering Deposition)之其一方式，或者印刷、含浸、噴塗之技術將透明導電油墨成型於該塑料膠片41的一側面上以形成透明導電薄膜層42。該透明導電油墨為氧化銦錫(Tndium Tin Oxide，ITO)、含掺奈米碳管透明導電膠或是有機半導體高分子材料(如聚乙撐二氧噻吩PEDOT， Poly-3,4-Ethylenedioxythiophene)。在本圖式中，該塑料膠片41厚度低於500um，以50um為佳。 Please refer to the third and fourth figures for the front and side views of the conductive film structure of this creation. As shown in the figure, the conductive film 4 adhered to the glued glass structure of the present invention comprises: a plastic film 41 and a transparent conductive film layer 42. The plastic film 41 is made of a transparent conductive film layer 42 on the side of the plastic film 41 by using, for example, polyethylene terephthalate (PET), and the transparent conductive ink is passed through a physical vapor deposition technique (Physical Vapor). Deposition, PVD) three processes: evaporation deposition, ion plating (Ion Plating), sputtering (Sputtering Deposition), or printing, impregnation, spraying technology to form transparent conductive ink on the plastic film A side of the 41 is formed to form a transparent conductive film layer 42. The transparent conductive ink is Tndium Tin Oxide (ITO), a conductive conductive paste containing a carbon nanotube or an organic semiconductor polymer material (such as polyethylene dioxythiophene PEDOT, Poly-3,4-Ethylenedioxythiophene). In the present drawing, the plastic film 41 has a thickness of less than 500 um, preferably 50 um.
進一步，再利用化學蝕刻或雷射雕刻製作，將透明導電薄膜層42上去除不要的部份，以製作出線路部份，前述之透明導電薄膜層42可以加以利用進一步利用前述蝕刻加工技術製作為導線線路與外部電源電性連接，如第三圖的扇形網狀，該透明導電薄膜層42其上具有複數條的天線421及複數條的導熱線422，或製作其他的金屬導線線路與外部電源電性連接。又，為增益上、下板玻璃1、2的黏合，不因受導電膜4的設置影響黏合效果，導電膜4結構非線路區域43可以經裁切或沖壓而簍空，以提供黏合層3直接穿導電膜4提供上、下玻璃板1、2間之黏合，請參閱第三圖之結構。 Further, by using chemical etching or laser engraving, the unnecessary portion of the transparent conductive film layer 42 is removed to form a wiring portion, and the transparent conductive film layer 42 can be further fabricated by using the etching process described above. The wire line is electrically connected to the external power source, such as the fan-shaped mesh of the third figure. The transparent conductive film layer 42 has a plurality of antennas 421 and a plurality of heat-conducting wires 422 thereon, or other metal wire lines and external power sources. Electrical connection. Moreover, in order to gain the adhesion of the upper and lower plate glasses 1, 2, the bonding effect of the conductive film 4 is not affected by the arrangement of the conductive film 4, and the non-line region 43 of the conductive film 4 can be hollowed out by cutting or punching to provide the adhesive layer 3 Directly through the conductive film 4 to provide adhesion between the upper and lower glass plates 1, 2, please refer to the structure of the third figure.
請參閱第五圖，係本創作之另一實施例示意圖。如圖所示：本創作可在一玻璃板5的一側面上設有一黏合層3，將該導電膜4的透明導電薄膜層42直接黏合在黏合層3上，使膠合玻璃結構僅需使用片的玻璃板5結構。 Please refer to the fifth figure, which is a schematic diagram of another embodiment of the present creation. As shown in the figure, an adhesive layer 3 is disposed on one side of a glass plate 5, and the transparent conductive film layer 42 of the conductive film 4 is directly bonded to the adhesive layer 3, so that the laminated glass structure only needs to use a sheet. The structure of the glass plate 5 .
請參閱第六圖，係本創作之再一實施例示意圖。如圖所示：本實實施例與第五圖大致相同，所不同係在該導電膜4上可以在黏合另一層導電膜4除了可連接外部電源(圖中未示)提供熱電轉換或連接通訊設備作為天線之用外，還可以供其他電子產品的信號傳遞或控制使用。 Please refer to the sixth figure, which is a schematic diagram of still another embodiment of the present creation. As shown in the figure, the embodiment is substantially the same as the fifth embodiment. The difference is that the conductive film 4 can be bonded to another conductive film 4 in addition to an external power source (not shown) for providing thermoelectric conversion or connection communication. As an antenna, the device can also be used for signal transmission or control of other electronic products.
本創作之膠合玻璃結構可設置在多種位置，例如：櫥櫃、窗、門、桌、牆、車、保溫裝置、保冷裝置、烘焙裝置之門窗用玻璃上 ，但是不以此為限。例如本創作為設置於汽車前擋玻璃，可提供具除霧或內置天線提升車內廣播或通訊傳遞，或門窗上鑲用本創作之膠合玻璃結構，亦俱備此前述功能。然而此處的門為一廣義的門，故不限於是住家用戶的門，亦可以是車門、冰箱(保冷裝置)門或烤箱(烘焙裝置)門，因此本創作設置在門上與設置在烘焙裝置上，可以是兩個分開的獨立事件，也可以指同一件事，同理，以上所提之位置，均應被擴大解釋，如窗可以是一般住家窗戶也可以是車窗等。 The glued glass structure of the present invention can be arranged in various positions, for example, cabinets, windows, doors, tables, walls, cars, heat preservation devices, cold storage devices, glass for doors and windows of baking devices. , but not limited to this. For example, this creation is provided in the front windshield of the car, and it can provide the defogging or built-in antenna to enhance the in-car broadcast or communication transmission, or the glued glass structure with the creation of the door and window. However, the door here is a generalized door, so it is not limited to the door of the home user, but also the door, the refrigerator (cooling device) door or the oven (baking device) door, so the creation is set on the door and set in the baking. On the device, it can be two separate independent events, or it can refer to the same thing. Similarly, the above mentioned positions should be expanded and explained. For example, the window can be a general house window or a window.
附帶一提的是，本創作是有關於膠合玻璃結構，更進一步地，是關於該膠合玻璃結構在材料上系選用透明素材導電膜4具透視效果。藉此產生一種功能上的特殊組合效果，故關於上述如何達到透視效果的技術內容更非用以限定本創作的權利範圍。 Incidentally, the present invention relates to a glued glass structure, and further, the laminated glass structure is made of a transparent material conductive film 4 with a see-through effect. In this way, a special combination of functions is produced, so that the technical content of how to achieve the perspective effect described above is not intended to limit the scope of the present invention.
綜上所述本創作可達到結合玻璃強化、玻璃除霧、無線通訊增益，使本創作能夠與諸多裝置、結構產生極佳的組合、整合效果，在無形中更加擴增了其應用範疇，是現代社會之中相當方便且實用的新穎創作。惟以上所述僅為本創作之較佳實施例，非意欲侷限本創作的專利保護範圍，故舉凡運用本創作說明書或圖式內容所為的等效變化，均同理皆包含於本創作的權利保護範圍內，合予陳明。 In summary, the creation can achieve the combination of glass strengthening, glass defogging, and wireless communication gain, which enables the creation of an excellent combination and integration effect with many devices and structures, and further expands its application range in the invisible. A very convenient and practical novel creation in modern society. However, the above description is only a preferred embodiment of the present invention, and it is not intended to limit the scope of patent protection of the present creation. Therefore, the equivalent changes made by using the present specification or the content of the schema are all included in the right of the creation. Within the scope of protection, it is given to Chen Ming.
1‧‧‧上玻璃板 1‧‧‧Upper glass plate
11‧‧‧第一正面 11‧‧‧ first positive
12‧‧‧第一背面 12‧‧‧ first back
2‧‧‧下玻璃板 2‧‧‧Under glass plate
21‧‧‧第二正面 21‧‧‧ second positive
22‧‧‧第二背面 22‧‧‧ second back
3‧‧‧黏合層 3‧‧‧Adhesive layer
4‧‧‧導電膜 4‧‧‧Electrical film
Claims (11)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103204772U TWM481234U (en) | 2014-03-20 | 2014-03-20 | Sandwich glass structure |
| CN201420144410.9U CN203901860U (en) | 2014-03-20 | 2014-03-27 | Glued glass structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103204772U TWM481234U (en) | 2014-03-20 | 2014-03-20 | Sandwich glass structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM481234U true TWM481234U (en) | 2014-07-01 |
Family
ID=51723392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103204772U TWM481234U (en) | 2014-03-20 | 2014-03-20 | Sandwich glass structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203901860U (en) |
| TW (1) | TWM481234U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017120142A1 (en) | 2017-09-01 | 2019-03-07 | E-Lead Electronic Co., Ltd. | Laminated glass adhesive coating specific manufacturing process |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201610639D0 (en) * | 2016-06-17 | 2016-08-03 | Univ Swansea | Glass laminate structure |
-
2014
- 2014-03-20 TW TW103204772U patent/TWM481234U/en not_active IP Right Cessation
- 2014-03-27 CN CN201420144410.9U patent/CN203901860U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017120142A1 (en) | 2017-09-01 | 2019-03-07 | E-Lead Electronic Co., Ltd. | Laminated glass adhesive coating specific manufacturing process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN203901860U (en) | 2014-10-29 |
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