TWM480784U - Chip card connector - Google Patents

Chip card connector Download PDF

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Publication number
TWM480784U
TWM480784U TW102223971U TW102223971U TWM480784U TW M480784 U TWM480784 U TW M480784U TW 102223971 U TW102223971 U TW 102223971U TW 102223971 U TW102223971 U TW 102223971U TW M480784 U TWM480784 U TW M480784U
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Taiwan
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housing
wafer
wafer card
card connector
terminals
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TW102223971U
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Chinese (zh)
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Pin-Yuan Hou
Jin-Fei Li
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Advanced Connectek Inc
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Publication of TWM480784U publication Critical patent/TWM480784U/en

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Description

晶片卡連接器Chip card connector

本創作係關於一種連接器之設計,特別是關於一種晶片卡連接器。This creation relates to the design of a connector, and more particularly to a wafer card connector.

就現有行動電話而言,每一隻行動電話裝置內部會插置使用者身份模組(Subscriber Identity Module,SIM),通常稱為「SIM卡」的晶片卡,以辨識使用者的身份,而且SIM還能夠儲存簡訊資料和電話號碼。為了將SIM卡插接於行動電話裝置內,一般的行動電話裝置都會在裝置內部的電路板中設置有晶片連接器,用以插接SIM卡,以及對SIM卡進行資料的讀取及寫入。In the case of an existing mobile phone, a subscriber identity module (SIM), a chip card commonly referred to as a "SIM card", is inserted inside each mobile phone device to identify the user, and the SIM It is also able to store newsletter materials and phone numbers. In order to insert the SIM card into the mobile phone device, a general mobile phone device is provided with a chip connector in the circuit board inside the device for plugging in the SIM card, and reading and writing data to the SIM card. .

針對現有晶片連接器的結構,例如在中華民國第M360469號專利案中揭示了一種卡連接器,包括絕緣本體以及複數導電端子,絕緣本體包括本體部及貫穿本體部而形成之呈列設置的開口部。複數導電端子係呈列設於絕緣本體內,各導電端子包括固定於絕緣本體內的固定部及自固定部一端延伸形成的懸臂設置於該絕緣本體開口部內的接觸部。該接觸部包括分別自固定部兩側延伸之平行設置的兩延伸臂、連接兩延伸臂末端的連接臂及自連接臂傾斜延伸位於兩延伸臂之間的彈性臂。當SIM卡插置於該晶片連接器時,晶片連接器之接觸部係接觸於晶片卡之晶片,以透過 該接觸部讀取晶片卡的資料或是將資料寫入晶片卡。For a structure of a conventional wafer connector, for example, in the Patent No. M360469 of the Republic of China, a card connector is disclosed, comprising an insulative housing and a plurality of conductive terminals, the insulative housing comprising a body portion and an array of openings formed through the body portion unit. The plurality of conductive terminals are arranged in the insulating body, and each of the conductive terminals includes a fixing portion fixed in the insulating body and a contact portion in which the cantilever extending from one end of the fixing portion is disposed in the opening of the insulating body. The contact portion includes two extending arms respectively extending from two sides of the fixing portion, a connecting arm connecting the ends of the extending arms, and a resilient arm extending from the connecting arms obliquely between the extending arms. When the SIM card is inserted into the chip connector, the contact portion of the chip connector contacts the wafer of the wafer card to pass through The contact reads the data of the wafer card or writes the data to the wafer card.

由於不同的行動電話裝置所插接的晶片卡(SIM卡)的尺寸亦不相同,如果是小尺寸的晶片卡插接於大尺寸晶片連接器時,必須使用轉接卡方能將不同尺寸的晶片卡插接於適當的晶片卡連接器。Since the size of the chip card (SIM card) inserted by different mobile phone devices is also different, if a small-sized wafer card is inserted into the large-sized chip connector, the adapter card must be used to be able to have different sizes. The wafer card is inserted into a suitable wafer card connector.

小尺寸的晶片卡雖然可以藉由轉接卡插接於大尺寸的晶片連接器,但是將小尺寸的晶片卡組裝於轉接卡後,晶片卡與轉接卡之間仍然會有間隙存在,而且上述的晶片連接器的接觸部係由彈性臂所延伸。因此,當小尺寸的晶片卡藉由轉接卡插接於上述晶片連接器,或是從該晶片連接器拔除時,可能會有轉接卡的間隙卡住晶片連接器的接觸部的情況,若是使用者不當用力,可能造成接觸部的損壞或變形,而無法再次插接晶片卡。Although a small-sized wafer card can be inserted into a large-sized wafer connector by a riser card, after a small-sized wafer card is assembled to the riser card, there is still a gap between the wafer card and the riser card. Moreover, the contact portion of the above wafer connector is extended by a resilient arm. Therefore, when a small-sized wafer card is inserted into or removed from the chip connector by the adapter card, there may be a case where the gap of the adapter card catches the contact portion of the chip connector. If the user improperly uses force, the contact portion may be damaged or deformed, and the wafer card cannot be inserted again.

緣此,本創作之目的即是提供一種晶片卡連接器,係改變晶片連接器之複數個端子的結構,以解決習知轉接卡的間隙造成端子的接觸部變形的問題。Accordingly, the purpose of the present invention is to provide a wafer card connector that changes the structure of a plurality of terminals of the chip connector to solve the problem that the contact portion of the terminal is deformed by the gap of the conventional riser card.

本創作所提供之晶片卡連接器包括殼體以及複數個端子。殼體具有分隔部,該分隔部兩側係形成有複數個平行排列且貫穿該殼體之開口;複數個端子分別設置於該殼體之複數個開口中,各該端子之兩端部係分別為第一端與第二端,該第一端係嵌埋於該殼體之分隔部,該第二端係從該殼體之側面穿透出且外露於該殼體,且各該端子於該第一端與該第二端之間分別具有凸起之接觸部。The wafer card connector provided by the present invention includes a housing and a plurality of terminals. The housing has a partitioning portion, and a plurality of openings arranged in parallel and extending through the housing are formed on both sides of the housing; a plurality of terminals are respectively disposed in the plurality of openings of the housing, and the two ends of the terminals are respectively a first end and a second end, the first end is embedded in the partition of the housing, the second end is penetrated from the side of the housing and exposed to the housing, and each of the terminals is The first end and the second end respectively have convex contact portions.

本創作另提供一種晶片卡連接器,包括殼體以及複數個端 子。殼體具有分隔部,該分隔部兩側係形成有複數個平行排列且貫穿該殼體之開口,且該分隔部對應各該開口處有擋片,該擋片之底部具有結合面;複數個端子分別設置於各該開口,且各該端子之兩端部分別係為第一端與第二端,該第一端係可活動地結合該擋片之結合面,該第二端係從該殼體之側面穿透出且外露於該殼體,且各該端子於該第一端與第二端之間具有凸起之接觸部。The present invention further provides a wafer card connector including a housing and a plurality of ends child. The housing has a partitioning portion, and the two sides of the partitioning portion are formed with a plurality of openings arranged in parallel and extending through the housing, and the partitioning portion has a blocking piece corresponding to each of the openings, and the bottom of the blocking piece has a joint surface; The terminals are respectively disposed in the openings, and the two ends of the terminals are respectively a first end and a second end, the first end is movably coupled to the joint surface of the baffle, and the second end is from the The side of the housing penetrates and is exposed to the housing, and each of the terminals has a convex contact portion between the first end and the second end.

由上可知,由於本創作之接觸部係形成於端子之二端部之間,並非如同習知的晶片連接器中,接觸部係由懸臂所延伸出。因此當晶片卡插置於本創作之晶片卡連接器時,本創作之接觸部會接觸晶片卡之晶片,而且由於本創作之接觸部並非由懸臂所延伸出,因此當晶片卡於插接或拔除時,並不會造成接觸部的損傷或變形。As can be seen from the above, since the contact portion of the present invention is formed between the two ends of the terminal, unlike the conventional wafer connector, the contact portion is extended by the cantilever. Therefore, when the wafer card is inserted into the wafer card connector of the present invention, the contact portion of the creation contacts the wafer of the wafer card, and since the contact portion of the creation is not extended by the cantilever, when the wafer is stuck or When removed, it will not cause damage or deformation of the contact.

1、1’、1”‧‧‧晶片卡連接器1, 1', 1" ‧‧ ‧ chip card connector

10‧‧‧殼體10‧‧‧shell

101‧‧‧分隔部101‧‧‧Departure

1011‧‧‧擋片1011‧‧‧Block

1012‧‧‧結合面1012‧‧‧ joint surface

102‧‧‧開口102‧‧‧ openings

11、11’、11”‧‧‧端子11, 11', 11" ‧ ‧ terminals

111‧‧‧第一端111‧‧‧ first end

112‧‧‧第二端112‧‧‧ second end

1121‧‧‧彎折部1121‧‧‧Bends

113‧‧‧接觸部113‧‧‧Contacts

114‧‧‧緩衝結構114‧‧‧buffer structure

12‧‧‧晶片卡12‧‧‧wafer card

121‧‧‧晶片121‧‧‧ wafer

第1A圖係為本創作第一實施例之立體圖;第1B圖係為第1A圖之剖視圖;第1C圖係為本創作第一實施例之晶片卡連接器結合晶片卡示意圖;第2A圖係為本創作第二實施例之立體圖;第2B圖係為本創作第二實施例之底視圖;第2C圖係為本創作第二實施例之晶片卡連接器結合晶片卡示意圖;及第3圖係為本創作晶片卡連接器第三實施例之示意圖。1A is a perspective view of a first embodiment of the present invention; FIG. 1B is a cross-sectional view of FIG. 1A; FIG. 1C is a schematic view of a wafer card connector incorporating a wafer card according to a first embodiment of the present invention; 2B is a bottom view of the second embodiment of the present invention; FIG. 2C is a schematic view of the wafer card connector combined with the wafer card of the second embodiment; and FIG. This is a schematic diagram of a third embodiment of the authored wafer card connector.

以下藉由特定的具體實施例說明本創作之實施方式,熟悉此 技藝之人士可由本說明書所揭示之內容輕易地瞭解本創作之其他優點及功效。The following describes the implementation of the present invention by a specific embodiment, and is familiar with this. Those skilled in the art can readily appreciate the other advantages and functions of the present invention as disclosed in this specification.

請同時參閱第1A圖及第1B圖,第1A圖係為本創作晶片卡連接器第一實施例之立體圖,第1B圖係為第1圖之剖視圖。如圖所示,本創作之晶片卡連接器1包括殼體10以及複數個端子11。Please refer to FIG. 1A and FIG. 1B simultaneously. FIG. 1A is a perspective view of the first embodiment of the wafer card connector of the present invention, and FIG. 1B is a cross-sectional view of FIG. As shown, the wafer card connector 1 of the present invention includes a housing 10 and a plurality of terminals 11.

殼體10具有分隔部101,該分隔部101兩側分別具有複數個平行排列且貫穿該殼體10之開口102。The housing 10 has a partition 101 having a plurality of openings 102 extending in parallel and extending through the housing 10 on both sides.

複數個端子11係分別設置於殼體10之開口102中,且各個端子11分別具有第一端111以及第二端112。各端子11之第一端111係嵌埋於殼體10之分隔部101,各端子11之第二端112係從殼體10之側面穿透出,且外露於殼體10之外,而在各端子11之第一端111與第二端112之間具有凸起之接觸部113,用以接觸晶片卡(Subscriber Identity Module,SIM)之晶片。本領域具有通常知識者可知,本創作之晶片卡連接器1係用以裝設於行動電話裝置之電路板(圖未示),因此,可以在端子11之第二端112形成有彎折部1121,用以方便焊接於電路板。A plurality of terminals 11 are respectively disposed in the openings 102 of the housing 10, and each of the terminals 11 has a first end 111 and a second end 112, respectively. The first end 111 of each terminal 11 is embedded in the partition 101 of the housing 10, and the second end 112 of each terminal 11 penetrates from the side of the housing 10 and is exposed outside the housing 10, and A bump 113 is formed between the first end 111 and the second end 112 of each of the terminals 11 for contacting a wafer of a Subscriber Identity Module (SIM). It is known to those skilled in the art that the wafer card connector 1 of the present invention is for mounting on a circuit board (not shown) of a mobile phone device. Therefore, a bent portion can be formed at the second end 112 of the terminal 11. 1121, used to facilitate soldering to the circuit board.

請參閱第1C圖,係為本創作第一實施例之晶片卡結合晶片卡連接器示意圖。如圖所示,當晶片卡12插接於晶片卡連接器1時,晶片卡12係以具有晶片121之表面結合晶片卡連接器1。此時,晶片卡12之晶片121係對應地結合於各該端子11之接觸部113,以藉由該接觸部113讀取晶片121的資料,經由第二端112傳送至電路板,或是將電路板的資料經過第二端112,從接觸部113寫入於晶片121。Please refer to FIG. 1C, which is a schematic diagram of the wafer card bonded wafer card connector of the first embodiment of the present invention. As shown, when the wafer card 12 is inserted into the wafer card connector 1, the wafer card 12 is bonded to the wafer card connector 1 with the surface of the wafer 121. At this time, the wafer 121 of the wafer card 12 is correspondingly coupled to the contact portion 113 of each of the terminals 11, so that the material of the wafer 121 is read by the contact portion 113, transmitted to the circuit board via the second end 112, or The data of the board is written to the wafer 121 from the contact portion 113 via the second end 112.

請參閱第2A及2B圖,第2A圖係為本創作晶片卡連接器第 二實施例之立體圖,第2B圖係為本創作第二實施例之底視圖。如圖所示,本實施例之晶片卡連接器1’之組成構件與第一實施例大致相同,故相同組成構件以相同之元件符號標示,以資對應,且由於各組成構件之作用方式與第一實施例大致相同,故不在此多作贅述。其差異在於,本實施例之晶片卡連接器1’係於殼體10之分隔部101對應各該開口102處設置有擋片1011,用以限制端子11’之第一端111之作動。從第2B圖可以看出,擋片1011之底部具有結合面1012,各個端子11’之第一端111係可活動地結合於擋片1011之結合面1012。Please refer to Figures 2A and 2B. Figure 2A is the creation of the chip card connector. 2 is a perspective view of a second embodiment of the present invention. As shown in the figure, the components of the wafer card connector 1' of the present embodiment are substantially the same as those of the first embodiment, so that the same component members are denoted by the same component symbols, and the function of each component member is The first embodiment is substantially the same, so it will not be repeated here. The difference is that the wafer card connector 1' of the present embodiment is provided with a blocking piece 1011 corresponding to each opening 102 of the partitioning portion 101 of the housing 10 for restricting the actuation of the first end 111 of the terminal 11'. As can be seen from Fig. 2B, the bottom of the flap 1011 has a joint surface 1012, and the first end 111 of each terminal 11' is movably coupled to the joint surface 1012 of the flap 1011.

請參閱第2C圖,其係為本創作第二實施例之晶片卡連接器結合晶片卡示意圖。當晶片卡12插接於晶片卡連接器1’時,各該端子11’之接觸部113係對應地接觸晶片卡12之晶片121。此時,晶片卡12於接觸部113產生下壓之壓制力,而由於端子11’之第一端111並非固定於分隔部101兩側之擋片1011,故,端子11’之第一端111會因為晶片卡12之壓制力而與擋片1011分離,如第2C圖所示。當晶片卡12從晶片卡連接器1’移除時,端子11’因為停止受到晶片121的壓制而回復初始狀態,即端子11’之第一端111接觸於擋片1011之結合面1012。Please refer to FIG. 2C, which is a schematic diagram of a wafer card connector combined with a wafer card according to a second embodiment of the present invention. When the wafer card 12 is inserted into the wafer card connector 1', the contact portion 113 of each of the terminals 11' correspondingly contacts the wafer 121 of the wafer card 12. At this time, the wafer card 12 generates a pressing force for pressing down at the contact portion 113, and since the first end 111 of the terminal 11' is not fixed to the blocking piece 1011 on both sides of the partitioning portion 101, the first end 111 of the terminal 11' It will be separated from the flap 1011 by the pressing force of the wafer card 12, as shown in Fig. 2C. When the wafer card 12 is removed from the wafer card connector 1', the terminal 11' is returned to the initial state by stopping the pressing of the wafer 121, i.e., the first end 111 of the terminal 11' is in contact with the bonding face 1012 of the shutter 1011.

請參閱第3圖,其係為本創作晶片卡連接器第三實施例之示意圖。本實施例之晶片卡連接器1”之組成構件與第一實施例大致相同,故相同組成構件以相同之元件符號標示,以資對應,且由於各組成構件之作用方式與第一實施例大致相同,故不在此多作贅述。其差異在於,本實施例之晶片卡連接器1”之各該端子11”更包括有緩衝結構114,係位於各端子11”之第一端111與 接觸部113之間,以及第二端112與接觸部113之間。Please refer to FIG. 3, which is a schematic diagram of a third embodiment of the present wafer card connector. The constituent members of the wafer card connector 1" of the present embodiment are substantially the same as those of the first embodiment, so that the same constituent members are denoted by the same reference numerals, and the functions of the constituent members are substantially the same as those of the first embodiment. The same is true, and the difference is that each of the terminals 11 ′ of the wafer card connector 1 ′′ of the embodiment further includes a buffer structure 114 located at the first end 111 of each terminal 11 ′′. Between the contact portions 113 and between the second end 112 and the contact portion 113.

如同第二實施例所述,當晶片卡12插接於晶片卡連接器1”時,各該端子11”之接觸部113係對應地接觸晶片卡12之晶片121,同時晶片卡12對於接觸部113產生下壓之壓制力。而在一般使用者的使用習慣上不會經常拔除晶片卡12,因此,晶片卡連接器1”之各該端子11”長時間受到晶片卡12的抵壓,容易造成端子11”的損傷及變形。As described in the second embodiment, when the wafer card 12 is inserted into the wafer card connector 1", the contact portion 113 of each of the terminals 11" correspondingly contacts the wafer 121 of the wafer card 12, while the wafer card 12 contacts the portion 113 produces a pressing force for pressing. However, the wafer card 12 is not often removed during the use habits of the general user. Therefore, the terminals 11" of the chip card connector 1" are pressed by the wafer card 12 for a long time, which easily causes damage and deformation of the terminal 11". .

因此,在本實施例中,係於各端子11”之第一端111與接觸部113之間,以及第二端112與接觸部113之間設計了緩衝結構114,以減緩晶片卡12於端子11”之接觸部113所產生的壓制力,進而降低端子11”的損傷。其中,本實施例之緩衝結構114係為迴彎結構,然而,迴彎結構之緩衝結構114僅用於作為實施方式之說明,並不應以此為限,本領域具有通常知識者當可依照上述說明而將緩衝結構114改良為其他形式。Therefore, in the present embodiment, a buffer structure 114 is designed between the first end 111 of each terminal 11" and the contact portion 113, and between the second end 112 and the contact portion 113 to slow the wafer card 12 to the terminal. The pressing force generated by the contact portion 113 of the 11" further reduces the damage of the terminal 11". The buffer structure 114 of the present embodiment is a bent back structure, however, the buffer structure 114 of the back bending structure is only used as an embodiment. The description should not be limited thereto, and those skilled in the art can improve the buffer structure 114 to other forms according to the above description.

經由上述的說明可知,本創作之晶片卡連接器1、1’、1”係改變了端子1、11’、11”的結構,使接觸部113從習知技術中從懸臂所延伸的形式改良為位於第一端111以及第二端112之間形成有凸起狀之接觸部113。因此,當晶片卡12或是轉接卡插接於本創作時,無論是插接時或是拔除時,晶片卡12或是轉接卡並不會有卡住的情形,解決了習知技術中,因為晶片卡12或轉接卡在插接或移除過程中卡在端子11的接觸部113而造成接觸部113變形或損毀的問題。As can be seen from the above description, the wafer card connector 1, 1', 1" of the present invention changes the structure of the terminals 1, 11', 11", and the contact portion 113 is modified from the cantilever by the prior art. A convex contact portion 113 is formed between the first end 111 and the second end 112. Therefore, when the chip card 12 or the adapter card is inserted into the creation, the wafer card 12 or the adapter card does not get stuck when the card is inserted or removed, and the conventional technology is solved. The problem that the contact portion 113 is deformed or damaged is caused by the wafer card 12 or the riser card being caught in the contact portion 113 of the terminal 11 during the insertion or removal.

上述實施例僅為例示性說明本創作之原理及其功效,而非用於限制本創作。任何本領域中具有通常知識者均可在不違背本創 作之精神及範疇下,對上述實施例進行修飾與變化。The above embodiments are merely illustrative of the principles of the present invention and its effects, and are not intended to limit the present invention. Anyone with ordinary knowledge in the field can do without violating this Modifications and variations of the above embodiments are made in the spirit and scope of the invention.

1‧‧‧晶片卡連接器1‧‧‧wafer card connector

10‧‧‧殼體10‧‧‧shell

101‧‧‧分隔部101‧‧‧Departure

102‧‧‧開口102‧‧‧ openings

11‧‧‧端子11‧‧‧ Terminal

112‧‧‧第二端112‧‧‧ second end

1121‧‧‧彎折部1121‧‧‧Bends

113‧‧‧接觸部113‧‧‧Contacts

Claims (8)

一種晶片卡連接器,包括:殼體,具有分隔部,該分隔部兩側係形成有複數個貫穿該殼體之開口;以及複數個端子,分別設置於該殼體之複數個開口中,各該端子並分別具有第一端與第二端,該第一端係嵌埋於該殼體之分隔部,該第二端係從該殼體之側面穿透出且外露於該殼體,且各該端子於該第一端與該第二端之間分別具有凸起之接觸部。A wafer card connector comprising: a housing having a partition formed on each side with a plurality of openings extending through the housing; and a plurality of terminals respectively disposed in the plurality of openings of the housing The terminal has a first end and a second end respectively, the first end is embedded in the partition of the housing, and the second end is penetrated from the side of the housing and exposed to the housing, and Each of the terminals has a convex contact portion between the first end and the second end. 如申請專利範圍第1項所述之晶片卡連接器,其中,各該第二端具有彎折部。The wafer card connector of claim 1, wherein each of the second ends has a bent portion. 如申請專利範圍第1項所述之晶片卡連接器,其中,各該端子更包括緩衝結構,形成於該接觸部與該第一端之間以及該接觸部與該第二端之間。The wafer card connector of claim 1, wherein each of the terminals further comprises a buffer structure formed between the contact portion and the first end and between the contact portion and the second end. 如申請專利範圍第3項所述之晶片卡連接器,其中,該緩衝結構係為迴彎結構。The wafer card connector of claim 3, wherein the buffer structure is a bent back structure. 如申請專利範圍第1項所述之晶片卡連接器,其中,該複數個開口係平行排列。The wafer card connector of claim 1, wherein the plurality of openings are arranged in parallel. 一種晶片卡連接器,包括:殼體,具有分隔部,該分隔部兩側係形成有複數個貫穿該殼體之開口,且該分隔部對應各該開口處設置有擋片,該擋片之底部具有結合面;以及複數個端子,分別設置於各該開口,且各該端子之兩端部分別係為第一端與第二端,該第一端係可活動地結合該擋片之 結合面,該第二端係從該殼體之側面穿透出且外露於該殼體,且各該端子於該第一端與第二端之間具有凸起之接觸部。A wafer card connector includes a housing having a partition formed on each side of the partition with a plurality of openings extending through the housing, and the partition is provided with a blocking piece corresponding to each of the openings, the blocking piece The bottom portion has a bonding surface; and a plurality of terminals are respectively disposed in the openings, and the two ends of each of the terminals are respectively a first end and a second end, and the first end is movably coupled to the blocking piece The bonding surface penetrates from the side of the housing and is exposed to the housing, and each of the terminals has a convex contact portion between the first end and the second end. 如申請專利範圍第6項所述之晶片卡連接器,其中,各該第二端具有彎折部。The wafer card connector of claim 6, wherein each of the second ends has a bent portion. 如申請專利範圍第6項所述之晶片卡連接器,其中,複數個開口係平行排列。The wafer card connector of claim 6, wherein the plurality of openings are arranged in parallel.
TW102223971U 2013-06-17 2013-12-19 Chip card connector TWM480784U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9547809B2 (en) 2014-07-01 2017-01-17 Foxconn Interconnect Technology Limited Card connector preventing scrapping to card inserted therein
TWI577089B (en) * 2014-08-06 2017-04-01 鴻騰精密科技股份有限公司 Electrical card connector
US10062987B2 (en) 2016-10-19 2018-08-28 Foxconn Interconnect Technology Limited Card connector contact having a frame portion and a curved portion anchored to opposite front and rear of the frame portion

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103337726A (en) * 2013-06-17 2013-10-02 连展科技电子(昆山)有限公司 Chip card connector
JP5884839B2 (en) * 2014-01-14 2016-03-15 Smk株式会社 Card connector
CN105337071B (en) * 2014-07-01 2018-07-06 富士康(昆山)电脑接插件有限公司 Electronic card coupler

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9547809B2 (en) 2014-07-01 2017-01-17 Foxconn Interconnect Technology Limited Card connector preventing scrapping to card inserted therein
TWI577089B (en) * 2014-08-06 2017-04-01 鴻騰精密科技股份有限公司 Electrical card connector
US10062987B2 (en) 2016-10-19 2018-08-28 Foxconn Interconnect Technology Limited Card connector contact having a frame portion and a curved portion anchored to opposite front and rear of the frame portion

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