TWM475020U - Chip terminal structure improvement and terminal material belt for making the same - Google Patents

Description

Improved structure of wafer terminal and terminal tape for manufacturing the same

The present invention relates to a terminal structure, and more particularly to a terminal structure that can be used to connect components in an electronic device to transmit data, signals, or detection results.

In recent years, due to the rapid development of technology, various electronic devices have been widely used and widely used, including, for example, televisions, air conditioners, refrigerators, video recorders, modulators, routers, A/D converters, and various communication devices. These electronic devices are composed of components of various performances, which are usually electrically connected to each other by terminals, for transmitting data, signals, or detection results, to achieve the functions set by the components. The terminals used here can be designed into different structures and shapes depending on the application.

In view of this, a "conductive terminal and an electrical connector using the same" is disclosed in the national patent M394476. The conductive terminal is used to electrically connect the solder ball of the chip module to the printed circuit board to transmit data, signals, and test results. The electrical connector includes an insulative housing and a conductive terminal received in the insulating body, so that the solder ball of the chip module achieves a good electrical connection during the pressing of the conductive terminal.

In addition, referring to FIG. 8, the "wafer terminal" 4 of the prior art includes a body 41 which is designed in the shape of a circuit pattern and has a plurality of conductive segments 43 for increasing contact between the terminals and the wafer module (not shown). The area enhances its electrical conductivity. In addition, the front end of the wafer terminal has three soldering A hole 42 for soldering the wire to conduct data and signals.

Further, referring to Figures 9 and 10, it is shown that three wires 44 are respectively welded to the three welding holes 42 to form three welding points 45 when the wiring is mounted. However, such welding has the following disadvantages:

1. The solder itself is not strong enough to fall off or break, so that the wiring 44 is disconnected and broken, causing the terminal to lose its connection and conductive function.

2. If the soldering technique is poor or negligent, the solder joints 45 are easily in contact with each other, causing a short circuit between the wires 44. Therefore, the use of such a wafer terminal structure is currently necessary for further improvement.

The purpose of the present invention is to provide an improved structure of a wafer terminal, which can avoid the following disadvantages and disadvantages of the prior art wafer terminal: the wiring installation must implement a soldering process, which takes time and consumes materials, and the soldering hole is easily broken and the wiring is dropped. Causes an open circuit to disable the terminal.

To achieve this object, the present invention provides an improved structure of a wafer terminal, comprising: a plurality of conductive segments; three pins each formed by a front segment and a rear segment, the height of the rear segment being higher than the height of the front segment, and the Two protrusions are arranged on both sides of the front section, and a protruding claw is arranged on both sides of the front end of the front section, and the front section is used for accommodating and fixing a wire, and the wire can be prevented from falling off to achieve a good conductive function of the terminal.

In the above description, the improved structure of the wafer terminal is formed by stamping a metal piece.

When the wiring is mounted to the wafer terminal improved structure, the wiring is placed between the two protrusions on both sides of the front side of the pin and the protrusions are clamped using a jig so that the wire is protruded from the front end of the pin The claw is fixedly positioned such that the wire is clamped and fixed to the front surface Will move and make the wiring on the front section have the same height as the rear section. Therefore, by using this creation, the wiring does not move, fall off, or break after installation, so as to avoid the lack of shortcomings and shortcomings of the terminal failure caused by the soldering of the prior art and the disconnection of the wiring. In order to facilitate continuous operation on the press table, a plurality of wafer terminal improved structures can be punched on the metal sheet to become a terminal strip.

The advantage of this creation is that the wiring installation can omit the welding step to save the welding material and the welding process cost, and obtain a firm wiring connection.

1‧‧‧Terminal tape

10‧‧‧Frame

11‧‧‧Connecting belt

12‧‧‧Truncate

20‧‧‧Chip terminal improved structure

21‧‧‧ feet

211‧‧‧

212‧‧‧After

213‧‧‧Wiring conductor retention

214‧‧‧Wiring conductor retaining section

215‧‧‧Wiring positioning structure

22‧‧‧Conducting section

23‧‧‧Cut slices

3‧‧‧ wiring

4‧‧‧ wafer terminal

41‧‧‧ Subject

42‧‧‧welding holes

43‧‧‧Electrical section

44‧‧‧ wiring

45‧‧‧ solder joints

Figure 1 is a schematic overall view of the improved structure of the wafer terminal.

Fig. 2 is a schematic view showing an improved structure of the wafer terminal of the present invention.

Fig. 3 is a schematic view showing the wiring on the pin of the improved structure of the wafer terminal.

Fig. 4 is a schematic view showing the wiring on the pin of the improved structure of the wafer terminal.

Fig. 5 is a cross-sectional view showing the mounting wiring on the pin of the improved structure of the wafer terminal.

Fig. 6 is a schematic view showing the improved structure of the wafer terminal after pressing.

Figure 7 is a schematic view of the terminal strip of the improved structure of the wafer terminal.

Figure 8 is a schematic diagram of a conventional wafer terminal structure.

Fig. 9 is a schematic view showing a solder terminal on a soldering hole of a wafer terminal structure of the prior art.

Figure 10 is a cross-sectional view showing a solder terminal on a soldering hole of a wafer terminal structure of the prior art.

In order to make the reviewer's content easy to understand the content of the creation and the effect that can be achieved, the specific embodiments are listed with reference to the drawings, which are described in detail as follows: First, referring to FIG. 1 and FIG. 2, the wafer terminal improvement structure 20 includes three Pick up The legs 21 are arranged parallel to each other, and each has a front section 211 and a rear section 212. The horizontal position of the front section 211 is lower than the horizontal position of the rear section 212, and the two sides of the front section 211 are vertically erected to form two groups. The wiring conductor retaining portions 213 and 214; and the three conductive segments 22 are respectively connected to the rear segments 212 of the three pins 21 and connected to each other, and the two conductive segments 22 are respectively connected by at least one cut piece 23. The three conductive segments 22 each have a different circuit shape depending on the structure and function of the connected circuit (not shown). The front end of the front section 211 of each of the pins 21 further includes a wire positioning structure 215 which is a protrusion extending upward from both front ends of the front section 211. The outer wafer terminal modification structures 20 are respectively connected to the connection belt 11 by a cut-off portion 12 for operation on a rivet machine (not shown).

Referring to Figures 3 and 4, the main function of the front section 211 of the pin 21 is to mount the wiring 3. At the time of installation, the pin 21 is placed on the front section 211, and is pressed using a mold (not shown), so that the wire conductor holding portions 213, 214 clamp the wire 3. The wire positioning structure 215 allows the wire 3 to be securely fixed to the front section 211 without moving left and right up and down, and does not fall off to cause an open circuit to ensure a good conductive function of the terminal.

Referring to FIG. 5, the difference in height between the horizontal positions of the front section 211 and the rear section 212 is such that the wiring 3 and the rear section 212 are at the same horizontal position. Referring to FIG. 5, the horizontal position of the three conductive segments 22 is also lower than the horizontal position of the rear segment 212. The three pins 21 can simultaneously complete the crimping connection of the wire 3 in the operation of the first pressing die on the riveting machine (not shown), and then perform the cutting operation on the two cutting points 12 to make the chip terminal. The improved structure 20 is separated from the connecting strip 11.

In order to facilitate the continuous operation of the wiring crimping, the modified structure 2 of the plurality of wafer terminals and the connecting strip 11 may be stamped with a single piece of metal sheet to form a terminal strip. Referring to FIG. 7, the terminal strip 10 includes a modified structure 20 of a plurality of wafer terminals, wherein the modified structure 2 of the plurality of wafer terminals is The rows are arranged in parallel with each other; and the connecting strip 11 is connected to the improved structure 2 of all the wafer terminals.

The connecting strip 11 forms a plurality of frames 10, each of which houses a modified structure 20 of a wafer terminal. The frame 10 is connected by two cut-off portions 12 to the improved structure 20 of the wafer terminals therein, and the two cut-off portions 12 are distributed on both sides of the improved structure 20 of the wafer terminals.

In summary, by using the improved structure of the wafer terminal of the present invention, it is possible to avoid the disadvantages of the prior art solder fracture such that the wiring is disconnected or the short circuit between the solders, and the wiring can be connected by the protrusions and the claws provided on the pins. Securely fastened to the terminal pins to ensure terminal connection and conduction. Moreover, by using the present invention to implement wiring, the prior art soldering steps can be omitted to save the cost of soldering materials and welding labor. Therefore, this creation has the unpredictable effect of the conventional technology, conforms to the patent requirements and has patent value.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, the equivalent changes and modifications of the shapes, structures, features and spirits described in the scope of the patent application are all equivalent. It should be included in the scope of the patent application for this creation.

10‧‧‧Frame

11‧‧‧Connecting belt

12‧‧‧Truncate

20‧‧‧Chip terminal improved structure

21‧‧‧ feet

211‧‧‧

212‧‧‧After

213‧‧‧Wiring conductor retention

214‧‧‧Wiring conductor retaining section

215‧‧‧Wiring positioning structure

22‧‧‧Conducting section

23‧‧‧Cut slices

Claims (11)

An improved structure of a wafer terminal, comprising: three pins arranged parallel to each other and each having a front section and a rear section, wherein the horizontal position of the front section is lower than the horizontal position of the rear section, and the front section is two The side edges are vertically erected to form a wire conductor retaining portion; and three conductive segments are respectively connected after the rear segment, and the conductive segments are connected to each other with at least a cut piece. The improved structure of the wafer terminal according to claim 1, wherein the height difference between the horizontal position of the front segment and the rear segment is such that the current segment is placed in a wire and pressed to cause the wire conductor retaining portion to clamp the wire. After that, the wiring is in the same horizontal position as the rear section. The improved structure of the wafer terminal according to claim 1, wherein the front end of the front portion of each of the pins further comprises a wire positioning structure. The improved structure of the wafer terminal according to claim 3, wherein the wire positioning structure is a claw extending upward from both front ends of the front portion. The improved structure of the wafer terminal of claim 1, wherein the three conductive segments each have a different circuit shape. The improved structure of the wafer terminal of claim 1, wherein the horizontal position of the three conductive segments is lower than the horizontal position of the rear segment. The improved structure of the wafer terminal of claim 1, wherein the improved structure of the wafer terminal is formed by stamping a metal sheet. A terminal strip comprising: a plurality of modified structures of the wafer terminals according to any one of claims 1 to 7, wherein The improved structure of the plurality of wafer terminals is arranged in a row; and a connecting strip is connected to the modified structure of the plurality of wafer terminals. The terminal strip of claim 8, wherein the connecting strip forms a plurality of frames, each of which houses an improved structure of the wafer terminals. The terminal strip of claim 9, wherein the frame is connected to the improved structure of the wafer terminal by two cut-off portions, and the two cut-off portions are distributed on both sides of the wafer terminal. The terminal strip of claim 8, wherein the modified structure of the plurality of wafer terminals and the connecting strip are formed by stamping a metal sheet.