TWM472243U - Panel structure - Google Patents

Abstract

A panel structure including a substrate, a decoration layer, and a conductive component is provided. The region with and without the decoration are respectively a first region and a second region. The decoration layer includes a flat portion and a first boarder protruding portion thicker than the flat portion. Each conductive component is extended from the second region to the first region in a first direction to cross the first boarder protruding portion and then extended in a second direction when being located above the flat portion of the decoration layer. The second direction intersects the first direction. A part of each conductive component on the first boarder protruding portion has a first linewidth, another part thereof on the flat portion and extended in the second direction has a second linewidth, and the first linewidth is greater than the second line width.

Description

Panel structure

The novel creation relates to a panel structure, and in particular to a panel structure having a decorative layer.

In various electronic devices, in order to be able to perform various functions, such as display, touch, sounding, etc., it is often required to be realized by some conductor members, wherein the conductor members must be connected to the driving wafer to be able to operate. In the case of a touch panel, the conductive element may include a sensing electrode and a transmission line, wherein the sensing pad mainly provides a function of touch sensing in the active area, and the transmission line is disposed in the peripheral area. The sensing electrode needs to extend from the active region to the peripheral region and is connected to the drive wafer by a peripheral transmission line.

In general, if the transmission wires in the peripheral area are exposed, the appearance of the overall device will be affected. Therefore, a decorative layer is often disposed on the peripheral area to shield the transmission lines. However, the decorative layer constitutes a convex structure in the peripheral region, and when the conductive member extends from the active region to the peripheral region to cover the decorative layer, the presence of the decorative layer may affect the configuration of the conductive member. For example, the conductive element may be broken due to unevenness of the decorative layer.

The novel creation provides a panel structure in which a conductor member can be continuously extended from an active region to a peripheral region without easily causing a wire breakage phenomenon based on an uneven structure of the peripheral region.

The panel structure of the novel creation comprises a substrate, a decorative layer and a conductive element. The decorative layer is disposed on the substrate. The area where the decorative layer is located is a first area and the area other than the decorative layer is a second area. The decorative layer includes a central portion and a first edge raised portion. The thickness of the first edge protrusion is greater than the thickness of the center portion, and the first edge protrusion is located between the center portion and the second region. Each of the conductive elements extends from the second region toward the first region in a first direction and traverses the first edge projection and extends in a second direction on the central portion of the decorative layer. The first direction intersects the second direction. Each of the conductive elements has a first line width on the first edge projection. Each of the conductive elements has a second line width on the central portion and extending in the second direction, and the first line width is greater than the second line width.

In an embodiment of the present invention, each of the conductive elements includes a first conductive pattern and a second conductive pattern. The first conductive pattern is located at least in the second region and extends in the first direction. The second conductive pattern includes a transmission section and a lap section. The transmission section extends in the second direction on the central portion and has a second line width, and the overlapping section is connected between the first conductive pattern and the transmission section. The first conductive pattern of each of the conductive elements extends from the second region in the first direction to cover the first edge protrusion, and the first conductive pattern has a first line width on the first edge protrusion. The lap section has a third line width intersecting the first direction, and the third line width is greater than the second line width. Splice section And the first conductive pattern covers the first edge protrusion. In addition, the panel structure may further include a ground line and an insulating layer. The ground line and the second conductive pattern are the same film layer. The grounding wire is located between the second conductive case and the first edge protrusion. The insulating layer covers the ground line and has an opening to expose the overlapping segments of the second conductive pattern. The first conductive pattern covers the insulating layer and is connected to the overlapping section through the opening.

In an embodiment of the present invention, the step of the second conductive pattern extends from the first region toward the second region in the first direction and traverses the first edge projection. The lap phase of the second conductive pattern includes a traverse portion traversing the first edge protrusion portion and a contact portion contacting the first conductive pattern, wherein the traverse portion has a first line width and the contact portion has a third line width and The third line width is greater than the first line width.

In an embodiment of the present invention, the decorative layer further includes a second edge protrusion, wherein the first edge protrusion and the second edge protrusion are on opposite sides of the central portion. The panel structure may further include a ground line, wherein the ground line covers the second edge protrusion.

In an embodiment of the present invention, the decorative layer includes a first sub-decorative layer and a second sub-decorative layer, wherein the first sub-decorative layer is located between the second sub-decorative layer and the substrate. The first sub-decorative layer has a central portion and at least one edge portion. A first distance between the top surface of the central portion and the substrate is less than a second distance between the top surface of the edge portion and the substrate. The difference between the first distance and the second distance is ΔH, the thickness of the second sub-decorative layer is T, and ΔH>T. The second sub-decorative layer is disposed on the central portion to constitute a central portion of the decorative layer. The material of the first sub-decorative layer is different from the material of the second sub-decorative layer. The first sub-decorative layer includes an upper layer, a middle layer and a lower layer, wherein the middle layer Between the upper and lower layers. The width of the middle layer is smaller than the width of the upper layer and smaller than the width of the lower layer. The width of the lower layer is greater than the width of the upper layer. The widths of the upper, middle and lower layers are sequentially reduced or increased.

In an embodiment of the present invention, the material of the decorative layer comprises a photoresist, an ink, an inorganic material or a combination thereof.

Based on the above, in the panel structure of the present creative embodiment, the conductive members extending to the decorative layer have a sufficient width. Therefore, when the decorative layer has a non-uniform thickness, the conductive member is less likely to be broken. Therefore, the panel structure of the novel creation embodiment of the present invention has an ideal quality.

The above described features and advantages of the present invention will become more apparent and understood from the following description.

10‧‧‧The first sub-decorative layer

10A‧‧‧Upper

10B‧‧‧ Middle

10C‧‧‧Under

20‧‧‧Second sub-decorative layer

30, 50‧‧‧ insulation

40‧‧‧Decorative layer ontology

100, 200, 300, 400, 500‧‧‧ panel structure

102‧‧‧First area

104‧‧‧Second area

110‧‧‧Substrate

120, 120A, 102B, 102C, 120D, 120E, 120F‧‧‧ decorative layer

122‧‧‧Central Department

124‧‧‧First edge raised

126‧‧‧Second edge raised

130, 230, 430, 530‧‧‧ conductive elements

140, 340‧‧‧ Grounding wire

232, 432, 532‧‧‧ first conductive pattern

234, 434, 534‧‧‧ second conductive pattern

234A, 434A, 534A‧‧‧ transmission section

234B, 434B, 534B‧‧‧ lap

350‧‧‧Insulation

352‧‧‧ openings

534B1‧‧‧crossing

534B2‧‧‧Contacts

540‧‧‧Interior decorative layer

A-A, B-B, C-C, D-D‧‧‧

B1, B2, B3, WE‧‧‧ width

D1‧‧‧ first direction

D2‧‧‧ second direction

G‧‧‧ gap

H1, H2‧‧‧ distance

△H‧‧‧distance difference

L, L1, L2‧‧‧ ladder structure

T, T1, T2‧‧‧ thickness

X‧‧‧ area

W1‧‧‧ first width

W2‧‧‧ second width

W3‧‧‧ third width

FIG. 1 is a partial top plan view of a panel structure according to an embodiment of the present invention.

Figure 2 is a cross-sectional view of the panel structure of Figure 1 taken along line A-A'.

Fig. 3 is a partial top plan view showing the panel structure of the second embodiment of the present invention.

4 is a cross-sectional view taken along line B-B of the panel structure of FIG. 3, in which the first conductive pattern is first formed and the second conductive pattern is formed.

5 is a cross-sectional view taken along line B-B of the panel structure of FIG. 3, after the first conductive pattern is formed and the second conductive pattern is first formed.

Fig. 6 is a partial top plan view showing the panel structure of the third embodiment of the present invention.

Figure 7 is a cross-sectional view of the panel structure of Figure 6 taken along line C-C.

Fig. 8 is a partial top plan view showing the panel structure of the fourth embodiment of the present invention.

Figure 9 is a cross-sectional view of the panel structure of Figure 8 taken along line D-D.

Figure 10 is a partial top plan view showing the panel structure of the fifth embodiment of the present invention.

11A is a cross-sectional view of the panel structure of FIG. 10 taken along line E-E.

Figure 11B is a schematic illustration of another design of the cross-section of the panel structure of Figure 10 taken along line E-E.

Figure 11C is a cross-sectional view showing the panel structure of the sixth embodiment of the present invention.

12 to 17 are schematic cross-sectional views showing a decorative layer of a plurality of embodiments of the present invention.

1 is a partial top plan view of a panel structure of an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the panel structure of FIG. 1 taken along line A-A'. Referring to FIGS. 1 and 2 , the panel structure 100 includes a substrate 110 , a decorative layer 120 , and a plurality of conductive elements 130 . In the present embodiment, conductive element 130 can be constructed of a conductive material and provide electrical signal conduction in panel structure 100 to achieve the desired functionality. Therefore, when the conductive element 130 can sense the touch action of the user, When the touch sensing signal is used, the panel structure 100 is a touch panel. In addition, when the conductive element 130 can be used to drive a display medium, the panel structure can be a drive substrate of the display panel. Therefore, the panel structure term described herein can be applied to touch sensing applications, display uses, driving uses, and the like.

The decorative layer 120 is disposed on the substrate 110. Here, the area where the decorative layer 120 is located is a first area 102 and the area other than the decorative layer 120 is a second area 104. The decorative layer 120 includes a central portion 122, a first edge raised portion 124, and a second edge raised portion 126. In the present embodiment, the first edge protrusion 124 and the second edge protrusion 126 are located on opposite sides of the central portion 122 , and the first edge protrusion 124 is located between the central portion 122 and the second region 104 . Specifically, the first edge convex portion 124 and the second edge convex portion 126 are structures generated in the process of fabricating the decorative layer 120 based on factors such as manufacturing conditions or decorative layer materials. Here, the thickness T1 of the first edge convex portion 124 is greater than the thickness T2 of the central portion 122, and the thickness T3 of the second edge convex portion 126 is also greater than the thickness T2 of the central portion 122. In other embodiments, the decorative layer 120 may have only the first edge protrusions 124, or the thickness T1 and the thickness T3 may be different from each other, based on differences in fabrication conditions.

Each of the conductive elements 130 extends from the first region 102 in a first direction D1 toward the second region 104 and traverses the first edge protrusion 124. Specifically, each of the conductive elements 130 extends in a second direction D2 on the central portion 122 of the decorative layer 120 after traversing the first edge protrusions 124. Here, the first direction D1 intersects the second direction D2, but is not limited to being orthogonal. That is, the conductive element 130 may undulate with the surface of the decorative layer 120 as it extends from the first region 102 toward the second region 104.

Each of the conductive elements 130 has a first line width W1 on the first edge protrusion 124. Moreover, each of the conductive elements 130 has a second line width W2 when extending on the central portion 120 and extending in the second direction D2. In general, when the conductive element 130 is formed on a high and low undulating surface, the wire breakage may occur due to poor coverage, and in particular, the line width is more likely to occur. Therefore, in the present embodiment, the first line width W1 is greater than the second line width W2, which allows the conductive element 130 to continuously extend from the second region 104 to the first region 102 without being at the first edge raised portion 124. A wire break occurred. It is worth mentioning that the first line width W1 is the width of the portion guiding the electrical component 130 on the first edge convex portion 124, and the measuring direction of the width is perpendicular to the extending direction of the portion. Similarly, the second line width W2 is the width of the portion that guides the electrical component 130 on the central portion 120 and extends in the second direction D2, and the measurement direction of this width is perpendicular to the extending direction of this portion.

In addition, in the embodiment, when the panel structure 100 needs to consider the electrostatic protection capability, the panel structure 100 may additionally include a grounding line 140, and the grounding wire 140 may cover the second edge protrusion 126. In particular, the line width WG of the ground line 140 may be greater than the second line width W2, and the ground line 140 may extend along the second edge protrusion 126. In particular, when the decorative layer 120 is disposed to surround the perimeter of the panel structure 100, the ground line 140 can also surround the perimeter of the panel structure 100.

The above embodiments are merely illustrative of the arrangement relationship between the decorative layer 120 and the conductive element 130, and are not intended to limit the novel creation. For example, conductive element 130 can be constructed from multiple components in other embodiments. Therefore, other aspects of the conductive element 130 will be further exemplified below in conjunction with the drawings. Of course, the following instructions It is for illustrative purposes only and is not intended to limit the creation of this novel.

Fig. 3 is a partial top plan view showing the panel structure of the second embodiment of the present invention. Referring to FIG. 3, the panel structure 200 is similar to the panel structure 100, and thus the same and similar components in the two embodiments will be denoted by the same reference numerals. Specifically, the panel structure 200 includes a substrate 110, a decorative layer 120, and a plurality of conductive elements 230, wherein each of the conductive elements 230 includes a first conductive pattern 232 and a second conductive pattern 234. The first conductive pattern 232 is located at least in the second region 104 and extends in the first direction D1. The second conductive pattern 234 includes a transmission section 234A and a overlapping section 234B. The transfer section 234A is located on the central portion 122 of the decorative layer 120 and extends in the second direction D2. The lap section 234B is connected between the first conductive pattern 232 and the transfer section 234A. In addition, the materials of the first conductive pattern 232 and the second conductive pattern 234 may be the same or different, and include a metal, a conductive oxide, a conductive polymer or other conductive materials. When the panel structure 200 is used as the touch panel, if the materials of the first conductive pattern 232 and the second conductive pattern 234 are the same, the touch panel formed by the panel structure 200 may be a single layer solution type (OLS). The touch panel, that is, the first conductive pattern 232 and the second conductive pattern 234 may be simultaneously formed in the same film layer. In addition, when the first conductive pattern 232 is required to have a certain light transmittance, the first conductive pattern 232 may be composed of at least one of a group consisting of a transparent conductive material, a metal, and a nano-sized nanowire. The type may be a continuous film or a grid; in the case of a metal, the shape may be a metal mesh or a thin film metal, but not limited thereto, and it may be a single layer or multiple layers. Stacking, including stacking of the same materials or stacking of different materials. In addition, The material and the shape of the second conductive pattern 234 may be the same as the first conductive pattern 232. Taking the metal grid as an example, the transmission section 234A and the lap section 234B of the second conductive pattern 234 may all be metal grids. It is also possible that only the overlapping section 234B or the transmission section 234A is a metal mesh.

In the present embodiment, the first conductive pattern 232 of the conductive element 230 is extended by the second region 104 in the first direction D1 to cover the first edge raised portion 124. At this time, the portion of the first conductive pattern 232 on the first edge convex portion 124 has a first line width W1, the transfer portion 234A has a second line width W2, and the first line width W1 is greater than the second line width W2. According to the description of the foregoing embodiment, the first line width W1 is greater than the second line width W2, so that the conductive element 230 can be continuously extended from the second area 104 to the first area 102 without being on the first edge protrusion 124. A wire break has occurred. In other words, the panel structure 200 has a desirable quality.

In addition, in the embodiment, the overlapping section 234B of the second conductive pattern 234 has a third line width W3 intersecting the first direction D1, and the third line width W3 is greater than the second line width W2. The lap section 234B is a section in which the second conductive pattern 234 is to be connected and in contact with the first conductive pattern 232. Therefore, the design that the third line width W3 is greater than the second line width W2 means that the second conductive pattern 234 is in contact with the increase in the area of the first conductive pattern 232, which helps to ensure the second conductive pattern 234 and the first conductive pattern 232. Electrical connection. Of course, in other embodiments, the third line width W3 may be greater than the first line width W1, or the third line width W3 may be equal to the first line width W1. In addition, it should be noted that the first conductive pattern 232 may have a first line width W1 in the first region 102, and may have other line widths different from the first line width W1 in the second region 104. For example, the cells spanning the first conductive pattern 232 at the first region 102 and the second region 104 may have a triangular shape with a bottom line having a first line width W1 and a line width of the first conductive pattern 232 facing the second region 104. The direction is shrinking.

In this embodiment, the order in which the first conductive patterns 232 and the second conductive patterns 234 are formed may be adjusted according to different requirements. Therefore, the cross-sectional structure of the panel structure 200 may vary depending on the order of fabrication. 4 is a cross-sectional view taken along line B-B of the panel structure of FIG. 3, in which the first conductive pattern is first formed and the second conductive pattern is formed. Referring to FIG. 3 and FIG. 4 simultaneously, when the first conductive pattern 232 is formed first and the second conductive pattern 234 is formed, the first conductive pattern 232 is continuously distributed along the surface of the decorative layer 120. At the same time, the overlapping section 234B of the second conductive pattern 234 covers the end of the first conductive pattern 232. That is, the end of the first conductive pattern 232 is located between the overlapping portion 234B of the second conductive pattern 234 and the decorative layer 120.

5 is a cross-sectional view taken along line B-B of the panel structure of FIG. 3, after the first conductive pattern is formed and the second conductive pattern is first formed. Referring to FIG. 3 and FIG. 4 simultaneously, when the second conductive pattern 234 is formed first and the first conductive pattern 232 is formed, the first conductive pattern 232 is continuously distributed along the surface of the decorative layer 120. At the same time, the end of the first conductive pattern 232 will cover the overlapping portion 234B of the second conductive pattern 234. That is, the overlapping section 234B of the second conductive pattern 234 is located between the end of the first conductive pattern 232 and the decorative layer 120.

In addition, in the panel structure 200, the first conductive pattern 232 and the second conductive pattern 234 may be utilized to form other members. For example, Figure 6 A partial top view of the panel structure of the third embodiment is created for the present invention, and FIG. 7 is a cross-sectional view of the panel structure of FIG. 6 taken along line C-C. Referring to FIG. 6 and FIG. 7 simultaneously, the panel structure 300 is similar to the panel structure 200, and thus the same and similar components in the two embodiments will be denoted by the same reference numerals. Specifically, the panel structure 300 includes a ground line 340 and an insulating layer 350. The ground line 340 is located between the second conductive pattern 234 of the conductive element 230 and the first edge raised portion 122 of the decorative layer 120.

In this embodiment, the ground line 340 and the second conductive pattern 234 are, for example, the same film layer. Accordingly, the insulating layer 350 covers the ground line 340 to separate the ground line 340 from the first conductive pattern 232 of the conductive element 230. In addition, in order to electrically connect the first conductive pattern 232 and the second conductive pattern 234, the insulating layer 350 has an opening 352 to expose the overlapping portion 234B of the second conductive pattern 234. In this way, the first conductive pattern 232 covers the insulating layer 350 and can be connected to the overlapping portion 234B through the opening 352.

In the present embodiment, the first conductive pattern 232 of the conductive element 230 extends from the second region 104 in the first direction D1 across the first edge raised portion 124. At this time, a portion of the first conductive pattern 232 on the first edge convex portion 124 has a first line width W1. The first line width W1 may be larger than the width WE of the portion of the transmission section 234A extending toward the overlapping section 234B to prevent the first conductive pattern 232 from extending from the second area 104 toward the first area 102, based on the unevenness of the decorative layer 120. Broken and broken. In addition, in other embodiments, the first conductive pattern 232 may cover only a portion of the overlapping segments 234B.

Figure 8 is a partial top view of the panel structure of the fourth embodiment of the present invention Intended, and FIG. 9 is a cross-sectional view of the panel structure of FIG. 8 taken along line D-D. Referring to FIG. 3, the panel structure 400 is similar to the panel structure 100, and thus the same and similar components in the two embodiments will be denoted by the same reference numerals. Specifically, the panel structure 400 includes a substrate 110, a decorative layer 120, and a plurality of conductive elements 430, wherein each of the conductive elements 430 includes a first conductive pattern 432 and a second conductive pattern 434. The first conductive pattern 432 is located at least in the second region 104 and extends in the first direction D1. The second conductive pattern 434 includes a transmission section 434A and a lap section 434B. The transfer section 434A is located on the central portion 122 of the decorative layer 120 and extends in the second direction D2. The lap section 434B is connected between the first conductive pattern 432 and the transfer section 434A. In addition, the materials of the first conductive pattern 432 and the second conductive pattern 434 may be the same or different, and the material and structure may be the same as the first conductive pattern 232 and the second conductive pattern 234, but not limited thereto. .

In the present embodiment, the first conductive pattern 432 of the conductive element 430 is extended by the second region 104 in the first direction D1 to cover the first edge raised portion 124. Moreover, in this embodiment, the overlapping section 434B of the second conductive pattern 434 and the first conductive pattern 432 both cover the first edge protrusion 124. At this time, the portion of the first conductive pattern 432 on the first edge convex portion 124 has a first line width W1, the transmission portion 434A has a second line width W2, and the first line width W1 is greater than the second line width W2. As can be seen from the description of the foregoing embodiments, the first line width W1 is greater than the second line width W2, such that the conductive element 430 is continuously extended from the second region 104 to the first region 102 without being on the first edge boss 124. A wire break has occurred. In other words, the panel structure 400 has a desirable quality. In addition, the first conductive pattern 432 does not have to be completely overlapped with the lap section 434B overlaps. In other embodiments, the first conductive pattern 432 and the overlap segment 434B may also only partially overlap, such as the lap relationship shown in FIG. Such a lap joint can be achieved by retracting or moving the first conductive pattern 432 toward the second region 104 or by expanding or displacing the lap segment 434B in the opposite direction of the second region 104.

In addition, in the embodiment, the overlapping section 434B of the second conductive pattern 434 has a third line width W3 intersecting the first direction D1, and the third line width W3 is greater than the second line width W2. Of course, in other embodiments, the third line width W3 may also be greater than the second line width W1. Alternatively, the third line width W3 may also be equal to the first line width W1. That is, the embodiment does not limit the size of the third line width W3. Any part of the conductive element 430 located on the first edge protrusion 124 has a line width larger than the line width of the transmission section 434A. The conductive element 430 is broken on the first edge protrusion 124.

Moreover, in the present embodiment, the overlapping section 434B of the second conductive pattern 434 is substantially located on the first edge protrusion 124, which helps to reduce the transmission section 434A of the second conductive pattern 434 and the second area 104. The gap G maintained between the boundaries. In this way, when the panel structure 400 has a plurality of transmission segments 434A juxtaposed in the first region 102, the width of the first region 102 can be further reduced as the gap G is reduced to achieve the effect of a narrow bezel.

10 is a partial top plan view of the panel structure of the fifth embodiment of the present invention, and FIG. 11A is a cross-sectional view of the panel structure of FIG. 10 taken along line E-E. Referring to FIG. 10 and FIG. 11A, the panel structure 500 is similar to the panel structure 100, and thus two Identical and similar components in the embodiments will be denoted by the same reference numerals. Specifically, the panel structure 500 includes a substrate 110, a decorative layer 120, and a plurality of conductive elements 530, wherein each of the conductive elements 530 includes a first conductive pattern 532 and a second conductive pattern 534. The first conductive pattern 532 is located at least in the second region 104 and extends in the first direction D1. The second conductive pattern 534 includes a transmission section 534A and a lap section 534B. The transfer section 534A is located on the central portion 122 of the decorative layer 120 and extends in the second direction D2. The lap section 534B is connected between the first conductive pattern 532 and the transfer section 534A.

Specifically, the landing stage 534B of the second conductive pattern 534 extends from the first region 102 toward the second region 104 in the first direction D1 and traverses the first edge protrusion 124. The landing stage 534B of the second conductive pattern 534 includes a traverse portion 534B1 that traverses the first edge protrusion portion 122 and a contact portion 534B2 that contacts the first conductive pattern 532. In the present embodiment, the traverse portion 534B1 is located substantially in the first region 102, and the contact portion 534B2 is located in the second region 104. When the material of the second conductive pattern 534 is metal, the panel structure 500 may further include an inner decorative layer 540 disposed in the second region 104 and adjacent to the decorative layer 120. The material of the inner decorative layer 540 may be, for example, a black or dark photoresist, or a black or dark ink to block a portion of the second conductive pattern 534 extending to the second region 104, such as the contact portion 534B2. In addition, when the decorative layer 120 has a multi-layered structure, the inner decorative layer 540 may also block the edges of the decorative layer 120 to avoid a poor visual effect due to unevenness in stacking when the multilayer structure is stacked. In the present embodiment, the inner decorative layer 540 is located between the substrate 110 and the second conductive pattern 534. Interior decoration during the process of making the panel structure 500 The layer 540 can be preferentially fabricated on the substrate 110, and then the decorative layer 120 is formed on the substrate 110. Alternatively, when the decorative layer 120 has a multi-layered structure, the inner decorative layer 540 may be fabricated with one of the layer structures of the decorative layer 120.

In addition, as shown in FIG. 11B, the interior decorative layer 540 may also be disposed between the first region 102 and the second region 104 and partially overlap the decorative layer 120. Certainly, one end of the first conductive pattern 532 may also be formed on the inner decorative layer 540 first, and then the contact portion 534B2 of the second conductive pattern 534 is overlapped with the first conductive pattern 532 on the inner decorative layer 540, such as the region X. Said. That is, the order in which the first conductive patterns 532 and the second conductive patterns 534 are formed is not particularly limited. In other designs, the first conductive pattern 532 may also extend continuously over the interior trim layer 540 toward the first region 102 to overlie the trim layer 120. As such, the contact portion 534B2 can be completely located in the first region 102. It is also mentioned that the decorative layer 120 may not cover the first conductive pattern 532.

As can be seen from FIG. 10, the traverse portion 534B1 has a first line width W1 and the first line width W1 is greater than the second line width W2 of the transmission portion 534A. In addition, the contact portion 534B2 has a third line width W3 and the third line width W3 is greater than the first line width W1. In the present embodiment, the design of the first line width W1 and the second line width W2 may allow the conductive member 530 to continuously extend between the first region 102 and the second region 104 without being easily broken. Meanwhile, the design in which the third line width W3 is larger than the first line width W1 may increase the contact area of the first conductive pattern 532 and the second conductive pattern 534. Therefore, the conductive element 530 can form a continuous conductive path to make the panel structure 500 have a desired quality, but not limited thereto. In other embodiments, the third line width W3 can also be smaller than the first line. Wide W1.

Moreover, in the present embodiment, the traversing portion 534B1 of the lap section 534B is substantially positioned on the first edge bulging portion 124, which helps to reduce the boundary between the transmission section 534A of the second conductive pattern 534 and the second region 104. The gap G maintained between. In this way, when the panel structure 500 has a plurality of transmission segments 534A juxtaposed in the first region 102, the width of the first region 102 can be further reduced as the gap G is reduced, and the effect of the narrow side width is achieved.

Figure 11C is a cross-sectional view showing the panel structure of the sixth embodiment of the present invention. In FIG. 11C, the panel structure 600 is substantially similar to the panel structure 500 described above, and thus the same components in the two embodiments will be denoted by the same reference numerals. In this embodiment, the second conductive pattern 534 in the panel structure 600 may be completely disposed in the first region 102 without additionally providing the interior decorative layer 540 illustrated in FIG. 11A, that is, as shown in FIG. 11B. As such, the second conductive pattern 534 can be completely blocked by the decorative layer 120 without being perceived by the user. Further, the first conductive pattern 532 may extend across the first edge protrusion 124 toward the first region 102. In addition, the contact portion 534B2 does not have to extend to the boundary between the first region 102 and the second region 104, and for example, it may be slightly extended beyond the first edge protrusion 124. It should be particularly noted that the order in which the first conductive patterns 532 and the second conductive patterns 534 are formed may also be reversed.

It should be understood that the above design is not limited to all the conductive elements, that is, as long as two or more conductive elements adopt the above design, it is within the scope of the novel creation, for example, there may be partial conductive Component (not shown) The first direction is the same as the second direction and does not intersect. Similarly, other components having multiple components are also the same, and will not be described again.

In the above embodiment, the material of the decorative layer 120 includes a photoresist, an ink, an inorganic material or a combination thereof. In addition, the specific structure of the decorative layer 120 can be of many types. For example, FIG. 12 to FIG. 17 are schematic cross-sectional views of a decorative layer of a plurality of embodiments of the present invention. The decorative layer shown in Figures 12 through 17 can be applied to any of the foregoing embodiments. Referring first to FIG. 12, the decorative layer 120A includes a first sub-decorative layer 10 and a second sub-decorative layer 20. The first sub-decorative layer 10 is located between the second sub-decorative layer 20 and the substrate 110. The first sub-decorative layer 10 has a central portion 12 and at least one edge portion 14. A first distance H1 between the top surface of the central portion 12 and the substrate 110 is less than a second distance H2 between the top surface of the edge portion 14 and the substrate 110. The difference between the first distance H1 and the second distance H2 is ΔH. In addition, the second sub-decorative layer 20 has a thickness T and ΔH>T. As such, the second sub-decorative layer 20 is disposed on the central portion 12 such that the decorative layer 120A has the central portion 122, the first edge protrusion 124, and the second edge protrusion 126 described in the foregoing embodiments.

Referring to FIG. 13 , the decorative layer 120B includes a first sub-decorative layer 10 and a second sub-decorative layer 20 . The first sub-decorative layer 10 is, for example, a white or colored ink, and the second sub-decorative layer 20 is, for example, a black or gray photoresist, but is not limited thereto. Preferably, the second sub-decorative layer 20 has an optical density greater than that of the first sub-decorative layer 10. The first sub-decorative layer 10 is located between the second sub-decorative layer 20 and the substrate 110. In addition, the first sub-decorative layer 10 includes an upper layer 10A, a middle layer 10B, and a lower layer 10C, wherein the middle layer 10B is located between the upper layer 10A and the lower layer 10C. In addition, the upper layer 10A, the middle layer 10B and the lower layer When the layer 10C has the width B1, the width B2, and the width B3, respectively, the width B2 of the middle layer 10B is smaller than the width B1 of the upper layer 10A and also smaller than the width B3 of the lower layer 10C. In addition, the width B1 of the upper layer 10A is also slightly smaller than the width B3 of the lower layer 10C, so that a step structure L is formed between the upper layer 10A and the lower layer 10C, and the edge protrusions of the lower layer 10C are partially or completely exposed, preferably partially. Exposed (as shown in Figure 13), so that the height of the edge projections can be further removed to further facilitate the continuous coverage of the conductive elements on the sidewalls of the decorative layer 120B. Of course, it is not limited thereto, as long as the line width of the conductive element at the step structure L is larger than the line width of the transmission section, which helps to improve the phenomenon of disconnection.

Referring to FIG. 14, the decorative layer 120C is similar to the decorative layer 120B, but the width B1, the width B2, and the width B3 are sequentially reduced. At this time, the lower layer 10C is covered by the intermediate layer 10B, the middle layer 10B is covered by the upper layer 10A, and the lower layer 10C is not in contact with the upper layer 10A. In addition, referring to FIG. 15, the decorative layer 120D is similar to the decorative layer 120B, but the width B1, the width B2, and the width B3 are sequentially increased. Thus, a step structure L is formed between the lower layer 10C and the middle layer 10B, and the edge protrusions of the lower layer 10C are partially or completely exposed, and a step structure is also formed between the middle layer 10B and the upper layer 10A. L2, and the edge protrusion of the middle layer 10B is partially or completely exposed, preferably partially exposed, so that the height of the edge protrusion can be further removed, so as to facilitate the continuous covering of the conductive element. The sidewall of layer 120D. Of course, it is not limited thereto. As long as the line width of the conductive element at the step structures L1 and L2 is larger than the line width of the transmission section, it helps to improve the phenomenon of disconnection.

In FIG. 16, the decorative layer 120E includes a first sub-decorative layer 10, and a second Sub-decorative layer 20 and insulating layer 30. The first sub-decorative layer 10 is located between the second sub-decorative layer 20 and the substrate 110. The stacking relationship and size of the first sub-decorative layer 10 and the second sub-decorative layer 20 can be referred to, for example, with reference to FIGS. 13 to 15 . But it is not limited to this. In addition, the insulating layer 30 may be further disposed between the first sub-decorative layer 10 and the second sub-decorative layer 20, and the insulating layer 30 substantially covers the surface of the first sub-decorative layer 10, and may selectively extend to cover The entire surface of the substrate 110. The insulating layer 30 can further block the interaction of the second sub-decorative layer 20 with the first sub-decorative layer 10, such as color mixing. Further, the insulating layer 30 may be, for example, an inorganic material, and may be an optical matching layer.

In FIG. 17, the decorative layer 120F may include a decorative layer body 40 and an insulating layer 50, wherein the decorative layer body 40 has a structural design as the aforementioned decorative layer 120, which is not described herein. Here, the insulating layer 50 covers the decorative layer body 40, and the decorative layer body 40 is located between the substrate 110 and the insulating layer 50. When the decorative layer 120F is applied to the aforementioned panel structures 100 to 600, the arrangement of the insulating layer 50 contributes to improving the fabrication yield of the conductive member. For example, the conductive material formed on the insulating layer 50 is less likely to undergo short-circuit removal between the conductive elements that should be separated from each other during the patterning process. Of course, the insulating layer 50 does not have to completely cover the decorative layer body 40, that is, only a portion of the decorative layer body 40 may be covered, for example, may extend from the inner edge of the decorative layer body 40 to the first edge convex portion. Further, the material of the insulating layer 50 may be, for example, a transparent photoresist.

In summary, in the panel structure of the present creative embodiment, the conductive members extending to the decorative layer have a sufficient width. Therefore, the decorative layer has unevenness At the time of thickness, the conductive member is not easily broken. Therefore, the panel structure of the novel creation embodiment of the present invention has an ideal quality.

102‧‧‧First area

104‧‧‧Second area

120‧‧‧decorative layer

122‧‧‧Central Department

124‧‧‧First edge raised

200‧‧‧ panel structure

230‧‧‧Conducting components

232‧‧‧First conductive pattern

234‧‧‧Second conductive pattern

234A‧‧‧Transport segment

234B‧‧‧ lap

B-B‧‧‧ cut line

D1‧‧‧ first direction

D2‧‧‧ second direction

W1‧‧‧ first width

W2‧‧‧ second width

W3‧‧‧ third width

Claims (21)

A panel structure includes: a substrate; a decorative layer disposed on the substrate, wherein the decorative layer is in a first region and the region outside the decorative layer is a second region, wherein the decorative layer includes a central portion And a first edge protrusion having a thickness greater than a thickness of the central portion, and the first edge protrusion is located between the central portion and the second region; a plurality of conductive elements, Each of the conductive elements extends from the second region toward the first region in a first direction and traverses the first edge protrusion and extends in a second direction on the central portion of the decorative layer, the first direction Intersecting with the second direction, wherein each of the conductive elements has a first line width on the first edge protrusion, and each of the conductive elements has a second line on the central portion and extending in the second direction Wide, and the first line width is greater than the second line width. The panel structure of claim 1, wherein each of the conductive elements comprises: a first conductive pattern, at least in the second region and extending along the first direction; and a second conductive pattern, including a a transmission section and a lap section, the transmission section extending along the second direction and having the second line width, the lap section being connected between the first conductive pattern and the transmission section. The panel structure according to claim 2, wherein each of the conductive elements The first conductive pattern of the piece extends from the second area along the first direction to cover the first edge protrusion, and the first conductive pattern has the first line on the first edge protrusion width. The panel structure of claim 3, wherein the overlapping section has a third line width intersecting the first direction, and the third line width is greater than the second line width. The panel structure of claim 3, wherein the overlapping segment and the first conductive pattern both cover the first edge protrusion. The panel structure of claim 3, further comprising a grounding wire and an insulating layer, the grounding wire and the second conductive pattern being the same film layer, wherein the grounding wire is located in the second conductive case and the first Between the edge protrusions, the insulating layer covers the ground line and has an opening to expose the overlapping portion of the second conductive pattern, the first conductive pattern covering the insulating layer and connected to the insulating layer through the opening Lap section. The panel structure of claim 2, wherein the overlapping portion of the second conductive pattern extends from the first region toward the second region along the first direction and traverses the first edge unit. The panel structure of claim 7, wherein the overlapping section of the second conductive pattern comprises a traverse portion traversing the first edge protrusion and a contact portion contacting the first conductive pattern The traverse portion has the first line width and the contact portion has a third line width and the third line width is greater than the first line width. The panel structure of claim 1, wherein the decorative layer further comprises a second edge protrusion, the first edge protrusion and the second edge protrusion Located on opposite sides of the central portion. The panel structure of claim 9, further comprising a grounding wire covering the second edge convex portion. The panel structure of claim 1, wherein the decorative layer comprises a first sub-decorative layer and a second sub-decorative layer, the first sub-decorative layer being located between the second sub-decorative layer and the substrate . The panel structure of claim 11, wherein the decorative layer comprises an insulating layer disposed between the first sub-decorative layer and the second sub-decorative layer. The panel structure of claim 11, wherein the first sub-decorative layer has a central portion and at least one edge portion, and a first distance between the top surface of the central portion and the substrate is smaller than the edge portion a second distance between the top surface and the substrate, the difference between the first distance and the second distance is ΔH, the thickness of the second sub-decorative layer is T, and ΔH>T, the second sub- A decorative layer is disposed on the central portion to constitute the central portion of the decorative layer. The panel structure of claim 11, wherein the second sub-decorative layer has an optical density greater than an optical density of the first sub-decorative layer. The panel structure of claim 11, wherein the first sub-decorative layer comprises an upper layer, a middle layer and a lower layer, the middle layer being located between the upper layer and the lower layer. The panel structure of claim 15, wherein the width of the middle layer is smaller than the width of the upper layer and smaller than the width of the lower layer. The panel structure of claim 15, wherein the width of the lower layer is greater than the width of the upper layer. The panel structure according to claim 15, wherein the widths of the upper layer, the middle layer and the lower layer are sequentially increased. The panel structure of claim 15, wherein the width of the upper layer, the middle layer and the lower layer are sequentially reduced. The panel structure of claim 2, wherein the first conductive pattern is a metal grid. The panel structure of claim 1, wherein the decorative layer comprises a decorative layer body and an insulating layer extending from the second region to the first region to the first edge convex portion .