TWM471044U - Card edge connector - Google Patents
Card edge connector Download PDFInfo
- Publication number
- TWM471044U TWM471044U TW102211328U TW102211328U TWM471044U TW M471044 U TWM471044 U TW M471044U TW 102211328 U TW102211328 U TW 102211328U TW 102211328 U TW102211328 U TW 102211328U TW M471044 U TWM471044 U TW M471044U
- Authority
- TW
- Taiwan
- Prior art keywords
- slot
- edge connector
- card edge
- holding
- arm
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/83—Coupling devices connected with low or zero insertion force connected with pivoting of printed circuits or like after insertion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
Description
本創作涉及電子領域,尤其是指一種卡緣連接器。This creation relates to the field of electronics, and in particular to a card edge connector.
現有之一種卡緣連接器,如應用於筆記型電腦中之卡緣連接器,一般包括絕緣體及設置於絕緣體內之複數導電端子。所述絕緣體包括縱長方向延伸之插槽及位於插槽上下兩側之間隔排列之複數端子槽道。所述導電端子包括豎直設置之基部、自基部一端朝向一側延伸之接觸部、自基部另一端朝向另一側延伸之焊接部及自基部延伸朝向一側延伸並位於接觸部與焊接部之間之固持部。然而,這種導電端子尤其是收容於下側端子槽道之導電端子呈F構型,使導電端子之高度較高,導致絕緣體之高度較高,進而導致整個連接器之高度較高,不利於薄型化之發展趨勢。A card edge connector, such as a card edge connector used in a notebook computer, generally includes an insulator and a plurality of conductive terminals disposed in the insulator. The insulator includes a slot extending in the longitudinal direction and a plurality of terminal slots arranged at intervals on the upper and lower sides of the slot. The conductive terminal includes a vertically disposed base portion, a contact portion extending from one end of the base portion toward one side, a solder portion extending from the other end of the base portion toward the other side, and extending from the base portion toward one side and located at the contact portion and the solder portion. The holding unit. However, the conductive terminal, in particular, the conductive terminal received in the lower terminal channel has an F configuration, so that the height of the conductive terminal is high, resulting in a high height of the insulator, thereby causing a high height of the entire connector, which is disadvantageous for The trend of thinning.
故,有必要提供一種新之卡緣連接器克服上述問題。Therefore, it is necessary to provide a new card edge connector to overcome the above problems.
基於此,有必要提供一種高度較低之卡緣連接器。Based on this, it is necessary to provide a lower height card edge connector.
本創作是通過以下技術方案實現之:一種卡緣連接器,是插接記憶模組,其包括絕緣體及複數導電端子,所述絕緣體包括縱長方向延伸之插槽、位於插槽內之防呆鍵、分別位於所述插槽上下兩側之複數上槽道與下槽道,所述導電端子包括收容於上槽道內之上端子和收容於下槽道 內之下端子,所述下端子包括固持於所述下槽道之第一固持部、自第一固持部一端延伸在插槽中之第一接觸部及自第一固持部另一端彎折延伸之第一焊接部,該插槽之中心線至第一焊接部之安裝面之高度1.20mm。The present invention is achieved by the following technical solution: a card edge connector is a plug-in memory module, which comprises an insulator and a plurality of conductive terminals, the insulator includes a slot extending in the longitudinal direction, and the docking in the slot The plurality of upper and lower channels are respectively located on the upper and lower sides of the slot, and the conductive terminal includes a terminal received in the upper channel and a terminal received in the lower channel, the lower terminal The first holding portion that is retained in the lower channel, the first contact portion extending from one end of the first holding portion in the slot, and the first soldering portion that is bent and extended from the other end of the first holding portion, the slot Height of the center line to the mounting surface of the first welded portion 1.20mm.
本創作之有益效果如下:卡緣連接器之下端子結構簡單,安裝方便,降低了安裝下端子之絕緣體下側之厚度,從而減小了整個絕緣體之厚度。The beneficial effects of the creation are as follows: the terminal structure under the card edge connector is simple, the installation is convenient, and the thickness of the lower side of the insulator of the lower terminal is reduced, thereby reducing the thickness of the entire insulator.
100‧‧‧卡緣連接器100‧‧‧ card edge connector
200‧‧‧記憶模組200‧‧‧ memory module
300‧‧‧電路板300‧‧‧ boards
1‧‧‧絕緣體1‧‧‧Insulator
11‧‧‧插槽11‧‧‧Slot
110‧‧‧防呆鍵110‧‧‧Defense button
12‧‧‧上槽道12‧‧‧Upper channel
13‧‧‧下槽道13‧‧‧ lower channel
131‧‧‧固持槽131‧‧‧ holding slot
132‧‧‧收容槽132‧‧‧ Containment trough
2‧‧‧導電端子2‧‧‧Electrical terminals
22‧‧‧上端子22‧‧‧Upper terminal
23‧‧‧下端子23‧‧‧ Lower terminal
221‧‧‧第二固持部221‧‧‧Second Holding Department
222‧‧‧第二接觸部222‧‧‧Second contact
223‧‧‧第二焊接部223‧‧‧Second welding department
231‧‧‧第一固持部231‧‧‧First Holding Department
232‧‧‧第一接觸部232‧‧‧First contact
233‧‧‧第一焊接部233‧‧‧First Welding Department
4‧‧‧延伸臂4‧‧‧Extension arm
41‧‧‧卡槽41‧‧‧ card slot
5‧‧‧卡持臂5‧‧‧ card holding arm
51‧‧‧卡扣部51‧‧‧Snap Department
52‧‧‧凸台52‧‧‧Boss
53‧‧‧連接部53‧‧‧Connecting Department
6‧‧‧金屬體6‧‧‧Metal body
61‧‧‧卡持部61‧‧‧Keeping Department
62‧‧‧相連部62‧‧‧Connected Department
63‧‧‧焊接片63‧‧‧welding piece
第一圖為本創作卡緣連接器連接記憶模組與電路板之立體組裝圖;第二圖為第一圖所示卡緣連接器連接記憶模組與電路板之前之立體示意圖;第三圖為第一圖所示卡緣連接器位於電路板上之立體示意圖;第四圖為第一圖所示卡緣連接器之立體分解圖;第五圖為第一圖所述卡緣連接器部分區域立體放大圖;第六圖為第一圖所示卡緣連接器沿線VI-VI方向之剖視圖。The first figure is a three-dimensional assembly diagram of the memory card edge connector connecting the memory module and the circuit board; the second figure is a three-dimensional schematic view of the card edge connector connected to the memory module and the circuit board in the first figure; 1 is a perspective view of the card edge connector shown on the first circuit board; the fourth figure is an exploded perspective view of the card edge connector shown in the first figure; the fifth figure is the card edge connector portion of the first figure The three-dimensional enlarged view of the area; the sixth figure is a cross-sectional view of the card edge connector shown in the first figure along the line VI-VI.
請參第一圖至第五圖,本創作揭示一種卡緣連接器100,用於卡接記憶模組200,且將記憶模組200電性連接於一電路板300上,該記憶模組包括子電路板及安裝在子電路板上之晶片(未圖式)。卡緣連接器100包括絕緣體1及複數導電端子2,絕緣體1包括縱長方向延伸之插槽11、位於插槽內之防呆鍵110及位於插槽11上下兩側之複數上槽道12與下槽道13。下槽道13呈T形,其包括自絕緣體1之後表面向前凹陷之水準固持槽131及自插槽 11下側向下凹陷且連通固持槽131之豎直收容槽132,收容槽132向後延伸至貫通絕緣體之後表面。絕緣體1下側後表面比絕緣體1之上側後表面更靠後。複數上槽道12排列成一排,複數下槽道13排列成一排。自絕緣體之上表面向下看,上槽道12與下槽道13相互交錯之排列。Referring to FIG. 1 to FIG. 5 , the present invention discloses a card edge connector 100 for latching the memory module 200 and electrically connecting the memory module 200 to a circuit board 300. The memory module includes Sub-board and wafer mounted on the sub-board (not shown). The card edge connector 100 includes an insulator 1 and a plurality of conductive terminals 2, and the insulator 1 includes a slot 11 extending in the longitudinal direction, a foolproof button 110 located in the slot, and a plurality of upper channels 12 on the upper and lower sides of the slot 11. Lower channel 13. The lower channel 13 has a T shape, and includes a leveling groove 131 and a self-slot recessed from the surface of the insulator 1 The lower side is recessed downwardly and communicates with the vertical receiving groove 132 of the holding groove 131. The receiving groove 132 extends rearward to penetrate the rear surface of the insulator. The lower rear surface of the insulator 1 is further rearward than the upper rear surface of the insulator 1. The plurality of upper channels 12 are arranged in a row, and the plurality of lower channels 13 are arranged in a row. The upper channel 12 and the lower channel 13 are alternately arranged from each other as viewed from the upper surface of the insulator.
前述導電端子2包括收容於上槽道12內之上端子22和收容於下槽道12內之下端子23。下端子23包括固持於固持槽131之第一固持部231、自第一固持部231一端向前彎折延伸之第一接觸部232及自第一固持部231另一端向後彎折延伸之第一焊接部233,第一接觸部232收容於收容槽132且延伸至插槽11中。第一焊接部233暴露於絕緣體1之後表面之後方。The conductive terminal 2 includes a terminal 22 received in the upper channel 12 and a terminal 23 received in the lower channel 12. The lower terminal 23 includes a first holding portion 231 that is fixed to the holding groove 131 , a first contact portion 232 that is bent forward from one end of the first holding portion 231 , and a first bent portion that extends backward from the other end of the first holding portion 231 . The soldering portion 233 receives the first contact portion 232 in the receiving groove 132 and extends into the slot 11 . The first soldering portion 233 is exposed to the rear surface of the rear surface of the insulator 1.
上端子22包括固持於所述絕緣體1上側之第二固持部221、自第二固持部221向後彎折延伸且收容於收容插槽11之第二接觸部222及自所述第二固持部221向前彎折延伸之第二焊接部223,第二焊接部223延伸出所述絕緣體1且位於絕緣體1之前方。第一焊接部233之焊接面與第二焊接部223之焊接面在同一水平面,有利於將上、下端子22、23同時焊接於電路板300上。The upper terminal 22 includes a second holding portion 221 that is fixed on the upper side of the insulator 1 , a second contact portion 222 that is bent backward from the second holding portion 221 and is received in the receiving slot 11 , and the second holding portion 221 . The second welded portion 223 is bent forward, and the second welded portion 223 extends out of the insulator 1 and is located in front of the insulator 1. The welding surface of the first welded portion 233 and the welded surface of the second welded portion 223 are in the same horizontal plane, which facilitates simultaneous soldering of the upper and lower terminals 22, 23 to the circuit board 300.
卡緣連接器100還包括自絕緣體1兩端向前延伸之一對鎖扣臂,該鎖扣臂包括延伸臂4及分別安裝於延伸臂4上之卡持臂5。延伸臂4與絕緣體1一體成型。延伸臂4設有自其後表面向前凹陷而成之卡槽41,卡持臂5具有位於其前端且卡持於卡槽41之卡扣部51、位於其後端且向內凸伸之凸台52及連接卡扣部51與凸台52之連接部53。The card edge connector 100 further includes a pair of latch arms extending forwardly from opposite ends of the insulator 1, the latch arms including the extension arms 4 and the latch arms 5 respectively mounted on the extension arms 4. The extension arm 4 is integrally formed with the insulator 1. The extension arm 4 is provided with a card slot 41 which is recessed forward from the rear surface thereof. The latching arm 5 has a latching portion 51 at the front end thereof and being held by the card slot 41, and a convex portion at the rear end thereof and protruding inwardly. The table 52 and the connecting portion 53 of the connecting portion 51 and the boss 52.
卡緣連接器100還包括安裝於所述卡接臂5與延伸臂4上之金屬體6,金屬體6卡持於延伸臂4中,金屬體6與卡持臂5一體成型,卡持臂5 覆蓋並連接金屬體6之外表面。金屬體6包括卡持於延伸臂4內卡持部61、自卡持部61向後延伸之相連部62及自相連部62向內側向延伸之焊接片63。相連部62與卡持臂5之連接部53固定在一起。The card edge connector 100 further includes a metal body 6 mounted on the latching arm 5 and the extension arm 4, the metal body 6 is held in the extension arm 4, and the metal body 6 is integrally formed with the clamping arm 5, and the clamping arm is 5 Cover and connect the outer surface of the metal body 6. The metal body 6 includes a holding portion 61 that is held in the extension arm 4, a connecting portion 62 that extends rearward from the holding portion 61, and a welding piece 63 that extends inward from the connecting portion 62. The connecting portion 62 is fixed to the connecting portion 53 of the holding arm 5.
如第六圖所示,插槽之中心線至第一焊接部之安裝面之高度A1.20mm,以改善絕緣體1之上表面至第一焊接部之安裝面之距離B2.70mm。記憶模組200上晶片(未圖示)安裝在電路板之一個表面上,上述高度可以使得插入插槽11之記憶模組200更加薄,更加小型化。As shown in the sixth figure, the height A of the mounting line of the center line of the slot to the first soldering portion 1.20mm to improve the distance B from the upper surface of the insulator 1 to the mounting surface of the first welded portion B 2.70mm. A wafer (not shown) on the memory module 200 is mounted on one surface of the circuit board. The height allows the memory module 200 inserted into the slot 11 to be thinner and more compact.
當記憶模組200插接在卡緣連接器100時,下端子23與上端子22之第一、第二焊接部233、223焊接與電路板300之導電片301相焊接,金屬體6之焊接片63焊接於電路板300之焊片302上。卡持臂5之凸台52卡持於記憶模組200之兩側。When the memory module 200 is inserted into the card edge connector 100, the first and second soldering portions 233 and 223 of the lower terminal 23 and the upper terminal 22 are soldered to the conductive sheet 301 of the circuit board 300, and the metal body 6 is soldered. The sheet 63 is soldered to the solder tab 302 of the circuit board 300. The bosses 52 of the holding arms 5 are held on both sides of the memory module 200.
本創作卡緣連接器100改進了現有卡緣連接器中絕緣體與下端子相連之方式,從而降低了安裝下端子23之絕緣體1下側之厚度,從而減小了整個絕緣體1之厚度。The present card edge connector 100 improves the manner in which the insulator is connected to the lower terminal in the conventional card edge connector, thereby reducing the thickness of the lower side of the insulator 1 on which the lower terminal 23 is mounted, thereby reducing the thickness of the entire insulator 1.
上述所列具體實現方式為非限制性之,對於本領域之技術人員來說,在不偏離本創作範圍內,進行之各種改進和變化,均屬於本創作之保護範圍。The specific implementations listed above are non-limiting, and various modifications and changes made by those skilled in the art without departing from the scope of the invention are within the scope of the present invention.
11‧‧‧插槽11‧‧‧Slot
12‧‧‧上槽道12‧‧‧Upper channel
13‧‧‧下槽道13‧‧‧ lower channel
131‧‧‧固持槽131‧‧‧ holding slot
132‧‧‧收容槽132‧‧‧ Containment trough
221‧‧‧第二固持部221‧‧‧Second Holding Department
222‧‧‧第二接觸部222‧‧‧Second contact
223‧‧‧第二焊接部223‧‧‧Second welding department
231‧‧‧第一固持部231‧‧‧First Holding Department
232‧‧‧第一接觸部232‧‧‧First contact
233‧‧‧第一焊接部233‧‧‧First Welding Department
Claims (8)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201220292388 | 2012-06-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM471044U true TWM471044U (en) | 2014-01-21 |
Family
ID=47971052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102211328U TWM471044U (en) | 2012-06-20 | 2013-06-18 | Card edge connector |
Country Status (3)
Country | Link |
---|---|
CN (2) | CN202977797U (en) |
TW (1) | TWM471044U (en) |
WO (1) | WO2013189166A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202977797U (en) * | 2012-06-20 | 2013-06-05 | 启东乾朔电子有限公司 | Clamping edge connector |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201638971U (en) * | 2009-12-23 | 2010-11-17 | 富士康(昆山)电脑接插件有限公司 | Card flange connector |
CN201829663U (en) * | 2010-09-27 | 2011-05-11 | 富士康(昆山)电脑接插件有限公司 | Electronic card connector |
CN201956478U (en) * | 2010-12-17 | 2011-08-31 | 康而富控股股份有限公司 | Electrical connector |
CN202094330U (en) * | 2011-04-29 | 2011-12-28 | 百慕大商泰科资讯科技有限公司 | Card edge connector |
CN202217811U (en) * | 2011-08-18 | 2012-05-09 | 泰科电子(上海)有限公司 | Card edge connector |
CN202977797U (en) * | 2012-06-20 | 2013-06-05 | 启东乾朔电子有限公司 | Clamping edge connector |
-
2012
- 2012-12-20 CN CN2012207078874U patent/CN202977797U/en not_active Expired - Fee Related
- 2012-12-20 CN CN2012105582442A patent/CN103022765A/en active Pending
-
2013
- 2013-01-17 WO PCT/CN2013/000047 patent/WO2013189166A1/en active Application Filing
- 2013-06-18 TW TW102211328U patent/TWM471044U/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2013189166A1 (en) | 2013-12-27 |
CN202977797U (en) | 2013-06-05 |
CN103022765A (en) | 2013-04-03 |
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Legal Events
Date | Code | Title | Description |
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MM4K | Annulment or lapse of a utility model due to non-payment of fees |