TWM470318U - Touch panel - Google Patents

Abstract

A touch panel comprises a transparent substrate, a touch sensor layer disposed under the transparent substrate and a ground ring disposed on or above or under a black matrix and around the sidewall of the touch sensor layer.

Description

Touch panel

The present invention relates to a touch panel, and more particularly to a touch panel having a ground ring design capable of reducing a frame.

The touch display is an input/output device formed by combining sensing technology and display technology, and is commonly used in electronic devices, such as portable and handheld electronic devices.

A capacitive touch panel is a commonly used touch panel that utilizes a capacitive coupling effect to detect a touch position. When the finger touches the surface of the capacitive touch panel, the capacitance of the corresponding position is changed, and the touch position is detected.

The first A picture and the first B picture respectively show a cross-sectional view and a top view of the touch panel. The first A diagram shows that a black matrix (BM) 8 is provided around the lower surface of the glass substrate 2, and a touch sensing layer 4 is provided on the lower surfaces of the glass substrate 2 and the black matrix 8. The touch sensing layer 4 includes an electrode layer to detect a touch position. The lower surface of the touch sensing layer 4 is provided with a trace portion 11 and a ground ring 12, a first overcoat layer 15 and a bridge 17. The second cover layer 6 is disposed to cover the touch sensing layer 4, the wire portion 11 and the ground ring 12 and the first cover layer 15. The wire portion 11 and the grounding ring 12 are located directly below the black matrix 8.

The first B diagram shows the protective design of the grounding ring 12 of the touch panel surrounding the electrodes 14 and 16 and the wires 18 to achieve electrostatic discharge. The first B diagram simultaneously shows the connection portion 17 connecting the adjacent electrodes 16.

However, in the case where the size of the touch panel is limited, in order to increase the area of the touch panel that can be touch-sensitive and displayable, the width of the black matrix 8 or the width of the border of the touch panel must be reduced as much as possible. The purpose of the border. Therefore, the outer dimension of the touch panel can be reduced without changing the size of the touch panel. However, since the wire portion 11 and the grounding ring 12 are located directly below the black matrix 8, the width reduction of the black matrix 8 is limited.

Therefore, there is a need to provide a novel touch panel for improving the disadvantages of the above conventional touch panel.

In view of the above, one of the purposes of the new embodiment is to provide a touch panel having a ground ring design that can reduce the frame to increase the area that can be touch-sensitive and displayable.

According to an embodiment of the invention, the touch panel comprises a transparent substrate, a touch sensing layer and a grounding ring. The touch sensing layer is disposed on a lower surface of the transparent substrate, and the grounding ring is disposed on a side of the touch sensing layer and surrounds the touch sensing layer.

According to another embodiment of the present invention, the touch panel includes a transparent substrate, a black matrix disposed on the lower surface of the transparent substrate, a touch sensing layer disposed on the transparent substrate and the lower surface of the black matrix, and a ground ring disposed on the black Below or above the matrix and around the touch sensing layer.

2A to 2C are cross-sectional views showing the touch panel of the third embodiment of the present invention. This embodiment is preferably applied to a one-piece glass substrate (OGS) or a one-film substrate/solution (OFS) touch panel, but is not limited thereto.

As shown in FIG. 2A, a black matrix 26 is disposed around the lower surface of the glass substrate 20 of the touch panel, and a touch sensing layer 21 is disposed on the lower surface of the glass substrate 20 and the black matrix 26. The touch sensing layer 21 includes an electrode layer to detect a touch position. The lower surface of the touch sensing layer 21 is provided with a lead portion 24, a first cover layer 25 and a connecting portion 27. The second cover layer 28 is disposed to cover the touch sensing layer 21, the wire portion 24 and the first cover layer 25. The lead portion 24 is located directly below the black matrix 26. The grounding ring 22A is located on the side of the touch panel. The preferred embodiment surrounds the touch panel and is located on the side of the black matrix 26, the touch sensing layer 21 and the second cover layer 28, and is matched with the system.

In the embodiment shown in FIG. 2B, the grounding ring 22B is located on the side of the black matrix 26 and the touch sensing layer 21 and surrounds the touch panel. In the embodiment shown in FIG. 2C, the grounding ring 22C is located on the side of the black matrix 26, the touch sensing layer 21, and a portion of the second covering layer 28. It should be noted that the grounding ring is not limited to the side of any one or both of the black matrix 26, the touch sensing layer 21, or the second covering layer 28, that is, the grounding ring mainly needs to surround the touch sensing layer. , wire section to block external static electricity.

The material of the transparent substrate 20 may be an insulating material such as glass, polycarbonate (PC), polyethylene terephthalate (PET), polyethylene (Polyethylen, PE), polyvinyl chloride (Poly). Vinyl chloride, PVC), Polystyrene (PS), Polystyrene (PS), Polymethyl methacrylate (PMMA) or Cyclic olefin copolymer (COC) .

The touch sensing layer 21 includes a structure formed of a conductive material. The conductive material may be indium tin oxide (ITO), indium zinc oxide (IZO), aluminum-doped ZnO (AZO) or antimony tin oxide (ATO), nai. Rice silver or nano copper.

The grounding ring 22 includes a conductive material, such as indium tin oxide, indium zinc oxide, zinc aluminum oxide or tin oxide germanium, which is formed on the side of the touch panel by sputtering or printing, and surrounds the touch panel, but is not limited thereto. this.

2D to 2F show cross-sectional views of the touch panel of the other three embodiments of the present invention. This embodiment is also preferably applied to a single-piece glass touch panel or a single-film touch panel, but is not limited thereto.

As shown in FIG. 2D, a black matrix 26 is disposed around the lower surface of the glass substrate 20 of the touch panel, and a touch sensing layer 21 is disposed on the lower surface of the glass substrate 20 and the black matrix 26, and the grounding ring 23A is provided. Located below or below the black matrix 26 in the touch sensing layer 21. The touch sensing layer 21 includes an electrode layer to detect a touch position. The ground ring 23A can be located under the black matrix 26 in the touch sensing layer 21 and at any position of the electrode layer. The lower surface of the touch sensing layer 21 is provided with a lead portion 24, a first cover layer 25 and a connecting portion 27. The second cover layer 28 is disposed to cover the touch sensing layer 21, the wire portion 24 and the first cover layer 25. The wire portion 24 is also located directly below the black matrix 26.

In the embodiment shown in FIG. E, the ground ring 23B is located below or below the glass substrate 20 or above the black matrix 26. In the embodiment shown in the second F diagram, the grounding ring 23C is located below the black matrix 26 and below the second cover layer 28 or in the lower surface of the second cover layer 28 or in the second cover layer 28.

The grounding ring 23A includes a conductive material, such as indium tin oxide, indium zinc oxide, zinc aluminum oxide or tin oxide germanium, which may be formed in the touch sensing layer 21 simultaneously with the electrode layer and under the black matrix 26, and surround the electrode layer, but It is not limited to this.

The grounding ring 23B includes a conductive material, such as indium tin oxide, indium zinc oxide, zinc aluminum oxide or tin oxide germanium, which may be formed on the lower surface of the glass substrate 20 and above the black matrix 26, and surrounds the electrode layer, but is not limited thereto. .

The grounding ring 23C includes a conductive material, such as indium tin oxide, indium zinc oxide, zinc aluminum oxide or tin oxide germanium, which may be formed in the second cover layer 28 or under the second cover layer 28 or on the lower surface of the second cover layer 28, and It is located below the black matrix 26 and surrounds the electrode layer, but is not limited thereto.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; any equivalent changes or modifications made without departing from the spirit of the novel disclosure are included in the following. Within the scope of the patent application.

2‧‧‧ glass substrate
4‧‧‧ touch sensing layer
6‧‧‧Second overlay
8‧‧‧Black matrix
11‧‧‧Wire Department
12‧‧‧ Grounding ring
14‧‧‧Electrode
15‧‧‧First cover
16‧‧‧Electrode
17‧‧‧Connecting Department
18‧‧‧Wire
20‧‧‧ glass substrate
21‧‧‧Touch sensing layer
22A~22C‧‧‧ Grounding ring
23A~23C‧‧‧ Grounding ring
24‧‧‧Wire Department
25‧‧‧First cover
26‧‧‧Black matrix
27‧‧‧Connecting Department
28‧‧‧Second overlay

The first A picture and the first B picture respectively show a cross-sectional view and a top view of the touch panel. 2A to 2F are cross-sectional views showing the touch panel of the six embodiments of the present invention.

20‧‧‧ glass substrate

21‧‧‧Touch sensing layer

22‧‧‧ Grounding ring

24‧‧‧Wire Department

25‧‧‧First cover

26‧‧‧Black matrix

27‧‧‧Connecting Department

28‧‧‧Second overlay

Claims (16)

A touch panel includes: a transparent substrate; a touch sensing layer disposed on a lower surface of the transparent substrate; and a ground ring disposed on a side of the touch sensing layer and surrounding the touch sensing layer. The touch panel of claim 1, further comprising a black matrix disposed on a lower surface of the transparent substrate, the touch sensing layer being disposed on the transparent substrate and a lower surface of the black matrix, wherein the ground ring The touch sensing layer is disposed on a side of the black matrix and surrounds the touch sensing layer. The touch panel of claim 2, further comprising a cover layer disposed to cover the touch sensing layer, wherein the ground ring is disposed on the side of the touch sensing layer, the black matrix and the cover layer Surround the touch sensing layer. The touch panel of claim 1, wherein the transparent substrate comprises glass, polycarbonate (polycarbonate, PC), polyethylene terephthalate (PET), polyethylene (Polyethylen, PE), Polyvinyl Chloride (PVC), Polypropylene (PP), Polystyrene (PS), Polymethyl methacrylate (PMMA) or cyclic olefin copolymerization Cyclic olefin copolymer (COC). The touch panel of claim 1, wherein the touch sensing layer comprises a transparent structure formed of a transparent conductive material, the transparent conductive material comprising indium tin oxide (ITO), indium zinc oxide (indium zinc oxide, IZO), aluminum oxide (Al-doped ZnO, AZO) or antimony tin oxide (ATO), nano silver or nano copper. The touch panel of claim 1, wherein the ground ring comprises indium tin oxide, indium zinc oxide, zinc aluminum oxide or tin oxide. The touch panel of claim 6, wherein the ground ring is formed on the side of the touch sensing layer by sputtering or printing. The touch panel of claim 1, wherein the touch panel comprises a single-chip glass touch panel or a single-film touch panel. A touch panel includes: a transparent substrate; a black matrix disposed on a lower surface of the transparent substrate; a touch sensing layer disposed on the transparent substrate and a lower surface of the black matrix; and a ground ring disposed on the black matrix Below or above and surrounding the touch sensing layer. The touch panel of claim 9, further comprising a cover layer covering the touch sensing layer. The touch panel of claim 9, wherein the ground ring comprises indium tin oxide, indium zinc oxide, zinc aluminum oxide or tin oxide. The touch panel of claim 9, wherein the grounding ring is disposed on a lower surface of the black matrix and surrounds the touch sensing layer. The touch panel of claim 9, wherein the grounding ring is disposed under the lower surface of the transparent substrate and above the black matrix and surrounds the touch sensing layer. The touch panel of claim 10, wherein the grounding ring is disposed below the black matrix and below or below the cover layer. The touch panel of claim 10, wherein the grounding ring is disposed below the black matrix and within the cover layer. The touch panel of claim 9, wherein the touch panel comprises a monolithic glass touch panel or a single film touch panel.