TWM464603U - LED lamp structure - Google Patents

Description

LED lamp body structure

The present invention relates to an LED lamp body structure, and more particularly to an LED lamp body structure in which a frame is punched through a hole outside the lamp body to achieve a better heat dissipation effect.

The light-emitting diode has the advantages of small volume, low power consumption, fast reaction speed and long service life. The use of the light-emitting diode in the past mainly provides the light source for the backlight of the screen. After continuous research and improvement, the light-emitting diode gradually becomes It can be applied to general lighting equipment. Although the manufacturing cost is higher than that of traditional light bulbs, the light-emitting diodes have a longer life when used as lighting applications such as lamps, and consume less power under the same illumination. In the long run, the light-emitting two Polar lighting can improve the energy efficiency of today's lighting, and it is more likely to completely replace traditional lighting in the future.

However, when the light-emitting diode operates, additional waste heat is generated in addition to the light energy, and the high temperature accumulated by the waste heat shortens the service life of the light-emitting diode, and the light-emitting diode cannot pass the infrared radiation method. The generated waste heat is discharged, and the heat energy can be transmitted only through the connection path with the package such as the circuit layer. Therefore, the general light-emitting diode lamps mostly use a heat-conducting material to reduce the thermal resistance, so that the waste heat can be smoothly transmitted to Outside the package of the light-emitting diode. However, the heat sink and the air require a large amount of contact area to achieve the heat dissipation effect, so the heat sink is relatively bulky relative to the lamp, and the weight of the finished product is increased. Therefore, in the conventional light-emitting diode lamp structure, the heat dissipation mode is improved.

The main purpose of the present invention is to solve the problem that the above-mentioned prior art light-emitting diode lamps discharge heat energy in a heat sink manner to occupy a large amount of usable volume and increase the weight of the finished product.

In order to solve the above problems, the present invention provides an LED lamp body structure including an outer frame, a light guide plate, a reflector, a lighting module, and a back plate. The outer frame has an accommodating space and at least one frame disposed on a circumference side of the accommodating space. The light guide The plate is disposed in the accommodating space, and includes a light guide plate body, a light emitting surface disposed on a side of the light guide plate body, and a light incident surface surrounding the peripheral side of the light guide plate body. The reflector is disposed on the other side of the light guide plate with respect to the light exit surface. The lighting module includes a plurality of lighting units that emit light toward the light incident surface, and a circuit layer disposed on at least one of the frames. The backboard is coupled to the outer frame and covers the reflector. The backplane is provided with at least one heat dissipation hole.

Further, the circuit layer includes a turning portion, the turning portion includes a heat dissipating portion, and the lighting unit adjacent to the turning portion includes a heat resistant region, wherein the heat dissipation hole is disposed in the heat dissipating region and the heat resistant region Overlapping position.

Further, the circuit layer includes a terminal end, the end portion includes a heat dissipation region, and the illumination unit adjacent to the end portion includes a heat resistant region, and the heat dissipation hole is disposed at an overlapping position of the heat dissipation region and the heat resistant region.

Further, the lighting unit is disposed around the accommodating space.

Further, the lighting unit is connected to the circuit layer through a thermal adhesive.

Further, the back plate is made of a heat conductive material.

Further, the circuit layer is a printed circuit board (PCB).

Further, the circuit layer is a Flexible Print Circuit (FPC).

Further, the LED lamp body structure further includes a dustproof plate covering the light emitting surface.

Further, the light guide plate is a cast acrylic plate.

This creation has at least the following beneficial effects compared to the prior art:

1. The back plate of the present invention is provided with a heat dissipation hole at the intersection of the heat dissipation region such as the turning portion and the end position of the adjacent circuit layer and the heat-resistant region of the illumination unit, thereby avoiding the heat resistance of the circuit layer due to the hole opening. The local hot spot is too close to the lighting unit, and the heat energy is transmitted to the heat dissipation hole through the heat dissipation hole on the back plate to avoid the problem of high temperature shortening the service life of the light emitting diode.

2. The lighting unit of the creation can be set in which several borders are adjacent to the space The inner side of the space is provided without a plurality of illumination units on the back side of the light-emitting surface, and the light can be refracted through the light guide plate to generate uniform plane light, and the cost of the lamp is reduced by reducing the number of illumination units. In addition, the lighting units can also be disposed around the accommodating space, thereby making the light emitted by the LED lamp body structure of the present invention more uniform.

3. The lighting unit of the present invention is connected to the circuit layer through a thermal adhesive to reduce the thermal resistance to achieve better heat dissipation.

1‧‧‧LED body structure

10‧‧‧External framework

11‧‧‧Border

12‧‧‧ accommodating space

20‧‧‧Light guide

21‧‧‧Light guide body

22‧‧‧Glossy

23‧‧‧Into the glossy surface

30‧‧‧Lighting module

31‧‧‧Lighting unit

311‧‧‧heat resistant area

32‧‧‧ circuit layer

321‧‧‧ turning section

End of 322‧‧‧

323‧‧‧heating area

40‧‧‧ Backboard

41‧‧‧ vents

50‧‧‧reflector

60‧‧‧Dust board

Figure 1 is a schematic exploded view of the LED lamp body structure of the present invention.

Figure 2 is a schematic diagram of the light propagation path of the present creation.

FIG. 3 is a top plan view of the outer frame and the lighting module of the first embodiment of the present invention.

Figure 4 is a schematic perspective view of the first embodiment of the present invention.

The detailed description and technical contents of the present invention will now be described with reference to the drawings. In addition, the drawings are not intended to limit the scope of the present invention, and the proportions thereof are not intended to limit the scope of the present invention.

Regarding the technology of this creation, please refer to FIG. 1 , which is a schematic exploded view of the LED lamp body structure of the present invention, as shown in the figure: The LED lamp body structure 1 of the present invention is a Light-Emitting Diode (LED). As a light source of the lighting device, its appearance is formed into a flat shape, and the light is evenly dispersed from the plane of the flat plate, and can be used for indoor and outdoor lighting. The LED lamp body structure 1 mainly includes an outer frame 10, a light guide plate 20, a reflector 50, a lighting module 30, and a back plate 40.

The outer frame 10 is fixedly connected to other members, and has at least one frame 11 disposed on the circumferential side of the accommodating space 12. The accommodating space 12 is for accommodating the LED lamp body structure 1 , and the frame 11 can be a wood product, a plastic product or a metal product, and is not limited in the present invention.

Referring to FIG. 2 together, it is a schematic diagram of the light propagation path of the present invention. As shown in the figure, the light guide plate 20 is disposed in the accommodating space 12 and fixed by the frame 11 , and the light guide plate 20 is A light guide body 21 is disposed on one side of the light guide body 21 The smooth surface 22 and a plurality of light incident surfaces 23 disposed around the light guide plate main body 21 are provided. When the light guide plate 20 is fabricated, the computer numerical control (CNC) can be used for forming, or the laser light guide plate 20 can be used to guide the light guide plate 20 with a plurality of light guide portions arranged at different angles (in the figure). When the light entering the light guide plate 20 from the light incident surface 23 is transmitted to the light guiding portions, the light is scattered toward the light emitting surface 22, and the light source placed laterally of the light guide plate 20 is uniformly transmitted to the light source. The effect of the light-emitting surface 22, this design method can make the LED lamp body structure 1 thin and flat, and can carry out various styles of design.

In addition, the light energy transmitted through a portion of the light guiding portion is reflected by the light reflecting plate 50 disposed on the other side of the light emitting surface 22 to the light emitting surface 22, and the reflecting plate 50 may be a foil metal plate. The reflective surface, or a colored translucent sheet, reflects the transmitted light toward the exit surface 22 to reduce optical energy loss. The light exiting surface 22 is located on the medium surface (the boundary between the light guide plate 20 and the air), and when the light reaches the light exiting surface 22, the light is again refracted and leaves the light guide plate 20, and the light of the reflecting portion propagates toward the light reflecting plate 50 and again faces the light emitting surface. 22 reflections.

The illumination module 30 is disposed on the inner side of the outer frame 10 (ie, adjacent to one side of the accommodating space 12), and the illumination module 30 includes a plurality of light rays that are emitted toward the light incident surface 23 The lighting unit 31 and the circuit layer 32 disposed on at least one of the frames 11. The illumination unit 31 is a light emitting diode. The circuit layer 32 can be a rigid circuit board, a flexible circuit board, etc., and can be selected according to circuit requirements, and is not limited in this creation. The lighting units 31 are connected to the circuit layer 32 through a thermal conductive adhesive to reduce thermal resistance and achieve better heat dissipation. In another embodiment, the illumination units 31 can be disposed around each of the bezels 11 in such a manner that the light is more uniform from the LED lamp body structure 1 of the present invention, but the above is only an example. It should be noted that the number and position of the lighting unit 31 of the present creation are not limited.

Since the light-emitting diode generates waste heat during operation, and its thermal energy cannot be discharged from the package of the light-emitting diode via infrared radiation, it is necessary to rely on the circuit board to conduct heat energy to the outside to maintain the lower temperature to extend the light-emitting diode. The life of the polar body. The backplane 40 is connected to the outer frame 10 and covers the reflector 50. The backplane 40 is provided with a heat dissipation hole 41. The back plate 40 is preferably a heat dissipation material such as a heat conductive alloy. Heat energy out more quickly. It should be noted that the hole in the back plate 40 also increases the thermal resistance at the hole. In other words, the through hole 41 will form a local hot spot with a higher temperature around, if the local hot spot is close to the hair The position of the photodiode generates a high temperature and shortens the service life of the light-emitting diode.

The following description further illustrates the manner in which the creation of the heat dissipation holes 41 in the backing plate 40 is employed. The lighting unit 31 includes a heat resistant region 311, and the circuit layer 32 includes a heat dissipation region 323. The term "heat-resistant region 311" of the present invention means that when a local hot spot is generated in the heat-resistant region 311, the illumination unit 31 can tolerate the temperature at the location without causing a shortened service life. In fact, the location of the local hot spot must be The thermal conductivity of the circuit layer 32 and the backing plate 40 depends on the power and maximum operating temperature of the LED. The term "heat dissipation area 323" as used herein refers to a position at which the heat dissipation hole 41 can be pierced in the back plate 40 to increase the heat dissipation rate, that is, the position where the thermal resistance is the largest on the circuit layer 32, and the heat dissipation area 323 is preferably adjacent to the circuit. End 322 or transition 321 of layer 32.

Referring to FIG. 3 and FIG. 4 together, FIG. 3 is a schematic top view of the outer frame 10 and the illumination module 30 according to the first embodiment of the present invention, and FIG. 4 is a schematic perspective view of the first embodiment of the present invention. It is shown that in the first embodiment of the present invention, the heat-resistant region 311 and the heat-dissipating region 323 have an overlap (shaded portion in the figure), which can be on the back plate 40 according to the overlap. The heat dissipation holes 41 are bored, thereby causing local hot spots to be generated at a distance from the light-emitting diodes to avoid adverse effects of high temperature on the light-emitting diodes, and on the other hand, the rate of heat dissipation can be increased.

In addition, the LED lamp body structure 1 of the present invention further includes a dustproof plate (not shown) covering the light exiting surface 22, and the dustproof plate can cover the light emitting surface 22 so that rainwater does not flow into the LED light body. The gap of the structure 1 can prevent the mosquito attracted by the light from flying into the LED lamp body structure 1 and can be used for outdoor lighting.

In summary, the lighting unit of the present invention has a heat-resistant area, and the end or the turning portion adjacent to the circuit layer has a heat-dissipating area, and the heat-dissipating hole can be penetrated at the intersection of the backing plate and the heat-resistant area and the heat-dissipating area. In order to achieve better heat dissipation, and to avoid local hot spots generated in the vicinity of the lighting unit, the life of the lighting unit is shortened. In addition, the connection of the lighting unit and the circuit layer through the thermal conductive adhesive can achieve a faster transfer of thermal energy outside the package of the lighting unit.

The above description has been made in detail, but the above is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the creation of the creation, that is, the equality of the patent application scope according to the present creation. Changes and modifications are still covered by the patents of this creation.

1‧‧‧LED body structure

10‧‧‧External framework

11‧‧‧Border

12‧‧‧ accommodating space

20‧‧‧Light guide

21‧‧‧Light guide body

22‧‧‧Glossy

23‧‧‧Into the glossy surface

30‧‧‧Lighting module

31‧‧‧Lighting unit

32‧‧‧ circuit layer

321‧‧‧ turning section

40‧‧‧ Backboard

41‧‧‧ vents

50‧‧‧reflector

60‧‧‧Dust board

Claims (10)

An LED lamp body structure includes: an outer frame having an accommodating space and at least one frame disposed on a circumference side of the accommodating space; and a light guide plate disposed in the accommodating space, including a guide a light-emitting plate body, a light-emitting surface disposed on a side of the light-guiding plate body, and a light-incident surface surrounding the peripheral side of the light-guide plate body; a light-reflecting plate disposed on the other side of the light-guiding plate opposite to the light-emitting surface a lighting module comprising: a plurality of lighting units that emit light toward the light incident surface, and a circuit layer disposed on the at least one of the frames; and a back surface connected to the outer frame and covering the reflective plate The board is provided with at least one heat dissipation hole. The lamp body structure of claim 1, wherein the circuit layer comprises a turning portion, the turning portion comprises a heat dissipating portion, and the lighting unit adjacent to the turning portion comprises a heat-resistant region, wherein the heat dissipation portion The hole system is disposed at the overlapping position of the heat dissipation region and the heat resistant region. The lamp body structure of claim 1, wherein the circuit layer includes an end, the end portion includes a heat dissipating region, and the lighting unit adjacent to the end portion includes a heat resistant region, and the heat dissipation hole is disposed The heat dissipating area and the overlapping position of the heat resistant area. The lamp body structure of claim 1, wherein the lighting unit is disposed around the accommodating space. The lamp body structure of claim 1, wherein the lighting unit is connected to the circuit layer through a thermal conductive adhesive. The lamp body structure of claim 1, wherein the back plate is a heat conductive material. The lamp body structure of claim 1, wherein the circuit layer is a printed circuit board (PCB). The lamp body structure of claim 1, wherein the circuit layer is a Flexible Print Circuit (FPC). The lamp body structure according to claim 1, further comprising a dustproof plate covering the light emitting surface. The lamp body structure of claim 1, wherein the light guide plate is a cast acrylic plate.