TWM462407U - A touch sensing substrate - Google Patents

Abstract

A touch sensing substrate is provided, which includes a substrate, a patterned conductive layer, a plurality of first bridging lines, an insulating layer, a protective layer and a patterned peelable adhesive layer. The patterned conductive layer is disposed on the substrate, in which the patterned conductive layer includes a plurality of first sensing pads. The first bridging lines are disposed on the substrate, and each of the first bridging lines is connected with two adjacent first sensing pads. The insulating layer is interposed between the patterned conductive layer and the first bridging lines. The protective layer fully covers the patterned conductive layer and the first bridging lines. The patterned peelable adhesive layer covers the protective layer and the patterned conductive layer there beneath but does not cover the first bridging lines beneath the protective layer.

Description

Touch substrate

The present invention relates to a touch substrate comprising a peelable adhesive layer.

The touch interface is more diversified because it allows users to easily input data and click functions. The touch display panel can be divided into an out-cell touch display panel and an in-cell touch display panel according to the position of the touch panel. The external touch display panel is provided with a touch substrate on the outside of the display panel. As for the in-cell touch display panel, the liquid crystal display panel can be divided into the LCD cell structure (in-cell) according to the position of the touch sensing component. It is provided on two types of color filter substrates (on-cell). In addition, according to the sensing principle, the in-cell touch display panel can be subdivided into a resistive, capacitive, and optical touch display panel.

With the popularization of handheld touch products, the requirements for light and thin devices have become the focus of touch product development. Therefore, in recent years, the development of touch products has been mostly aimed at lightweighting and thinning, and has produced a form of One Glass Solution (OGS), that is, a touch sensing element. It is formed directly on the film surface of the protective glass to achieve light weight of the product. Then, the touch glass substrate with the touch sensing element is assembled with the display panel to form an external touch display panel.

In order to rapidly mass-produce the touch glass substrate, the touch sensing element can be directly fabricated on a large-sized substrate and then split into a plurality of small-sized touch glass substrates. Subsequent procedures such as edging chamfering process and high pressure water washing are performed. However, after the dicing process, the strength of the glass substrate is lowered. Therefore, after the cracking, edging chamfering and high-pressure water washing process, a secondary strengthening process can be performed to achieve a certain level of strength of the glass substrate. In addition, in order to prevent the glass debris generated in the cleavage and edging and chamfering process from scratching the touch sensing element, a high-adhesive peelable adhesive cover is formed before the dicing process and the touch sensing element is protected. After the secondary strengthening process, the stripping process can be carried out. However, since the peelable adhesive has high adhesiveness, in the process of tearing off the peelable adhesive, the touch sensing element is easily damaged, and even a part of the touch sensing element is peeled off. Among them, the vicinity of the bridge line of the touch sensing element is most easily damaged. This will cause a serious decrease in the yield of the touch substrate.

In view of the above, there is a need for an improved touch substrate structure that does not require touch sensing elements in subsequent processes such as substrate chipping, bevel chamfering, high pressure water washing, secondary strengthening, and peeling of the peelable adhesive layer. Any damage will occur.

The purpose of the present invention is to provide a touch substrate comprising a pattern a peelable adhesive layer, the patterned peelable adhesive layer not covering the first bridge wire belonging to different layers of the patterned conductive layer (that is, the pattern peelable adhesive layer avoids the cross-bridge line in the touch sensing element), The subsequent tear-off pattern peeling layer step does not damage the first bridge wire.

One aspect of the present invention provides a touch substrate comprising a substrate, a patterned conductive layer, a plurality of first bridge lines, an insulating layer, a protective layer, and a patterned strippable layer. The patterned conductive layer is disposed on the substrate, wherein the patterned conductive layer comprises a plurality of first sensing pads. The first bridge wire is disposed on the substrate, and each of the first bridge wires connects two adjacent first sensing pads. The insulating layer is sandwiched between the patterned conductive layer and the first bridge. The protective layer completely covers the patterned conductive layer and the first bridge. The pattern strippable layer covers the protective layer and the patterned conductive layer therebelow, and does not cover the first bridge under the protective layer.

According to an embodiment of the present invention, the pattern peelable layer has a plurality of openings respectively corresponding to one of the first bridge lines.

According to an embodiment of the invention, one of the openings has a maximum width greater than a length of each of the first bridge wires.

According to an embodiment of the invention, one of the openings has a maximum width of no more than 0.5 mm.

According to an embodiment of the invention, the shape of each opening is circular, elliptical or polygonal.

According to an embodiment of the present invention, the pattern conductive layer further includes a plurality of second sensing pads and a plurality of second bridge wires, each of the second bridge wires connecting two adjacent second sensing pads, wherein each of the second bridge wires is connected to One of the first bridge wires is staggered.

According to an embodiment of the present invention, the pattern strippable layer does not cover the second bridge of the patterned conductive layer under the protective layer.

According to an embodiment of the present invention, one of the pattern peelable layers has a thickness of 20 to 40 microns.

Another object of the present invention is to provide a touch substrate comprising a strippable layer in place of the protective layer, the strippable layer covering the patterned conductive layer and the first bridge line (ie, the bridge line in the touch sensing element) . In this way, it is not necessary to tear off the peelable adhesive layer, and any problem caused by tearing off the peelable adhesive layer can be completely avoided.

One aspect of the present invention provides a touch substrate comprising a substrate, a patterned conductive layer, a plurality of first bridge lines, an insulating layer, and a peelable adhesive layer. The patterned conductive layer is disposed on the substrate, wherein the patterned conductive layer comprises a plurality of first sensing pads. The first bridge wire is disposed on the substrate, and each of the first bridge wires connects two adjacent first sensing pads. The insulating layer is sandwiched between the patterned conductive layer and the first bridge. The peelable adhesive layer completely covers the patterned conductive layer and the first bridge wire.

According to an embodiment of the present invention, one of the peelable layers has a thickness of 20 to 40 microns.

200A, 200B, 400A, 400B, 600A, 600B‧‧‧ touch substrates

110‧‧‧Substrate

120‧‧‧patterned conductive layer

1201‧‧‧First sensing pad

1202‧‧‧Second sensing pad

1203‧‧‧Second bridge wiring

130‧‧‧First bridge wiring

130a‧‧‧Climb

140‧‧‧Insulation

150‧‧‧protection layer

160‧‧‧pattern peelable layer

160a‧‧‧ openings

160'‧‧‧ peelable layer

D1‧‧‧ first direction

D2‧‧‧ second direction

H1‧‧‧The thickness of the pattern peelable layer

Length of L1‧‧‧ first bridge wiring

S1‧‧‧first sensing series

S2‧‧‧Second sensing series

W1‧‧‧ maximum width of opening

2-2', 4-4', 6-6'‧‧‧ segments

1 is a top plan view showing a touch substrate according to an embodiment of the present invention.

Figure 2A shows the touch substrate along line 2-2' of Figure 1 (first A schematic cross-sectional view of the bridge wiring disposed above the patterned conductive layer.

FIG. 2B is a schematic cross-sectional view showing the touch substrate along the line 2-2' of FIG. 1 (the first bridge line is disposed under the pattern conductive layer).

3 is a top plan view showing a touch substrate according to an embodiment of the present invention.

4A is a schematic cross-sectional view showing the touch substrate along the 4-4' line of FIG. 3 (the first bridge line is disposed above the patterned conductive layer).

4B is a cross-sectional view showing the touch substrate along the 4-4' line of FIG. 3 (the first bridge line is disposed under the patterned conductive layer).

FIG. 5 is a top view showing a touch substrate according to an embodiment of the present invention.

Fig. 6A is a schematic cross-sectional view showing the touch substrate along the 6-6' line of Fig. 5 (the first bridge line is disposed above the patterned conductive layer).

FIG. 6B is a schematic cross-sectional view showing the touch substrate along the 6-6' line segment of FIG. 5 (the first bridge line is disposed under the patterned conductive layer).

The embodiments of the present invention are disclosed in the following drawings, and for the sake of clarity, the details of the invention are described in the following description. However, it should be understood that these practical details are not intended to limit the novel. That is to say, in some embodiments of the present invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

1 is a touch substrate according to an embodiment of the present invention. (Upper view of the protective layer, peelable layer). Fig. 2A is a schematic cross-sectional view showing the touch substrate 200A along the line 2-2' of Fig. 1. For the convenience and clarity of the structure of the touch substrate having the peelable adhesive layer illustrated in FIGS. 3 and 5, the structure of the touch substrate other than the protective layer and the peelable adhesive layer will be described first. That is, the structure of the touch sensing element will be described first.

Referring to FIG. 1 and FIG. 2A simultaneously, the touch substrate 200A includes a substrate 110, a patterned conductive layer 120, a plurality of first bridge lines 130, and an insulating layer 140.

The substrate 110 can be, for example, a glass substrate, a quartz substrate, or a plastic substrate.

The patterned conductive layer 120 is disposed on the substrate 110 , wherein the patterned conductive layer 120 includes a plurality of first sensing pads 1201 . The material of the pattern conductive layer 120 may be indium tin oxide (ITO), aluminum zinc oxide (AZO), aluminum tin oxide (ATO), gallium zinc oxide (GZO), indium titanium oxide (ITiO), indium oxide molybdenum (IMO) or Other transparent conductive materials.

The first bridge wire 130 is disposed on the substrate 110. In the present embodiment, the first bridge line 130 is disposed on the pattern conductive layer 120. In other words, the first bridge line 130 and the pattern conductive layer 120 are disposed on different layers. The material of the first bridge wire 130 may be a metal, a metal compound or a transparent conductive material. The metal material includes molybdenum (Mo), chromium (Cr), aluminum (Al), niobium (Nd), titanium (Ti), copper (Cu), silver (Ag), gold (Au), zinc (Zn), indium ( In), gallium (Ga), other suitable materials, or a combination of the above. Metal compound materials include metal alloys, metal oxides, metal nitrides, metal oxynitrides, and other suitable materials Material or combination of the above. For an example of the transparent conductive material, please refer to the material exemplified in the above patterned conductive layer 120. Each of the first bridge wires 130 connects two adjacent first sensing pads 1201 to form at least one first sensing series S1 extending along the first direction D1 as shown in FIG. 1 . In this way, the touch signal can be transmitted from the first sensing pad 1201 to the other first sensing pad 1201 through the first bridge wire 130.

In one embodiment, the pattern conductive layer 120 further includes a plurality of second sensing pads 1202 and a plurality of second bridge lines 1203, as shown in FIG. Each of the second bridge wires 1203 connects the two adjacent second sensing pads 1202 to form at least one second sensing series S2 extending along the second direction D2. In this way, the touch signal can be transmitted from the second sensing pad 1202 to the other second sensing pad 1202 through the second bridge wire 1203. The first direction D1 is different from the second direction D2. Further, the first direction D1 may be perpendicular to the second direction D2. For example, the touch substrate 200A is located on the x-y plane, the first direction D1 may be the y direction, and the second direction D2 may be the x direction. As shown in FIG. 1, the first sensing series S1 extends in the y direction, and the second sensing series S2 extends in the x direction. Also, one of the second bridge wires 1203 is interleaved with one of the first bridge wires 130.

In the present embodiment, the second sensing series S2 is the same material as the first sensing pad 1201. The material of the first sensing pad 1201 and the first bridge wire 130 may be the same or different. For example, the material of the second sensing series S2 and the first sensing pad 1201 may be a transparent conductive material, and the material of the first bridge wire 130 may be a metal or a transparent conductive material.

The insulating layer 140 is sandwiched between the first bridge line 130 and the patterned conductive layer The second bridge line 1203 in 120 is between a portion of the first sensing pad 1201 such that the first bridge line 130 and the second sensing series S2 are separated from each other, that is, electrically insulated from each other. The material of the insulating layer 140 may comprise an organic dielectric material, an inorganic dielectric material, or a combination thereof. The organic dielectric material is, for example, Polyimide (PI), other suitable materials, or a combination thereof; the inorganic dielectric material is, for example, cerium oxide, cerium nitride, cerium oxynitride, other suitable materials, or a combination thereof. .

Fig. 2B is a schematic cross-sectional view showing the touch substrate along line 2-2' of Fig. 1. Referring to FIGS. 1 and 2B , the touch substrate 200B includes a substrate 110 , a plurality of first bridge lines 130 , a patterned conductive layer 120 , and an insulating layer 140 . The difference from the touch substrate 200A illustrated in FIG. 2A is that the first bridge line 130 of the touch substrate 200B illustrated in FIG. 2B is disposed under the second bridge line 1203 and a portion of the first sensing pad 1201. For the specific implementation of the substrate 110, the first bridge line 130, the pattern conductive layer 120, and the insulating layer 140, reference may be made to the substrate 110, the first bridge line 130, the pattern conductive layer 120, and the insulating layer 140 of the above FIGS. 1 and 2A. Specific implementation.

Several embodiments of a touch substrate comprising a strippable layer are detailed below. FIG. 3 is a top view showing a touch substrate (including a protective layer and a pattern peelable layer) according to an embodiment of the present invention. Fig. 4A is a schematic cross-sectional view showing the touch substrate along the line 4-4' of Fig. 3. Referring to FIGS. 3 and 4A , the touch substrate 400A includes a substrate 110 , a patterned conductive layer 120 , a plurality of first bridge lines 130 , an insulating layer 140 , a protective layer 150 , and a patterned strippable layer 160 . The substrate 110, the patterned conductive layer 120, For a specific embodiment of the first bridge line 130 and the insulating layer 140, reference may be made to the specific embodiment of the substrate 110, the patterned conductive layer 120, the first bridge line 130, and the insulating layer 140 of FIGS. 1 and 2A.

The protective layer 150 completely covers the first sensing pad 1201, the second sensing pad 1202, and the second bridge 1203 of the first bridge line 130 and the pattern conductive layer 120, as shown in FIG. 4A. That is, the protective layer 150 completely covers the first sensing series S1 and the second sensing series S2. For an example of the material of the protective layer 150, please refer to the material exemplified above for the insulating layer 140.

Importantly, the touch substrate 400A of the present embodiment includes a patterned strippable layer 160 covering the first sensing pad 1201 and the second sensing pad 1202 of the protective layer 150 and the patterned conductive layer 120 therebelow, but not The first bridge line 130 under the protective layer 150 is covered as shown in FIGS. 3 and 4A. For example, the pattern peelable adhesive layer 160 may be formed on the protective layer 150 by screen printing. In one embodiment, one of the patterned strippable layers 160 has a thickness H1 of 20 to 40 microns.

As shown in FIG. 3, the pattern strippable layer 160 has a plurality of openings 160a corresponding to one of the first bridge lines 130, respectively. That is, each of the openings 160a is located above each of the first bridge wires 130. Moreover, one of the openings 160a has a maximum width W1 greater than a length L1 of each of the first bridge wires 130. In one embodiment, one of the openings 160a has a maximum width W1 of no more than 0.5 mm. In one embodiment, one of the first bridge wires 130 has a length L1 of no more than 0.3 mm. As a result, since the upper surface of the protective layer 150 above the first bridge wire 130 is not covered by the pattern peelable layer 160, the first bridge wire 130 is climbed during the process of peeling off the pattern peelable layer 160. 130a will not Damaged by external force.

In one embodiment, each opening 160a is circular, elliptical or polygonal in shape. Of course, the opening 160a may also be other suitable shapes as long as the pattern peelable layer 160 does not cover the first bridge line 130 below the protective layer 150.

More preferably, the patterned strippable layer 160 also does not cover the second bridge line 1203 of the patterned conductive layer 120 under the protective layer 150. That is, the pattern strippable layer 160 in the present embodiment covers only a flat area, such as the first sensing pad 1201 and the second sensing pad 1202 in the pattern conductive layer 120, and the uncovered undulation is more obvious. The area, such as the first bridge line 130, the junction of the insulating layer 140 and the second bridge line 1203. This avoids the phenomenon that the undulation structure is particularly susceptible to damage when the pattern peelable layer 160 is removed.

In summary, the pattern strippable layer 160 of the touch substrate 400A illustrated in FIGS. 3 and 4A does not cover the first bridge line 130 belonging to different layers of the pattern conductive layer 120, so that the subsequent tear-off pattern can be performed. In the step of peeling the adhesive layer 160, the protective layer 150 above the first bridge wire 130 is not affected, so that the first bridge wire 130 is not damaged, and the problems generated by the prior art can be solved.

Fig. 4B is a schematic cross-sectional view showing the touch substrate along the line 4-4' of Fig. 3. Referring to FIGS. 3 and 4B , the touch substrate 400B includes a substrate 110 , a patterned conductive layer 120 , a plurality of first bridge lines 130 , an insulating layer 140 , a protective layer 150 , and a pattern strippable layer 160 . The difference from the touch substrate 400A illustrated in FIG. 4A is that the first bridge line 130 of the touch substrate 400B illustrated in FIG. 4B is disposed on the second bridge line 1203. Below the portion of the first sensing pad 1201. For the specific implementation of the substrate 110, the patterned conductive layer 120, the first bridge line 130, and the insulating layer 140, reference may be made to the substrate 110, the patterned conductive layer 120, the first bridge line 130, and the insulating layer 140 of FIGS. 1 and 2A. Specific implementation. For specific implementations of the protective layer 150 and the patterned strippable layer 160, reference may be made to the specific embodiments of the protective layer 150 and the pattern strippable layer 160 of FIGS. 3 and 4A above.

FIG. 5 is a top view showing a touch substrate (including a peelable layer) according to an embodiment of the present invention. Fig. 6A is a schematic cross-sectional view showing the touch substrate 600A along the line 6-6' of Fig. 5. Referring to FIG. 5 and FIG. 6A simultaneously, the touch substrate 600A includes a substrate 110, a patterned conductive layer 120, a plurality of first bridge lines 130, an insulating layer 140, and a peelable adhesive layer 160'. For the specific implementation of the substrate 110, the patterned conductive layer 120, the first bridge line 130, and the insulating layer 140, reference may be made to the substrate 110, the patterned conductive layer 120, the first bridge line 130, and the insulating layer 140 of FIGS. 1 and 2A. Specific implementation.

It should be noted that the strippable layer 160 ′ of the present embodiment completely covers the first sensing pad 1201 , the second sensing pad 1202 , and the second bridge 1203 of the first bridge line 130 and the patterned conductive layer 120 . That is, the peelable adhesive layer 160' replaces the function of the protective layer 150 in the touch substrate 400A illustrated in FIG. 4A. Therefore, in the subsequent cracking, edging chamfering, high-pressure water washing and secondary strengthening processes, the touch sensing element is not damaged, and after the secondary strengthening process, it is not necessary to tear off the peelable layer 160'. Any problems caused by tearing off the peelable layer 160' can be completely avoided. And, in an embodiment, One of the peelable adhesive layers 160' has a thickness H1 of 20 to 40 microns as shown in Fig. 4A. Compared with a protective layer having a thickness of only several hundred nanometers, the peelable adhesive layer 160' used in the present embodiment is extremely thick, and can effectively protect the touch sensing element underneath. Even if the surface layer of the peelable adhesive layer 160' is scratched, the touch sensing element below is not damaged. And the transparent peelable adhesive layer 160' can be adjusted into various colors for easy identification.

Fig. 6B is a schematic cross-sectional view showing the touch substrate along line 6-6' of Fig. 5. Referring to FIG. 5 and FIG. 6B simultaneously, the touch substrate 600B includes a substrate 110, a patterned conductive layer 120, a plurality of first bridge lines 130, an insulating layer 140, and a peelable adhesive layer 160'. The difference from the touch substrate 600A illustrated in FIG. 6A is that the first bridge line 130 of the touch substrate 600B illustrated in FIG. 6B is disposed under the second bridge line 1203 and a portion of the first sensing pad 1201. For the specific implementation of the substrate 110, the patterned conductive layer 120, the first bridge line 130, and the insulating layer 140, reference may be made to the substrate 110, the patterned conductive layer 120, the first bridge line 130, and the insulating layer 140 of FIGS. 1 and 2A. Specific implementation. For a specific embodiment of the peelable adhesive layer 160', reference may be made to the specific embodiment of the peelable adhesive layer 160' of the above fifth and sixth embodiments.

In summary, the pattern strippable layer in the touch substrate of the embodiment of the present invention does not cover the first bridge line that belongs to different layers of the pattern conductive layer (that is, avoids the first bridge line), so that When the step of peeling off the pattern can be peeled off, the protective layer above the first bridge wire is not affected, so the first bridge wire is not damaged. On the other hand, the peelable adhesive layer in the touch substrate of another embodiment of the present invention replaces the protective layer, so in the subsequent cracking, edging chamfering, high pressure water washing and secondary strengthening processes, the touch sensing element Will not be damaged, and After the secondary strengthening process, it is not necessary to remove the peelable adhesive layer, and any problem caused by tearing off the peelable adhesive layer can be completely avoided.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any one skilled in the art can make various changes and retouchings without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

120‧‧‧patterned conductive layer

1201‧‧‧First sensing pad

1202‧‧‧Second sensing pad

1203‧‧‧Second bridge wiring

130‧‧‧First bridge wiring

140‧‧‧Insulation

160‧‧‧pattern peelable layer

160a‧‧‧ openings

D1‧‧‧ first direction

D2‧‧‧ second direction

Length of L1‧‧‧ first bridge wiring

S1‧‧‧first sensing series

S2‧‧‧Second sensing series

W1‧‧‧ maximum width of opening

4-4'‧‧‧ segments

Claims (11)

A touch substrate includes: a substrate; a patterned conductive layer disposed on the substrate, wherein the patterned conductive layer comprises a plurality of first sensing pads; a plurality of first bridge wires are disposed on the substrate, and each The first bridge wire connects two adjacent first sensing pads; an insulating layer is sandwiched between the patterned conductive layer and the first bridge wires; a protective layer covers the patterned conductive layer and the plurality of layers a first bridge wire; and a patterned strippable layer covering the protective layer and the patterned conductive layer under the protective layer and not covering the first bridge lines under the protective layer. The touch substrate of claim 1, wherein the pattern strippable layer has a plurality of openings respectively corresponding to one of the first bridge lines. The touch substrate of claim 2, wherein a maximum width of each of the openings is greater than a length of each of the first bridge wires. The touch substrate of claim 2, wherein one of the openings has a maximum width of no more than 0.5 mm. The touch substrate of claim 2, wherein each of the first bridge wires One of the lengths is no more than 0.3 mm. The touch substrate of claim 2, wherein each of the openings has a circular shape, an elliptical shape or a polygonal shape. The touch substrate of claim 1, wherein the patterned conductive layer further comprises: a plurality of second sensing pads; and a plurality of second bridge wires, each of the second bridge wires connecting two adjacent second sensing a pad, wherein each of the second bridge wires is interleaved with one of the first bridge wires. The touch substrate of claim 7, wherein the pattern strippable layer does not cover the second bridge lines of the pattern conductive layer under the protective layer. The touch substrate of claim 1, wherein one of the pattern strippable layers has a thickness of 20 to 40 microns. A touch substrate includes: a substrate; a patterned conductive layer disposed on the substrate, wherein the patterned conductive layer comprises a plurality of first sensing pads; a plurality of first bridge wires are disposed on the substrate, and each The first bridge wire connects two adjacent first sensing pads; An insulating layer is sandwiched between the patterned conductive layer and the first bridge wires; and a peelable adhesive layer covers the patterned conductive layer and the first bridge wires. The touch substrate of claim 10, wherein one of the strippable layers has a thickness of 20 to 40 microns.