TWM461913U - Structure of stacked USB 3.0 connector - Google Patents
Structure of stacked USB 3.0 connector Download PDFInfo
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- TWM461913U TWM461913U TW102200722U TW102200722U TWM461913U TW M461913 U TWM461913 U TW M461913U TW 102200722 U TW102200722 U TW 102200722U TW 102200722 U TW102200722 U TW 102200722U TW M461913 U TWM461913 U TW M461913U
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Description
本新型為提供一種堆疊式USB3.0連接器之結構,尤其是指一種降低無線電干擾、成本降低及組裝維修便利的堆疊式USB3.0連接器之結構。The present invention provides a structure of a stacked USB 3.0 connector, in particular, a structure of a stacked USB 3.0 connector that reduces radio interference, reduces cost, and facilitates assembly and maintenance.
按,連接器之運用非常廣泛,所及包含USB等等之連接器,而在於USB3.0連接器方面則是不斷的改良、進步,並同時增加了其傳輸速度。According to the connector, the connector is widely used, including the connector of USB and the like, and the USB3.0 connector is continuously improved and improved, and at the same time increases its transmission speed.
市面上一般之USB堆疊結構,因結構之設計,使一埠需要用到兩組端子組,且因配合端子組之結合,導致使用上同為一埠兩組絕緣膠體,此外於屏蔽殼體之組裝上為三件式組合之方式,透過相互卡掣結合,包覆於該USB連結器之外部。The general USB stack structure on the market, due to the design of the structure, makes it necessary to use two sets of terminal groups, and because of the combination of the matching terminal groups, the use of the same two sets of insulating colloids, in addition to the shielding shell The assembly is a three-piece combination, which is bonded to the outside of the USB connector through mutual clamping.
然上述習用USB連結器之堆疊結構於使用時,為確實存在下列問題與缺失尚待改進:However, when the above-mentioned stacked structure of the USB connector is used, the following problems and defects are indeed to be improved:
一、每一埠皆需使用到兩組端子組及兩組絕緣膠體,導致製作上之成本提升,以及組裝維修上之不便。First, each group needs to use two sets of terminal sets and two sets of insulating colloids, resulting in cost improvement in production and inconvenience in assembly and maintenance.
二、其屏蔽殼體為三件式或多件式組裝而成,使製作過程之難度提升,故材料無法充分利用,導置成本提升。Second, the shielding shell is assembled in three-piece or multi-piece, which makes the difficulty of the production process increase, so the material can not be fully utilized and the guiding cost is increased.
三、同因上述之結構所致,使每一埠皆有無線電干擾之問題,造成使用上之不 便。Third, due to the above structure, each of them has radio interference problems, resulting in the use of Will.
是以,要如何解決上述習用之問題與缺失,即為本新型之創作人與從事此行業之相關廠商所亟欲研究改善之方向所在者。Therefore, how to solve the above problems and problems in the past, that is, the creators of the new type and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.
故,本新型之創作人有鑑於上述缺失,乃搜集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種降低無線電干擾、成本降低及組裝維修便利的堆疊式USB3.0連接器之結構新型專利者。Therefore, in view of the above-mentioned deficiencies, the creators of this new model have collected relevant information, and through multi-party evaluation and consideration, and through years of experience accumulated in this industry, through continuous trial and modification, they have designed such reduction of radio interference and cost. A new patent for the structure of a stacked USB 3.0 connector that is easy to assemble and maintain.
本新型之主要目的在於:透過一端子組對應設置於一第一絕緣膠體或一第二絕緣膠體,此後再將該第一絕緣膠體及第二絕緣膠體堆疊設置相互結合,藉由上述技術,可針對習用USB堆疊結構所存在之成本過高、組裝維修不便及無線電干擾的問題點加以突破,達到降低無線電干擾、成本降低及組裝維修便利之實用進步性。The main purpose of the present invention is to provide a first insulating colloid or a second insulating colloid correspondingly through a terminal group, and then the first insulating colloid and the second insulating colloid are stacked and combined with each other. To solve the problem of excessive cost, assembly and maintenance inconvenience and radio interference in the conventional USB stack structure, the practical progress of reducing radio interference, cost reduction and assembly and maintenance convenience is achieved.
本新型之次要目的在於:透過一體成型之屏蔽殼體,並於上形成複數彎折部,將其彎折改變外型態樣,而後包覆設置於第一絕緣膠體及第二絕緣膠體上,藉由上述技術,可針對習用之屏蔽殼體所存在之多件式及製作上材料無法有效使用的問題點加以突破,達到降低成本之實用進步性。The second objective of the present invention is to form a plurality of bent portions by forming a plurality of bent portions on the upper portion, and then bending and changing the outer shape, and then covering the first insulating colloid and the second insulating colloid. With the above technology, it is possible to break through the problem that the multi-piece type of the conventional shielding case and the material on the production cannot be effectively used, and achieve practical improvement in cost reduction.
為達上述目的,本創作主要結構包括複數端子組、一第一絕緣膠體、至少一第二絕緣膠體及一屏蔽殼體,該些端子組分別設於一第一絕緣膠體及至少一第二絕緣膠體上,且該些第二絕緣膠體係堆疊設置於該第一絕緣膠體上,而該屏蔽殼體上形成有複數提供彎折成型之彎折部,透過彎折成型後包覆結合該第一絕緣膠體及該第二絕緣膠體;藉由上述之結構,一端子組對應設置於一第一絕緣膠體或一第二絕緣膠體之設計方式,可有效降低其製作上之成本,並透過第一絕緣膠體及第二絕緣膠體堆疊設置,降低每埠受無線電干擾之程度,改善其工作效率,而屏蔽殼體透過彎折部之彎折成型,改變其態樣並與第一絕緣膠體及第二絕緣膠體包覆結合,當中因屏蔽殼體為一體成型之設計,將材料有效利用,大幅節省材料使成本降低,並於後續組裝及維修上困難度降低,透過上述之結構及方式,達成本新型降低無線電干擾、成本降低及組裝維修便利之優勢。In order to achieve the above objective, the main structure of the present invention comprises a plurality of terminal groups, a first insulating gel, at least one second insulating gel and a shielding shell, wherein the terminal groups are respectively disposed on a first insulating colloid and at least a second insulating layer. On the colloid, the second insulating glue system is stacked on the first insulating colloid, and the shielding shell is formed with a plurality of bent portions for providing bending forming, and the first and second bending parts are formed by bending and forming The insulating colloid and the second insulating colloid; according to the above structure, the design of a terminal group corresponding to a first insulating colloid or a second insulating colloid can effectively reduce the manufacturing cost and penetrate the first insulating The colloid and the second insulating colloid are stacked to reduce the degree of radio interference per turn and improve the working efficiency, and the shielding shell is bent and bent through the bending portion to change its state and is insulated from the first insulating colloid and the second insulating body. The combination of colloidal coating, in which the shielded shell is integrally formed, the material is effectively utilized, the material is greatly saved, the cost is reduced, and the difficulty in subsequent assembly and maintenance is lowered. Through the above-mentioned structure and the way to reach this new reduce radio interference, reduce maintenance costs and assembly advantages of convenience.
為達成上述目的及功效,本新型所採用之技術手段及構造,茲繪圖就本新型較佳實施例詳加說明其特徵與功能如下,俾利完全了解。In order to achieve the above objects and effects, the technical means and structure adopted by the present invention are described in detail in the preferred embodiment of the present invention, and the features and functions thereof are as follows.
請參閱第一圖、第二圖、第三圖、第四圖、第五圖、第六圖及第七圖所示,係為本新型第一較佳實施例之立體圖、分解圖、端子組分解圖(一)、端子組分解圖(二)、絕緣膠體分解圖、絕緣膠體剖視圖及屏蔽殼體立體圖,由圖中可清楚看出本新型堆疊式USB3.0連接器之結構係包括:一第一絕緣膠體1;至少一與該第一絕緣膠體1堆疊設置第二絕緣膠體2,該第二絕緣膠體2係包括有一第一膠體21及一第二膠體22;複數端子組3,該些端子組3係分別設置於該第一絕緣膠體1及該第二絕緣膠體2上,該端子組3係包含有一第一差分訊號傳輸導體組31、一位於該第一差分訊號傳輸導體組31一側之第二差分訊號傳輸導體組32、一位於該第一差分訊號傳輸導體組31及該第二差分訊號傳輸導體組32之間的第一接地傳輸導體33、一位於該第一差分訊號傳輸導體組31及該第一接地傳輸導體33之間的第一訊號傳輸導體34、一位於該第一差分訊號傳輸導體組31及該第一訊號傳輸導體34之間的電源傳輸導體35、一位於該第 二差分訊號傳輸導體組32及該第一接地傳輸導體33之間的第二訊號傳輸導體36及一位於該第二差分訊號傳輸導體組32及該第二訊號傳輸導體36之間的第二接地傳輸導體37,第一差分訊號傳輸導體組31之一端處形成呈平板狀之第一差分訊號接觸部311,另一端處係形成一以表面貼附(SMT)方式結合之第一差分訊號焊接部312,第二差分訊號傳輸導體組32之一端處形成呈平板狀之第二差分訊號接觸部321,另一端處係形成一以表面貼附(SMT)方式結合之第二差分訊號焊接部322,第一接地傳輸導體33之一端處係形成一呈平板狀之第一接地接觸部331,另一端處係形成一以插接設置(DIP)方式結合之第一接地焊接部332,第一訊號傳輸導體34之一端處形成一呈彈性彎曲狀之第一訊號接觸部341,另一端處係形成一插接設置(DIP)方式結合之第一傳輸焊接部342,電源傳輸導體35之一端處係形成一呈彈性彎曲狀之電源接觸部351,另一端處係形成一插接設置(DIP)方式結合之電源焊接部352,第二訊號傳輸導體36一端處係形成一呈彈性彎曲狀之第二訊號接觸部361,另一端處係形成一插接設置(DIP)方式結合之第二訊號焊接部362,第二接地傳輸導體37一端處係形成一呈彈性彎曲狀之第二接地接觸部371,另一端處係形成一插接設置(DIP)方式結合之第二接地焊接部372; 一屏蔽殼體4,該屏蔽殼體4係為一體成型製成,且該屏蔽殼體4上係形成有複數彎折部41,並於側面處上形成有複數與第二絕緣膠體2卡掣結合之卡扣部42、複數彎折成型固定用之結合部43、複數供第一差分訊號焊接部312及第二差分訊號焊接部322裸露於外便於加工之切口部44、複數固定用之第一固定部45及複數固定用之第二固定部46。Please refer to the first, second, third, fourth, fifth, sixth and seventh figures, which are perspective views, exploded views and terminal groups of the first preferred embodiment of the present invention. Exploded diagram (1), terminal group exploded view (2), insulating colloid exploded view, insulating colloidal cross-sectional view and shielded housing perspective view, it can be clearly seen from the figure that the structure of the novel stacked USB3.0 connector includes: a first insulating colloid 1; at least one of the second insulating colloid 2 is disposed on the first insulating colloid 1; the second insulating colloid 2 includes a first colloid 21 and a second colloid 22; and a plurality of terminal groups 3, The terminal group 3 is disposed on the first insulating colloid 1 and the second insulating colloid 2, and the terminal group 3 includes a first differential signal transmission conductor group 31 and a first differential signal transmission conductor group 31. a second differential signal transmission conductor group 32 on the side, a first ground transmission conductor 33 located between the first differential signal transmission conductor group 31 and the second differential signal transmission conductor group 32, and a first differential signal transmission Conductor group 31 and the first ground transmission conductor a first signal transmission conductor 34 between 33, a power transmission conductor 35 located between the first differential signal transmission conductor group 31 and the first signal transmission conductor 34, one located at the a second signal transmission conductor 36 between the second differential signal transmission conductor group 32 and the first ground transmission conductor 33 and a second ground between the second differential signal transmission conductor group 32 and the second signal transmission conductor 36 a transmission conductor 37, a first differential signal contact portion 311 formed in a flat shape at one end of the first differential signal transmission conductor group 31, and a first differential signal welding portion bonded in a surface mount (SMT) manner at the other end 312, a second differential signal contact portion 321 is formed at one end of the second differential signal transmission conductor group 32, and a second differential signal soldering portion 322 is formed at the other end by a surface mount (SMT) method. A first ground contact portion 331 is formed at one end of the first ground transmission conductor 33, and a first ground soldering portion 332 is formed at the other end by a DIP connection. The first signal transmission is performed. A first signal contact portion 341 having an elastic bending shape is formed at one end of the conductor 34, and a first transmission welding portion 342 is formed at the other end in a DIP manner, and one end of the power transmission conductor 35 is shaped. The power contact portion 351 is formed in a flexible and curved shape, and the power supply soldering portion 352 is formed in a DIP manner at the other end. The second signal transmitting conductor 36 forms a second signal which is elastically bent at one end. The contact portion 361 is formed with a second signal soldering portion 362 in a DIP manner, and a second ground contact portion 371 is formed at one end of the second ground transmitting conductor 37. a second grounding soldering portion 372 is formed at one end by a plug-in arrangement (DIP); a shield case 4 is integrally formed, and the shield case 4 is formed with a plurality of bent portions 41, and a plurality of the second insulating colloid 2 are formed on the side surface. The engaging portion 42 and the joint portion 43 for the plurality of bending forming fixings, the plurality of first differential signal welding portions 312 and the second differential signal welding portion 322 are exposed to the outside for facilitating the cutting portion 44, and the plurality of fixing portions A fixing portion 45 and a plurality of fixing portions 46 for fixing.
其中該第一訊號接觸部341係位於該第一差分訊號接觸部311之後方處,且該電源接觸部351係位於該第一差分訊號接觸部341之後方處,而該第二訊號接觸部361係位於該第二差分訊號接觸部321之後方處,再該第二接地接觸部371係位於該第二差分訊號接觸部321之後方處。The first signal contact portion 341 is located behind the first differential signal contact portion 311, and the power contact portion 351 is located behind the first differential signal contact portion 341, and the second signal contact portion 361 is located at the rear of the first differential signal contact portion 341. The second ground contact portion 321 is located behind the second differential signal contact portion 321 , and the second ground contact portion 371 is located behind the second differential signal contact portion 321 .
藉由上述之結構、組成設計,茲就本新型之使用作動情形說明如下,請同時配合參閱第八圖、第九圖、第十圖、第十一圖、第十二圖、第十三圖、第十四圖、第十五圖、第十六圖及第十七圖所示,係為係為本新型第一較佳實施例之結合作動示意圖(一)、結合作動示意圖(二)、結合作動示意圖(三)、屏蔽殼體彎折成型示意圖(一)、屏蔽殼體彎折成型示意圖(二)、屏蔽殼體彎折成型示意圖(三)、屏蔽殼體彎折成型示意圖(四)、屏蔽殼體彎折成型示意圖(五)、屏蔽殼體彎折成型示意圖(六)及屏 蔽殼體彎折成型示意圖(七),由圖中可清楚看出,將第二絕緣膠體2依序堆疊結合於第一絕緣膠體1上方,此後再將屏蔽殼體4透過彎折改變態樣,由第一絕緣膠體1及第二絕緣膠體2前方套入後包覆結合,此後再將其由基板5之上方插設結合,完成USB3.0連接器之結合組裝;而此處對屏蔽殼體4彎折改變態樣之方式進一步說明,該屏蔽殼體4係為一體成型之方式製成,並於此處以配合四埠之屏蔽殼體4作為解說,首先將屏蔽殼體4前方之彎折部41進行彎折,形成每一埠分隔之區隔部,此後再將屏蔽殼體4之較大之兩側面區進行彎折,最後再將屏蔽殼體4後方之門板區進行彎折,當完成改變態樣後,當中屏蔽殼體4之卡扣部42與第二絕緣膠體2卡掣結合,使第一絕緣膠體1、第二絕緣膠體2與屏蔽殼體4穩固結合,而結合部43之更使屏蔽殼體4之整體強度提升,並透過將第一固定部45及第二固定部46插設於基板5上,並因切口部44之設計方式,使第一差分訊號焊接部312及第二差分訊號焊接部322裸露於屏蔽殼體4外,方便相關之加工及維修。With the above structure and composition design, the following is a description of the operation of the present invention. Please refer to the eighth, ninth, tenth, eleventh, twelfth, and thirteenth drawings. The fourteenth, fifteenth, sixteenth and seventeenth drawings are the schematic diagram of the cooperation of the first preferred embodiment of the present invention (1), and the joint cooperation diagram (2). Schematic diagram of combined actuation (3), schematic diagram of bending forming of shielding shell (1), schematic diagram of bending forming of shielding shell (2), schematic diagram of bending forming of shielding shell (3), schematic diagram of bending forming of shielding shell (4) Schematic diagram of bending forming of shielding shell (5), schematic diagram of bending forming of shielding shell (6) and screen Schematic diagram of the buckling of the casing (7), as is clear from the figure, the second insulating colloid 2 is sequentially stacked and bonded to the top of the first insulating colloid 1, and then the shielding shell 4 is changed by bending. The first insulating colloid 1 and the second insulating colloid 2 are sleeved in front and then covered and bonded, and then inserted and assembled from above the substrate 5 to complete the assembly of the USB3.0 connector; The manner in which the body 4 is bent and changed is further described. The shield case 4 is formed in an integrally formed manner, and the shield case 4 is matched with the shield case 4, and the front of the shield case 4 is first bent. The folded portion 41 is bent to form a partition portion of each of the partitions, and then the larger two side regions of the shield case 4 are bent, and finally the door panel region behind the shield case 4 is bent. After the change of the state is completed, the latching portion 42 of the shielding case 4 and the second insulating colloid 2 are latched, so that the first insulating colloid 1, the second insulating colloid 2 and the shielding shell 4 are firmly combined, and the joint portion is 43 further enhances the overall strength of the shielded housing 4 and transmits through the first solid The portion 45 and the second fixing portion 46 are inserted into the substrate 5, and the first differential signal soldering portion 312 and the second differential signal soldering portion 322 are exposed outside the shield case 4 due to the design of the cutout portion 44. Processing and maintenance.
請參考第十八圖及第十九圖所示,係為本新型第二較佳實施例之立體圖及分解圖,由圖中可清楚看出,本實施例之結構與上述之大致相同,其不同處在於第二絕緣膠體2a為一體成型之結構,同樣透過堆疊之方式結合於第一絕緣 膠體1a上,此後並將屏蔽殼體4a彎折改變其態樣後結合於上,當中之不同處在於,該些端子組3a上分別設置該第一絕緣膠體1a及第二絕緣膠體2a,並於該些端子組基部30a進行一次以上之向下彎折(面向基板5a之方向),使該些端子組基部30a形成至少一轉角部301a,透過此加工方式,大幅減省製作上之困難,藉此實現成本降低及組裝維修便利之優勢。Please refer to FIG. 18 and FIG. 19 for a perspective view and an exploded view of a second preferred embodiment of the present invention. As is apparent from the drawings, the structure of the present embodiment is substantially the same as the above. The difference is that the second insulating colloid 2a is an integrally formed structure, and is also bonded to the first insulating layer by stacking. The first insulating colloid 1a and the second insulating colloid 2a are respectively disposed on the pair of terminal groups 3a, and the shield housing 4a is bent and changed to be in a state of being attached thereto, and the difference is that the first insulating colloid 1a and the second insulating colloid 2a are respectively disposed on the terminal groups 3a, and The terminal group base portion 30a is bent downward at one time or more (in the direction facing the substrate 5a), and the terminal group base portion 30a is formed with at least one corner portion 301a. By this processing method, the manufacturing difficulty is greatly reduced. Thereby achieving the advantages of cost reduction and assembly and maintenance convenience.
請參考第二十圖所示,係為本新型之第三較佳實施例之立體圖,由圖中可清楚看出,本實施例為一埠之USB連接器,如同上述之結構,將端子組3b設置於第一絕緣膠體1b上,再將屏蔽殼體4b彎折後包覆結合,當中其不同處在於,其電源焊接部352b及第二接地焊接部372b為0.08毫米(mm),透過加大上述之焊接部,降低其電阻值,藉此達成其改善工作特性之優勢。Referring to the twentieth embodiment, which is a perspective view of a third preferred embodiment of the present invention, it can be clearly seen from the figure that the present embodiment is a USB connector, and the terminal group is the same as the above structure. 3b is disposed on the first insulating colloid 1b, and then the shield case 4b is bent and then combined, wherein the difference between the power supply soldering portion 352b and the second grounding soldering portion 372b is 0.08 mm (mm). The above-mentioned welded portion reduces the resistance value, thereby achieving the advantage of improving the working characteristics.
請參考第二十一圖所示,係為本新型之第四較佳實施例之立體圖,由圖中可清楚看出,本實施例為二埠之USB連接器,如同上述之結構,其主要結構皆如上述相同,透過第一絕緣膠體1c上對疊一第二絕緣膠體2c,再將屏蔽殼體4c包覆結合,再將其插設於基板5c上,其中不同之出在於該屏蔽殼體4c之前端區隔部為一個,且該卡扣部42c之位置需對應第二絕緣膠體2c,而該切口部44c也有所不同。Please refer to the twenty-first embodiment, which is a perspective view of a fourth preferred embodiment of the present invention. It can be clearly seen from the figure that the present embodiment is a USB connector of the second embodiment, like the above structure, mainly The structure is the same as the above, the second insulating colloid 2c is stacked on the first insulating colloid 1c, and the shielding case 4c is then coated and then inserted on the substrate 5c, wherein the shielding case is different. The front end portion of the body 4c is one, and the position of the hook portion 42c corresponds to the second insulating colloid 2c, and the notch portion 44c is also different.
請參考第二十二圖所示,係為本新型之第五 較佳實施例之立體圖,由圖中可清楚看出,本實施例為三埠之USB連接器,如同上述之結構,其主要結構皆如上述相同,透過第一絕緣膠體1d上對疊複數第二絕緣膠體2d,再將屏蔽殼體4d包覆結合,再將其插設於基板5d上,其中不同之出在於該屏蔽殼體4d之前端區隔部為兩個,且該卡扣部42d之位置需對應第二絕緣膠體2d,而該切口部44d也有所不同,達成不同態樣之實施方式。Please refer to the twenty-second figure, which is the fifth of the new model. A perspective view of a preferred embodiment, as is clear from the figure, the present embodiment is a three-way USB connector. As with the above structure, the main structure is the same as above, and the first insulating colloid 1d is stacked on the first insulating layer 1d. The second insulating colloid 2d is coated and bonded to the shielded housing 4d, and then inserted into the substrate 5d. The difference is that the shielding housing 4d has two front end partitions, and the latching portion 42d The position needs to correspond to the second insulating colloid 2d, and the notch portion 44d is also different, and different embodiments are achieved.
惟,以上所述僅為本新型之較佳實施例而已,非因此即侷限本新型之專利範圍,故舉凡運用本新型說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本新型之專利範圍內,合予陳明。However, the above description is only the preferred embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, all the simple modifications and equivalent structural changes that are made by using the present specification and the drawings are the same. It is included in the scope of this new patent and is given to Chen Ming.
故,請參閱全部附圖所示,本新型使用時,與習用技術相較,著實存在下列優點:Therefore, please refer to all the drawings, when compared with the conventional technology, the present invention has the following advantages:
一、透過第一絕緣膠體1及第二絕緣膠體2之堆疊方式,可達成降低無線電干擾實用進步性。1. Through the stacking method of the first insulating colloid 1 and the second insulating colloid 2, the practical progress of reducing radio interference can be achieved.
二、藉由一端子組3設置於一第一絕緣膠體1或一第二絕緣膠體2之方式,與習用一端子需搭配兩組膠芯相較,本新型達成成本降低及組裝維修便利之實用進步性。Second, by means of a terminal group 3 disposed on a first insulating colloid 1 or a second insulating colloid 2, compared with the conventional one terminal, it is necessary to match two sets of rubber cores, and the utility model achieves cost reduction and convenient assembly and maintenance. Progressive.
三、透過一體成型之屏蔽殼體4之設計,與習用多件式組裝相較,除了材料能 充分使用外,及製作組裝上更為便利,達成本新型成本降低及組裝維修便利之實用進步性。Third, through the design of the integrally formed shielding shell 4, compared with the conventional multi-piece assembly, in addition to the material can It is more convenient to use it fully, and it is more convenient to make and assemble, and achieve the practical progress of the new cost reduction and assembly and maintenance convenience.
四、透過彎折端子組基部30a之製作方式,改良簡化習用之工法,使製作上更加容易,達成本新型成本降低及組裝維修便利之實用進步性。Fourth, through the manufacturing method of bending the base group 30a of the terminal group, the method of simplifying the conventional use is improved, making the production easier, and achieving the practical improvement of the cost reduction and assembly and maintenance convenience of the present invention.
綜上所述,本新型之堆疊式USB3.0連接器之結構於使用時,為確實能達到其功效及目的,故本新型誠為一實用性優異之新型,為符合新型專利之申請要件,爰依法提出申請,盼 審委早日賜准本新型,以保障創作人之辛苦創作,倘若 鈞局審委有任何稽疑,請不吝來函指示,創作人定當竭力配合,實感德便。In summary, the structure of the stacked USB3.0 connector of the present invention can achieve its efficacy and purpose when used, so the novel is a new type of application with excellent practicability, and is in conformity with the application requirements of the new patent.提出 Submit an application in accordance with the law, and hope that the trial committee will grant this new type as soon as possible to protect the creators' hard work. If there is any doubt in the ruling committee, please do not hesitate to give instructions, the creator will try his best to cooperate and feel good.
1、1a、1b、1c、1d‧‧‧第一絕緣膠體1, 1a, 1b, 1c, 1d‧‧‧ first insulating colloid
2、2a、2c、2d‧‧‧第二絕緣膠體2, 2a, 2c, 2d‧‧‧ second insulating colloid
21‧‧‧第一膠體21‧‧‧First colloid
22‧‧‧第二膠體22‧‧‧Second colloid
3、3a、1b‧‧‧端子組3, 3a, 1b‧‧‧ terminal group
30a‧‧‧端子組基部30a‧‧‧Terminal base
301a‧‧‧轉角部301a‧‧‧ Corner
31‧‧‧第一差分訊號傳輸導體組31‧‧‧First differential signal transmission conductor set
311‧‧‧第一差分訊號接觸部311‧‧‧First Differential Signal Contact
312‧‧‧第一差分訊號焊接部312‧‧‧First Differential Signal Welding Department
32‧‧‧第二差分訊號傳輸導體組32‧‧‧Second differential signal transmission conductor set
321‧‧‧第二差分訊號接觸部321‧‧‧Second differential signal contact
322‧‧‧第二差分訊號焊接部322‧‧‧Second Differential Signal Welding Department
33‧‧‧第一接地傳輸導體33‧‧‧First ground transmission conductor
331‧‧‧第一接地接觸部331‧‧‧First ground contact
332‧‧‧第一接地焊接部332‧‧‧First grounding weld
34‧‧‧第一訊號傳輸導體34‧‧‧First signal transmission conductor
341‧‧‧第一訊號接觸部341‧‧‧First Signal Contact
342‧‧‧第一訊號焊接部342‧‧‧First Signal Welding Department
35‧‧‧電源傳輸導體35‧‧‧Power transmission conductor
351‧‧‧電源接觸部351‧‧‧Power Contact
352、352b‧‧‧電源焊接部352, 352b‧‧‧Power Welding Department
36‧‧‧第二訊號傳輸導體36‧‧‧Second signal transmission conductor
361‧‧‧第二訊號接觸部361‧‧‧Second Signal Contact
362‧‧‧第二訊號焊接部362‧‧‧Second Signal Welding Department
37‧‧‧第二接地傳輸導體37‧‧‧Second ground transmission conductor
371‧‧‧第二接地接觸部371‧‧‧Second ground contact
372、372b‧‧‧第二接地焊接部372, 372b‧‧‧Second grounding welding department
4、4a、4b、4c、4d‧‧‧屏蔽殼體4, 4a, 4b, 4c, 4d‧‧‧ shielding housing
41‧‧‧彎折部41‧‧‧Bend
42、42c、42d‧‧‧卡扣部42, 42c, 42d‧‧‧ buckle
43‧‧‧結合部43‧‧‧Combination
44、44c、44d‧‧‧切口部44, 44c, 44d‧‧‧ cut section
45‧‧‧第一固定部45‧‧‧First Fixed Department
46‧‧‧第二固定部46‧‧‧Second fixed department
5、5c、5d‧‧‧基板5, 5c, 5d‧‧‧ substrate
第一圖 係為本新型第一較佳實施例之立體圖。The first figure is a perspective view of the first preferred embodiment of the present invention.
第二圖 係為本新型第一較佳實施例之分解圖。The second drawing is an exploded view of the first preferred embodiment of the present invention.
第三圖 係為本新型第一較佳實施例之端子組分解圖(一)。The third figure is an exploded view of the terminal group of the first preferred embodiment of the present invention (1).
第四圖 係為本新型第一較佳實施例之端子組分解圖(二)。The fourth figure is an exploded view of the terminal set of the first preferred embodiment of the present invention (2).
第五圖 係為本新型第一較佳實施例之絕緣膠體分解圖。The fifth drawing is an exploded view of the insulating colloid of the first preferred embodiment of the present invention.
第六圖 係為本新型第一較佳實施例之絕緣膠體剖視圖。Figure 6 is a cross-sectional view showing the insulating colloid of the first preferred embodiment of the present invention.
第七圖 係為本新型第一較佳實施例之屏蔽殼體立體圖。Figure 7 is a perspective view of the shield case of the first preferred embodiment of the present invention.
第八圖 係為本新型第一較佳實施例之結合作動示意圖(一)。The eighth figure is a schematic diagram (1) of the cooperation of the first preferred embodiment of the present invention.
第九圖 係為本新型第一較佳實施例之結合作動示意圖(二)。The ninth diagram is a schematic diagram of the cooperation of the first preferred embodiment of the present invention (2).
第十圖 係為本新型第一較佳實施例之結合作動示意圖(三)。The tenth figure is a schematic diagram (3) of the cooperation of the first preferred embodiment of the present invention.
第十一圖 係為本新型第一較佳實施例之屏蔽殼體彎折成型示意圖(一)。Figure 11 is a schematic view showing the bending of the shield case of the first preferred embodiment of the present invention (1).
第十二圖 係為本新型第一較佳實施例之屏蔽殼體彎折成型示意圖(二)。Figure 12 is a schematic view showing the bending of the shield case of the first preferred embodiment of the present invention (2).
第十三圖 係為本新型第一較佳實施例之屏 蔽殼體彎折成型示意圖(三)。Figure 13 is a screen of the first preferred embodiment of the present invention Schematic diagram of bending and forming of the casing (3).
第十四圖 係為本新型第一較佳實施例之屏蔽殼體彎折成型示意圖(四)。Figure 14 is a schematic view showing the bending forming of the shield case of the first preferred embodiment of the present invention (4).
第十五圖 係為本新型第一較佳實施例之屏蔽殼體彎折成型示意圖(五)。The fifteenth figure is a schematic view of the bending forming of the shield case of the first preferred embodiment of the present invention (5).
第十六圖 係為本新型第一較佳實施例之屏蔽殼體彎折成型示意圖(六)。Figure 16 is a schematic view showing the bending forming of the shield case of the first preferred embodiment of the present invention (6).
第十七圖 係為本新型第一較佳實施例之屏蔽殼體彎折成型示意圖(七)。Figure 17 is a schematic view showing the bending forming of the shield case of the first preferred embodiment of the present invention (7).
第十八圖 係為本新型第二較佳實施例之立體圖。Figure 18 is a perspective view of a second preferred embodiment of the present invention.
第十九圖 係為本新型第二較佳實施例之分解圖。Figure 19 is an exploded view of the second preferred embodiment of the present invention.
第二十圖 係為本新型第三較佳實施例之立體圖。Figure 20 is a perspective view of a third preferred embodiment of the present invention.
第二十一圖 係為本新型第四較佳實施例之立體圖。The twenty-first embodiment is a perspective view of the fourth preferred embodiment of the present invention.
第二十二圖 係為本新型第五較佳實施例之立體圖。The twenty-second diagram is a perspective view of the fifth preferred embodiment of the present invention.
1‧‧‧第一絕緣膠體1‧‧‧First Insulating Colloid
2‧‧‧第二絕緣膠體2‧‧‧Second insulating colloid
4‧‧‧屏蔽殼體4‧‧‧Shield housing
Claims (6)
Priority Applications (1)
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TW102200722U TWM461913U (en) | 2013-01-11 | 2013-01-11 | Structure of stacked USB 3.0 connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW102200722U TWM461913U (en) | 2013-01-11 | 2013-01-11 | Structure of stacked USB 3.0 connector |
Publications (1)
Publication Number | Publication Date |
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TWM461913U true TWM461913U (en) | 2013-09-11 |
Family
ID=49629496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW102200722U TWM461913U (en) | 2013-01-11 | 2013-01-11 | Structure of stacked USB 3.0 connector |
Country Status (1)
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TW (1) | TWM461913U (en) |
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2013
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